Abstract: A combination structure of a vapor chamber and a heat pipe includes a half-shell seat element, a half-shell cover element, a wick structure, and a working fluid. The half-shell seat element includes a vapor chamber half-shell seat and multiple heat pipe half-shell seats. Each heat pipe half-shell seat is extended from the vapor chamber half-shell seat. The vapor chamber half-shell seat includes a vapor chamber cavity. Each heat pipe half-shell seat includes a heat pipe cavity. Each heat pipe cavity communicates with the vapor chamber cavity. The half-shell cover element is sealedly connected with the half-shell seat element. The wick structure is continuously laid on the vapor chamber half-shell seat and each heat pipe half-shell seat, and is formed in the vapor chamber cavity and each heat pipe cavity. The working fluid is disposed in the vapor chamber cavity.

Abstract: A heat pipe with micro tubes includes of a solid heat conductor provided therein with two or more parallel micro tubes. The micro tubes are filled with a working medium which exchanges heat through phase change. Two ends of the heat conductor are sealed and at least one of the ends is provided with a sealing strip of gradually shrinking shape that is formed from cold welding.

Abstract: A heat-dissipating device includes a casing and a heat dissipating fin set. The casing has a first hole structure. The heat dissipating fin set includes a protruding fin, a sheltering component and a bridging component. A hollow chamber of the protruding fin has a first opening and a second opening adjacent to each other. The first opening is connected to an inner space of the casing. The sheltering component is disposed on the protruding fin to shelter the second opening. The bridging component is connected to the protruding fin and fixed onto the first hole structure.

Abstract: A concentrate adaptor for a vaporizer device includes a reservoir and a base. The reservoir holds a concentrate. The reservoir is positioned within a vessel of the vaporizer device and is heated by a heating element of the vaporizer device to transfer heat to the concentrate, thereby generating an aerosol for inhalation by a user. The reservoir includes a sidewall surrounding an interior volume of the reservoir. The reservoir also includes a capillary structure positioned along the sidewall configured to direct the concentrate to the sidewall to be heated by the heating element.

Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.

Abstract: Embedded cooling systems and methods of forming the same are disclosed. A system may include a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of the power device stack, and a vapor chamber embedded within at least the pre-preg layer of the PCB stack and the power device stack being coupled to the vapor chamber.

Abstract: A heat transfer member reinforcement structure includes a main body. The main body has a first side, a second side and a reinforcement member. The reinforcement member is selectively disposed between the first and second sides or inlaid in a sink formed on the first side. The reinforcement member is connected with the main body to enhance the structural strength of the main body.

Abstract: A wick assembly for use with a heat pipe is disclosed. The wick assembly includes an end plug including a wick receiving area, a wick, and a crimp. A portion of the wick is positioned about the wick receiving area. The crimp is positioned about the portion of the wick and the wick receiving area. The end plug, the portion of the wick, and the crimp are diffusion bonded.

Abstract: Printed circuit board (PCB) substrates include at least one pre-preg layer interposed between one or more electrically conductive layers, power device stacks, each having a power device embedded within the PCB substrate in a vertical stack configuration, and a flat heat pipe positioned between the power device stacks within the at least one pre-preg layer, one surface of the flat heat pipe directly bonded to a first one of the power device stacks and an opposite surface of the flat heat pipe thermally coupled to a second one of the power device stacks.

Abstract: A cooling device for a computing system is disclosed. The device includes a heat sink, a base, and a cover. The heat sink includes a plurality of fins extending from a first section of the heat sink. The base includes a plurality of grooves on a first side. The plurality of grooves is configured to mate with at least a portion of the plurality of fins of the heat sink. The cover is configured to be coupled to the base and encapsulate the heat sink. The cover further includes two apertures, each aperture configured to be connected to a tube. A width of the plurality of fins of the heat sink is less than a width of the plurality of grooves of the base. A height of the heat sink is less than a height of an interior portion of the cover.

Abstract: A dual heat transfer structure, comprising: at least a heat pipe and at least a vapor chamber; the heat pipe having a first end, an extension portion, and a second end, the first and second ends disposed at the two ends of the extension portion; the vapor chamber being concavely bent with its two ends being joined together and selectively compasses, encircles, encloses, or surrounds one of the first and second ends and extension portion. The dual heat transfer structure of the present invention is a complex structure that can both transfer heat with a large area and to the distal end of the structure.

Abstract: The vapor chamber includes a casing, a working fluid, a microchannel, and a wick. The casing includes an upper casing sheet and a lower casing sheet that face each other and are joined together at an outer edge so as to define an internal space therebetween. The working fluid is sealed in the internal space. The microchannel is in the lower casing sheet and in communication with the internal space so as to form a flow path for the working fluid. The wick is in the internal space of the casing, and is in contact with the microchannel. An area of the wick is larger than an area of a region corresponding to the microchannel in a plan view of the vapor chamber.

Abstract: A method of passive cooling for a high concentrating photovoltaic, the high concentrating photovoltaic, includes a photovoltaic receiver, a parabolic dish reflector and a plurality of thermally conductive heat pipes having a direct thermal contact between the receiver and the reflector to transfer excessive heat. The method includes receiving sunlight by the parabolic dish reflector, reflecting the sunlight towards the photovoltaic receiver that converts the sunlight into electricity and heat, transferring the heat through the thermally conductive heat pipes and absorbing the heat by the reflector serving a dual purpose as a heat sink. A reduction in weight and cost is accomplished by incorporating the flat heat pipes.

Abstract: A heat dissipation device is provided and includes a vapor chamber unit, a heat pipe set provided on an outer surface of the vapor chamber unit, a first fin set provided on the outer surface of the vapor chamber unit and sleeving the heat pipe set, and a second fin set stacked on the first fin set and sleeving the heat pipe set, where the fin arrangement direction of the first fin set is different from the fin arrangement direction of the second fin set.

Abstract: A method of passive cooling for a high concentrating photovoltaic, the high concentrating photovoltaic, includes a photovoltaic receiver, a parabolic dish reflector and a plurality of thermally conductive heat pipes having a direct thermal contact between the receiver and the reflector to transfer excessive heat. The method includes receiving sunlight by the parabolic dish reflector, reflecting the sunlight towards the photovoltaic receiver that converts the sunlight into electricity and heat, transferring the heat through the thermally conductive heat pipes and absorbing the heat by the reflector serving a dual purpose as a heat sink. A reduction in weight and cost is accomplished by incorporating the flat heat pipes.

Abstract: A conformal thermal ground plane is disclosed according to some embodiments along with a method of manufacturing a conformal thermal ground plane according to other embodiments. The method may include forming a first planar containment layer into a first non-planar containment layer having a first non-planar shape; forming a second planar containment layer into a second non-planar containment layer having a second non-planar shape; disposing a liquid cavity and a vapor cavity between the first non-planar containment layer and the second non-planar containment layer; sealing at least a portion of the first non-planar containment layer and at least a portion of the second non-planar containment layer; and charging at least the liquid cavity with a working fluid.

Abstract: A method for manufacturing a roll-bond heat exchanger has steps of: (1) A preparing step: preparing an in-process roll-bond plate that has a main plate with a bulged structure, and a degassing portion with a tube; (2) A degassing step: removing air from the bulged structure through the tube; (3) A filling step: filling refrigerant into the bulged structure; (4) A pressing step: pressing the bulged structure flat to form a pressed portion; (5) A cutting step: cutting the degassing portion to form a cut portion on the main plate; and (6) A sealing step: welding the cut portion. The main plate and the degassing portion are integrally formed as a single part and the degassing portion is able to be directly connected with the vacuum filling machine. Accordingly, processing steps and manpower for manufacturing the roll-bond heat exchanger are reduced.

Abstract: A convection/radiation air conditioning terminal and an air conditioning system are provided. The convection/radiation air conditioning terminal includes a heat pipe. One end of the heat pipe is connected to a first heat exchange pipeline, and the other end of the heat pipe is connected to a second heat exchange pipeline. The heat pipe includes multiple first microchannels which are arranged and independent of each other, and multiple second microchannels which are arranged and independent of each other, where the first microchannels and the second microchannels are arranged and independent of each other. The first microchannels are each internally provided with a first heat exchange working medium, and the second microchannels are each internally provided with a second heat exchange working medium.

Abstract: A method for sealing a high-temperature heat pipe includes: (1) necking and reducing two ends of the heat pipe separately, so as to obtain a necked end and a reduced end; (2) sealing the necked end by laser welding or electron beam welding; (3) placing the heat pipe in an inert gas glove box, and pouring a working medium without impurities into the heat pipe; (4) heating the heat pipe, connecting the reduced end to a vacuum pump, pumping gas inside the heat pipe by the vacuum pump to vacuumize the heat pipe, such that pressure in an inner cavity of the heat pipe reaches a target pressure, and flattening the reduced end; and (5) sealing an opening of the flattened reduced end by electron beam welding or laser welding, so as to obtain the high-temperature heat pipe.

Abstract: A multi-thermal characteristic heat sink fin, comprising a first heat spreading plate, a second heat spreading plate, and a primary heat spreading plate is provided. A plurality of multi-thermal characteristic heat sink fins is assembled together to form a heat sink, further having at least a heat pipe assembled therethrough, and a base plate, assembled to the at least a heat pipe and in contact with a heat source. The primary heat spreading plate is sandwiched and enclosed within the first and second heat spreading plates, hindering debris, contaminants, and moisture from entering the surface interfaces therebetween. The material of the heat pipes and primary heat spreading plate is different from that of the first and second heat spreading plates. No heat treatment process of two or more different materials is required for assembly of the multi-thermal characteristic heat sink fin and at least a heat pipe assembled thereto.

Abstract: A heat transfer tube is made of aluminum and includes a streak-shaped Zn diffusion layer (6, 106) which is spirally formed on a circular outer peripheral surface in a length direction. According to this heat transfer tube, even in a case where rainwater or dew concentration water is intensively accumulated in a portion of the outer peripheral surface in a circumferential direction, it is possible to obtain a sufficient corrosion resistance.

Abstract: A heat dissipation structure mounted in an electronic device includes a base body defining a seal chamber, a heat transfer medium in the seal chamber, and a connecting element. The seal chamber includes interconnected evaporation and condensation portions. The connecting element is coupled to the evaporation portion and a camera module of the electronic device. Heat generated by the camera module is transferred to the evaporation portion via the connecting element, the heat transfer medium turns to gas, and the gas flows into the condensation portion and condenses, dissipating the heat to the outside of the electronic device. The disclosure further provides an electronic device using the heat dissipation structure.

Abstract: A vapor chamber includes a housing including first and second sheets that face each other and that include respective outer edge portions joined to each other, supports that support the first and second sheets from inside and that are disposed therebetween, and a hydraulic fluid enclosed in the housing. The first and second sheets do not include an angled portion having an angle of about 90° or less between a joint and a support nearest to the joint. The expression 0.02?b/a?0.3 is satisfied, where a is a distance from an outer edge of the outermost support to an inner edge of the joint between the first and second sheets, and b is a distance between the first and second sheets at the outer edge of the outermost support.

Abstract: A heat pipe includes an intermediate metal layer interposed between outermost metal layers, an inlet passage defined by opposing wall portions of the intermediate metal layer and the outermost metal layers, and a porous body provided at one or both of the wall portions. The porous body includes a first bottomed hole that caves in from one surface of the intermediate metal layer, a second bottomed hole that caves in from the other surface of the intermediate metal layer, and a pore formed by the first bottomed hole that partially communicates with the second bottomed hole. The outermost metal layers, the intermediate metal layer, the inlet passage, and the porous body form an inlet for filling a working fluid into the heat pipe.

Abstract: An apparatus for cooling an electronic device is disclosed. In an aspect, the apparatus includes a vapor chamber coupled to a heat generating component of the electronic device. In an aspect, the vapor chamber is coupled to an inner surface of an outer cover of the electronic device and conforms to a shape of the inner surface of the outer cover. In another aspect, the vapor chamber forms the outer cover of the electronic device. The vapor chamber comprises a sealed container, a wick structure disposed on an inner surface of the sealed container, and a fluid contained in the sealed container, wherein as heat is applied to an evaporator side of the sealed container coupled to the heat generating component, the fluid vaporizes over a condenser side of the sealed container opposite the evaporator side and returns to the evaporator side via the wick structure.

Abstract: A method of assembling a thermosiphon system includes placing a base of an evaporator and a tube of a condensate line in a brazing fixture such that the base covers an aperture in a bottom of the tube with a bottom surface of the base abutting a precision machined surface of the brazing fixture, and simultaneously brazing the base and the tube while held by the brazing fixture to form a unitary body in a single brazing process, the unitary body including the evaporator and the condensate line.

Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.

Abstract: A heat pipe structure and a manufacturing method of the heat pipe structure. The heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber. The chamber has a first side and a second side. A working fluid is contained in the chamber. The wall faces of the first and second sides are respectively formed with a first channel set and a second channel set. A first contact section and a second contact section are respectively formed at the junctions between the first and second channel sets and the wall faces of the first and second sides. The mesh body is disposed in the chamber and attached to the first and second contact sections. Accordingly, the thickness of the heat pipe is greatly reduced and the manufacturing cost of the heat pipe is lowered.

Abstract: The present application relates to a method of manufacturing a heat sink from a plurality of extruded lamellas, each lamella including a base portion having a top surface, a bottom surface, and two side surfaces, each lamella further including a fin portion extending from the top surface of the base portion, wherein the base portion is wider than the fin portion. The method includes aligning the base portions of the plurality of lamellas with the fin portion of each lamella extending in the same direction and the side surfaces of adjacent base portions facing each other; pressing the base portions of adjacent lamellas into contact with each other by applying a force to the side surface of at least one of the base portions; and welding the bottom surfaces of adjacent base portions together. A heat sink and a lamella for use in manufacturing a heat sink are also disclosed.

Abstract: The method of manufacturing heat pipe is disclosed to insert a center bar into a metal tube such that the center bar contacts a clearance area of the inner sidewall of the metal tube. Then, the method is to fill the interval between the center bar and the metal tube with powder for sintering. At last, the method is to perform a sintering, extract the center bar, inject working fluid, and close the metal tube. A heat pipe is therefore formed. Because of no sintered powder on the clearance area, the heat pipe can be bent at the clearance area without damaging the capillary structure formed by the sintered powder. The flow path of the working fluid is not interrupted or influenced, so the heat transfer efficiency can be maintained, which overcomes the decrement of the heat transfer efficiency of a bent heat pipe in the prior art.

Abstract: A method for generating a microchannel heat pipe on a substrate surface includes co-extruding a primary material and a secondary material such that the primary material forms side walls that are spaced apart by the secondary material to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body structure having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid.

Abstract: A manufacturing method of thin heat pipe includes steps of: providing a hollow tubular body and a mesh capillary structure; placing the mesh capillary structure into the tubular body; providing a tool and placing the tool into the mesh capillary structure; sintering the tubular body to make the mesh capillary structure sintered on an inner wall face of the tubular body and then taking out the tool; vacuuming the tubular body and filling a working fluid into the tubular body; sealing the tubular body; and pressing and flattening the tubular body into a flat form by means of mechanical processing. According to the manufacturing method of thin heat pipe, the mesh capillary structure can fully tightly attach to the inner wall face of the tubular body to keep the completeness of the tubular body and the completeness of the vapor-liquid circulation passageways in the heat pipe.

Abstract: A plate-type heat pipe sealing structure and a manufacturing method thereof are disclosed. The plate-type heat pipe includes a main body and a tube body. A notch is formed at one of two ends of the main body or one of four corners of the main body as a sealed section thereof. The tube body is disposed in the notch and connected with the main body. The main body of the plate-type heat pipe is cut by means of a mechanical processing method such as punching to form the notch. The notch of the main body is sealed by means of high frequency wave or copper welding. The tube body is positioned within the notch without protruding from the main body of the plate-type heat pipe. Accordingly, when assembled with a heat sink unit, the sealed section of the plate-type heat pipe will not interfere with the heat sink unit.

Abstract: A structural panel for a satellite comprising an elongate pipe mounted thereto. The heat pipe is bonded to the panel intermediate its remote ends with a thermally conductive adhesive. The adhesive is omitted proximate at least one distal end of the heat pipe. The at least one distal end of the heat pipe without adhesive is mechanically secured to the panel by at least one bolt received in a cooperating threaded receiving element. A method of manufacturing such a panel is also provided.

Abstract: A slim-type heat pipe includes a tube, being hollow and flat; and a wick structure, longitudinally disposed in the tube, having an attachment side attached on a local portion of an inner side of the tube and a formation side opposite to the attachment side, and a vapor passage formed between the formation side and the inner side of the tube. The wick structure is provided with grooves radially around the inner side of the tube. The attachment side is attached on the grooves. Depth of the groove is less than 30% of thickness of a wall of the tube.

Abstract: The present invention relates to a flat plate heat pipe and a method for manufacturing the same. The heat pipe includes a flattened pipe whose inner surface is coated with a wick structure layer. The interior of the flattened pipe is provided with a sintered supporting layer and a working fluid. The sintered supporting layer has a plurality of posts arranged in the flattened pipe to vertically support therein. With this arrangement, the thickness of the pipe can be reduced but the whole structural strength can be maintained to prevent deformation. Further, a return path for the working fluid can be provided in the pipe. By only sealing two sides of the pipe, a sealed chamber can be formed for the operation of the working fluid. By the inventive method, the manufacturing process can be simplified and a larger space inside the chamber can be obtained.

Abstract: A heat pipe structure and a manufacturing method of the heat pipe structure. The heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber. The chamber has a first side and a second side. A working fluid is contained in the chamber. The wall faces of the first and second sides are respectively formed with a first channel set and a second channel set. A first contact section and a second contact section are respectively formed at the junctions between the first and second channel sets and the wall faces of the first and second sides. The mesh body is disposed in the chamber and attached to the first and second contact sections. Accordingly, the thickness of the heat pipe is greatly reduced and the manufacturing cost of the heat pipe is lowered.

Abstract: A method for manufacturing a heat pipe with an ultra-thin capillary structure comprises the steps of: (a) preparing a hollow tube body, and pre-manufacturing a capillary structure that is shaped as a thin plate, the capillary structure having an adhering surface attached to a partial portion of an inner wall of the tube body and a forming surface that is opposite to the adhering surface; (b) disposing the capillary structure into the tube body so as to let the adhering surface be attached to the partial portion of the inner wall of the tube body for positioning; and (c) pressing the tube body in order to let the inner wall of the tube body urge on a partial portion of the forming surface of the capillary structure, and a vapor channel being formed between the capillary structure and the inner wall of the tube body.

Abstract: A method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction includes the steps of preparing a slab-shaped capillary structure, forming narrow and long recessed portions with an interval apart from each other on a surface of the slab-shaped capillary structure by an extrusion method, and arranging the recessed portion along the lengthwise direction of the slab-shaped capillary structure, and installing the slab-shaped capillary structure in a hollow plate-like housing, such that a vapor channel is formed between each recessed portion of the slab-shaped capillary structure and an inner wall of the plate-like housing.

Abstract: A method for enclosing a heat pipe with metal is disclosed. The method includes the steps of: a) providing a tube made of a metal; b) putting the heat pipe in a hollow of the tube; and c) stretching the tube to shrink an inner diameter of the tube for tightly enclosing the heat pipe.

Abstract: A heat transfer device filled with a working fluid, includes a casing and a wick disposed within the casing. The wick includes a first sintered layer, a second sintered layer, and a third sintered layer. The first sintered layer is disposed proximate to an inner surface of the casing and the second sintered layer is disposed on the first sintered layer. The second sintered layer includes a first set of 3-dimensional sintered projections and a second set of 3-dimensional sintered projections disposed along a portion of the wick. Further, the third sintered layer is disposed on at least a portion of the second sintered layer. The heat transfer device includes at least one first sintered particle of the first sintered layer, which is smaller in size than at least one second pore of the second sintered layer.

Abstract: A system, including: a subsea pressure vessel; and a passive heat transfer apparatus, wherein the passive heat transfer apparatus penetrates a hull or shell of the subsea pressure vessel.

Abstract: A method and apparatus for cooling a heat source is disclosed. The apparatus includes a fin-diffuser including a blower integrated with fins of a diffuser. A heat spreader is coupled to the fin-diffuser. The heat spreader is configured to spread heat from a location proximate the blower to location of the fins. The apparatus spreads heat from a heat source proximate a blower of the fin-diffuser to a location away from the blower to cool the heat source.

Abstract: A heat transfer device includes a casing and a wick disposed within the casing. The wick includes a first sintered layer and a second sintered layer. The first sintered layer includes a plurality of first sintered particles, having a first porosity and a plurality of first pores. The first sintered layer is disposed proximate to an inner surface of the casing. The second sintered layer includes a plurality of second sintered particles, having a second porosity and a plurality of second pores. The second sintered layer is disposed on the first sintered layer. The heat transfer device includes at least one first sintered particle smaller than at least one second pore and the first porosity is smaller than the second porosity.

Abstract: A vapor chamber includes a first metal cover plate and a second metal cover plate. The first metal cover plate has a plurality of first support portions, each of the first support portions has a head portion and a neck portion, and the head portion is extended from the neck portion. The second metal cover plate has a plurality of second support portions, each of the second support portions has a through hole and an engaging recess, and the engaging recess is formed in the through hole. The head portion is disposed in the engaging recess and the neck portion is disposed in the through hole, such that the first support portion and the second support portion are engaged with each other.

Abstract: A method of making a fluid cooled assembly that incorporates a base that forms a partial enclosure defining an interior void space and having a top wall that has a top surface and that defines at least one opening through the top wall to the void space, the base further defining fluid entrance and exit ports into the void space, the top wall being made of material that can be friction stir welded. A lid having a size and shape substantially conformal to the opening, having a top surface and a bottom surface that defines a set of downwardly extending pins, and that is formed of a material that can be friction stir welded to the base is placed into the opening so that the lid top surface is flush with the top surface of the base top wall and friction welding the lid to the base.

Abstract: A method for manufacturing a casing of a heat pipe includes steps: providing a hollow mold; injecting a feedstock of powder and molten binder into the mold under pressure, thus forming a desired body of a first shell and a desired body of a second shell; separating the binder from the body of the first shell and the body of the second; sintering the body of the first shell and the body of the second shell, thereby forming the first shell and the second shell; and mounting the second shell on the first shell and sintering the first shell and the second shell together, thereby forming the casing of the heat pipe.

Abstract: A heat pipe system and methods of arranging a heat pipe system are provided. The heat pipe system includes a plurality of heat pipes, with each of the plurality of heat pipes including a hot end thermally coupled to a heat source and a cold end thermally coupled to a heat sink The plurality of heat pipes include a first pair of heat pipes. When the plurality of heat pipes are secured to a rotatable body, the first pair of heat pipes are aligned with and oriented in opposing directions along a first axis of rotation of the rotatable body.

Abstract: A heat transfer arrangement for a fluid-washed body having first and second ends and a fluid-washed surface extending there-between. The arrangement includes a heat transfer member extending from the first end at least part way along the body towards the second end. A heat source is arranged in use to heat the heat transfer member in the vicinity of the first end of the body. A plurality of thermal control layers are provided on the heat transfer member, each of the layers having a different thermal conductivity and being juxtaposed so as to create a thermal conductivity profile which varies along the length of the member. The arrangement may be used for prevention of icing of an aerofoil body such as a blade, vane or the like.

Abstract: A thermal management device including a first face configured to be in contact with a hot source and a second face opposite the first face configured to be in contact with a cold source, and at least one network of cells filled with a solid/liquid phase-change material located in a cavity between the first and second faces, wherein the cells include walls formed of carbon nanotubes, wherein the nanotubes extend roughly from the first to the second face, thermally connecting the first face to the second face.