Abstract: Methods and apparatus for testing packaged ICs are disclosed. In some embodiments, an apparatus for testing a packaged integrated circuit (IC) can include a device handler for moving the packaged IC; a testing station for testing the packaged IC; and a pre-test conditioning station configured to remove at least a portion of an oxidation layer formed on contacts of the packaged IC prior to testing. In some embodiments, a method for testing packaged ICs may include providing a packaged IC to be tested; at least partially removing an oxidation layer from contacts of the packaged IC prior to testing; inserting the packaged IC into an interface structure; and testing the packaged IC.

Abstract: A method and apparatus for a pre-biasing storage mechanism to prevent oxidation and other contaminants from forming on the probe tips and probe tails of a probe card. The pre-biasing storage mechanism imposes a positive bias on the probe needles of the probe card so as to create physical contact between the probe tails and the conductive pads of the printed circuit board (PCB) arrangement of the probe card during a disengaged state of the probe card. In addition, the storage mechanism imposes a positive bias on the probe needles of the probe card, so as to create physical contact between the probe tips and a probe tip cleaning pad, or other protective surface, during a disengaged state of the probe card.

Abstract: A probe for engaging a conductive pad is provided. The probe includes a probe contact end for receiving a test current, a probe retention portion below the contact end, a block for holding the probe retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a generally planar self-cleaning skate disposed perpendicular below the contact tip. The self-cleaning skate has a square front, a round back and a flat middle section. The conductive pad is of generally convex shape having a granular non-conductive surface of debris and moves to engage the skate, whereby an overdrive motion is applied to the pad causing the skate to move across and scrub non-conductive debris from the pad displacing the debris along the skate and around the skate round back end to a position on the skate that is away from the pad.