Abstract: A measuring system including: at least two electromechanical resonators each having a resonant frequency varying around an offload resonant frequency according to a physical quantity to be measured; at least one reading device connected to inputs of the resonators and configured to supply an excitation signal on the inputs; and a memory in which is recorded, for each resonator, offload resonance information relating to the offload resonant frequency of the resonator. Each reading device is configured to determine the resonant frequency of one or more resonators selected for reading by configuring at least one element of the reading device using the offload resonance information stored for each selected resonator.

Abstract: In a Radio Frequency (RF) filter, a first conductive link has a first length corresponding to a first (N) number of wavelengths of a primary RF frequency. A second conductive link has a second length corresponding to both a second (M) number of wavelengths of the primary RF frequency and an out-out-phase (X) number of wavelengths of a secondary RF frequency. An input interface receives an input RF signal and transfers a first component of the input signal over the first link and transfers a second component of the input RF signal over the second link. An output interface combines the first component from the first link with the second component from the second link to transfer an output RF signal. The energy at the primary frequency constructively combines in-phase, but the energy at the secondary frequency destructively combines out-of-phase.

Abstract: A periodic signal generator is configured to generate high frequency signals characterized by relatively low temperature coefficients of frequency (TCF). This generator may include an oscillator containing a pair of equivalent MEMs resonators therein, which are configured to support bulk acoustic wave and surface wave modes of operation at different resonance frequencies. Each resonator includes a stack of layers including a semiconductor resonator body (e.g., Si-body), a piezoelectric layer (e.g., AIN layer) on the resonator body and interdigitated drive and sense electrodes on the piezoelectric layer. The oscillator is configured to support the generation of first and second periodic signals having unequal first and second frequencies (f1, f2) from first and second resonators within the pair. These first and second periodic signals are characterized by respective first and second temperature coefficients of frequency (TCf1, TCf2), which may differ by at least about 10 ppm/° C.

Abstract: A method of wafer level packaging includes providing a substrate including a buried oxide layer and a top oxide layer, and etching the substrate to form openings above the buried oxide layer and a micro-electro-mechanical systems (MEMS) resonator element between the openings, the MEMS resonator element enclosed within the buried oxide layer, the top oxide layer, and sidewall oxide layers. The method further includes filling the openings with polysilicon to form polysilicon electrodes adjacent the MEMS resonator element, removing the top oxide layer and the sidewall oxide layers adjacent the MEMS resonator element, bonding the polysilicon electrodes to one of a complementary metal-oxide semiconductor (CMOS) wafer or a carrier wafer, removing the buried oxide layer adjacent the MEMS resonator element, and bonding the substrate to a capping wafer to seal the MEMS resonator element between the capping wafer and one of the CMOS wafer or the carrier wafer.

Abstract: A design structure is embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes a substrate including a silicon layer. Furthermore, the design structure includes a metal layer on a bottom side of the silicon layer and a dielectric layer on a top side of the silicon layer. Additionally, the design structure includes a top-side interconnect of the through-silicon via bandpass filter on a surface of the dielectric layer and a plurality of contacts in the dielectric layer in contact with the top-side interconnect. Further, the design structure includes a plurality of through-silicon vias through the substrate and in contact with the plurality of contacts, respectively, and the metal layer.

Abstract: A handling member is prepared that provides a channel that can withstand subsequent back face processing as to a substrate having elements made up of a substrate and a membrane, and the handling member is fixed to the substrate so that at least a portion within the elements are supported by the handling member. This provides a manufacturing method wherein the physical strength of an element at the time of manufacturing an electromechanical transducing apparatus is strengthened, and the handling member is easily detached in a short time after processing of the element.

Abstract: A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, a capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; viewing windows are opened in the active layer of the resonator wafer; masking the single crystal silicon semiconductor material active layer of the resonator wafer with photoresist material; a single crystal silicon resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist material is subsequently dry stripped.

Abstract: There are many inventions described and illustrated herein, as well as many aspects and embodiments of those inventions. In one aspect, the present invention is directed to one or more microelectromechanical ring resonator structures having a circular or substantially circular outer surface and a circular or substantially circular inner surface. The microelectromechanical ring resonator(s) include an anchor support element having an impedance matching structure coupled to at least one substrate anchor. The impedance matching structure may be a beam, having a predetermined length, which couples the ring resonator(s) to substrate anchor. In one embodiment, the impedance matching structure operates in a bulk-elongation mode. In another embodiment, the impedance matching structure operates in a flexure mode. In operation, when induced, the microelectromechanical ring resonator structure oscillates in an elongating/compressing or breathing mode (or in a primarily or substantially elongating or breathing mode).

Abstract: A surface acoustic wave device includes: a piezoelectric substrate that has two or more resonators formed on a surface; and a supporting substrate that is joined to another surface of the piezoelectric substrate. In this surface acoustic wave device, at least two of the resonators have exciting portions that overlap each other in the direction of propagating surface acoustic waves, and at least a part of the piezoelectric substrate is removed or modified to have different properties between at least one pair of overlapping resonators among the resonators having the overlapping portions.

Abstract: A surface acoustic wave duplexer includes a first filter including a ladder filter and a second filter including a ladder filter with a pass band that is different from that of the first filter. Inductors are connected in parallel with respective series resonators of both first and second filters.

Abstract: Several MEMS-based methods and architectures which utilize vibrating micromechanical resonators in circuits to implement filtering, mixing, frequency reference and amplifying functions are provided. A method and subsystem are provided for processing RF signals utilizing a plurality of vibrating micromechanical devices typically in the form of an IF mixer-filter and an RF channel selector or an image-reject RF filter. One of the primary benefits of the use of such architectures is a savings in power consumption by trading power for high selectivity (i.e., high Q). Also, such methods and circuits can eliminate the need for a low noise amplifier in a receiver or transceiver subsystem. Consequently, the present invention relies on the use of a large number of micromechanical links in SSI networks to implement signal processing functions with basically zero DC power consumption.

Abstract: A compact high-performance mechanical vibration filter which deals with high frequency band signals. Microcolumn beams as minute mechanical vibrators are used to increase a mechanical resonance frequency. The plural microcolumn beams are arranged in an array and a common detection electrode surrounds each microcolumn beam with prescribed gaps between them, thereby preventing an output signal from becoming weak. When some of the mechanical vibrators are restrained from vibrating, it is possible to monitor and remove a noise component generated in the output signal by direct electromagnetic coupling of an input signal.

Abstract: A branching filter is a surface acoustic wave device in which a first filter having a relatively low bandpass frequency and a second filter having a relatively high bandpass frequency are connected to a common terminal. A junction-side resonator that is included in the second filter and that is connected in closest proximity to the common terminal is connected in series. The resonant frequency fsr of the junction-side resonator is higher than the center frequency f0, which is the center of the passband, of the second filter, and is more preferably set so as to satisfy the expression: f0+BW×0.2≦fsr≦f0+BW×0.7, where BW is the bandwidth of the passband.

Abstract: Torsional hinge support beams (104, 106, 108, 110, 400, 500, 600, 700, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500) that are corrugated, perforated and/or have non-uniform width are provided. The support beams are useful in flexural beam resonators (100, 1600), in which they serve to support the main flexural mode-vibrating beam (102, 1602). The support beams have phase lengths equal to an odd multiple of &pgr;/2, preferably the phase lengths are about equal to &pgr;/2 at the operating frequency of the resonators. Owing to the corrugations, the lengths of the support beams are shorter than comparable solid straight edge support beams. The short lengths of the support beams reduce the overall area occupied by the resonators and allow higher bias voltage to be employed in order to obtain greater electromechanical coupling.

Abstract: Several MEMS-based methods and architectures which utilize vibrating micromechanical resonators in circuits to implement filtering, mixing, frequency reference and amplifying functions are provided. For example, a method and apparatus for selecting at least one desired channel in an RF receiver subsystem is shown. One of the primary benefits of the use of such architectures is a savings in power consumption by trading power for high selectivity (i.e., high Q). Consequently, the present invention relies on the use of a large number of micromechanical links in SSI to VLSI networks to implement signal processing functions with basically zero DC power consumption.

Abstract: Microelectromechanical resonators that can be fabricated on a semiconductor die by processes normally used in fabricating microelectronics (e.g., CMOS) circuits are provided. The resonators comprises at least two vibratable members that are closely spaced relative to a wavelength associated with their vibrating frequency, and driven to vibrate one-half a vibration period out of phase with each other, i.e. to mirror each others motion. Driving the vibratable members as stated leads to destructive interference effects that suppress leakage of acoustic energy from the vibratable members into the die, and improve the Q-factor of the resonator. Vibratable members in the form of vibratable plates that are formed by deep anisotropic etching one or more trenches in the die are disclosed. Embodiments in which two sets of vibratable plates are spaced by ½ the aforementioned wavelength to further suppress acoustic energy leakage, and improve the Q-factor of the resonator are disclosed.

Abstract: Several MEMS-based methods and architectures which utilize vibrating micromechanical resonators in circuits to implement filtering, mixing, frequency reference and amplifying functions are provided. Apparatus is provided for selecting at least one desired passband or channel in an RF transmitter subsystem utilizing a bank of vibrating micromechanical devices. One of the primary benefits of the use of such architectures is a savings in power consumption by trading power for high selectivity (i.e., high Q). Consequently, the present invention relies on the use of a large number of micromechanical links in SSI networks to implement signal processing functions with basically zero DC power consumption.

Abstract: Electromechanical resonating devices such as MEMS resonators are provided in semiconductor structures and devices having high-quality monocrystalline semiconductor layers formed by utilizing compliant substrates. The semiconductor layer is patternwise etched to define a vibrational mode resonator member with one or more supports mechanically coupled to the member. A portion beneath the member is etched to provide clearance for vibrational mode operation of the resonating member. The semiconductor layer is selectively doped to define one or more conductive pathways to the resonating member.

Abstract: A first type of MEMS resonator adapted to be fabricated on a SOI wafer is provided. A second type of MEMS resonator that is fabricated using deep trench etching and occupies a small area of a semiconductor chip is taught. Overtone versions of the resonators that provide for differential input and output signal coupling are described. In particular resonators suited for differential coupling that are physically symmetric as judged from center points, and support anti-symmetric vibration modes are provided. Such resonators are robust against signal noise caused by jarring. The MEMS resonators taught by the present invention are suitable for replacing crystal oscillators, and allowing oscillators to be integrated on a semiconductor chip. An oscillator using the MEMS resonator is also provided.

Abstract: Integrated circuit fabrication technique for constructing novel MEMS devices, specifically band-pass filter resonators, in a manner compatible with current integrated circuit processing, and completely encapsulated to optimize performance and eliminate environmental corrosion. The final devices may be constructed of single-crystal silicon, eliminating the mechanical problems associated with using polycrystalline or amorphous materials. However, other materials may be used for the resonator. The final MEMS device lies below the substrate surface, enabling further processing of the integrated circuit, without protruding structures. The MEMS device is about the size of a SRAM cell, and may be easily incorporated into existing integrated circuit chips. The natural frequency of the device may be altered with post-processing or electronically controlled using voltages and currents compatible with integrated circuits.

Abstract: Several MEMS-based methods and architectures which utilize vibrating micromechanical resonators in circuits to implement filtering, mixing, frequency reference and amplifying functions are provided. Apparatus is provided for selecting at least one desired passband or channel in an RF transmitter subsystem utilizing a bank of vibrating micromechanical devices. One of the primary benefits of the use of such architectures is a savings in power consumption by trading power for high selectivity (i.e., high Q). Consequently, the present invention relies on the use of a large number of micromechanical links in SSI networks to implement signal processing functions with basically zero DC power consumption.

Abstract: A filter for electric signals has a substrate, a vibrating body capable of vibrating with at least two antipodes deflected in phase opposition relative to the substrate and has electrodes connected to a signal input and a signal output for electric excitation and for detection of the vibration of the vibrating body. The electrodes for detecting the vibration, each assigned to antipodes deflected in phase opposition, are connected to two separate terminals of the signal output.

Abstract: Integrated circuit fabrication technique for constructing novel MEMS devices, specifically band-pass filter resonators, in a manner compatible with current integrated circuit processing, and completely encapsulated to optimize performance and eliminate environmental corrosion. The final devices may be constructed of single-crystal silicon, eliminating the mechanical problems associated with using polycrystalline or amorphous materials. However, other materials may be used for the resonator. The final MEMS device lies below the substrate surface, enabling further processing of the integrated circuit, without protruding structures. The MEMS device is about the size of a SRAM cell, and may be easily incorporated into existing integrated circuit chips. The natural frequency of the device may be altered with post-processing or electronically controlled using voltages and currents compatible with integrated circuits.

Abstract: A composite longitudinal vibration mechanical filter for delivering out a supplied high-frequency signal in a predetermined frequency range includes a plurality of vibratable bodies including input and output longitudinal vibratable tuning bars with piezoelectric members superposed thereon, coupling elements by which the longitudinally vibratable tuning bars are coupled to each other, supporting elements projecting respectively from the input and output longitudinally vibratable tuning bars, and a holder to which the supporting elements are attached. At least one resonant frequency adjusting finger is disposed on at least one of the vibrational bodies. Grooves are defined in the longitudinally vibratable tuning bars at the same time that they are fabricated. The grooves extend in the direction in which the longitudinally vibratable tuning bars are longitudinally vibratable, and are shorter than the length of the longitudinally vibratable tuning bars.

Abstract: A method of manufacturing a composite longitudinal vibration mechanical filter that vibrates at a preselected central frequency in a high frequency range. The filter includes a plurality of vibratable bodies including input and output vibratable bodies each having respective piezoelectric members superposed thereon. Coupling elements couple the vibratable bodies to each other. Supporting elements project respectively from the input and output vibratable bodies. A holder is provided to which the supporting elements are attached. The method includes forming an integral body including the plurality of vibratable bodies, the coupling elements, the supporting elements, the holder and a vibration absorbing body holder for eliminating unnecessary vibrations.

Abstract: A composite longitudinal vibration mechanical filter for delivering out a supplied high-frequency signal in a predetermined frequency range includes a plurality of vibratable bodies including input and output longitudinal vibratable tuning bars with piezoelectric members superposed thereon, coupling elements by which the longitudinally vibratable tuning bars are coupled to each other, supporting elements projecting respectively from the input and output longitudinally vibratable tuning bars, and a holder to which the supporting elements are attached. At least one resonant frequency adjusting finger is disposed on at least one of the vibratable bodies. Grooves are defined in the longitudinally vibratable tuning bars at the same time that they are fabricated. The grooves extend in the direction in which the longitudinally vibratable tuning bars are longitudinally vibratable, and are shorter than the length of the longitudinally vibratable tuning bars.

Abstract: A composite longitudinal vibration mechanical filter for delivering out a supplied high-frequency signal in a predetermined frequency range includes a plurality of vibratable bodies including input and output longitudinal vibratable tuning bars with piezoelectric members superposed thereon, coupling elements by which the longitudinally vibratable tuning bars are coupled to each other, supporting elements projecting respectively from the input and output longitudinally vibratable tuning bars, and a holder to which the supporting elements are attached. Grooves are defined in the longitudinally vibratable tuning bars at the same time that they are fabricated. The grooves extend in the direction in which the longitudinally vibratable tuning bars are longitudinally vibratable, and are shorter than the length of the longitudinally vibratable tuning bars.

Abstract: There is disclosed an improved electromechanical resonator for use in multiresonator mechanical bandpass filters. The resonator is constructed using two resonator rods attached to a ceramic transducer which is substantially centrally located. The thus-formed electromechanical resonator resonates at the desired frequency in the third torsional mode, which is characterized by three motional nodes. Support pins are attached at the two outer nodes to provide physical support, and are also used for signal and ground connections, while the ceramic is positioned on or near the center node, which maximizes the achievable electromechanical coupling. Multiresonator mechanical bandpass filters which use such third-mode electromechanical resonators in conjunction with second-mode interior resonators have improved spurious rejection.

Abstract: By exchanging the position of the input and output resonator means relative to other resonator elements in a mechanical filter, the lengths of the bridging wires used to control the steepness of the bandpass characteristic of the filter can be reduced. Reducing the length of the bridging wires reduces both flexural spurious mode problems and extensional coupling variation problems.

Abstract: A trapped energy piezoelectric resonator for oscillator and multiple resonator applications has a piezoelectric substrate with electrodes disposed on each of its major surfaces. These electrodes are further comprised of a plurality of electrically interconnected and acoustically coupled sub-electrodes. The resonant frequency of these resonators may be controlled by varying the separation and, therefore, the acoustic coupling between the sub-electrodes. This resonator may be used in the feedback loop of an oscillator circuit as the frequency determining element. It may also be used to provide a resonator on a substrate carrying resonators of significantly different frequency.

Abstract: A mechanical bandpass filter of the cascaded flexure mode resonator bar type is provided with a coupling structure improving strength an reducing rigid-body spurious modes. Coupling wires are provided on both the top and bottom surfaces of the resonator bars, not just in a single plane.

Abstract: A multimode piezoelectric mechanical filter using edge-mode piezoelectric transducers, each comprising a semi-infinite or long piezoelectric plate polarized in the thickness direction, and a pair of exciting electrodes formed on the plate at an end portion thereof. Input and output edge-mode transducers are supported at their other ends together with optional resonator elements. The transducer and/or resonator elements are mechanically coupled with one another by a coupling rod at their end portions opposite the support to transmit the edge-mode vibration from one to the other. All of the transducers and resonator elements may be disposed in a common plane and may be integrally formed by punching a single piezoelectric plate to form a monolithic type mechanical filter. In such monolithic type filter, coupling rods are also integrally formed with the transducers and resonators.

Abstract: A mechanical filter having at least a pair of mechanical vibrators which are arrayed approximately in parallel with each other in regard to their longitudinal axes, and two couplers which are coupled to the pair of mechanical vibrators. According to the mechanical filter one of the pair of mechanical vibrators undergoes the vibration of the order of an odd number and the other one undergoes the vibration of the order of an even number in the same vibration mode, or both of them undergo the vibration of the order of an odd number or even number in the same vibration mode. Furthermore, these mechanical vibrators have such a mechanical size that they will vibrate at their required order of vibration and at their respective resonance frequencies, and the two couplers are so constructed that they will be differentially coupled to the pair of mechanical vibrators approximately at right angles therewith.

Abstract: An electromechanical filter having mechanical resonators which is used as a channel filter for a mobile radio communication receiver and a carrier telephone. The electromechanical filter is provided with exciter means, each of which is composed of a transducer and an exciter formed as a unitary structure and has the both functions. Each exciter means is a bar-shaped piezoelectric ceramic having a pair of electrodes deposited on its opposing surfaces and subjected to polarization treatment. The exciter means are mechanically coupled by mechanical coupling means with the mechanical resonators.

Abstract: In an electromechanical filter, poles are obtained by interconnecting an electrical reactance between the input and output of the filter. It is shown that this impedance behaves as a mechanical bridge.

Abstract: An electromechanical filter having minimum attenuation deviation in the pass band frequency range. The filter includes a plurality of mechanical resonators arranged substantially parallel to each other in one plane and mechanical couplers of longitudinal resonance characteristics which are disposed substantially transverse to the plurality of resonators for coupling the resonators together. The couplers have lengths which are between the first and second, and second and third oscillation modes of the longitudinal resonance characteristics. By virtue of the above structure, the couplers can be formed in a single mechanical coupling wire.

Abstract: An electromechanical filter having two transducers and a mechanical filter vibrating in longitudinal mode, which includes a plurality of resonators connected to each other by coupling rods. The resonators are arranged in two sections and staggered, and the coupling rods connecting two resonators are welded on flat portions provided at the ends of the resonators, each end resonator is connected to the respective transducer through a coupling rod secured to the end face of said resonator adjacent the flat portion, at a point located in the symmetry plane of the resonator, and the coupling rod which connects the end resonator to the next resonator is secured on the flat portion so that the middle of its welded length lies in said symmetry plane.

Abstract: An electromechanical bandpass filter includes at least one real pole consisting of vibrating resonators and couplers between adjacent resonators arranged as filter cells connected in parallel. Each cell includes a coupler and a half of each of the adjacent resonators. At least one bridge extends over at least one resonator and the image mobility of the cells which are spanned by the bridge is equal to the image mobility of the cells in an unbridged electromechanical filter of the same type and having the same passband.

Abstract: A pass-band electromechanical filter, comprising a mechanical unit vibrating in the longitudinal mode mounted between two electromechanical transducers, said unit comprising a plurality of half wave resonators mounted in series and coupling rods connecting the consecutive resonators, the resonators being distributed into two groups of which one comprises the resonators of odd rank and the other the resonators of even rank, the filter comprising moreover at least a bridging coupling rod connecting a resonator of rank k to a resonator of rank k+(2p+1) (p being a positive integer different from zero), said bridging coupling rod having its ends fixed at a certain distance from the end faces of the resonators, at least the bridging coupling rod on the one hand, or the coupling rod placed between the resonator of rank k and that of rank k+(2p+1) on the other hand, having a length which is respectively different from a three quarter wave or different from a quarter wave.

Abstract: An electromechanical filter comprising resonators interconnected by couplers and at least one bridge strapping over several resonators in which said resonators are longitudinally vibrating, said couplers and bridge are bending and the number of strapped resonators is a multiple of four. Such a filter shows improved phase characteristic within the pass band.