Abstract: Various exemplary embodiments relate to a support assembly for a planar filter. The assembly includes a u-shaped housing with angled surfaces at the inner corners of the u-shape, a first dielectric plate having a first angled surface in contact with one of the angled surfaces of the housing, a second dielectric plate having a second angled surface in contact with the other angled surface of the housing, at least one compressible ring, and a cover. The planar filter is supported between the first dielectric plate and the second dielectric plate. The cover compresses the compressible ring to apply downward force on the first and second dielectric plates. The downward force is translated to an inward force by the angled surfaces of the housing. The angled surfaces of the housing apply an inward force on the first dielectric plate and the second dielectric plate.

Abstract: The present invention relates generally to digital elliptic filters, and more particularly, but not exclusively to multi-layer digital elliptic filters and methods for their fabrication.

Abstract: A semiconductor device has a substrate and band-pass filter formed over the substrate. The band-pass filter includes a first conductive trace wound to exhibit inductive properties with a first end coupled to a first terminal of the semiconductor device and second end coupled to a second terminal of the semiconductor device, and first capacitor coupled between the first and second ends of the first conductive trace. A second conductive trace is wound to exhibit inductive properties with a first end coupled to a third terminal of the semiconductor device and second end coupled to a fourth terminal of the semiconductor device. The second conductive trace has a different size and shape as the first conductive trace. A second capacitor is coupled between the first and second ends of the second conductive trace. A third conductive trace is wound around the first and second conductive traces to exhibit inductive properties.

Abstract: On-chip millimeter wave (mmW) notch filters with via stubs, methods of manufacture and design structures are disclosed. The notch filter includes a signal line comprising a metal trace line connected to a metal via stub partially extending into a semiconductor substrate. The notch filter further includes a defected ground plane connected to at least one or more additional metal via stubs partially extending into the semiconductor substrate.

Abstract: A waveguide structure or a printed-circuit board is formed using a plurality of unit structures which are repetitively aligned in a one-dimensional manner or in a two-dimensional manner. The unit structure includes first and second conductive planes which are disposed in parallel with each other, a transmission line having an open end which is formed in a layer different from the first and second conductive planes and positioned to face the second conductive plane, and a conductive via electrically connecting the transmission line to the first conductive plane.

Abstract: A wideband high frequency bandpass filter is disclosed, which includes an open-circuit resonator structure and a short-circuit resonator structure. The open-circuit resonator has a signal transmission strip line and a T-shaped strip line. Both ends of the signal transmission strip line are bent toward to opposite ends of the T-shaped strip line respectively, so as to form gaps in the open-circuit resonator. The open-circuit resonator structure and the short-circuit resonator structure are coupled under the resonant mode, thereby achieving a bandpass filtering at 60 GHz.

Abstract: According to one embodiment, a semiconductor package includes a band stop filter, which includes: a transmission line pattern arranged on a package substrate; and a conductive stub pattern arranged along the transmission line pattern in a state of being separated from the transmission line pattern.

Abstract: A band-pass filter with a loop configuration is implemented on a circuit board in the form of a microstrip line for signals in the gigahertz range. The band-pass filter includes a dielectric substrate and a conductive layer disposed over the dielectric substrate, wherein the conductive layer comprises a loop portion; a first signal terminal extending from a first side of the loop portion; a second signal terminal extending from a second side of the loop portion; a first branch extending from a third side of the loop portion; and a second branch extending from a fourth side of the loop portion.

Abstract: A technique is provided to increase signal bandwidth of data processing signals by providing a plating stub as a filter using multiple line segments of different widths to filter the reflected high frequency components bouncing from the stub end toward the signal path. This stub-filter shifts the resonance point to a much higher frequency, placing that point of resonance beyond the bandwidth of interest without sacrificing a low frequency loss. Accordingly, there is provided an apparatus comprising a stub filter of a substrate, comprising a multi-segmented stub comprising a plurality of stub portions, where one of the stub portions has a different impedance than another of the stub portions.

Abstract: An apparatus for filtering a signal is disclosed. The apparatus includes a conductive line affixed to a surface of a substrate. For a signal received at an end of the conductive line, the apparatus is configured to filter at least a portion of the frequency components of the signal. First and second resistive films are adjacent to a respective side of the conductive line along a first side of each of the first and second resistive films, respectively. The first and second resistive films have a first resistivity. Third and fourth resistive films adjacent to a respective one of the first and second resistive films along a second side of each of the first and second resistive films. Each second side of the first and second resistive films extends beyond the third and fourth resistive films. The third and fourth resistive films have a second resistivity.

Abstract: A multilayer electronic component and a multilayer electronic component manufacturing method are capable of easily controlling the degree of magnetic field coupling between inductors. Via-hole conductors are arranged so that they extend in a lamination direction in a laminate, and function as a first inductor. Via-hole conductors are arranged so that they extend in the lamination direction in the laminate, and function as a second inductor. A first capacitor and the first inductor define a first resonance circuit. A second capacitor and the second inductor define a second resonance circuit. The via-hole conductors are arranged in a first insulating layer so that they are spaced apart from each other by a first distance. The via-hole conductors are arranged in a second insulating layer so that they are spaced apart from each other by a second distance that is different from the first distance.

Abstract: In a multilayer band-pass filter, each of first-stage to third-stage LC parallel resonators includes capacitor electrodes, via electrodes, and a line electrode. Jump-coupling capacitor electrodes face the capacitor electrodes of the first-stage and third-stage LC parallel resonators. The direction in which the inductor electrode extends from the capacitor electrodes of each of the first-stage and third-stage LC parallel resonators is opposite to the direction in which the inductor electrode extends from the capacitor electrodes of the second-stage LC parallel resonator.

Abstract: This invention relates to a microstrip to slotline transition circuit operating on two frequency bands, in which a first filtering circuit is connected between a first portion of microstrip line and a first input/output port, said first circuit and the portion of microstrip line being adapted to accept the frequencies from a first frequency band and reject the frequencies of a second frequency band, a second filtering circuit is connected between a second portion of microstrip line and a second input/output port, said second circuit and the portion of microstrip line being adapted to accept the frequencies from the second frequency band and reject the frequencies from the first frequency band, and the slotline is sized to provide an impedance that is substantially equal to the impedance of an open circuit at the coupling zone between the microstrip line and the slotline.

Abstract: An adjustable radiofrequency filter in planar technology comprises at least one dielectric substrate and n resonators R1, R2, . . . Ri, . . . Rj, . . . Rk, . . . Rn integrated into the substrate, and each resonator comprises, on a principal plane PL of the substrate, a succession of segments t1, t2, . . . tq, . . . tp of planar transmission lines each having two ends, p being the number of segments of planar transmission lines of the resonator Ri considered, p being equal to or greater than 2, q being the rank of the segment, an end of a segment tq of a resonator Ri being opposite and separated by a distance d from an end of the next segment t(q+1) of the same resonator Ri, the opposite ends of the successive segments of a resonator Rq being linked by an electrical link which locally raises the characteristic impedance of the resonator Ri considered.

Abstract: A Radio Frequency (RF) filter configured by combining a hybrid coupler with a general filter, for having different characteristics from original characteristics of a general filter is provided, in which a coupler receives an input signal through a first port, divides the input signal, outputs the divided signals through second and third ports, combines signals received through the second and third ports according to phases of the signals, and outputs the combined signal through the first port or as an output signal of the RF filter through a fourth port, and a first filter unit has a first port connected to the second port of the coupler and a second port connected to the third port of the coupler, for having a predetermined frequency filtering characteristic.

Abstract: An exemplary embodiment of the present disclosure illustrates a multilayer circuit board structure, for suppressing the undesired electromagnetic wave propagation within a specific frequency band. The multilayer circuit board structure includes a plurality of crystals and a plurality of conducting channels, wherein a crystal includes a first through fourth conducting planes, at least a first conducting connector, and at least a second conducting connector, wherein the first through the fourth conducting planes are substantially parallel to each other. The first conducting plane is electrically connected to the third conducting plane through the first conducting connector. The fourth conducting plane is electrically connected to the second conducting plane through the second conducting connector. The first and the third conducting planes are configured to be electrically separated from the second and the fourth conducting planes.

Abstract: Disclosed are various embodiments of power source redundancy in a power supply for a rack mounted computing device. The power supply includes a plurality of AC power converters configured to receive power from corresponding power sources. A first AC power converter provides DC power to a common DC bus of the power supply. A second AC power converter provides DC power to the common DC bus in response to a change in the voltage level provided by the first AC power converter.

Abstract: A CRLH resonator-based band-pass filter includes at least two CRLH resonators. The resonators are connected by capacitive coupling. The resonators includes a microstrip line having input and output ports. The microstrip line includes a first interdigital line serial-connected to the input port, a second interdigital line serial-connected to the output port, a connection line connecting the first and second interdigital lines, and an inductor line parallel-connected to the connection line and provided with a grounded end.

Abstract: A filter includes a dielectric substrate; an electrode layer continuously formed covering a first side of the dielectric substrate; a disk-shaped electrode pattern provided on a second side of the dielectric substrate, the disk-shaped electrode pattern and the electrode layer holding the dielectric substrate therebetween; a ground slot having an opening that is formed asymmetrically with respect to the center of a circular area included in the electrode layer and exposes the dielectric substrate, the circular area and the disk-shaped electrode pattern holding the dielectric substrate therebetween.

Abstract: Embodiments of the present invention provide a filter, a receiver, a transmitter, and a transceiver. The filter includes a resonant cavity component, a microstrip filtering component, and two connecting pieces, where the resonant cavity component includes at least two resonant cavities connected in parallel, each resonant cavity is provided with a resonator and a tuning screw, the microstrip filtering component includes a dielectric substrate and a microstrip positioned on the dielectric substrate, one of the connecting pieces matches and connects one end of the microstrip to the resonator on one resonant cavity, the other connecting piece matches and connects the other end of the microstrip to the resonator on another resonant cavity, and impedance of the resonant cavity component is less than impedance of the microstrip filtering component.

Abstract: An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.

Abstract: Provided are a bandpass filter and a radio communication module and a radio communication device using the same. The bandpass filter includes: a first and a second grounding electrode arranged on the upper and the lower surface of a layered body; single resonance electrodes and composite resonance electrodes arranged to orthogonally intersect the single resonance electrodes; a first input coupling electrode opposing to the single resonance electrode of the input stage and a second input coupling electrode connected thereto and opposing to the composite resonance electrode of the input stage; a first output coupling electrode opposing to the single resonance electrode of the output stage and a second output coupling electrode connected thereto and opposing to the composite resonance electrode of the output stage.

Abstract: A split ring-resonator includes a substrate, an inner-trench or cavity formed into the substrate, the inner trench or cavity including a split, and an outer trench or cavity formed into the substrate around the inner trench or cavity, the outer trench or cavity including another split disposed at an opposite end of the split in the inner trench or cavity, wherein the inner trench or cavity and the outer trench or cavity are configured to receive an electrically conductive gas and/or plasma to form a split-ring resonator.

Abstract: A microwave filter is provided that includes a transmission line having a signal input port and a signal output port, a stub connected to the transmission line between the input port and the output port, and a spurline embedded in the stub. The microwave filter is configured to substantially attenuate a frequency while substantially passing at least one predetermined odd harmonic of the frequency.

Abstract: Provided are a bandpass filter and a radio communication module and a radio communication device using the same. The bandpass filter includes: a first and a second grounding electrode arranged on the upper and the lower surface of a layered body; first resonance electrodes and second resonance electrodes arranged to orthogonally intersect the first resonance electrodes; a first input coupling electrode opposing to the first resonance electrode of the input stage and a second input coupling electrode connected thereto and opposing to the second resonance electrode of the input stage; a first output coupling electrode opposing to the first resonance electrode of the output stage and a second output coupling electrode connected thereto and opposing to the second resonance electrode of the output stage.

Abstract: An arrangement includes a plurality of split ring resonators on a planar substrate. Each split ring resonator of the plurality of split ring resonators includes two mutually parallel ring structures of a metal conductor element spaced apart by the substrate. The two mutually parallel rings structures are respectively separated by at least one gap. At least two split ring resonators of the plurality of split ring resonators are positionable relative to one another such that the separated ring structures may be reciprocally guided through a gap of the respective other ring structures and interlock. Overlap regions may be produced by common ring structure inner surfaces.

Abstract: A stripline filter having a substrate, a grounding electrode, principal-surface lines, side-surface lines, and common electrodes, and is mounted on a set substrate by soldering. The side-surface lines are disposed on a side surface of the substrate, and are wetted by solder during soldering. Each of the common electrodes is connected to a corresponding one of the principal-surface lines. The common electrodes are also connected to the grounding electrode via the side-surface lines.

Abstract: There is provided an improved bandpass filter having multiple passbands, and in one embodiment, two independent passbands are provided by a single filter. Embodiments of the present invention support communication architectures with several frequency bands without requiring one signal path per band, thus realizing improvements in size, cost, and weight. One aspect of the invention utilizes strongly overcoupled resonators to achieve multiple passband response, and in various embodiments, single-ended or differential mode inputs and outputs are accommodated.

Abstract: A band-pass filter including a double-sided circuit board, an input terminal, an output terminal and a plurality of resonance units are provided. The double-sided circuit board includes a first conductor layer and a second conductor layer. The first conductor layer includes a grounded metal layer. The grounded metal layer includes one or more vias to connect to a grounded layer of the second conductor layer. The input terminal is disposed in the first conductor layer to receive a signal. The output terminal is disposed in the first conductor layer to output the filtered signal. The resonance units are disposed in the first and second conductor layers respectively, wherein the number of the resonance units is N, and N is a positive integer greater than or equal to 3.

Abstract: A signal transmission device includes: a first substrate and a second substrate; a first resonance section including a first resonator and a second resonator electromagnetically coupled to each other; a second resonance section disposed side-by-side relative to the first resonance section, and electromagnetically coupled to the first resonance section to perform a signal transmission between the first and second resonance sections; and a first shielding electrode disposed between the first resonator and the second substrate and partially covering the first resonator to allow at least an open end of the first resonator to be covered therewith, and a second shielding electrode disposed between the second resonator and the first substrate and partially covering the second resonator to allow at least an open end of the second resonator to be covered therewith.

Abstract: Methods and devices for phase shifting an RF signal for a base station antenna are provided. The device includes a transmission line that has a stationary ground plane coupled to the top of a substrate and a signal line on the bottom of the substrate. The signal line has an input port and an output port. The input port receives the RF signal with a certain phase and travels across the bottom of the substrate to the output port. The RF signal has a different phase at the output port because defected ground structures etched on the stationary ground plane shift the phase of the RF signal. In addition, the device includes a movable ground plane that may cover a portion of the defected ground structures, the substrate, and the stationary ground plane such that the moveable ground plane further adjusts the phase of the RF signal.

Abstract: The present invention is related to a filtering device with slotted ground structure, comprising a first substrate, a second substrate and a pair of differential signal lines, in which a ground plane having slotted ground structure is provided between the first substrate and the second substrate. Each of the two differential signal lines is symmetric to each other and comprises a first line segment being horizontally provided on the top surface of the first substrate and a second line segment being horizontally provided on the bottom surface of the second substrate, respectively. The first line segment is connected to the second line segment through a vertically disposed conductive via. Thereby, a common-mode noise within a specific frequency band may be suppressed effectively, so as to avoid interference a differential-mode signal transmitted on the differential signal lines, due to the slotted ground structure etched on the ground plane.

Abstract: A printed filtering antenna is provided. This filtering antenna comprises an antenna part and a coupled line resonator. The antenna part is directly connected to a coupled line resonator and occupies an antenna area. The coupled line resonator provides a filtering mechanism together with the antenna part. The coupled line resonator comprises a short-circuited stub and an open-circuited stub. The short-circuited stub comprises an open-circuited end and a short-circuited end connected to ground. The open-circuited stub is parallel to the short-circuited stub. The open-circuited stub comprises a first end and a second end. The first end is connected to the feed point and is corresponding to the open-circuited end of the short-circuited stub such that the open-circuited stub is coupled to the short-circuited stub.

Abstract: Methods and systems for filters embedded in an integrated circuit package are disclosed and may include controlling filtering of signals within an integrated circuit via one or more filter components embedded within a multi-layer package bonded to the integrated circuit. The one or more filter components may be electrically coupled to one or more switchable capacitors within the integrated circuit. The filter components may include transmission line devices, microstrip filters, transformers, surface mount devices, inductors, and/or coplanar waveguide filters. The filter components may be fabricated utilizing metal conductive layers and/or ferromagnetic layers deposited on and/or embedded within the multi-layer package. The integrated circuit may be electrically coupled to the multi-layer package utilizing a flip-chip bonding technique.

Abstract: A filter circuit having two pass bands includes first and second bandpass filters which are connected in parallel with each other. Each of the bandpass filters includes at least a resonator group composed of a plurality of resonators arranged in orderly sequence so as to be coupled to each other to form a pass band, an input terminal coupled to a resonator on an input stage, and an output terminal coupled to a resonator on an output stage. The resonator group is composed of at least one of one or more quarter-wavelength resonators and one or more half-wavelength resonators. The resonator group of at least one of the first bandpass filter and the second bandpass filter includes both one or more quarter-wavelength resonators and one or more half-wavelength resonators.

Abstract: A fully integrated silicon-based bandpass filter which lends itself to applications in the gigahertz region is disclosed. The bandpass filter is fabricated on an integrated circuit and operates as a microwave/millimeter-wave filtering circuit. In accordance with one aspect, the bandpass filter includes a first set and a second set of filter coupled elements, a three-port “T” transmission line junction and a perturbing element. The three-port “T” transmission line junction has a first port coupled to a first end of a first one of the first set of filter coupled elements and a second port coupled to a first end of a first one of the second set of filter coupled elements. The perturbing element is coupled to a third port of the three-port “T” transmission line junction. A second one of the first set of filter coupled elements includes an input transmission line and has a first end thereof coupled to an input port and an opposite end thereof having an open end.

Abstract: A tunable notch filter, comprises a transmission line coupled to an antenna; a plurality of ring resonators inductively coupled to the transmission line, wherein each ring resonator of the plurality of ring resonators is grounded and comprises a variable microelectromechanical systems (MEMS) capacitor; wherein a set of variable MEMS capacitors of the plurality of variable MEMS capacitors are independently tunable to vary a notch location and a notch width of the tunable notch filter; and wherein a set of ring resonators of the plurality of ring resonators further comprises an attenuator configured to reduce power reflected from the antenna.

Abstract: A microwave resonator with impedance jump, comprises at least one line of high characteristic impedance of a determined length and one line of low characteristic impedance, at least the line of high characteristic impedance comprising a first line cut, a first link wire of a first determined impedance ensuring an electrical link for the passage of the signal from one side to the other of the first line cut. A method for producing a microwave resonator comprising an adjustment step is also provided.

Abstract: A dual mode filter (200, 500, 900) comprising an input (Pin) and an output port (Pout) and a non-conducting substrate (205, 505), and first (215, 510, 902) and second (210, 540, 901) conductors which connect the input port to the output port. The conductors are arranged on or in the substrate, and the first conductor is longer than the second conductor by 50%. Either the first or the second conductor comprises a perturbation element (208, 530, 915) at a central position. The first conductor is arranged between the input port and the output port with a number of sections (216-222; 511-519; 931-933, 936-938), at least some of which are parallel to each other, and arranged so that the current in a section which has one or more other sections in parallel to it always flows in the same direction as the current in the most adjacent of said other sections.

Abstract: Provided is a composite resonator wherein two resonance frequencies can be set discretionarily to a certain extent. The composite resonator is provided with a grounding electrode (21) arranged on a lower surface of a laminated body wherein a plurality of dielectric layers (11) are laminated, and a composite resonant electrode (26) arranged on an upper surface or inside of the laminated body. The composite resonant electrode (26) is composed of a base section (27) and a plurality of strip-like protruding sections (28a, 28b). One end of the base section (27) is grounded. One end of each of the protruding sections (28a, 28b) is connected to the other end of the base section (27), and the protruding sections are arranged in parallel.

Abstract: A bandpass filter for a wide frequency band such as UWB is disclosed. The bandpass filter comprises a laminate of a plurality of dielectric layers, a first ground electrode connected to a ground potential, a plurality of resonant electrodes in a first inter-layer and a plurality of coupling electrodes in a second inter-layer. A transmission characteristic of the bandpass filter having flat and low loss over the entire region of the broad pass band can be achieved.

Abstract: A band-pass filter has a plurality of frequency band channels each including a first inductor having a first terminal coupled to a first balanced port and a second terminal coupled to a second balanced port. A first capacitor is coupled between the first and second terminals of the first inductor. A second inductor has a first terminal coupled to a first unbalanced port and a second terminal coupled to a second unbalanced port. The second inductor is disposed within a first distance of the first inductor to induce magnetic coupling. A second capacitor is coupled between the first and second terminals of the second inductor. A third inductor is disposed within a second distance of the first inductor and within a third distance of the second inductor to induce magnetic coupling. A second capacitor is coupled between first and second terminals of the third inductor.

Abstract: A high frequency band pass filter with a coupled surface mount transition is provided, including a filter substrate, circuit connection elements defining input and an output elements provided on a surface of the filter substrate, electronic filter components provided on the first surface of the filter substrate, and impedance matching structures provided on the first surface of the filter substrate between the electronic filter components and the respective input and output elements. Signal connection structures are provided on an opposed surface of the filter substrate, in locations that positionally correspond to respective positions of the input and output elements.

Abstract: A technique is provided to increase signal bandwidth of data processing signals by providing a plating stub as a filter using multiple line segments of different widths to filter the reflected high frequency components bouncing from the stub end toward the signal path. This stub-filter shifts the resonance point to a much higher frequency, placing that point of resonance beyond the bandwidth of interest without sacrificing a low frequency loss. Accordingly, there is provided an apparatus comprising a stub filter of a substrate, comprising a multi-segmented stub comprising a plurality of stub portions, where one of the stub portions has a different impedance than another of the stub portions.

Abstract: A transmission line resonator includes a half-wavelength stepped-impedance resonator with two ends short-circuited to ground, and a capacitive element with one end connected to a center portion of the stepped-impedance resonator and the other end short-circuited to ground. The stepped-impedance resonator includes a first transmission line, a second transmission line, and a third transmission line. The second transmission line has a second line impedance and a second line length, with one end being connected to one end of the first transmission line and the other end being short-circuited to ground. The third transmission line has the second line impedance and the second line length, with one end being connected to the other end of the first transmission line and the other end being short-circuited to ground. The first line impedance is lowered in comparison with the second line impedance.

Abstract: A band-pass filter has a plurality of frequency band channels each including a first inductor having a first terminal coupled to a first balanced port and a second terminal coupled to a second balanced port. A first capacitor is coupled between the first and second terminals of the first inductor. A second inductor has a first terminal coupled to a first unbalanced port and a second terminal coupled to a second unbalanced port. The second inductor is disposed within a first distance of the first inductor to induce magnetic coupling. A second capacitor is coupled between the first and second terminals of the second inductor. A third inductor is disposed within a second distance of the first inductor and within a third distance of the second inductor to induce magnetic coupling. A second capacitor is coupled between first and second terminals of the third inductor.

Abstract: A filter is provided with a multilayer board incorporating a resonator formed by two ground plates opposed to each other and conductive side walls connected to the ground plates; two signal vias provided through the resonator; and two terminals connected to the signal vias to receive a pair of signals. The resonator has a first face of symmetry vertical to the ground plates. The signal vias are disposed symmetrically with respect to the first face of symmetry on a distance from the first face of symmetry.

Abstract: A semiconductor integrated circuit device with a balun which is formed above a conductive semiconductor substrate and which includes a dielectric film, an unbalanced line for transmitting an unbalanced signal, and balanced lines for transmitting a balanced signal. The unbalanced line is placed opposite to the balanced lines via a nano-composite film that is a region of the dielectric film. The nano-composite film, interposed between the unbalanced line and the balanced lines, has a relative permittivity higher than that of other regions of the dielectric film. This allows suppression of electromagnetic coupling of transmission lines or passive elements other than the balun, thereby providing a semiconductor device with a wide-band and small-size balun.

Abstract: A broad band diplexer employing suspended strip-line capacitors is disclosed. The diplexer has a low pass filter circuit and a high band pass filter circuit. The high band pass filter circuit has a first set of conductive pathways formed on the first surface of a suspended dielectric substrate, a second conductive pathway formed on the second surface of the substrate such that first and second conductive pathways are capacitively coupled, and plural resonators. The high pass filter circuit provides plural transmission poles within the band of operation exceeding the number of resonators.

Abstract: A wide-band balun device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil and a portion of the second coil oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A first portion of the third coil is oriented interiorly of the second coil. The third coil has a balanced port connected to the third coil between second and third portions of the third coil.