With Forming Eyelet From Elongated Conductor Patents (Class 29/864)
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Patent number: 11862915Abstract: [Object] The present invention provides a joined conductor and a method for manufacturing a joined conductor that can improve electrical conductivity between conductors.Type: GrantFiled: October 9, 2020Date of Patent: January 2, 2024Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.Inventors: Toshihiro Nakamura, Tomohiro Nakayama
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Patent number: 10763014Abstract: A method for producing an electrical conductor may include cutting an electrically conductive round wire composed of copper to a predefined desired length and plastically forming the round wire, in at least one forming section, into a predefined desired shape.Type: GrantFiled: April 26, 2019Date of Patent: September 1, 2020Assignee: Mahle International GmbHInventors: Thomas Bielesch, Michael Boehm, Wojciech Stasch
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Patent number: 9705245Abstract: A plug-in connection is described having a contact carrier including a contact element, which is mechanically connected to the contact carrier; a line has an electrical conductor, which is electrically connected to the contact element, and has an insulation which surrounds the electrical conductor. The line is mechanically connected to the contact carrier, the plug-in connection having a fixing element, into which is accommodated an uninsulated area of the line in which the electrical conductor is not surrounded by the insulation, and which fixes the electrical conductor to the contact carrier.Type: GrantFiled: April 11, 2014Date of Patent: July 11, 2017Assignee: Robert Bosch GmbHInventors: Martin Saur, Markus Lux
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Patent number: 8754665Abstract: A dual-stage fixture for a circuit tester includes a slide plate that can be slid between at least a first position and a second position. In the first position, an upper stripper plate is spring-loaded, and a full set of test probes, including both long-stroke and short-stroke probes, can contact the circuit board or UUT (unit under test). In the second position, the upper stripper plate becomes fixed in position, and only the long-stroke probes can contact the circuit board. The fixed positioning of the upper stripper plate prevents the short-stroke probes from contacting the circuit board even when there is unbalanced loading of probe pressure between the top and bottom of the circuit board, thereby preventing transient signals from interfering with testing. In addition, a vacuum is applied in this position during a non-powered test.Type: GrantFiled: April 11, 2012Date of Patent: June 17, 2014Assignee: Circuit Check, Inc.Inventors: Clement C. Adams, Matthew Eric Lavik, Gregory J. Michalko, Stuart Eickhoff
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Patent number: 8272128Abstract: A tool for changing first and second parts of a connector from a pre-assembly relationship into an assembled relationship. The tool is portable and has a frame with an operating mechanism thereon. The operating mechanism has a plunger that is movable to thereby change the relationship of the connector parts. The operating mechanism is operable by a pressurized fluid within a container that is connected to the frame.Type: GrantFiled: March 31, 2011Date of Patent: September 25, 2012Assignee: John Mezzalingua Associates, Inc.Inventors: Shawn M. Chawgo, Jeremy Amidon
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Publication number: 20120000069Abstract: A method for manufacturing an electric wire with a terminal, includes crimping a barrel portion of the terminal onto a core wire constructed of metal wires and creating a crack in a metal oxide layer immediately before the crimping. The metal oxide layer is formed on a metal surface of the core wire. The creating of crack is accomplished by applying a mechanical force to the metal oxide layer.Type: ApplicationFiled: March 18, 2010Publication date: January 5, 2012Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO WIRING SYSTEMS, LTD.Inventors: Masahiro Hagi, Hiroki Shimoda, Hiroki Hirai, Junichi Ono, Tetsuji Tanaka, Takuji Otsuka
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Patent number: 6948240Abstract: A method for shaping an object. The method includes the steps of preparing an attachment material having a glass transition temperature lower than that of the object, fixing the attachment material on the object, forming the object into a predetermined shape, heating the attachment material until the temperature is higher than its glass transition temperature, and cooling the attachment material and the object until the temperature is lower than the glass transition temperature of the attachment material. Additionally, shaping of the object and heating of the attachment material can achieve the same results.Type: GrantFiled: September 27, 2002Date of Patent: September 27, 2005Assignee: Benq CorporationInventor: Yung-Tsun Hsieh
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Patent number: 6950312Abstract: The present invention discloses method for packaging and assembly of electronic units comprising a multi-planar board system in which each single planar board provides electrical contacts and/or signal drive to its successive planar board via a flexible cable forming the only connection between successive planar boards. In its packaged position the planar boards are laid upon one another without affixing them with each other or affixing them with the housing of the electronic unit, wherein the packaging of the planar boards preferably forming a daisy chain. Positioning and adjusting of the planar boards to each other is mainly achieved by the cover element being wrapped around all surfaces of the planar boards during the packaging process, positioning and clamping of the packaging of the planar boards within the housing is mainly achieved by the self-adapting suspension during the assembly process of the electronic unit into the housing.Type: GrantFiled: September 26, 2002Date of Patent: September 27, 2005Assignee: International Business Machines CorporationInventor: Dieter E. Staiger
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Patent number: 6640436Abstract: A method for fabricating a semiconductor device includes removing a predetermined part of an insulative layer of a coated fine metallic wire by irradiating the predetermined part with a laser light and connecting the predetermined part of the fine metallic wire to one of the semiconductor device and a package of the semiconductor device. The insulative layer contains a substance that absorbs the laser light at a predetermined lasing wavelength.Type: GrantFiled: September 19, 2000Date of Patent: November 4, 2003Assignee: NEC Electronics CorporationInventors: Naoto Kimura, Takahiro Ito
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Patent number: 6381839Abstract: A method secures wire to an electrical contact using an insulation displacement contact (IDC) strain relief cap. The electrical contact has a bifurcated end for engaging and retaining the wire and is engaged with the strain relief cap in securing the wire. The cap attaches to the contact via means on the electrical contact for engaging both the cap and the wire. The wire is secured by placing cap onto the contact, aligning the wire with exit holes, and turning cap until locked into place.Type: GrantFiled: January 14, 2000Date of Patent: May 7, 2002Assignee: Avaya Technology CorpInventors: David B. Hollesen, Ivan Pawlenko, Thelma E. Cole, Jason A. Kay, David S. Kerr
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Patent number: 6374488Abstract: An apparatus and method for laser stripping coated cables for endocardial defibrillation leads comprising a jig for holding at least one insulated wire, the jig having a base plate, a linear stripping area on the plate, a first clasp mounted on the plate for holding a first end of the wire, at least two primary pins mounted on the plate on a first side of the linear stripping area, at least one secondary pin mounted on the plate on a second side of the linear stripping area, and a second clasp mounted on the plate for holding a second end of the wire; and a laser effective to remove insulation from the insulated wire, the laser being mounted to effectively remove insulation in the linear stripping area.Type: GrantFiled: January 5, 2000Date of Patent: April 23, 2002Assignee: Intermedics Inc.Inventors: Arthur G. N. McLean, G. Shantanu Reddy
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Patent number: 6151776Abstract: An installation method for installing machines of different heights at an installation site includes provision of a flexible power cord of particular length, affixed to an upper region of each machine. The power cord is terminated in a power-rated male connector. At the intended installation location, the power cord origination location is identified, which is the location at which the power cord will originate after installation. An interface box having a NEMA female connector is installed at a location such that the female connector is at a radius from the power cord origination location which is less than the length of the flexible power cord. The interface box is installed, connected to a power source, and tested, before physical installation of the machine. At the time of physical installation of the machine, there is no delay attributable to hard-wiring of the power connections to the machine, and it is connected with the flexible power cord.Type: GrantFiled: November 23, 1998Date of Patent: November 28, 2000Assignee: Lockheed Martin Corp.Inventors: Charles Thomas DiSaverio, James Robert Malia
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Patent number: 6085416Abstract: A wire shielding method which achieves electromagnetic shielding and reduces the number of component parts so as to enhance the efficiency of an assembling operation. In the wire shield structure, wires are covered with a shield member formed by laminating a metal foil layer and insulating layer together. The wires are led out of the shield member and connected to desired equipment. An extension portion of the shield member is folded, with the metal foil layer disposed at the inner side to form a lead wire portion. A distal portion of the lead wire portion is folded back with the metal foil layer exposed to form an earth terminal for grounding purposes. Therefore, without the use of a separate lead wire, the shielding effect can be enhanced and the number of component parts can be reduced.Type: GrantFiled: October 23, 1998Date of Patent: July 11, 2000Assignee: Yazaki CorporationInventor: Tomohiro Ikeda
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Patent number: 4490904Abstract: Apparatus and method for installing electrical connectors onto flat conductor cables wherein the connectors are fed to the machine from a magazine, transferred from the magazine to a press, captured by the press and then pressed onto and through the cable over an anvil which holds the connector to form a secure connection with the cable. The resulting profile of the connector is such that it extends through the conductor of the cable and is held thereon by a flange on one side of the cable, an eyelet-type crimp on the opposite side of the cable and a lance means. The transfer means includes a connector holder which carries the connector from the magazine to a guide pin on the press. The guide pin captures the connector and retains it as the holder is returned to the magazine. The holder has two regions thereon and automatically switches their orientations as it approaches the press area.Type: GrantFiled: May 3, 1982Date of Patent: January 1, 1985Assignee: Burndy CorporationInventor: George C. Moyher
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Patent number: 4390221Abstract: A modular connector assembly (50) combination characterized by a printed circuit board (60) having a plurality of apertures (66) extending between the surfaces thereof and with a circuit being printed on one of the panel surfaces; an interconnection device (70) mounted to the printed circuit board, the interconnection device being of dielectric material and associating a plurality of passages (76) extending therethrough with the apertures; and a contact (10) mounted within some of the passages of the interconnection device, the contact being of the type comprising a holder (20) of solderable material, a plurality of axial wires of conductive material secured medially of their ends (32, 34) in the holder and a sleeve (40) of non-solderable material extending forwardly of the holder, wavesoldering about an end portion of the holder extending through the aperture (66) mounting the contact and the interconnection device to the printed circuit board.Type: GrantFiled: April 24, 1981Date of Patent: June 28, 1983Assignee: The Bendix CorporationInventors: Paul D. Niles, Richard W. Normann