Abstract: The present disclosure provides an earphone power amplifier, including a ground contact connected to a ground wire of an earphone, a left sound channel power amplifying circuit connected to a left sound channel of the earphone, and a right sound channel power amplifying circuit connected to a right sound channel of the earphone. The left sound channel power amplifying circuit includes a first operational amplifier and a first positive feedback exported from an input end of the first ferrite bead to an in-phase input end of the first operational amplifier, the right sound channel power amplifying circuit includes a second operational amplifier and a second positive feedback exported from the input end of the first ferrite bead to an in-phase input end of the second operational amplifier.
Type:
Grant
Filed:
October 10, 2012
Date of Patent:
June 17, 2014
Assignee:
Huawei Device Co., Ltd.
Inventors:
Haitao Zhen, Yongxiang Yang, Xuxing Yan