Abstract: Methods and apparatus for performing event correlation using codebook processing including determining a most probable set of problems for observed symptoms in a system. In embodiments, a correlation matrix is received which has managed objects. Hypotheses are defined as a subset of problems having observed symptoms based on the correlation matrix and evaluated.

Abstract: An audit device according to one embodiment includes a substrate; at least one test element coupled to the substrate; a connector adapted for coupling the at least one test element to leads of a cable; and a probe for detecting at least one of: voltage across and current through the at least one test element. Additional systems and methods are also presented.

Abstract: A multi-chip semiconductor apparatus includes a plurality of semiconductor chips stacked and packaged therein, wherein each of the semiconductor chips includes: a through-silicon via (TSV) formed through the semiconductor chip; a probe pad exposed to an outside of the semiconductor chip so as to enable a probing test; a bump pad exposed to the outside of the semiconductor chip and electrically connected to the TSV; and a conductive layer electrically connecting the probe pad and the bump pad inside the semiconductor chip.

Abstract: A circuit and method for digitizing jitter in a high speed digital signal receives a digital signal using a comparator and supplies a clock signal to a counter. The circuit and method determine the frequency of the digital signal using the clock signal and the counter, and calculate the period of the digital signal based on the frequency (using a logic element). The method and circuit provide a linearized delay for jitter analysis based on the period of the digital signal (using a delay shift circuit) and output a delayed digital signal from the digital signal based on the linearized delay (using a measure delay circuit). The circuit and method supply the digital signal and the delayed digital signal to a programmable unit. The programmable unit comprises flip flops. The circuit and method count transitions of the flip flops within the programmable unit using the counter. The flip flops transition when the digital signal differs from the delayed digital signal.

Abstract: An integrated circuit die comprises an electronic circuit and one or more output ports for outputting signals from the die via an external impedance, to a load, external from the die. The output port is connected to the electronic circuit. The die is further provided with an on-die sampling oscilloscope circuit connected to the output port, for measuring a waveform of the outputted signals.

Abstract: A digital signal delay measuring circuit for measuring a delay time of a digital signal of a scan-testable digital circuit inside a device to be tested is provided. The circuit includes: outputting means for outputting a delay time measuring signal as a digital signal; delay means for delaying a timing when a state of the delay time measuring signal is changed; and at least two signal holding means, each receiving the delay time measuring signal and holding the state of the delay time measuring signal at a holding-command input timing.

Abstract: An audit device according to one embodiment includes a substrate; at least one test element coupled to the substrate; a connector adapted for coupling the at least one test element to leads of a cable; and a probe for detecting at least one of: voltage across and current through the at least one test element. Additional systems and methods are also presented.

Abstract: A target position detection apparatus for a robot includes: a robot including an arm configured to be freely moved in at least two directions of X and Y axes, the arm having a wrist axis provided at a distal end of the arm and configured to be freely moved in a horizontal direction, and the wrist axis being provided with an end effector; and a control unit adapted for driving a memory to store a teaching point therein and controlling an operation of the robot such that the end effector will be moved toward the teaching point stored in the memory.

Abstract: A test and measurement instrument including a port including a plurality of connections; an impedance sense circuit configured to sense an impedance coupled to a connection of the plurality of connections; and a controller configured to setup the test and measurement instrument in response to a sensed impedance from the impedance sense circuit.

Abstract: A method of inspecting an electrostatic chuck (ESC) is provided. The ESC has a dielectric support surface for a semiconductor wafer. The dielectric support surface is scanned with a Kelvin probe to obtain a surface potential map. The surface potential map is compared with a reference Kelvin probe surface potential map to determine if the ESC passes inspection.