Abstract: An apparatus for testing an object may include a test chamber, a first chamber, a second chamber, and a gas supply module. The test chamber receives a test board for testing an object. The first chamber is under the test chamber and receives a lower surface of the test board. The second chamber surrounds the first chamber to isolate the first chamber from ambient air. The gas supply module supplies a dry gas to the second chamber to provide a positive pressure higher than an ambient pressure, thereby preventing the ambient air from infiltrating into the first chamber. Thus, during the testing of the object at a low temperature, the second chamber may prevent the humid ambient air from infiltrating into the first chamber to prevent condensation of water on the lower surface of the test board.

Abstract: An electronic component handling apparatus handles a device under test (DUT). The electronic component handling apparatus includes: contact units that adjust a temperature of the DUT independently from one another and press the DUT against a socket independently from one another. The socket is disposed on a test head that is mounted to each of the contact units and that is connected to a tester. At least one of the contact units is removably disposed on the electronic component handling apparatus.

Abstract: Disclosed herein is an apparatus for depositing viscous material on an electronic substrate. The apparatus comprises a frame, an assembly material applicator coupled to the frame and configured to apply assembly material to the electronic substrate, a substrate support assembly, coupled to the frame, configured to support and secure the electronic substrate in a material application position, and a transport system, coupled to the frame, to shuttle electronic substrates to and from the substrate support assembly, the transport system including an upper track and a lower track disposed below the upper track.

Abstract: A test system is provided. A printed circuit board (PCB) includes a plurality of traces and at least one test point. A central processing unit (CPU) socket including a plurality of first pins and a memory module slot including a plurality of second pins are disposed on the PCB. Each of the second pins is coupled to the corresponding first pin of the CPU socket via the corresponding trace. A CPU interposer board is inserted into the CPU socket, and a memory interposer board is inserted into the memory module slot. The traces form a test loop via the CPU interposer board and the memory interposer board. When an automatic test equipment (ATE) provides a test signal to the test loop via the test point, the ATE determines whether the test loop is normal according to a reflectometry result of the test signal.

Abstract: A circuit board includes a main part on which a processor is mounted, a cut part to be cut off from the main part at a cut section before the board is reused, and a conductor pattern wired through the cut part via the cut section and to be cut off into a plurality of patterns at the cut section as the cut part is cut off. The processor detects a difference in signal level between a level of a signal output from the conductor pattern before the cut part is cut off, and a level of the signal output from the conductor pattern after the cut part is cut off, to determine a number of times the board is reused.

Abstract: A circuit board tester and method that precisely aligns the probe plate and circuit board is disclosed. With a circuit board and probe plate mounting within a housing having a top and bottom, hinged together, at closure there may be slight misalignments of the two. By making one of the two plates floating, or laterally slideable with respect to each other, it is possible to make final alignment at closure. One of the two plates can be provided with a pin and the other with a pin receiving alignment block. With the lateral slideability, the pin and block can insure proper probe alignment. Additional systems for correcting misaligned pins or blocks are also disclosed.

Abstract: Test structures for performing electrical tests of devices under one or more microbumps are provided. Each test structure includes at least one microbump pad and a test pad. The microbump pad is a part of a metal pad connected to an interconnect for a device. A width of the microbump pad is equal to or less than about 50 ?m. The test pad is connected to the at least one microbump pad. The test pad has a size large enough to allow circuit probing of the device. The test pad is another part of the metal pad. A width of the test pad is greater than the at least one microbump pad.

Abstract: A method of testing a semiconductor device using the test equipment includes loading an undivided printed circuit board (PCB) including unit PCBs in a test equipment. A semiconductor device is mounted in each of the unit PCBs. Product information of the undivided PCB loaded in the test equipment is confirmed. The undivided PCB whose product information has been confirmed is electrically connected to one of a plurality of main testers of the test equipment. Each of the main testers includes a main test interface directly connected to a cloud server in which firmwares for various kinds of tests are stored. The product information of the undivided PCB is transmitted to the main tester electrically connected to the undivided PCB. The main tester to which the product information has been transmitted performs a main test of the undivided PCB using the product information. The undivided PCB on which the main test has been performed by the main tester is unloaded from the test equipment.

Abstract: A test card includes a power interface, a controller, a test interface, and a test point. The test interface includes a power pin, a start pin, and a data signal pin. The power interface is connected to the controller and the power pin, and also connected to an external power to receive a work voltage. The controller transmits a turn-on signal to the start pin. The test point is connected to the data signal pin. When an interface of a motherboard is connected to the test interface, the power pin, the start pin, and the data signal pin are connected to corresponding pins of the interface of the motherboard. The motherboard outputs a data signal to the test point through the motherboard interface and the test interface after the controller receives the turn-on signal.

Abstract: The electronic device mounting apparatus 1 comprises: a first camera 123 for imaging a flexible board 74 of a base member 70 of a test carrier 60 to generate a first image information; an image processing apparatus 40 for detecting a position of an alignment mark 79 of the flexible board 74 from the first image information and calculating a print start position 782 of the first interconnect patterns 78 on the flexible board 74 on the basis of the position of the alignment mark 79; a printing head 122 for forming a first interconnect pattern 78 on the flexible board 74 from the print start position 782; and a second conveyor arm 21 for mounting a die 90 on the flexible board 74 on which the first interconnect pattern 78 is formed.

Abstract: A system for testing electronic device includes an electronic device, a temperature detecting module, a testing instrument and a testing computer. The testing electronic includes a main board and a power supply. The main board includes a slot and a card inserted in the slot. A plurality of dummy loads is located on the card. The slot includes at least one voltage interface. The power supply includes at least one power wire electrically connected to the at least one voltage interface. The temperature detecting module detects temperature signals of the plurality of dummy loads. The testing instrument is electrically connected to the at least one power wire to test current signals or power signals of the at least one power wire. The testing computer receives and displays the temperature signals, the current signals and the power signals.

Abstract: A system and method is disclosed that transfers carrier boards in a handler that supports the testing of electronic devices. A carrier board can be transferred from the transfer start position to one of the mid transfer positions and the transfer final position. Carrier boards, which are spaced apart from each other in a chamber, can be gathered adjacent to each other in the circulation direction of carrier board. The transfer speed and the total circulation speed of the carrier boards can be enhanced. The transfer speed of carrier board can be easily controlled according to the test conditions.

Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.

Abstract: In one embodiment, a device interface board is provided which includes a printed circuit board with a DUT interface structure, such as socket, associated with a DUT side of the printed circuit board. A high frequency connector and electronic component are mounted in a cavity formed in a back side of the printed circuit board. A signal via through the printed circuit board couples the high frequency connector and electronic component with the DUT interface structure. An encapsulating structure may be provided, which covers the cavity while allowing a cable to connect to the high frequency connector.

Abstract: A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include first and second stiffener bodies that are connected together at their central portions with adjustment mechanisms such as three differential screw mechanisms. A probe head may be attached to a first stiffener body at locations outside its central portion, while a prober machine may be attached to a second stiffener body at locations outside its central portion. The first and second stiffener bodies may have different coefficients of thermal expansion.

Abstract: An apparatus for testing an integrated circuit comprises: a chip unit with a plurality of electronic parts such as chip units arranged on the upside of a chip support; a probe unit having a plurality of contacts arranged on the underside of a probe support and spaced downward from the chip unit; a connection unit supporting the probe unit spaced downward from the chip unit on a pin support so as to penetrate the pin support in an up-down direction; and a coupling unit which couples separably the chip unit, the probe unit and the connection unit and displaces one of the chip support and the probe support and the pin support in a direction to approach each other and to be away from each other relative to the connection unit.

Abstract: A signal testing method of a printed circuit board (PCB) applies a robot arm and an oscilloscope to test the PCB. The method controls the robot arm to move to test points of electronic signals of the PCB. The method further controls the oscilloscope connected to the robot arm to measure the electronic signals.

Abstract: The innovation relates to systems and/or methodologies for error detection during sub-assembly in high voltage analog circuits. A signal driver communicates test signals to one or more high voltage analog circuits, and a state machine compares the electrical and/or thermal responses of the high voltage analog circuits to a set of predetermined expected results (e.g., signatures). The signal driver and state machine can be incorporated into the high voltage analog circuits. The expected results can be stored in the target circuits in the form of look-up tables, matrices, and so forth. Errors, such as, dry solders and bridge solders can be determined based on the comparison of the obtained responses to the expected signatures.

Abstract: Open and short systems and methods for testing integrated circuits are disclosed. An example implementation includes engaging an integrated circuit testing module with an integrated circuit testing apparatus, the integrated circuit testing module for receiving an integrated circuit, a first set of contact points, and a second set of contact points; engaging a first probe onto at least one of the contact points of the first set of contact points, controllably engaging at least one of a second probe onto at least one contact pair of the integrated circuit testing module, and providing an electrical stimulus to the integrated circuit testing module.

Abstract: A test device for testing a circuit board includes a base, a conveying platform, a driving unit, a connecting element, and a testing unit. The base has an operating space from above. The conveying platform is hinged to the base at a variable gradient, communicates with the operating space, and has thereon a carrier movable toward or away from the operating space as needed and configured to carry the circuit board. The driving unit is connected to the conveying platform and configured to drive the carrier to move. The connecting unit is connected to the conveying platform and the driving unit. The gradient of the conveying platform varies when the driving unit drives the carrier to move and thereby moves the connecting unit. The testing unit is movably disposed at the base and has at least one test terminal capable of approaching the operating space and testing the circuit board.

Abstract: A chip test fixture for assisting in examining a test chip on a printed circuit board includes a switching module, a pin cord and a magnetic unit. The switching module includes a standard chip and a switch element configured to turn on either the standard chip or the test chip. The pin cord is connected with the switch module at one end and is formed with a contacting head at the other end. The contacting head has a set of contact pins corresponding to that of the test chip. The magnetic unit is configured to draw the contacting head of the pin cord and the test chip together in such a way that the contact pins of the contacting head are in contact with that of the test chip once the contacting head approaches the test chip.

Abstract: An upright test apparatus for electronic assemblies includes a case assembly, first motherboard assemblies and a handler. The first motherboard assemblies are disposed in the case assembly. Each first motherboard assembly includes a motherboard, a first main connector, an adapter, a first sub-connector and a central processing unit (CPU). The motherboard is vertically disposed in the case assembly. The first main connector is disposed on the motherboard and electrically connected to the motherboard. The adapter is electrically connected to the first main connector and is substantially perpendicular to the motherboard. The first sub-connector is disposed on the adapter. The CPU is disposed on the motherboard and electrically connected to the motherboard. The handler inserts the electronic assemblies into the first sub-connectors in a vertical direction, respectively, tests the electronic assemblies and removes the electronic assemblies after the electronic assemblies are tested.

Abstract: A printed circuit board (PCB) testing system includes two gear groups, a pair of transmission belts and a driver. The pair of transmission belts geared onto and driven by the two gear groups is parallel and respectively perpendicular to the PCB transmission guideway so as to define a PCB accommodation space therebetween. Each transmission belt includes a plurality of projections. The two gear groups are rotated synchronously and inversely. During operation, the projections on the pair of transmission belts, facing the PCB accommodation space, move down, the projections move away from each other and to the bottom of the corresponding transmission belts, and a PCB supported by the pair of projections drops onto the PCB transmission guideway.

Abstract: A device includes an integrated circuit device having a sensor to measure an operating characteristic of the device. The sensor provides information based on the measured operating characteristic to a trigger module. In response to the information indicating the measured operating characteristic meets a threshold associated with a device failure, the trigger module provides an indication to a storage element, which stores information indicating the threshold has been met. In the event of a failure of the integrated circuit device, the storage element can be accessed by a device analyzer to retrieve the stored information to determine the cause of the device failure.

Abstract: A printed circuit board (PCB) testing fixture secures at least one PCB, each having a port. The PCB testing fixture includes a fixing frame and a testing plate. The fixing frame defines at least one first sliding groove to receive an edge of the at least one PCB. The testing plate is adjustably fixed on the fixing frame, and includes at least one backplane each including a connector corresponding to the at least one first sliding groove individually. The connector connects to the port of the at least one PCB. A location on which the testing plate is fixed to the fixing frame can be altered to test PCBs of different sizes.

Abstract: A method of enabling a circuit board analysis is disclosed. The method comprising removing a portion of the circuit board on a first side of the circuit board opposite a second side of the circuit board having an integrated circuit package; removing the circuit board from the integrated circuit package; performing a dye mapping to analyze bonds between the integrated circuit package and the circuit board; and performing an analysis of the integrated circuit package.

Abstract: A testing device for testing functions of a printed circuit board (PCB) includes a transfer board electrically coupled to the PCB, and a controller board electrically coupled to the transfer board and the PCB. The transfer board includes a signal bus and a controller bus. The PCB is capable of running a test program stored therein to transmit instructions to the controller board; and the controller board is capable of transmitting control signals to the transfer board according to the instructions. The transfer board is capable of switching the PCB corresponding ports on/off; and the PCB information is capable of being transmitted to the controller board via the signal bus. The controller board is capable of converting the PCB information to network information which is uploaded to the internet.

Abstract: A terminal board is part of a terminal board assembly for terminating and testing of railroad wires. The board includes a first terminal block with a front post and a back post installed on a plane, along with a plurality of terminal blocks with front posts. A control test link, with an insulating material lining one of three holes, is installed on the front posts of terminal blocks. A test nut, connectable to the front post of the first terminal block, has a face with a depression formed therein to contact the test link when installed on the front post of the first terminal block over the insulating material. First wiring is attached on the plane's front, and second wiring is terminated on the plane's back. A surge protection component and the control test link are pre-installed on the front of the plane, providing for easy removal.

Abstract: A chip test fixture for assisting in examining a test chip on a printed circuit board includes a switching module, a pin cord and a magnetic unit. The switching module includes a standard chip and a switch element configured to turn on either the standard chip or the test chip. The pin cord is connected with the switch module at one end and is formed with a contacting head at the other end. The contacting head has a set of contact pins corresponding to that of the test chip. The magnetic unit is configured to draw the contacting head of the pin cord and the test chip together in such a way that the contact pins of the contacting head are in contact with that of the test chip once the contacting head approaches the test chip.

Abstract: A interface adapter comprising a connecting board having the first ports and the second ports, the first ports being electrically connected with the second ports; a pin header having the first pins and the second pins, the first pins passing through the first ports, the second pins being connected with the second ports; a female header having openings for receiving the first pins, the connecting board being located between the pin header and the female header. The second pin is designed to O-shape or U-shape for providing enough position to connecting the test probe, preventing from disengagement of the chip from the test card.

Abstract: A test apparatus for an electronic device package is provided, which includes a test socket having a first portion with a recess for receiving an electronic device package having external terminals arranged in a terminal configuration and a second portion. An interchangeable insert board is disposed between the first portion and the second portion and extended on the recess, which includes first contact pads arranged in a first pad configuration compatible with the terminal configuration and facing the recess and second contact pads arranged in a second pad configuration and disposed between the first and the second portions. Trace layers each electrically connects one of the first contact pads to one of the second contact pads. The contact pins each penetrates through the second portion and electrically connects to one of the second pads, wherein the contact pins are arranged in a pin configuration compatible with the second pad configuration.

Abstract: There is provided a printed circuit board (“PCB”) test fixture comprising a support, an electrical tester, and a pusher. The support is for supporting a PCB being tested in a PCB test position, The electrical tester is positioned with respect to the PCB test position such that, when a PCB is supported by the support in the PCB test position, the electrical tester is disposed in electrical contact with a circuit on the PCB supported by the support in the PCB test position during PCB testing.

Abstract: An improved efficiency system for testing electronic components in a motherboard/daughterboard assembly in which the daughterboard is mounted in spaced parallel relationship the to motherboard includes one or more device-under-test socket sub-assemblies having a test socket thereon for receiving a device-under-test and a connector component for disengagable connection to a complementary connector component on the daughterboard with the socket sub-assembly effecting interengagement of the complementary connector component on the daughterboard via an opening in the motherboard to allow ready access to the test socket for temporary installation, testing, and removal of a device-under-test.

Abstract: A differential test probe for a printed wiring board test system includes a probe body having a proximal end and a distal end. Each of a plurality of coaxial cables extending from the proximal end to the distal end. The plurality of coaxial cables each includes a center conductor having an axial aperture at the distal end. The differential test probe also includes a plurality of signal pins that are each mounted in the axial aperture of the center conductor of one of the plurality of coaxial cables to electrically couple the signal pin to the center conductor. A plurality of ground pins are coupled to the probe body and selectively arranged relative to the plurality of signal pins to provide multiple signal to ground paths between the plurality signal pins and the plurality ground pins.

Abstract: A module for a tester for the testing of circuit boards is described. Such testers have a basic grid on which an adapter and/or a translator may be arranged in order to connect contact points of the basic grid with circuit board test points of a circuit board to be tested. The module comprises a support plate and a contact board. The contact board is formed by a rigid circuit board section which is described as the basic grid element, and at least one flexible circuit board section. Provided on the basic grid element are contact points which each form part of the contact points of the basic grid. The basic grid element is mounted at an end face of the support plate, and the flexible circuit board section is bent in such a way that at least part of the other section of the contact board is parallel to the support plate.

Abstract: The present invention provides on IC test substrate for testing various signals, a combined flexible and rigid PCB included in the structure is applicable to perform a mission including for example: stabilizing power input/output, signal transfer by a connector; general, power, and high frequency signal transmission in preserved integrity state.