Abstract: A plate member includes a frame portion (51) provided in a state of coupling both one end portion and other end portion and mounting terminal portions (44) protruding from the one end portion and the other end portion of said frame portion (51) to approach each other, from which a PCB joint portions (46) to be a mounting portion to a PCB are formed by cutting and bending when manufacturing a magnetic element. Further, a winding number adjustment means (41), which is capable of selecting joint portions with ends of a coil and adjusting the winding number of the coil in accordance with the selection, protrudes from the one end portion and the other end portion to approach each other farther as compared to the mounting terminal portions (44).

Abstract: A manufacture process of a connector includes six steps of: (1) providing an insulating body; (2) providing a shelter with at least one slot; (3) the shelter being covered on the insulating body; (4) a metal pellet passing through the slot being plated with the insulating body to form a metal layer with a specific shape by a method of a physical plating membrane; (5) putting the insulating body into chemical liquid so that the metal layer of the insulating body being plated with at least one metal layer for protecting; and (6) taking the shelter off. Comparing to the prior art, the manufacture process of the connector uses a method of plating membrane to form a metal layer having the same function as a conductive terminal. By the method, the elastic contact portion can be installed on the two ends of the pressing contact connector.

Abstract: Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors are formed by first stamping a selected configuration of conductors in a conductive ribbon. The conductors are bent as necessary and passed in a reel-to-reel manner through an insert injection molding process to form an electrically insulating casing about the conductors. After the molding process, the ribbon is singulated to obtain individual lead frame connectors. The individual conductors encased in the casing can be electrically separated by punching out a connecting conductive structure through a hole formed in the casing. The connecting conductive structure mechanically secures the conductors to each other during the molding process and, when punched out, substantially eliminate stubs that could otherwise degrade the RF performance of the lead frame connectors.

Abstract: An electrical connector has a hard base part forming at least one rearwardly and forwardly open seat and formed with a transverse passage extending across the seat generally at the rear seat end, a respective contact in the seat having a front end and a rear end, a respective wire projecting into the rear end of the seat and connected there to the rear contact end, and a soft jacket encapsulating a rear end of the base part and front ends of the wires and extending at least partially into the rear seat ends. This connector is made by fitting a flow-blocking bar through the passage into a position blocking forward flow in the seat to the front contact end. The rear end of the part and the bar are then enclosed in a cavity of a mold to be filled with hardenable resin.

Abstract: A method of manufacturing a solid-state imaging device. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external terminal portion, the internal terminal portion of the wiring being connected electrically with an electrode of the imaging element. The wirings are made of thin metal plate leads, the base is made up of a resin molded member in which the thin metal plate leads are embedded, and at least a part of a side edge face of the thin metal plate leads is embedded in the base. The rigidity of the base is enhanced by the thin metal plate leads, thus reducing a curl and a warp of the base.

Abstract: A method of manufacturing a RF connector includes the following steps. First, a first workpiece with first assembly units is provided. Each first assembly unit includes a first joint piece with a first joint portion, a metal shell with a ring and soldering tags extending therefrom, and a first connection portion connecting the first joint piece and the ring. Next, a second workpiece with second assembly units is provided. Each second assembly unit includes a second joint piece with a second joint portion, a center contact with a base and a center pin disposed thereon, and a second connection portion connecting the second joint piece and the base. Then, the first and second joint portions are positioned to contact with each other and then riveted together. Then, dielectric bodies are formed to at least correspondingly cover part of each ring and each base. Thereafter, a singularizing process is performed.

Abstract: A portable memory device includes a molded housing and a printed circuit board assembly (PCBA) encased with the molded housing such that a plug connector extends from one end. A lower housing portion is produced by injection molding using a first apparatus, and then the lower housing portion is transferred to a second molding apparatus. The PCBA is mounted onto the lower housing such that the plug connector is received in a protected region. The second molding apparatus is then closed, and an upper housing portion is injected molded over the PBCA and exposed peripheral edges of the lower housing portion such that the upper housing portion becomes fused to the lower housing portion. Multiple lower housing portions connected together by plastic tethers to form a plastic strip, which facilitates efficient transfer to the second molding apparatus as a unit. The tethers are subsequently removed (e.g., singulated) to form individual memory devices.

Abstract: Manufacturing of miniaturized three-dimensional electric components are presented, as well as components manufactured by the methods. The manufacturing methods comprise micro-replication of at least one master structure, e.g. via a mould structure, in at least one polymer layer onto which layer at least one conductive path is provided.

Abstract: An apparatus that can secure an electronic device into a vehicle recess is described. The apparatus provides a vehicle-specific integrated docking station for a digital media player, e.g. Apple's iPod. The docking station contains a connecting assembly to interface the digital media player to a digital media interface than in turn is connected to a vehicle audio system. The vehicle recess may be an ashtray recess, a change-tray recess, a cup-holder recess or other appropriate recess. The vehicles may be automobiles, trucks, boats or aircraft.

Abstract: In a method for producing a protective cover for a device formed in a substrate, at first a sacrificial structure is produced on the substrate, wherein the sacrificial structure comprises a first portion covering a first area of the substrate including the device and a second portion extending from the first portion into a second area of the substrate including no device. Then a first cover layer is deposited that encloses the sacrificial structure such that the second portion of the sacrificial structure is at least partially exposed. Then the sacrificial structure is removed, and the structure formed by the removal of the sacrificial structure is closed.

Abstract: The present invention provides a composite magnetic body containing metallic magnetic powder and thermosetting resin and having a packing ratio of the metallic magnetic powder of 65 vol % to 90 vol % and an electrical resistivity of at least 104 ?·cm. When a coil is embedded in this composite magnetic body, a miniature magnetic element can be obtained that has a high inductance value and is excellent in DC bias characteristics.

Abstract: A method for forming a separable electrical connector having an electrical interface surface includes the steps of molding an interface shell from a thermoplastic, placing the interface shell against an electrical interface portion of a mold cavity and molding a housing within the mold cavity. When placed in the mold cavity, the interface shell provides a barrier to the mold cavity interface portion, wherein the housing is isolated from the electrical interface potion of the mold cavity by the interface shell. The shell has an inner surface and an outer surface and the housing is bonded to one of the inner and outer surfaces, wherein the other of the inner and outer surfaces of the shell defines the electrical interface surface of the electrical connector.

Abstract: In a terminal manufacturing method of the present invention, first a thin plate-like body including a thin plate-like terminal portion and a thin plate-like leg portion is formed with a die. The thin plate-like terminal portion has a shape corresponding to a terminal portion 24 of an upper-level terminal 22 and a terminal portion 30 of a lower-level terminal 28. The thin plate-like leg portion has the shape corresponding to a leg portion 26 of the upper-level terminal 22 and a leg portion 32 of the lower-level terminal 28. Then, the upper-level terminal 22 is formed by bending the thin plate-like leg portion toward one side of a plate-thickness direction. Also, the lower-level terminal 28 is formed by bending the thin plate-like leg portion toward the other side of the plate-thickness direction. Thus, by simply changing the bending direction of the thin plate-like leg portion, either the upper-level terminal 22 or the lower-level terminal 28 can be formed.

Abstract: In a method for forming an electrical cable connector having a voltage detection test point, an insulative shield is first molded from a thermoplastic and a conductive voltage detection test point terminal is inserted within the plastic insulative shield. After the pre-assembled insulative plastic shield and test point terminal are positioned adjacent the opening of the conductive outer shield, and after the conductive outer shield and an internal conductor are positioned within a mold cavity, an inner insulative housing is molded within the conductive outer shield and around the internal conductor.

Abstract: An electrical connector and a method for producing the same are described. The electrical connector has an insulative housing and a plurality of metallic wires. The insulative housing has a plurality of slots formed therein, and the slots are defined with a width less than that of the metallic wire. The metallic wires are set into the slots and further are folded. Each of the metallic wires has a contact portion protruding out of a surface of the insulative housing for electrically connecting the electrical component.

Abstract: There are provided a connector capable of accomplishing electrical stability between contact members constituting the connector and a base, reduction in manufacturing cost, and simplicity in assembly and a method of manufacturing the connector. A base 11 comprises a plurality of bump portions 22 extending from the bonding surface, which contact members are bonded to, toward the opposite surface, and an insulating layer interposed between the bump portions 22. The contact members 23 are bonded to the bump portions 22. Accordingly, since the contact members 23 can be surface-mounted on the base 11, it is possible to enhance the electrical stability between the contact members 23 and the base 11.

Abstract: A method of processing a strip of lead frames is disclosed. The method includes engaging the strip with a lead frame advancement system, advancing the strip to a tooling member, and performing a tooling operation on the strip.

Abstract: A connector with a dip-molded housing and a method for forming a twist-on wire connector with a dip-molded housing. To dip-mold a covering or housing on a twist-on wire connector either a mandrel carrying a twist-on wire coil, a mandrel having the a shape of a spiral coil or a twist-on wire connector are dipped into a bath of an in situ solidfiable dip-moldable material such as liquid plastic. The dip-moldable solidified material solidifies to form a dip-molded shell on the wire connector.

Abstract: A printed circuit board electrical power contact for connecting a daughter printed circuit board to a mating contact on another electrical component. The power contact includes a main section; at least one daughter board electrical contact section extending from the main section; and at least one mating connector contact section extending from the main section. The mating connector contact section includes at least three forward projecting beams. A first one of the beams extends outward in a first direction as the first beam extends forward from the main section and has a contact surface facing the first direction. Two second ones of the beams are located on opposite sides of the first beam and extend outward in a second opposite direction as the second beams extend forward from the main section. The second beams have contact surfaces facing the second direction.

Abstract: A heating element for placing on a pipe or nozzle comprises a current-carrying conductor connectable by means of connecting leads to a power supply. Each of the connecting leads has a terminal contact piece which can be engaged with a contact surface of the heating element. The contact piece can be clamped against the heating element by means of a clamping device. The contact piece rests loosely on the contact surface and the clamping force of the clamping device acts in a substantially normal manner to the contact surface and clamps the contact piece against said contact surface.

Abstract: A method for making a terminal includes forming a reinforcement enclosed around the pieces of the distal end of the terminal to combine and connect the pieces. Thus, the pieces of the distal end of the terminal are connected closely by the reinforcement to form a compact conic body without forming an opening in the distal end of the terminal, so that the distal end of the terminal has a greater structural strength, thereby preventing the distal end of the terminal from being broken or worn out due to mutual hit when the distal end of the terminal is inserted into a female terminal in a misalignment manner.

Abstract: A shielded socket includes a conducting plate including a plurality of apertures, and an insulating layer. The insulating layer surrounds the conducting plate and lines at least one aperture. In an implementation, the conducting plate includes at least one grounding site.

Abstract: A structure and method to establish an electrical connection between a tester and an electrical component. A flexible dielectric layer has a first side and a second side. A through via extends through the first side and the second side of the dielectric layer. A blind via is placed in a position that is offset from the through via and extends laterally in a first direction from a section of the first through via to a section of the flexible dielectric layer. The blind via extends in a second direction from the first side of the flexible dielectric layer to a section of the flexible dielectric layer that is between the first side and the second side of the dielectric layer. An electrically conductive member extends through the through via and extends into the blind via, thereby filling the through via and the blind via. The electrically conductive member has a first surface and a second surface.

Abstract: The present invention is a method for manufacturing an electrical connector comprising an insulative housing with a base side and an opposed side and lateral sides interposed between said base side and said opposed side and at least one conductive contact extending from the base side of the insulation in a first leg and then laterally adjacent the top side of the housing in a second leg. In this method there is provided a mold comprising a first die and an opposed second die all defining an interior cavity and an exterior area. A molding compound input port extends between the exterior area and the interior cavity and a contact receiving aperture extending through the first die from the exterior area to the interior cavity. The conductive contact is then positioned so that the first leg extends upwardly from the exterior area through the contact receiving aperture into the interior cavity. The first leg extends through said interior cavity, and the second leg extends laterally adjacent the opposed die.

Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.

Abstract: The present invention provides an electric type initiator which can secure a reliability in activation and can be easily manufactured. The electric type initiator is characterized by comprising a header portion formed by using a resin material, a pair of conductive pins having top portions going through the header portion and exposing from an end portion of the header portion, a bridge wire formed by using a conductive body bridging between the top portions of the conductive pins, and a priming arranged in contact with the bridge wire. And, the present invention provides an initiator assembly which can be easily manufactured with less steps of the manufacturing process and can further reduce a manufacturing cost.

Abstract: A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures remain fixed during heating. A bi-layer encapsulating film is used to achieve planarization. A carrier is bi-laminated with a thermoplastic film layer followed by a chemically inert protective polymer film layer that can withstand etch and cleaning processes. The thermoplastic layer is laminated on top of the carrier; the polymer layer is laminated on top of the joined thermoplastic layer and carrier. The carrier with bi-layer film is then placed onto the backside of the structures to resist chemical attack from the front side during photostrip and enable planarization. When heat is applied, the bi-layer encapsulating film melts and pushes the polymer layer into the gaps between structures thereby achieving complete planarization.

Abstract: A method for manufacturing and packaging an integrated circuit includes following steps: pressure a continuous pin material and a base board area at first; then cut off pin material into several pin units, accommodate each pin units into respective position in a mould, and ejecting plastic into the mould gap to shape a pin unit, then remove waste part of the pin material after removing down the mould parts; put four pin units and a base board into a rectangle mould, then eject plastic again into mould gap, after that cut off waste part of the base board to attain an IC socket; stick an IC chip on top of the base board of the IC socket and wire it. Finally, cover and stick a panel on the IC socket to finish the whole IC packaging procedures.

Abstract: An electrical connector (1) includes an elongate insulative housing (10) and a number of contacts (2). The insulative housing has two side walls (12) and a slot (14) between the side walls. Each side wall defines an elongate cavity (11) and a number openings (15). The contacts are received in inner surfaces (141) of the side walls. The openings extend inwardly from outer surfaces of the side walls to the contacts.

Abstract: A method for manufacturing a high frequency electrical connector including positioning a plurality of parallel contacts, a plurality of terminals, and conductors interconnecting the contacts to the terminals in a manner such that signals flowing through proximate contacts are transmitted in opposite directions to reduce near-end crosstalk.

Abstract: A method of making electrical connecting elements includes a metallic thin film 15 is formed on a mold 11 having protrusions 12 complementary in shape to a conductor pattern to be formed; a substrate 17 having a transfer layer 16 of adherent (or adhesive) material applied to one side surface thereof is provided; and the transfer layer 16 side of the substrate is brought into intimate contact with the metallic thin film 15 laid over the protrusions 12, followed by pulling the transfer layer apart from the mold so as to transfer the metallic thin film 15 covering the protrusions 12 onto the transfer layer 16 to thereby form the conductor pattern 18 on the transfer layer 16.

Abstract: A method for manufacturing an insulation displacement connector is provided. The method includes steps of providing an injection molding device, providing a first and a second terminals, putting the first and the second terminals into the injection molding device, and injecting a molding material into the injection molding device for forming a first and a second terminal seats and a middle connecting portion, so that the first and the second terminals are simultaneously encapsulated and assembled by the first and the second terminal seats for completing the insulation displacement connector.

Abstract: An electrical connector having an end face defined by a molded annulus skirt is provided with a circumferential stiffener which is molded in place at the time of molding of the skirt intermediate the inner and outer diameters of the skirt and adjacent the end face.

Abstract: A method for manufacturing and packaging an integrated circuit includes following steps: pressure a continuous pin material and a base board area at first; then cut off pin material into several pin units, accommodate each pin units into respective position in a mould, and ejecting plastic into the mould gap to shape a pin unit, then remove waste part of the pin material after removing down the mould parts; put four pin units and a base board into a rectangle mould, then eject plastic again into mould gap, after that cut off waste part of the base board to attain an IC socket; stick an IC chip on top of the base board of the IC socket and wire it. Finally, cover and stick a panel on the IC socket to finish the whole IC packaging procedures.

Abstract: Method of fabricating LED assembly disclosed herein can provides a string of original colored high intensity LEDS usable for screen displaying or traffic signal lights molded by injecting harmless polyacrylic resin in a short time duration and at low temperature.

Abstract: A method of making a stimulator electrode with a conductive polymer coating is disclosed. A polymeric coating, such as polyethylene oxide containing NaCl or a similar ionic medium, coats and fills the pores of a high surface area electrode to provide a continuous ionic network from the can to the adjacent body tissue. In certain embodiments, the underlying high surface area, porous electrode is made by chemically etching a smooth electrode surface, such as that of a conventional titanium housing, followed by applying a thin coating of a noble metal such as platinum. In other embodiments, a noble metal or an oxide thereof, such as platinum black or iridium oxide, is applied to a titanium housing to form a porous, high surface area electrode. The conductive polymeric coating is then applied over the porous noble metal or metal oxide.

Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.

Abstract: A method of forming a receptacle connector insert capable of maintaining constant distances between terminal groups even when a receptacle connector has the terminal groups of three rows or more and of being easily produced, comprising the steps of locking a terminal group (2) positioned at both ends to a pair of metal mold main bodies (4) as shown in FIG. 3(a) and holding a terminal group (2) arranged at the center in a rear core (6), moving a front core (5a) arranged on the right side of a curved part (2b) downward while bending the curved part (2b) as shown in FIG. 3(b), storing the curved part (2b) in a second storing part (10a) as shown in FIG. 3(c), moving a front core (5b) arranged on the left side toward the curved part (2b) as shown in FIG. 3(d) and storing the curved part (2b) in a second storing part (10b) as shown in FIG.

Abstract: The invention provides a method for processing leadframe items to form IC packages, each of the leadframe items comprising an IC carried by a suitable leadframe, the leadframe items being of two or more types. The method includes receiving the two or more types of leadframe items along respective input paths, moving at least two holders alternately between a processing region and a respective leadframe item reception position, each of the holders moving to the processing region and at a time when the other of the holders moves to its respective reception position, the reception positions being on respective ones of the input paths, each of the holders receiving leadframe items of the respective type at the respective reception position and delivering them to the processing region and encapsulating the ICs at the processing position.

Abstract: An SMT connector suitable for surface mounting on a printed circuit board enabling the necessary coplanarity to be secured even if not providing a coplanarity correction step after assembly, wherein contact members made of a metal having a high hardness have lead members made of a metal having a low hardness and shaped straight connected to them, the connection parts are covered by an insulating material, next, the lead members are bent in a crank shape, whereby the coplanarity of the lead members is maintained at within a predetermined accuracy, and a method of production of the same.

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150° C., and can be comprised in less than 60 minutes.

Abstract: A contactor used for testing a semiconductor device is provided. The semiconductor device testing contactor is electrically connected to electrodes of a semiconductor device to be tested. Such a contactor includes a wiring board and a first reinforcing member for reinforcing the wiring board. The contactor has a flexible base film and device connecting pads to be electrically connected to the electrodes of the semiconductor device. The first reinforcing member is disposed on the surface opposite to the semiconductor device connecting surface of the wiring board. The wiring board and the first reinforcing member are collectively bonded.

Abstract: The present invention provides methods for shielding a cable that comprises a plurality of conductive leads that are encapsulated by a dielectric substrate. One embodiment of the method comprises applying a metallized layer around the dielectric substrate and coupling a metallized thermoform shield around an end of the metallized dielectric substrate and conductive leads so as to create a conductive connection between the metallized thermoform shield and the metallized layer on the dielectric substrate.

Abstract: A conductive damper for use in a speaker is provided, the endurance and the moldability of which are improved. A base is moved downward to allow an inner top mold to abut on a bottom mold, then the base is further moved downward to allow the inner top mold and the bottom mold to be applied pressure and the base moves down with being guided by guiding means. At this time, energizing means energizes the inner top mold to press the bottom mold, thereby corrugations for the inner part of a workpiece of the conductive damper are molded. At this time, the workpiece of the conductive damper is pulled toward the inner side thereof. Then, the base is further moved downward to press an outer top mold onto the bottom mold, thereby corrugations for the outer part of the workpiece of the conductive damper are molded.

Abstract: A method of making an article, such as an electrical connector includes an injection-molded plastic substrate and a pattern of injection-molded metal conductors supported on and mechanically interlocked with the substrate, wherein one of the substrate and the conductors is over-molded onto the other of the substrate and the conductors.

Abstract: A display module comprising a display assembly bonded to a substrate. The display assembly comprises a first side for displaying visual information and a second side. The second side comprises a first area having an adhesive layer and a second area having a through connection to a conductive pad. The substrate comprises a first side for receiving the display assembly. The first side comprises a first surface area for bonding to the adhesive layer and a second surface area comprising an electrode pad having multiple electrodes for receiving electrical signals. A conductive elastomer is positioned within the through connection establishing conductive continuity between the conductive pad and the electrode pad when the display assembly is bonded to the substrate.

Abstract: A semiconductor device lead frame made of copper or a copper alloy used for a resin sealing type semiconductor device, comprising a lead frame body made of copper or a copper alloy, a double-layer under plating film formed on the lead frame body and comprising a lower layer made of zinc or a copper-zinc alloy and an upper layer made of copper having a thickness of 0.02 to 0.4 &mgr;m and a precious metal plating film formed on at least a wire bonding portion of an inner lead of the copper upper layer of the under plating film. This lead frame is excellent in adhesion with a sealing resin, is free from contaminate a precious metal plating solution (particularly a silver plating solution), has a good appearance of the precious metal plating film, is excellent in corrosion resistance and moisture resistance, and has a good appearance and adhesion of an external solder plating film.

Abstract: A method for forming a contact insert subassembly (34) for a modular jack connector (200), includes the following steps: stamping a contact strip (10) to form a group of contacts (20) which are interconnected by an end carrier (11) and a middle carrier (13), the middle carrier dividing the contacts into first and second portions (21, 22); bending the first portion into a soldering tail portion for the contacts; subjecting the contact strip to an insert molding to form an insulative block (30) around the middle carrier (13); cutting the end carrier and the middle carrier from the contacts; and bending the second portion to form a contacting portion for the contacts.

Abstract: A sub-fractional Horsepower motor, intended for use with a worm on its output shaft, is positioned adjacent a servo actuator housing with the motor shaft disposed adjacent to and oriented generally parallel to the housing. The housing is provided with a resiliently deflectable rear motor mounting stanchion having a camming surface and a front motor mounting stanchion, both preferably formed integrally as a one-piece member with the housing. Upon assembly into the housing, the motor is maintained in its parallel orientation and moved in a single direction normal to the shaft to contact the camming surfaces, on the rear stanchion and deflects and snap-locks into the stanchion and the rear stanchion biases the motor axially such that the opposite shaft end of the motor registers against one surface of the front stanchion.

Abstract: A method of making a socket test probe which results in a probe head which has flat plates which serve as electrodes encased in resin. The electrodes are conductive plates with one or more edges of the conductive plates exposed for connection to the electrodes of a socket. The entire probe head starts as a solid block of conductive material which is drilled, machined, filled with resin and machined again to form a socket testing probe utilizing the edges of conductive plates as electrodes.