Abstract: A semiconductor module, including a cooler having first and second flow passages respectively formed on first and second sides of the semiconductor module that are opposite to each other, and a third flow passage connecting the first and second flow passages. The semiconductor module further includes a laminated substrate disposed on the cooler and having first to third circuit boards, a first sensing chip having a sensing function for detecting a temperature and a first non-sensing chip not having the sensing function, disposed on the first circuit board side by side along the third flow passage, and a second sensing chip having the sensing function and a second non-sensing chip not having the sensing function, disposed on the third circuit board side by side along the third flow passage. The first and second sensing chips are respectively disposed on the second side and the first side of the semiconductor module.

Abstract: Methods and apparatus of forming a thermal interface with condensate are described. In an example, a device may be disposed in a test environment or a test apparatus. An amount of condensate may be accumulated on a heat sink to coat the heat sink with a layer of condensate. The coated heat sink may be disposed on the device, where the layer of condensate is directed towards the device, and the disposal of the coated heat sink causes the layer of condensate to spread among voids between the heat sink and the device to form a thermal interface that includes the condensate. A test may be executed on the device with the thermal interface comprising the condensate between the coated heat sink and the device.

Abstract: A wafer probe test system includes a chuck to support a wafer, and a probe card having a first side to face the chuck, an opposite second side, and an aperture that extends between the first and second sides. The system also includes a probe head mounted to the first side of the probe card and having probe pins to contact a device under test of the wafer, and an infra-red thermal sensor facing the aperture of the probe card to sense a temperature of the wafer.

Abstract: A probe device according to an embodiment is a probe device for inspecting electrical characteristics of an inspection target object, mounted on a mounting table, by electrically contacting probes and the inspection target object to each other. The probe device includes a support base having on an upper surface thereof a needle trace transfer member for transferring needle traces of the probes, a fixed support portion extending from a side of the mounting table and configured to fix and support the support base from below, and a movable support unit that is disposed below the support base and is configured to be moved up and down to be in contact with the support base and movably support the support base.

Abstract: A prober includes a plurality of inspection chambers, each of the plurality of inspection chambers including: a probe card having a plurality of probes; a probe card holder configured to hold the probe card; a chuck top configured to place a wafer on the chuck top; a seal mechanism configured to form a sealed space between the probe card holder and the chuck top; a temperature adjustor configured to adjust a temperature of the chuck top; and a gas supplier configured to supply a dry gas to the sealed space, and wherein, in a state in which no wafer is placed on the chuck top, the sealed space is purged with the dry gas, and precooling of the probe card is performed by cold heat of the chuck top having a temperature adjusted by the temperature adjustor.

Abstract: An inspection apparatus includes: a stage on which an inspection target is mounted; a temperature adjustment mechanism configured to adjust a temperature of the stage; an inspecting part configured to exchange electrical signals for an electrical characteristics inspection with the inspection target; a probe card having terminals in contact with the inspection target; an intermediate connection member having connectors electrically connecting the inspecting part and the probe card; a position adjustment mechanism configured to adjust a relative position between the stage and the probe card; a temperature measurement member configured to measure a temperature of the intermediate connection member; a preliminary temperature adjusting part configured to adjust a temperature of the probe card prior to the electrical characteristics inspection; and a determining part configured to determine whether or not the temperature of the probe card is stabilized, based on the temperature of the intermediate connection membe

Abstract: An inspection system, for inspecting an inspection target on a stage in a low temperature environment, includes a system main body including an inspection apparatus having inspection chambers each accommodating an inspection unit for performing electrical inspection of an inspection target on a stage and having inspection spaces arranged in multiple stages vertically, the plurality of inspection chambers being arranged horizontally, and a loader unit for transferring the inspection target with respect to the stage of the inspection unit; and a coolant supply unit configured to supply a coolant to the stage. The system main body further includes coolant line arrangement spaces, in which coolant lines extending from the coolant supply unit are arranged, provided above or below the respective inspection spaces to correspond to the respective inspection spaces, and the coolant lines are directed toward the corresponding inspection spaces in each of the coolant line arrangement spaces.

Abstract: An SOI substrate evaluating method includes: forming a device onto a measuring SOI substrate, and previously determining a relationship between an interface state density and a leakage power upon application of radio-frequency thereon, or converting the interface state density to a resistance followed by previously determining a relationship between the converted resistance and the leakage power; measuring an interface state density of the evaluation target SOI substrate to determine the interface state density or a resistance converted from the interface state density; evaluating a leakage power of the evaluation target SOI substrate from the measured interface state density of the evaluation target SOI substrate on the basis of the determined relationship between the interface state density and the leakage power, or from a resistance converted from the measured interface state density of the evaluation target SOI substrate on the basis of the determined relationship between the resistance and leakage power.

Abstract: Provided is a probe station system which can measure thermal distribution and thermographic images. More particularly, a probe station is provided which can detect an electrical characteristics change according to the supply of heat to an element, for example a thermoelectric element to measure the characteristics of the element. The probe station for the simultaneous measurement of thermal and electrical characteristics of a thermoelectric element includes: a chamber, a base, a platform, a probe unit, a heat source, and an infrared image detection unit and the thermographic image and the voltage signal of the element are synchronized in real time.

Abstract: Embodiments of the invention are based on a method for positioning a carrier with a plurality of electronic components in a device for testing the electronic components, wherein the carrier is provided with a pick-and-place unit. According to embodiments of the invention several markings at one side of the carrier are detected with at least one camera and the position of the markings is determined in relation to the known position of a nest for receiving the carrier, the nest is moved into a position exactly opposite to the carrier, the carrier is handed over to the nest, several further markings at the other side of the carrier are detected by at least one further camera and the position of the further markings is determined in relation to the determined position of a test socket, the nest is positioned in a position exactly opposite to the test socket and the carrier is pressed against the test socket.

Abstract: A wafer handler including, a wafer loading station (3) for loading a wafer (1) mounted on a tack film (2); a tensioner (30) for tensioning the tacky film; a picking module (66) for successively picking a plurality of devices from the wafer; a vision system (5, 50) with one or several cameras (50) for capturing a first image of the wafer or of portions of the wafer, the first image showing a plurality of devices, wherein the vision system is arranged for determining from the first image the individual position of a plurality of devices. The wafer handler further includes an additional camera (63) positioned proximate to the picking module (66) and arranged for capturing an second image of a device to be picked, wherein the second image is used for fine adjustment of the wafer so that the device to be picked is centered under the picking module.

Abstract: An integrated circuit (IC) device tester maintains a set point temperature on an IC device under test (DUT) having a die attached to a substrate. The tester includes a thermal control unit and a fluid management system configured to supply the thermal control unit with fluids for pneumatic actuation, cooling, and condensation abating. The tester can includes a box enclosing the thermal control unit thereby providing a substantially isolated dry environment during low humidity testing of the DUT. The heat exchange plate may include an inner structure for thermal conductivity enhancement.

Abstract: A device tester for an IC device under test (DUT), the DUT having a substrate and an attached die. The device tester includes a thermal control unit and a test socket assembly which conforms to the DUT's profile. The thermal control unit includes a pedestal assembly, a heater having a fuse coupled to a heating element, a substrate pusher, and a force distributor for distributing force between the pedestal assembly and the substrate pusher. The test socket assembly includes a socket insert that supports and also conforms to the DUT's profile.

Abstract: Apparatus and method adapted for use with an optionally pre-conditioned air supply that is pressurized, for ramping a component to a temperature setpoint, having a vortex tube, a ventilated mount connected to the vortex tube, a pedestal adapted for thermal connection with the component, and a heat exchanger thermally connected with the pedestal and extending within an inward hollowed and enclosed chamber of the ventilated mount, the chamber having wall thickness and size and having a plurality of smaller apertures, or a single larger aperture, therein, and optionally baffling, so as to be adapted for regulating the airflow through the chamber for effectively ramping the temperature of the component and to maximize noise abatement performance.

Abstract: Thermal control units (TCU) for maintaining a set point temperature on an IC device under test (DUT) are provided. The units include a pedestal assembly comprising a heat-conductive pedestal, a fluid circulation block, a thermoelectric module (Peltier device) between the heat-conductive pedestal and the block for controlling heat flow between the pedestal and fluid circulation block, and a force distribution block for controllably distributing a z-axis force between different pushers of the TCU. Alternatively, instead of a thermoelectric module, a heater can provide heat to the DUT. Optionally, a swivelable temperature-control fluid inlet and outlet arms may be provided to reduce instability of the thermal control unit due to external forces exerted on the TCU such as by fluid lines attached to the fluid inlet and outlet arms. Also optionally, an integrated means for abating condensation on surfaces of the TCU during cold tests may be provided.

Abstract: Pressing an electronic device (2) to be tested to contact terminals (132a and 132b) while bringing a heater (112) having equal or close temperature change characteristics to those of the electronic device to be tested by a test pattern, transmitting a test pattern to the electronic device to be tested in this state, and controlling a power consumption of a heater so that total power of a power consumption of the electronic device to be tested by the test pattern and a power consumption of the heater becomes a constant value.

Abstract: Thermal control units (TCU) for maintaining a set point temperature on an IC device under test (DUT) are provided. The units include a pedestal assembly comprising a heat-conductive pedestal, a fluid circulation block, a thermoelectric module (Peltier device) between the heat-conductive pedestal and the block for controlling heat flow between the pedestal and fluid circulation block, and a force distribution block for controllably distributing a z-axis force between different pushers of the TCU. Optionally, a swivelable temperature-control fluid inlet and outlet arms may be provided to reduce instability of the thermal control unit due to external forces exerted on the TCU such as by fluid lines attached to the fluid inlet and outlet arms. Also optionally, an integrated means for abating condensation on surfaces of the TCU during cold tests may be provided.

Abstract: A handler for conveying a plurality of devices under test to a socket for a test that can reduce a test time includes: a test section provided with the socket; a heat applying section into which a tray having a plurality of devices under test placed on its surface is conveyed and that controls the temperature of the devices under test to a predetermined test temperature and conveys the tray into the test section; a device image capturing section that in the heat applying section, captures images of the respective devices under test by moving with respect to the surface of the tray in two non-parallel directions of a first direction and a second direction; and a position adjusting section that adjusts the positions of the devices under test with respect to the socket based on the images of the devices under test captured by the device image capturing section.

Abstract: Methodologies and test configurations are provided for testing thermal interface materials and, in particular, methodologies and test configurations are provided for testing thermal interface materials used for testing integrated circuits. A test methodology includes applying a thermal interface material on a device under test. The test methodology further includes monitoring the device under test with a plurality of temperature sensors. The test methodology further includes determining whether any of the plurality of temperature sensors increases above a steady state.

Abstract: A testing system for a PSU includes a test chamber and a control device. The test chamber includes a first partition with the PSU accommodated therein and a second partition with an electric load accommodated therein. The PSU is electrically connected to the electric load. The control device includes a microcontroller unit (MCU). The MCU is connected to a setting circuit and a temperature sensing circuit. The setting circuit is configured to set one of predetermined parameters. The temperature sensing circuit is capable of sensing temperature in the test chamber. The MCU is capable of automatically controlling a predetermined temperature in the test chamber and presetting a test time for testing the PSU.

Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.

Abstract: The present invention relates to a guide device comprising a baseplate unit having formed therein a guide channel for guiding electronic devices, wherein at least two portions of the baseplate unit are spatially fixed, said guide device being characterized in that means for compensating the thermal expansion of the baseplate unit are provided. The invention additionally relates to a test apparatus which comprises the guide device according to the present invention.