Abstract: One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the component during reflow soldering through surface tension/capillary forces of the solder paste material in the channels. Such channels also can be used, for example, by an image processing system to facilitate accurate positioning and/or alignment of the component. The image processing system can use the location of the channels alone, or in combination with other features such as a solder mask or other alignment marks, to position and/or align the component with high accuracy.

Abstract: Provided is a substrate holding unit that holds a pair of substrates that are aligned and layered, comprising a first holding member that holds one of the substrates; a plurality of members to be joined that are connected to the first holding member; a second holding member that holds the other of the substrates to face the one of the substrates; a plurality of joining members that exert an adhesion force on the members to be joined and are connected to the second holding member at positions corresponding to positions of the members to be joined; and an adhesion restricting section that restricts the adhesion force until the substrates are aligned.

Abstract: A reusable electronic circuit assembling system facilitates assembly and testing of electronic circuits. The system has at least one baseboard and one or more assembling blocks magnetically or mechanically attached to the baseboard. Each assembling block has at least two electrically connected conductive clips located separately in the opening holes of the assembly block. Discrete electronic components are connected by selectively inserting the electrodes of the to-be-connected electronic components into the clips of the assembling blocks. A complete circuit is constructed by attaching the above block-component assemblies on the baseboard and connecting them in accordance with the desired circuit diagram.

Abstract: The described embodiments relate generally to magnetic fasteners. In particular a fastening apparatus for engaging and disengaging a fastener disposed within a device housing is described. By designing a fastener with a magnetically coded head that fastener can be both engaged and disengaged to a fastener attachment point within a device housing by a magnetic driver having a magnetically coded driving feature that corresponds to the magnetically coded fastener head. In this way a fastener can be attached at various orientations within a device housing after the device housing has been closed.

Abstract: A system and method for creating one or more magnetically conditioned regions on a rotatable shaft or disk-shaped torque sensing element, wherein rotation noise produced by the element due to magnetic field variations is substantially negated. Upon magnetization of the torque sensing element, rotation noise produced by the magnetically conditioned region is measured. Adjustment factors are calculated based on the measured rotation noise, and the adjustment factors are used to adjust a magnetic field source during subsequent magnetization of the torque sensing element.

Abstract: A method and fixture using magnetic field assisted self-alignment for chip packaging. Typical embodiments include a magnetic device having one or more pole groups, each pole group including two or three poles. Some embodiments provide multiple pole groups arranged in a one or two dimensional pole group array. The poles can build up a self-alignment magnetic field. The structure of fixture is simple and easy to implement. Typical embodiments can greatly reduce chip packaging cost and make packaging more efficient. In accordance with typical embodiments, a chip and a substrate can be self-aligned magnetically regardless of their shapes.

Abstract: A self-assembly apparatus for assembling a plurality of devices with a predetermined aspect ratio is provided. The self-assembly apparatus includes a guiding element, a vibration device, and a magnetic field inducing device. The guiding element has a mesh structure. The vibration device is coupled to the guiding element and configured to vibrate the guiding element. The magnetic field inducing device is disposed below the guiding element and configured to generate a time-varying magnetic field to rotate each of the devices. Through a collective effect of the vibration of the guiding element, the time-varying magnetic field, and the self-gravity of each of the devices, the devices are positioned on a plate between the guiding element and the magnetic field inducing device through the mesh structure.

Abstract: A self-assembly apparatus for assembling a plurality of devices with a predetermined aspect ratio is provided. The self-assembly apparatus includes a guiding element, a vibration device, and a magnetic field inducing device. The guiding element has a mesh structure. The vibration device is coupled to the guiding element and configured to vibrate the guiding element. The magnetic field inducing device is disposed below the guiding element and configured to generate a time-varying magnetic field to rotate each of the devices. Through a collective effect of the vibration of the guiding element, the time-varying magnetic field, and the self-gravity of each of the devices, the devices are positioned on a plate between the guiding element and the magnetic field inducing device through the mesh structure.

Abstract: A device to transfer a tiny hearing aid battery to the battery compartment of a hearing aid. Pressure on a button at the top creates contact to a single AAA battery, thus energizing an electromagnet which then holds the hearing aid battery. When the pressure at the devices's top button is released, the AAA battery is turned off and the battery is released undisturbed in the hearing aid's battery compartment.

Abstract: A mounting method for mounting an electronic component on a printed circuit board, the mounting method includes fixing a lower surface of a magnet panel to a magnetic body included in the electronic component by a magnetic force, seizing the electronic component by attracting a part of an upper surface of the magnet panel to an attaching unit, determining a position of the attracting unit to place the electronic component at a predetermined position with respect to the printed circuit board and releasing the attracting unit from the upper surface of the magnet panel.

Abstract: A device to transfer a tiny hearing aid battery to the battery compartment of a hearing aid. Pressure on a button at the top creates contact to a single AAA battery, thus energizing an electromagnet which then holds the hearing aid battery. When the pressure at the devices's top button is released, the AAA battery is turned off and the battery is released undisturbed in the hearing aid's battery compartment.

Abstract: A component placement apparatus includes: a tray storing device having slots for storing trays, a tray transporting device for transporting a tray from the tray storing device to a pickup area, a controller for controlling the transport of the trays into and out of the tray storing device, and at least one component pickup and placement device for picking-up a component in a tray located in the pickup area and placing the component on a substrate. The tray storing device includes first and second parts located proximal and distal the pickup area, respectively. The first part stores trays (i) from which at least one component may be removed and/or (ii) that are expected to be needed at the pickup area in the short term. The second part stores trays, which are empty, full, or are not expected to be needed in the pickup area in the short term.

Abstract: A magnetically directed, self-assembled structure has a first body. The first body includes a single magnet or plurality of magnets disposed thereon to form a spatially variable magnetic field in a first predetermined pattern. A second body has a single magnet or plurality of magnets disposed thereon to form a spatially variable magnetic field in a second predetermined pattern. The second predetermined pattern is complementary to the first pattern. The first body is attracted to the second body with an attractive force greater than a mixture force such that the first body and second body are fully aligned to each other and bonded together.

Abstract: Provided herein are methods, apparatuses and systems for fabricating photovoltaic cells and modules. In certain embodiments, the methods, apparatuses and systems involve coating ferromagnetic substrates with thin film solar cell materials and using magnetic force to constrain, move or otherwise manipulate partially fabricated cells or modules. According to various embodiments, the methods, apparatuses and systems provide magnetically actuated handling throughout a photovoltaic cell or module fabrication process, from forming photovoltaic cell layers on a substrate to packaging the module for transport and installation. The magnetically manipulated processing provides advantages over conventional photovoltaic module processing operations, including fewer mechanical components, greater control over placement and tolerances, and ease of handling. As a result, the methods, apparatuses and systems provide highly efficient, low maintenance photovoltaic module fabrication processes.

Abstract: Provided herein are methods, apparatuses and systems for fabricating photovoltaic cells and modules. In certain embodiments, the methods, apparatuses and systems involve coating ferromagnetic substrates with thin film solar cell materials and using magnetic force to constrain, move or otherwise manipulate partially fabricated cells or modules. According to various embodiments, the methods, apparatuses and systems provide magnetically actuated handling throughout a photovoltaic cell or module fabrication process, from forming photovoltaic cell layers on a substrate to packaging the module for transport and installation. The magnetically manipulated processing provides advantages over conventional photovoltaic module processing operations, including fewer mechanical components, greater control over placement and tolerances, and ease of handling. As a result, the methods, apparatuses and systems provide highly efficient, low maintenance photovoltaic module fabrication processes.

Abstract: A method of fabricating a clamping device for a flexible substrate is provided. A carrier board is provided. A plurality of holes is formed in the carrier board. A fixed positioning assembly and a movable positioning assembly are respectively embedded in the plurality of holes.

Abstract: A clamping device for a flexible substrate is provided. The clamping device includes a carrier board. The carrier board has a fixed positioning assembly and a plurality of movable positioning assemblies. The fixed positioning assembly and the movable positioning assemblies are disposed in locations that almost correspond to a plurality of through holes on the flexible substrate. The fixed positioning assembly includes a hole body with a positioning hole and a dowel pin. Each movable positioning assembly includes a hole body with a positioning hole, a plurality of curved extending arms and a dowel pin. Each curved extending arm is connected to the hole body and the carrier board and the dowel pin is inserted into the positioning hole.

Abstract: An apparatus for transplanting a multi-board is provided. This apparatus includes an orientation device, a calibration device, and an image-adjusting device. The orientation device has a first movable platform, and the multi-board is fixed on the first movable platform. The calibration device has a second movable platform and is used for moving a substitution circuit board to a recombination position of the multi-board. The image-adjusting device captures image data of the multi-board and the substitution circuit board and compares the image data to obtain an error signal. The calibration device receives the error signal and moves the second movable platform according to the error signal in order to calibrate the relative position between the substitution circuit board and the multi-board.

Abstract: An assembly support platform apparatus, system and method assembles a motherboard into an information handling system by coupling simulated electronic connectors of the platform to electronic connectors of the motherboard to support movement of the motherboard to an installation position in the information handling system. Openings in the assembly platform allow insertion of attachment devices to attach the motherboard to the chassis of the information handling system. Once the motherboard is secured, the assembly platform is removed by pulling away from the motherboard to de-couple the simulated electronic connectors of the assembly board from the electronic connectors of the motherboard.

Abstract: An electronic component includes a semiconductor chip with a chip topside, an integrated circuit, and a chip backside. The chip backside includes a magnetic layer. The electronic component further includes a chip carrier with a magnetic layer on its carrier topside. At least one of the two magnetic layers is permanently magnetic such that the semiconductor chip is magnetically fixed on the chip carrier.

Abstract: A holding structure, such as a manipulator, includes a plurality fingers. At least one of the fingers is movable such that an object can be held or released by a closing or opening motion of the movable finger. At least one contact surface of the fingers, which is capable of being brought into contact with the object, is formed by an elastic member, and at least one elastic member is adapted to reversibly change its elasticity under the control of an external supply of energy to the elastic member.

Abstract: In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.

Abstract: The apparatus is for securely fetching and positioning an SMD chip on a printed circuit board and soldering the same to the board. Two spring plates form the clasping fingers which are wedged apart to a width larger than the width of the SMD chip by an expander formed on an elongated rod slidably mounted within a vertical tubular housing. An SMD chip may be safely fetched by pressing the rod on the top of the SMD with a continuous depressing motion until the fingers clasp the SMD chip safely therebetween. A soldering unit with a bifurcate soldering head located juxtaposed to the fingers is operative to solder the SMD chip to the printed circuit board while the SMD chip is safely held in place.

Abstract: Disclosed is an electronic-component mounting apparatus 1 for mounting a plurality of electronic components onto a printed-wiring board 10, which comprises a component mounting head 4 adapted to suck up the electronic component and mount the sucked up electronic component on the printed-wiring board 10 while moving along an X-axis direction, a table 8 adapted to move the printed-wiring board 10 along a Y-axis direction, an electronic-component feeding device 12, 14 attached to the table 8 and adapted to move in sync with the movement of the printed-wiring board 10, and component image-recognition/correction means 16 for correcting a posture of the electronic component in accordance with image recognition of the posture, during the time between the sucking up and mounting of the electronic component by the component mounting head, wherein respective positions of the sucking of the electronic component, the mounting of the electronic component and the image recognition are located on the X-axis.

Abstract: An apparatus for mounting semiconductor chips with a transport device that transports the substrates in cycles to a bonding station where a semiconductor chip is deposited comprises a receiving table with a support surface on which the substrates are presented one after the other for transport by the transport device as well as a pusher device with a drive system and a slide for alignment of the substrate on an end stop. In accordance with the invention, the drive system and the slide comprise a first magnet and a second magnet that attract each other, ie, they are magnetically coupled. The drive system is arranged underneath the support surface and moves its magnet back and forth whereby the magnet of the slide is moved with it. One of the two magnets can also be a ferromagnetic body. The drive system is controlled by software.

Abstract: A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

Abstract: A fixing tool for quickly setting up a secure device with an engaging member and a secure unit is used for mounting the secure device to an electronic component. The fixing tool includes a main member, a driving member with an extending part pivotally connected to the main member and an ejection member with an ejecting part disposed at the bottom cover of the main member. The bottom cover defines a moving direction and a rotating direction and the driving member rotates between a prior-trigger position and a trigger position along the rotating direction and the ejection member moves between a prior-ejecting position and an ejection position. When the driving member is disposed at the prior-trigger position, the ejection member is at the prior-ejecting position. When the driving member is disposed at the trigger position, the ejection member is disposed at the ejection position and the engaging member in the containing chamber is pushed by the ejection member to join with the secure unit.

Abstract: An anisotropically conductive connector, inhibits permanent deformation by contact of target electrodes to be connected with pressure and deformation by abrasion from occurring even if the target electrodes to be connected are those projected, achieves stable conductivity over a long period of time even when it is pressed repeatedly, and prevents or inhibits an object of connection from adhering, a production process thereof, and an inspection apparatus for circuit devices equipped with the anisotropically conductive connector. The anisotropically having an anisotropically conductive film, in which a plurality of conductive path-forming parts each extending in a thickness-wise direction of the film are arranged in a state mutually insulated by insulating parts.

Abstract: A stator assembly that may be rounded into an annular form is disclosed that includes a plurality of stator segments where each stator segment defines a yoke portion and a stator tooth and a containment structure configured to position the stator segments relative to one another such that the stator segments do not physically touch one another and such that no magnetic circuit between adjacent stator segments is formed. Also disclosed is a method for forming a segmented stator, involving the steps of positioning a plurality of stator segment in a containment structure such that no magnetic circuit between adjacent stator segments is formed, forming a winding coil about at least some of the stator segments; and deforming the containment structure to form an annular stator and to establish a magnetic circuit between adjacent stator segments.

Abstract: An electrostatic gripper for moving wafers includes bipolar electrodes with an insulating layer of zirconium oxide, which are positioned on a circuit board. The gripper is produced by a pressing process and can be operated with a DC voltage of less than 900 V. As a result, heating of the wafer is almost completely prevented even under a vacuum.

Abstract: An apparatus for safe and easy installation of wall-mounted electrical switches utilizing a multi-function tool. The tool is provided, in the form of an insulated handle that is detachably engaged with a wall switch. The wall switch device is temporarily attached to a switch fixture using one or more magnets. The tool further includes built-in electrical wire measuring, stripping and bending structures.

Abstract: An apparatus for performing operations on at least one surface of an electronic substrate having a first surface and a second surface includes a frame, a transportation system that moves the substrate through the apparatus, a substrate support system, coupled to the frame, having a non-rigid portion that contacts and supports the substrate during an operation on the substrate, wherein the non-rigid portion allows flexure of the substrate before and during the performance of an operation on the substrate, and a device coupled to the frame that performs an operation on a surface of the substrate.

Abstract: An apparatus for placing a semiconductor chip as a flipchip on a substrate has a flip device for flipping the semiconductor chip. The flip device is formed as a parallelogram construction which consists of a support bracket, a first and a second swivel arm and a connecting arm. A chip gripper is arranged on the connecting arm. A drive system serves the back and forth movement of the parallelogram construction between a first limit position where the chip gripper accepts the semiconductor chip and a second limit position where the chip gripper places the semiconductor chip on the substrate.

Abstract: A system for mounting heatsinks, in particular, high-mass heatsinks, on printed circuit boards, such as motherboards. The mounting system includes a backplate, disposed beneath the motherboard, with pins protruding up through the motherboard, and a linkage assembly, which is fixably attached to a base portion of a heatsink assembly. The linkage assembly includes scoops, for grasping the pins during engagement, and a ratcheting system, for compressing the heatsink and thermal interface material onto the package. The mounting system is designed to effectively distribute the heatsink weight, as well as the forces caused by chronic and dynamic stresses, through, rather than upon the motherboard, such as to a chassis. The mounting system thus alleviates stress cracks, component pullout, solderball stress, and other damaging conditions to the motherboard. The mounting system may be engaged and disengaged without the use of tools.

Abstract: An electric-component mounting system for mounting a plurality of electric components onto a circuit board. The system includes a plurality of electric-component mounting units which are arranged in a predetermined direction with a spacing distance between each adjacent pair of the electric-component mounting units. Each of the electric-component mounting units includes (a) a board holding device which is capable of holding the circuit board in a predetermined position, (b) a component mounting device which is capable of mounting the electric components onto the circuit board held by the board holding device, and (c) a component supplying device which is capable of supplying the electric components to the component mounting device. The system further includes a spacing-distance changing device capable of changing the spacing distance.

Abstract: The invention provides a mounting apparatus with a beam which is free from adverse effect on its performance due to thermal distortion and misalignment of its guide rails, on which the beam for mounting operation travels. One end of the beam is rotatably supported on a slide, which moves along the guide rails. Another end of the beam is also rotatably supported on another slider through a moving element. The slider and the mounting element move along the guide rail. The moving element moves in a direction perpendicular to the guide rails.

Abstract: An electronics packaging system (1) including a printer (3), a placing unit (4) and a reflow unit (5), wherein a printed wiring board (2) is carried while being kept in an upright position. The printed wiring board (2) has solder printed on all the lands thereof at the same time, the electronic parts (10) are all placed on the lands at the same time, and the electronic parts (10) are all soldered to the lands at the same time. Thus, the system (1) can be designed more compact, and the electronic parts packaged in a shorter time.

Abstract: A vibration control system comprising an actuator, and a sensor useful for controlling vibrations in systems for fabricating electronics equipment. The actuator may comprise one or more plates or elements of electro-active material bonded to an electroded sheet.

Abstract: A component mounting method recognizes reference marks on a printed circuit board and an electronic component, and uses these reference marks to determine a shift between a position of the circuit board and a position of the electronic component. This shift is corrected and then the electronic component is mounted to the printed circuit board such that electrical connecting portions of the circuit board are connected to electrical connecting portions of the electronic component. The reference marks are formed simultaneously with corresponding electrical connecting portions via a mask, such that in order to accurately position the electrical connecting portions, it is only necessary to accurately relatively position the reference marks.

Abstract: Disclosed is a method of mounting chips, including the steps of: dipping a mounting board in a solvent in which chips are dispersed; and mounting the chips on the mounting board by forming electric field gradients on the mounting board in correspondence with positions where the chips are to be mounted. With this configuration, fine chips such as fine semiconductor chips can be mounted at desired positions on a mounting board with a high efficiency and a high yield.

Abstract: A position control apparatus of a feeder stage is disclosed, at which a tape reel for feeding parts to be mounted on a PCB is mounted in a surface mount device (SMD). The position control apparatus includes a feeder stage disposed inside a base frame of a SMD, a height/rotation power transmission device for controlling a height (Z) and a rotation angle (?) of the feeder stage, a first power transmission device for controlling the X-axis position of the feeder stage, and a second power transmission device for controlling the Y-axis position of the feeder stage. Therefore, the apparatus can be easily controlled the mounting position of the tape reel by controlling the position of the feeder stage at which the tape reel is mounted in the SMD.

Abstract: A tape head module assembly system is disclosed. A first and second module holder are placed in an initial alignment with module holder ends facing each other, the module ends each holding a tape head module. A tape wrap angle between the first and second module is set by first performing a fringe alignment and then lifting a rear end of the first and second module holder a prescribed amount. A horizontal adjuster produces a rotation for the first module holder so that gaps between the first and second modules are parallel. An alignment along a longitudinal axis for the second module holder is selected and the second module is translated laterally until the second tape head module held by the second module holder is aligned with the first tape head module held by the first module holder to provide reader-opposite-writer track-to-track registration. Then, the first and second tape head modules are joined together using a joining agent in the gap between the first and second tape head modules.

Abstract: A printed-board holding device for holding a printed board in a work system in which the printed board and a working head are moved relative to each other in a direction parallel with a top surface of the printed board so that the working head executes a desired operation in each of a plurality of predetermined portions of the top surface of the printed board. The printed-board holding device includes (a) a supporting member which is to be brought into contact with a central portion of a bottom surface of the printed board and is capable of supporting the central portion, and (b) a pressing member which is to be brought into contact with a central portion of the top surface and is capable of forcing the printed board toward the supporting member.

Abstract: A terminal examination jig 10 includes a jig body 12 having a gauge receiving portion 13 and a terminal holding portion 20, and a limit gauge 28 releasably supported pivotally on a support pin 14 extending through the gauge receiving portion 13 in a bridging manner. The terminal receiving portion 20 has a fixing surface 23a against which a bottom surface of a terminal (an object to be examined) is adapted to abut, and a fixing screw 25 for pressing the terminal against the fixing surface 23a to hold the terminal is provided at the terminal receiving portion 20. The limit gauge 28 has an opening portion 30 which is formed into a shape corresponding to the shape of an electrical contact portion of the terminal. Whether or not the bending of the terminal is within a tolerance is judged by checking whether or not the electrical contact portion can pass through the opening portion 30 without interference when the limit gauge 28 is pivotally moved about the support pin 14.

Abstract: A tool for reworking a connector attached to an electronic board having a plurality of stacked wafer modules thereon. The tool includes first and second jaws for grasping and removing a selected one of the modules from the board, a holding structure for holding the board, and movement structure for moving the two jaws relative to the holding structure, at least one of the jaws adapted for separating each selected module from a module on each opposing side of the selected module such that removal of the selected module is attained without damage to the separated, adjacent modules.

Abstract: An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.

Abstract: A printed circuit board support comprising a support base, a base extension and a magnetic source. The support base defines a support surface and a lower surface. The base extension is secured to the support base and arranged to define at least a portion of a height dimension of the printed circuit board support. The magnetic source is secured to the base extension and positioned such that the lower surface of the support base is arranged to secure the printed circuit board support to an object under magnetic force. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR §1.72 (b).

Abstract: An assembly support platform apparatus, system and method assembles a motherboard into an information handling system by coupling simulated electronic connectors of the platform to electronic connectors of the motherboard to support movement of the motherboard to an installation position in the information handling system. Openings in the assembly platform allow insertion of attachment devices to attach the motherboard to the chassis of the information handling system. Once the motherboard is secured, the assembly platform is removed by pulling away from the motherboard to de-couple the simulated electronic connectors of the assembly board from the electronic connectors of the motherboard.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted.

Abstract: A wafer having heterostructure therein is formed using a substrate with recesses formed within a dielectric layer. A magnetized magnetic layer or a polarized electret material is formed at the bottom of each recess. The magnetized magnetic layer or a polarized electret material provides a predetermined magnetic or electrical field pattern. A plurality of heterostructures is formed from on an epitaxial wafer wherein each heterostructure has formed thereon a non-magnetized magnetic layer that is attracted to the magnetized magnetic layer formed at the bottom of each recess or dielectric layer that is attracted to the polarized electret material formed at the bottom of each recess. The plurality of heterostructures is etched from the epitaxial wafer to form a plurality of heterostructure pills.