Abstract: The invention relates to a probe card (PC) for use with an automatic test equipment (ATE), wherein the probe card (PC) comprises a probe head (PH) on a first side thereof, and wherein the probe card (PC) is adapted to be attached to an interface (IF) and wherein the probe card (PC) comprises a plurality of contact pads on a second side in a region opposing at least a region of the interface (IF), arranged to contact a plurality of contacts of the interface (IF), and wherein the probe card (PC) comprises one or more coaxial connectors (CCPT) arranged to mate with one or more corresponding coaxial connectors (CCPT) of the interface (IF). The invention relates further to pogo tower (PT) for connecting a wafer probe interface (WPI) of an automatic test equipment with the probe card (PC).

Abstract: Disclosed is a test device for testing a high-frequency and high-speed semiconductor. The test device includes a probe supporting block formed with a tube accommodating portion along a test direction; a conductive shield tube accommodated in the tube accommodating portion; and a probe accommodated and supported in the shield tube without contact, the tube accommodating portion including a conductive contact portion for transmitting a ground signal to the shield tube. When a high-frequency and high-speed semiconductor or the like subject is tested, the test device easily and inexpensively prevents crosstalk between the adjacent signal probes and improves impedance characteristic.

Abstract: The invention relates to a probe card (PC) for use with an automatic test equipment (ATE), wherein the probe card (PC) comprises a probe head (PH) on a first side thereof, and wherein the probe card (PC) is adapted to be attached to an interface (IF) and wherein the probe card (PC) comprises a plurality of contact pads on a second side in a region opposing at least a region of the interface (IF), arranged to contact a plurality of contacts of the interface (IF), and wherein the probe card (PC) comprises one or more coaxial connectors (CCPT) arranged to mate with one or more corresponding coaxial connectors (CCPT) of the interface (IF). The invention relates further to pogo tower (PT) for connecting a wafer probe interface (WPI) of an automatic test equipment with the probe card (PC).

Abstract: Embodiments described herein relate to a system. The system may include a base configured to be removably coupled to an electrical component. The base may include a first plurality of crossbar alignment features arranged in a first pattern. The system may also include a crossbar configured to be removably coupled to the base using a portion of the first plurality of crossbar alignment features. The crossbar may include a first plurality of adapter plate alignment features arranged in a second pattern. The system may also include an adapter plate configured to be removably coupled to the crossbar using a subset of the first plurality of adapter plate alignment features. The adapter plate may include a plurality of measurement device mounting features.

Abstract: The present disclosure relates to a probe head receiver, which includes: a first template, a guide plate and a spacer. The first template has a number of apertures of a first size. The guide plate has a number of apertures of a second size, each of the number of apertures of the first template is aligned with each of the number of apertures of the guide plate. The spacer is between the first template and the guide place. The second size is different from the first size.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to via structures and via patterning using oblique angle deposition processes. The method includes: depositing a material on a lower wiring layer; forming one or more openings in the material; filling the one or more openings with a conductive material; growing via structures on the conductive material; forming interlevel dielectric material on the via structures; and forming an upper wiring layer on the interlevel dielectric material and in contact with the via structures.

Abstract: A test device for a printed circuit board assembly is disclosed. The test device includes a test platform for securing a printed circuit board assembly to be tested and a positioning platform located above the test platform and for securing a plurality of test probes. The plurality of test probes are secured at the bottom of the positioning platform and the secured positions in the positioning platform thereof are adjustable to align the test points on the printed circuit board assembly to be tested.

Abstract: A probe card includes a ceramic substrate; an electrode connection part connecting an electrode pad and a via pad which are provided on one surface of the ceramic substrate; a bonding pad provided on an upper surface of the electrode pad and disposed inwardly of an edge of the electrode pad; and a probe bonded to an upper surface of the bonding pad by a solder layer between the bonding pad and the probe. The bonding pad includes a lead part protruding from a side surface of the bonding pad. As a result, overflowed solder at the time of attaching the probe onto the upper surface of the bonding pad may be dispersed to the lead part.

Abstract: The different advantageous embodiments may provide an apparatus comprising a vision system, a drilling tool, and a system controller. The vision system may be configured to generate data about a number of laser signatures on a surface of a workpiece. The drilling tool may be configured to drill a number of holes in the surface of the workpiece. The system controller may be configured to generate drilling instructions for the drilling tool using the data generated by the vision system.

Abstract: An electrical process control sensor assembly 10 for sensing a process or machine parameter, the assembly 10 including a sensor body 12 and a head 14, the body 12 defining a body interior 20. The assembly includes a sensing device 22 at least partially located in the body interior 20. The head 14 defines a head interior 24 which communicates with the body interior 20. The assembly 10 includes a connector arrangement 26 located in the head interior 24. The assembly 10 includes internal communicating members 28 extending between the sensing device 22 and the connector arrangement 26, the connector arrangement 26 connecting, in an installed condition, the internal communicating members 28 to external communicating members 30 to permit electrical communication therebetween. The head 14 defines a port 34 through which the external connecting members 30 are located in the installed condition.

Abstract: To diagnose plasma in a plasma space, a plurality of floating probes are installed at a plurality of points, respectively, in a plasma space. An electron density ratio at each of the points is calculated by measuring a first probe current of each of the floating probes, the probe current including a DC component. A point ion density and a point electron temperature at each of the points are calculated by measuring a second probe current of each of the floating probes before the electron density ratio is calculated, the second probe current excluding the DC component.

Abstract: A test device for testing a flat module includes a test station and a cover movable relative to the test station between a test position and a removal position. At least two holding devices are arranged and formed on the cover in such a way that, when the cover moves from its removal position into the test position, they releasably connect to the flat module arranged in the test station in such a way that, when the cover moves from its test position into the removal position, the flat module is held by the at least two holding devices.

Abstract: A terminal testing device provides an adapter customized to a port of a connector being tested so that force applied to the adapter identifies loose and fixed terminals in the connector. The adapter includes springs and push pins that correspond in number to the number of terminals being tested and has a face plate that corresponds to the type of connector being tested. The push pins provide force against the terminal end. Specifically, the device seats the adapter and connector to align both and permit force to be in line with terminal ends. The force applied to the terminal ends is uniform and controlled by means of the adapter and is obtained by a single driving means.

Abstract: A display driving device a driving unit, an output unit, and an output control unit. The driving unit includes a first buffer and a second buffer generating a first driving voltage and a second driving voltage, respectively. The output unit includes a first output pad and a second output pad to which voltages are respectively applied via first second data driving paths, respectively, and which output the voltages to outside. The output control unit includes a charge share path that connects the first output pad and the second output pad. Each of the first data driving path and the second data driving path includes a first electro-static discharge (ESD) protection element, and the charge share path includes a second ESD protection element that is disposed separately from the first data driving path and the second data driving path.

Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.

Abstract: An integrated circuit (IC) device tester maintains a set point temperature on an IC device under test (DUT) having a die attached to a substrate. The tester includes a thermal control unit and a fluid management system configured to supply the thermal control unit with fluids for pneumatic actuation, cooling, and condensation abating. The tester can includes a box enclosing the thermal control unit thereby providing a substantially isolated dry environment during low humidity testing of the DUT. The heat exchange plate may include an inner structure for thermal conductivity enhancement.

Abstract: A test carrier includes a film-shaped base film which has first bumps which contact test pads of a die; and a cover film which is superposed over the base film, and the test carrier holds the die between the base film and the cover film. The first bumps are relatively higher than second bumps which the die has.

Abstract: A device tester for an IC device under test (DUT), the DUT having a substrate and an attached die. The device tester includes a thermal control unit and a test socket assembly which conforms to the DUT's profile. The thermal control unit includes a pedestal assembly, a heater having a fuse coupled to a heating element, a substrate pusher, and a force distributor for distributing force between the pedestal assembly and the substrate pusher. The test socket assembly includes a socket insert that supports and also conforms to the DUT's profile.

Abstract: An inspection apparatus includes an insulating substrate, a probe pin having a body portion secured to the insulating substrate, a tip portion connected to one end of the body portion and disposed on the back surface side of the insulating substrate, and a connection portion connected to the other end of the body portion and disposed on the front surface side of the insulating substrate, and a heat-radiating terminal in contact with the connection portion, wherein a current is applied through the heat-radiating terminal and the probe pin to an object to measured, and wherein the heat-radiating terminal discharges heat from the probe pin.

Abstract: A test coupler for supplying a device under test with test signals contains a first coaxial connector, a waveguide port, and a first strip conductor. Test signals of a lower frequency range are supplied to the first coaxial connector. Test signals of an upper frequency range are supplied to the waveguide port. The test coupler guides the test signals on the first strip conductor to the device under test.

Abstract: A signal test apparatus for a serial attached Small Computer System Interface (SAS) device includes an SAS female connector to be connected to the SAS device, an SAS male connector to be connected to a server, first and second pairs of subminiature version A (SMA) connectors, and first and second groups of switches. When the first pair of SMA connectors is connected to an oscillograph to test a pair of output signals from the SAS device, the second group of switches are turned on and the first group of switches are turned off to communicate the SAS device with the server. When the second pair of SMA connector is connected to the oscillograph to test another pair of output signals from the SAS device, the first group of switches are turned on and the second group of switches are turned off to communicate the SAS device with the server.

Abstract: A signal detection apparatus for a serial attached SCSI (SAS) device includes an SAS female connector to be connected to a SAS device, an SAS male connector to be connected to a system, and first to fourth pairs of subminiature version A (SMA) connectors. When the first pair of SMA connectors is connected to an oscillograph to detect a pair of output signals from the SAS device, the second and third pairs of SMA connectors connect the SAS device with the system. When the second pair of SMA connector is connected to the oscillograph to detect another pair of output signals from the SAS device, the first and fourth pairs of SMA connectors connect the SAS device with the system.

Abstract: A probe card facilitates a wiring connection, reducing working time and preventing a working error and includes a main circuit board having an opening in its center. A reinforcement member has a lower end coupled to that opening to prevent deforming the board. A sub-circuit board electrically connected to the main board is seated on an upper side of the reinforcement member. A space transformer is positioned on a lower portion of the opening of the main board. A plurality of wires have both ends inserted into through holes in the sub-circuit board and space transformer to electrically connect them. Probes are provided on a lower portion of the space transformer, each having one end in contact with the wire inserted into the through-hole of the space transformer and the other end in contact with a wafer to be tested.

Abstract: A testing jig of a pogo pin connector for testing a connection between at least one pogo pin and an electrical plug is disclosed. The testing jig includes a first support element, a second support element, and a platform. The first support element has a first groove and at least one opening defined therein. The second support element has a second groove corresponding to the first groove for receiving the electrical plug. The platform is disposed below the first support element, and at least one receiving hole is defined in the platform. The at least one pogo pin is disposed in the at least one receiving hole and exposed in the first groove through the at least one opening. The pogo pin is configured in various tilt angles through the platform with the opening for solving high cost of various mold developments.

Abstract: The present idea refers to a needle head, its use in a probe arrangement, and a method for electrically contacting multiple electronic components. The needle head comprises a body with a lower surface, needle electrodes emerging from the lower surface, and multiple outlets arranged in the lower surface. A channel is arranged between an inlet in the body and the outlets for conveying a medium from the inlet to the outlets. By this means, electronic components arranged in close distance under the lower surface of the needle head are directly exposed to the medium which provides a test environment during a test of the electronic components.

Abstract: A deflection measurement probe includes a body portion having a cavity defined by the body portion, a first positional measurement sensor disposed in the cavity of the body portion, the first positional measurement sensor including a sensor tip extending from the body portion operative to contact a measurement surface, and a second positional measurement sensor disposed in the cavity of the body portion, the first positional measurement sensor including a sensor tip extending from the body portion operative to contact a measurement surface.

Abstract: A probe-unit base member having high rigidity and requiring no troublesome operations for its manufacture and a probe unit are provided. To achieve the purpose, the probe-unit base member includes a conductive substrate 41 that has a first opening 41a capable of fitting therein a probe holder 3 and a second opening 41b communicated with the first opening 41a; a coating 42 that is made of an insulating adhesive agent and is coated at least on an edge of the second opening 41b; and an insulating guide member 43 that is bonded to the edge of the second opening 41b through the coating 42 and guides one of two contact bodies to a position in contact with probes 2.

Abstract: An apparatus and method for inspecting a circuit of a substrate is described. The apparatus includes a pin probe coming into contact with a first end of an electrode formed on a first side of a substrate, a voltage source for applying a voltage to the pin probe, a film disposed at a second end of the electrode formed on a second side of the substrate, a dielectric fluid sealed in the film, and an electronic ink dispersed in the dielectric fluid, and charged with electricity to flow when the electrode is electrified. The present invention is advantageous in that whether an electrode has been electrified is measured using charged electronic ink, so that the use of a pin probe is limited to one side of a substrate, thus reducing cost required for the entire inspection.

Abstract: There is provided a probe block comprising a probe including first contact portions, second contact portions, and beams connecting the first contact portion to the second contact portion and a guide where the probe is inserted and supported, wherein the probe block is installed in a probe card for inspecting a semiconductor chip.

Abstract: An electrical signal connector which may be used for testing narrow-pitched chips or multi-chips, and causes no faulty connections between probes and pads or between probes and a circuit board even in a high temperature environment such as in a burn-in test is provided. The electrical signal connector has a probe unit in which a plurality of resin-made film probes, corresponding to one or more pads on a semiconductor chip to be tested, are supported in parallel on a plurality of support plates; a first probe holder of grid structure provided with a plurality of openings; and a second probe holder of the same configuration as that of the first probe holder, the second probe holder having projections at intersection points in the grid structure. The first and second probe holders are fastened to the circuit board with the projections of the second probe holder inserted in corresponding holes of the circuit board and the first probe holder being fastened to the circuit board with screws.

Abstract: A semiconductor device test system is disclosed. The semiconductor device test system extends driver- and comparator-functions acting as important functions of a test header to an external part (e.g., a HIFIX board) of the test header, such that it can double the productivity of a test without upgrading the test header. The semiconductor device test system includes a test header for testing a semiconductor device by a test controller, and a HIFIX board for establishing an electrical connection between the semiconductor device and the test header, and including a Device Under Test (DUT) test unit which processes a read signal generated from the semiconductor device by making one pair with a driver of the test header and transmits the processed read signal to the test header.

Abstract: A probe apparatus for probing a device on a semiconductor wafer to be tested by a testing equipment is provided. The probe apparatus includes a replaceable probe tile removably mounted in a probing location on a base plate. The probe tile is configured into a self-contained assembly which includes a chassis body containing a plurality of probes for probing devices on a wafer, a dielectric block for supporting the probes, and a wireguide for guiding a plurality of cables from the testing equipment into the chassis body. A wafer station having replaceable base plates and replaceable probe tiles are also provided.

Abstract: The contact assembly having a contact member with a contact tip positioned within holes in a test socket or probe plate wherein the contact tip or the hole in the probe plate or test socket has a cam surface to provide lateral movement of the contact tip across a surface of a test location during compression of the contact member to induce scrubbing on the surface of the test site.

Abstract: A silicon carrier space transformer assembly includes one or more silicon structures, which provide space transformer scaling to permit interconnection for fine pitch input/output interconnections with a semiconductor die or wafer, and fine pitch test probe tips connected to the one or more silicon structures.

Abstract: A connecting device for connecting pins of a DIP chip to a test device comprises two each of half frames, columns of testing pins, connecting screws, fixing screws, and four holding plates. The two columns of testing pins are arranged respectively on the two half frames parallel to the lengthways direction of the half frame. The distance between two adjacent testing pins in the same column is equal to that between the two adjacent pins in the same column of the DIP chip. The two connecting screws screw into the half frames perpendicular to the lengthways direction of the half frame. Two of the holding plates extend down from each of the half frames and are aligned with short sides of the corresponding half frame. The fixing screws fix the two holding plates on the same half frame along a direction parallel to the lengthways direction of the half frame.

Abstract: Provided is a test apparatus that tests a device under test including an external interface circuit that transfers signals between an internal circuit inside a device and the outside of the device, the test apparatus comprising a pattern generating section that inputs, to the external interface circuit, a test pattern for testing the external interface circuit; an interface control section that causes the external interface circuit to loop back and output the test pattern; and an interface judging section that judges acceptability of the external interface circuit based on the test pattern looped back and output by the external interface circuit.

Abstract: According to an example embodiment, a contact cell includes a first element that is flexible and electrically conductive, and that is structured to have at least one bend along an entire length of the first element. The contact cell further includes a second element that is flexible and electrically conductive, and that is structured to have at least one bend along an entire length of the second element. The contact cell further includes a tie that is electrically non-conductive, and that is affixed to the first element and affixed to the second element such that the first element and second element are physically and electrically separated from each other.

Abstract: Provided is a circuit board unit for connecting a connecting terminal of a testing apparatus to a connected terminal of a device under test, including: a circuit board having, on one surface, a contact corresponding to the connected terminal; and a connector guide provided on the one surface of the circuit board, the connector guide guiding a connector having the connecting terminal to the circuit board, and pulling the connector towards the circuit board. In this circuit board unit, the connector guide may bias the connector on a side of the connecting terminal, towards the circuit board. Moreover in the circuit board unit, the circuit board may further have a substrate frame that is coupled to the connector guide and biases the connector guide towards the circuit board.

Abstract: A probe head assembly for testing a device under test includes a plurality of test probes and a probe head structure. The probe head structure includes a guide plate and a template and supports a plurality of test probes that each includes a tip portion with a tip end for making electrical contact with a device under test, a curved compliant body portion and a tail portion with a tail end for making electrical contact with the space transformer. Embodiments of the invention include offsetting the position of the tail portions of the test probes with respect to the tip portions of the test probes so that the tip portions of the test probes are biased within the apertures of the guide plate, using hard stop features to help maintain the position of the test probes with respect to the guide plate and probe ramp features to improve scrubbing behavior.

Abstract: A fixing device for fixing probes of an oscillograph. The fixing device includes a base, a holding member for holding the probe, and an arm connected between the base and the holding member. The arm is made of pliable metal material. Therefore, the arm may be bent and deformed easily.

Abstract: A probe having a conductive body and a contacting tip that is terminated by one or more blunt skates for engaging a conductive pad of a device under test (DUT) for performing electrical testing. The contacting tip has a certain width and the blunt skate is narrower than the tip width. The skate is aligned along a scrub direction and also has a certain curvature along the scrub direction such that it may undergo both a scrub motion and a self-cleaning rotation upon application of a contact force between the skate and the conductive pad. While the scrub motion clears oxide from the pad to establish electrical contact, the rotation removes debris from the skate and thus preserves a low contact resistance between the skate and the pad. The use of probes with one or more blunt skates and methods of using such self-cleaning probes are especially advantageous when testing DUTs with low-K conductive pads or other mechanically fragile pads that tend to be damaged by large contact force concentration.

Abstract: A method for manufacturing a probe needle having beams and a contactor placed on tips of the beams comprises preparing a Si wafer 20, forming a seed layer 21 on the Si wafer 20, and forming grooves in a desired shape of the beams on the seed layer 21 by patterning a photoresist 23. Subsequently, the grooves are filled up with metal-plated layers 24a, 24b to form the desired shape of beams.

Abstract: A universal test socket includes a housing frame including a side wall, an inner protruding portion protruding inwardly from the side wall, and a through window formed at a center portion of the housing frame, wherein the through window is surrounded by the side wall, a pin plate assembly coupled to the housing frame and including a pin plate in which a plurality of test pins are arranged and a plurality of guide pins formed on periphery of the pin plate, and a package guide portion coupled to the housing frame and located above the pin plate assembly, a semiconductor package to be tested being mounted on the package guide portion. When the pin plate assembly is coupled to the housing frame, the positions of the test pins arranged in the housing frame are varied according to a rotation angle of the pin plate assembly with respect to the housing frame.

Abstract: A probe device includes a probe body having a plurality of first holes extending through a first face thereof and a plurality of second holes aligned with the first holes and extending through an opposite second face thereof, a plurality of spaced-apart first probe pins inserted fittingly and removably into respective first holes and each including a first contact portion extending out of the first face, and a first connecting portion extending into the respective first hole, and a plurality of spaced-apart second probe pins inserted fittingly and removably into respective second holes and each including a second contact portion extending out of the second face, and a second connecting portion extending into the respective second hole and having an insert space. The first connecting portion is inserted fittingly and removably into the insert space, and mates with the second connecting portion.

Abstract: An RF chip test method is disclosed. The RF chip test method includes disposing an RF chip within a chip socket, with the RF chip having at least one RF pin and at least one non-RF pin, the chip socket having conductive elements, and the conductive elements contacting the RF pin and the non-RF pin; connecting the non-RF pin to a ground end and connecting the RF pin to an RF measuring instrument; measuring a S11 parameter of the RF pin using the RF measuring instrument; and comparing the S11 parameter with an allowable range so as to judge the contact condition between the RF pin and the conductive element.

Abstract: Apparatus and methods for identifying a signal on a printed circuit board (‘PCB’) under test, including an integrated circuit mounted on the PCB, the integrated circuit having a test signal generator that transmits a test signal to an output pin of the integrated circuit, with the output pin connected to a test point on the PCB; the integrated circuit also having signal identification logic that inserts into the test signal, an identifier of the signal; a test probe in contact with the test point; and a signal-identifying controller that receives the test signal and the identifier from the test probe and displays, in dependence upon the identifier, the identity of the signal.

Abstract: A serial attached small computer system interface (SCSI) (SAS) interface output signal detecting apparatus includes an SAS female connector, an SAS male connector, and two subminiature version A (SMA) connectors. Each of the SAS female and male connectors includes first and second groups of data pins and a group of power pins. The power pins of the SAS female connector are connected to the power pins of the SAS male connector. The SMA connectors are connected to two data output pins of the second or first group of data pins of the SAS female connector in response to the first group of data pins of the SAS female connector being connected to the first group of data pins of the SAS male connector or the second group of data pins of the SAS female connector being connected to the second group of data pins of the SAS male connector.

Abstract: A connecting device for connecting pins of a DIP chip to a test device comprises two each of half frames, columns of testing pins, connecting screws, fixing screws, and four holding plates. The two columns of testing pins are arranged respectively on the two half frames parallel to the lengthways direction of the half frame. The distance between two adjacent testing pins in the same column is equal to that between the two adjacent pins in the same column of the DIP chip. The two connecting screws screw into the half frames perpendicular to the lengthways direction of the half frame. Two of the holding plates extend down from each of the half frames and are aligned with short sides of the corresponding half frame. The fixing screws fix the two holding plates on the same half frame along a direction parallel to the lengthways direction of the half frame.

Abstract: The case cable management has a shell, a circuit board, multiple sockets and a cover. The shell has a bottom board and a sidewall. The circuit board is attached securely to the bottom board of the shell. The sockets are mounted through the sidewall of the shell and have multiple terminals connected securely to the circuit board. The cover covers the shell. Multiple power lines are mounted through the sidewall of the shell to connect the circuit board and sockets to a power supply and cables from computer apparatuses are connected to the sockets to receive electric power. Different cables can be distinguished clearly and conveniently for simplified cable routing to avoid confusion and facilitate replacement.

Abstract: A probe for engaging a conductive pad is provided. The probe includes a probe contact end for receiving a test current, a probe retention portion below the contact end, a block for holding the probe retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a generally planar self-cleaning skate disposed perpendicular below the contact tip. The self-cleaning skate has a square front, a round back and a flat middle section. The conductive pad is of generally convex shape having a granular non-conductive surface of debris and moves to engage the skate, whereby an overdrive motion is applied to the pad causing the skate to move across and scrub non-conductive debris from the pad displacing the debris along the skate and around the skate round back end to a position on the skate that is away from the pad.