Abstract: Embodiments include package substrates and method of forming the package substrates. A package substrate includes a dielectric over a conductive layer, and a conductive line on the dielectric. The package substrate includes a plurality of conductive bumps on a surface of the conductive line, where the conductive bumps are conductively coupled to the conductive line, and a solder resist over the conductive line and the dielectric. The surface of the conductive line may be a bottom surface, where the conductive bumps are below the conductive line and conductively coupled to the bottom surface of the conductive line, and where the conductive bumps may be embedded in the dielectric. The surface of the conductive line may be a top surface, where the conductive bumps are above the conductive line and conductively coupled to the top surface of the conductive line, and wherein the conductive bumps are embedded in the solder resist.

Abstract: The present disclosure relates to an oscillator apparatus comprising a differential transmission line forming a closed loop, a plurality of active core components that are electrically connected to the differential transmission line and that are configured to compensate for loss in the differential transmission line, a plurality of tuning elements that are electrically coupled with the differential transmission line, and a processor configured to control each tuning element of the plurality of tuning elements to activate or deactivate such that an effective electrical length of the differential transmission line is changed.

Abstract: An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. A top enclosure encloses the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the top enclosure engage reference ground metal traces on respective surface of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry.

Abstract: Signal conductor patterns (21, 31) are respectively formed on a first main surface (101) and a second main surface (102) of an insulating substrate (100). Ground conductor patterns (222, 322) are formed on the first main surface (101) and the second main surface (102). A first conductive member (41) is formed in the insulating substrate (100) and electrically connects the signal conductor patterns (21, 31) in the thickness direction. A second conductive member (42) is formed in the insulating substrate (100) and connected to the ground conductor patterns (222, 322). A dielectric member (43) is disposed between the first conductive member (41) and the second conductive member (42), is in contact with the first conductive member (41) and the second conductive member (42), and has a dielectric constant different from the dielectric constant of the insulating substrate (100).

Abstract: An electronic device and a method for manufacturing such an electronic device are described. The electronic device includes an electronic component, and a component carrier in which the electronic component is embedded. The component carrier includes a first component carrier part having a first cut-out portion and a second component carrier part having a second cut-out portion, the first cut-out portion and the second cut-out portion facing opposite main surfaces of the electronic component. An electrically conductive material is provided on the surface of the first cut-out portion and on the surface of the second cut-out portion. The first cut-out portion and the second cut-out portion respectively form a first cavity and a second cavity on opposite sides of the electronic component.

Abstract: A hybrid coupler for dividing an input electrical signal to produce first and second output electrical signals which are substantially out of phase, the hybrid coupler including an input port for receiving the input electrical signal, and an input line for coupling the input electrical signal to a slotline. The hybrid coupler further includes an output line for coupling the first and second output electrical signals to a first output port and a second output port, respectively. The output line has a junction with the slotline. The hybrid coupler further includes a co-planar waveguide electrically connected to said output line and having a first end and an opposing second end, and defining, at the second end, a sum port configured to divert common mode signals received at said first and second output ports to said second end. The slotline transitions into the first end of the co-planar waveguide.

Abstract: To provide an electronic device and a connecting component which have a shield function and which enable downsizing. The electronic device includes: a substrate having a first substrate portion and a second substrate portion that is arranged at a position facing the first substrate portion; a plurality of potential wirings which are connected to the first substrate portion and to the second substrate portion and which have an arbitrary potential; and a plurality of signal wirings which are connected to the first substrate portion and to the second substrate portion and to which a signal is supplied. The first substrate portion has a mounting region of an electronic component on a side of a surface facing the second substrate portion. The plurality of potential wirings are arranged outside of the mounting region.

Abstract: A millimeter-wave (mmWave) assembly (1) comprising a first mmWave module (2), a second mmWave module (3), and a connector (4) configured to releasably interconnect the first mmWave module (2) and the second mmWave module (3). The connector (4) comprises a first connector element (5) associated with the first mmWave module (2). The first mmWave module (2) comprises a first substrate (7) and an mmWave radio frequency integrated circuit (RFIC) (8), and the second mmWave module (3) comprises a second substrate (9) and an mmWave antenna array (10). The connector (4) is configured to transmit at least one signal between the mmWave RFIC (8) and the mmWave antenna array (10) when the first mmWave module (2) and the second mmWave module (3) are interconnected.

Abstract: An integrated circuit package includes a transmission line structure, conductive bonds, a post and a dielectric post. The transmission line structure runs from a printed circuit board (PCB) to an integrated circuit (IC) and includes a center transmission line surrounded by ground and sealed from exposure to air. The conductive bonds connect the transmission line structure to pads on the integrated circuit from where the center transmission line exits the integrated circuit package. The first post is part of the center transmission line where the center transmission line enters the integrated circuit package from the printed circuit board. The dielectric post supports the center transmission line where the center transmission line exits the integrated circuit package to connect to the conductive bonds and compensates part of the conductive bond inductance.

Abstract: Realized is a multilayer substrate and a multilayer substrate array, each of which has a high degree of freedom in a production method. At least part of an outer periphery (51) of a multilayer substrate (100), which includes a wiring provided on an inner layer, is processed so as to have a wave shape.

Abstract: An optical waveguide is configured to propagate a light signal. Metal vias are arranged along and on either side of a portion of the optical waveguide. Additional metal vias are further arranged along and on either side of the optical waveguide both upstream and downstream of the portion of the optical waveguide. The metal vias and additional metal vias are oriented orthogonal to a same plane, the same plane being orthogonal to a transverse cross-section of the portion of the optical waveguide.

Abstract: An RF signal processing system including multiple drop-in modular circuit blocks is disclosed. The drop-in modular circuit blocks include input and output launches exhibiting the same launch geometry. The RF system may include a conductive plate with a grid of holes disposed on the conductive plate. Multiple modular blocks may be installed on the conductive plate to form a cascade of modular blocks that exhibit common launch geometries. The cascade may include an RF probe with a projection and conductive pin that overhang a portion of a launch of a modular block at an end of the cascade. Flex connects may be disposed on, and held in position by, anchors to connect adjacent modular blocks together in a prototype system. A production RF system may exhibit the same overall geometry as a prototype RF system to speed up the transition from prototype design to production design.

Abstract: Techniques that facilitate a superconducting combiner or separator of DC-currents and microwave signals are provided. In one example, a device includes a direct current circuit and a microwave circuit. The direct current circuit comprises a bandstop circuit and provides transmission of a direct current signal. The microwave circuit provides transmission of a microwave signal. The microwave circuit and the direct current circuit that comprises the bandstop circuit are joined by a common circuit that provides transmission of the direct current signal and the microwave signal.

Abstract: A device includes a substrate that includes a resonant cavity. The resonant cavity includes a plurality of dipolar molecules that have an absorption frequency. The resonant cavity resonates at a frequency that is equal to the absorption frequency of the dipolar molecules. The device further includes a first port on the resonant cavity configured to receive a radio frequency (RF) signal.

Abstract: Printed circuit board mounted antenna and waveguide interfaces are provided herein. An example device includes any of a dielectric substrate or transmission line, an antenna mounted onto the dielectric substrate, and an elongated waveguide mounted onto the dielectric substrate so as to enclose around a periphery of the antenna and contain radiation produced by the antenna along a path that is coaxial with a centerline of the waveguide.

Abstract: A waveguide system for a transition between a waveguide structure having an exterior stripline element and a waveguide structure having a stripline element which is completely shielded. To that end, the present invention provides a transition which is able to be realized particularly easily and efficiently with the aid of a multilayer printed circuit board architecture.

Abstract: The illustrative embodiments pertain to a test fixture having low insertion inductance for large bandwidth monitoring of current signals. In one exemplary embodiment, the test fixture includes a baseplate with each resistor of a set of resistors embedded inside a respective non-plated through slot in the baseplate. A first terminal of each resistor is soldered to a top metallic zone of the baseplate and a second terminal soldered to a first of two bottom metallic zones of the baseplate. The top metallic zone is connected by plated-through holes to a second of the two bottom metallic zones. When mounted upon a PCB, the test fixture allows current flow from the first bottom metallic zone, upwards through the set of resistors to the top metallic zone, and downwards to the second bottom metallic zone. An observation instrument may be coupled to a coaxial connector that is mounted on the baseplate.

Abstract: The present disclosure relates to a balun arrangement (1, 1?, 1?) comprising a single-ended port (2, 2; 17, 26), a differential port arrangement (61), a coupled first and second transmission line section (5, 6) constituting a first coupled pair (7), and a third and fourth coupled transmission line section (8, 9) constituting a second coupled pair (10). The first transmission line section (5) is connected between a first coupled pair first port (11) and the third transmission line section (8), the second transmission line section (6) is connected between a first coupled pair second port (12) and the first differential port (3), the third transmission line section (8) is connected between a second coupled pair first port (13) and the first transmission line section (5), and the fourth transmission line section (9) is connected between a second coupled pair second port (14) and the second differential port (4).

Abstract: An electronic device is provided. The electronic device includes a circuit board, a first conductive member electrically connected to the circuit board at a first point, a second conductive member electrically connected to the circuit board at a second point, and a connection member connecting the first conductive member and the second conductive member, where the connection member includes a first conductive layer electrically connected to the first conductive member, a second conductive layer electrically connected to the second conductive member, and a dielectric layer disposed between the first conductive layer and the second conductive layer.

Abstract: A compact wideband RF antenna for incorporating into a planar substrate, such as a PCB, having at least one cavity with a radiating slot, and at least one transmission line resonator disposed within a cavity and coupled thereto. Additional embodiments provide stacked slot-coupled cavities and multiple coupled transmission-line resonators placed within a cavity. Applications to ultra-wideband systems and to millimeter-wave systems, as well as to dual and circular polarization antennas are disclosed.

Abstract: An interconnection includes a cable assembly and a board assembly. The cable assembly includes a cable having an inner conductor. The board assembly comprises an intermediate layer disposed between first and second outer layers, a recess disposed between the first and second outer layers so as to form a cable-receiving space at a first side edge, and a first inner-conductor contact opening extending through at least one of the first and second outer layers and opening into the cable-receiving space. The inner conductor is inserted at the first side edge into the cable-receiving space and is disposed at an offset in a longitudinal direction relative to the first inner-conductor contact opening. The inner conductor is electrically conductively soldered via a first soldered inner-conductor connection to a first inner-conductor connection region of the first and/or second outer layers, at least in a region of the first inner-conductor contact opening.

Abstract: A circuit apparatus includes at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

Abstract: An implantable device includes a cylindrical housing, a metallic feedthrough, a metallic collar, and a battery. The cylindrical housing has a sidewall and an internal cavity, and is formed from a ceramic. One or more electrical components are integrated into the sidewall. The metallic feedthrough is joined to a first end of the cylindrical housing. The metallic collar is joined to a second end of the cylindrical housing. The battery is joined to the metallic collar.

Abstract: There is provided a method for manufacturing a group-III nitride substrate, including: (a) preparing a substrate which is made of a group III-nitride crystal and which has a high oxygen concentration domain where an oxygen concentration is higher than that of a matrix of the crystal; (b) irradiating the substrate with laser beam aiming at the high oxygen concentration domain, forming a through-hole penetrating the substrate in a thickness direction, and removing at least a part of the high oxygen concentration domain from the substrate; and (c) embedding at least a part of an inside of the through-hole by growing the group-III nitride crystal in the through-hole.

Abstract: A high-frequency circuit includes: a first substrate; a transmission line formed on the first substrate and having first and second output portions branched from an input portion; a second substrate; first and second pads formed on the second substrate; a first wire connecting the first output portion to the first pad; and a second wire connecting the second output portion to the second pad, wherein an electrical length from the input portion to an edge of the second output portion is longer than an electrical length from the input portion to an edge of the first output portion, and a length from a junction between the second wire and the second output portion to the edge of the second output portion is longer than a length from a junction between the first wire and the first output portion to the edge of the first output portion.

Abstract: A compact wideband RF antenna for incorporating into a planar substrate, such as a PCB, having at least one cavity with a radiating slot, and at least one transmission line resonator disposed within a cavity and coupled thereto. Additional embodiments provide stacked slot-coupled cavities and multiple coupled transmission-line resonators placed within a cavity. Applications to ultra-wideband systems and to millimeter-wave systems, as well as to dual and circular polarization antennas are disclosed.

Abstract: An RF signal processing system including multiple drop-in modular circuit blocks is disclosed. The drop-in modular circuit blocks include input and output launches exhibiting the same launch geometry. The RF system may include a conductive plate with a grid of holes disposed on the conductive plate. Multiple modular blocks may be installed on the conductive plate to form a cascade of modular blocks that exhibit common launch geometries. The cascade may include an RF probe with a projection and conductive pin that overhang a portion of a launch of a modular block at an end of the cascade. Flex connects may be disposed on, and held in position by, anchors to connect adjacent modular blocks together in a prototype system. A production RF system may exhibit the same overall geometry as a prototype RF system to speed up the transition from prototype design to production design.

Abstract: A variable ISI transmission channel apparatus inserted in a high-speed transmission channel for the high-speed serial data communication simulates a “live” ISI environment to which the high-speed transmission channel in operation is exposed, in a situation such as a bit error test by means of continuously adjusting an amount of inter-symbol interference (ISI) in the high-speed transmission channel. By allowing an undersurface of a transmission loss generating member (6) (16) (26) such as a dielectric, a magnetic body, and an electric conductor to face, and slide on, a top surface of a conductor strip (2) exposed on a top surface of a plate-shaped dielectric substrate (1), a facing area is continuously increased/decreased. A dielectric loss, a magnetic loss, or a resistance loss increased/decreased in the transmission loss generating member is reflected on a high-frequency signal on the conductor strip (2).

Abstract: The present invention relates to a microwave signal transition component (1) having a first signal conductor side (2) and a second signal conductor side (3). The signal transition component (1) is arranged for transfer of microwave signals from the first signal conductor side (2) to the second signal conductor side (3). The transfer component (1) comprises at least one, at least partly circumferentially running, electrically conducting frame (4), a dielectric filling (5) positioned at least partly within said conducting frame (4), at least one filling aperture (6; 6a, 6b) miming through the dielectric filling, and, for each filling aperture (6; 6a, 6b), an electrically conducting connection (7; 7a, 7b) that at least partly is positioned within said filling aperture (6; 6a, 6b). The present invention also relates to a method for manufacturing a microwave signal transition component according to the above.

Abstract: A multiple-layer circuit board has a signaling layer, an exterior layer, and a ground layer. A pair of differential signal lines implemented as strip lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. An element conductively extends inwards from the exterior layer, and as an antenna radiates the EMI propagated by the strip lines along the signaling layer outwards from the circuit board. A defected ground structure within the ground layer has a size, shape, and a location in relation to the element to suppress the EMI propagated by the strip lines to minimize the EMI that the element radiates outwards as the antenna.

Abstract: An information processing apparatus includes: a display unit; a circuit board; a power supply cable coupled to the circuit board; a coupling cable including an overlapping portion that overlaps with the power supply cable as viewed in a thicknesswise direction of the circuit board and coupled to the display unit; and a projection projecting from the circuit board and disposed between the power supply cable and the overlapping portion.

Abstract: A technique relates to a superconducting airbridge on a structure. A first ground plane, resonator, and second ground plane are formed on a substrate. A first lift-off pattern is formed of a first lift-off resist and a first photoresist. The first photoresist is deposited on the first lift-off resist. A superconducting sacrificial layer is deposited while using the first lift-off pattern. The first lift-off pattern is removed. A cross-over lift-off pattern is formed of a second lift-off resist and a second photoresist. The second photoresist is deposited on the second lift-off resist. A cross-over superconducting material is deposited to be formed as the superconducting airbridge while using the cross-over lift-off pattern. The cross-over lift-off pattern is removed. The superconducting airbridge is formed to connect the first and second ground planes by removing the superconducting sacrificial layer underneath the cross-over superconducting material. The superconducting airbridge crosses over the resonator.

Abstract: A microwave transmission line having a coplanar waveguide and a pair of conductive members, each one of the pair of conductive members having a proximal end disposed on a portion of a corresponding one of a pair of ground plane conductors of the coplanar waveguide and a distal end disposed over, and vertically spaced from, a region between a center conductor of the coplanar waveguide and a corresponding one of the pair of ground plane conductors of the coplanar waveguide. The distal ends are laterally separated from each other by a region disposed over the center conductor.

Abstract: A flexible substrate includes a first pad that extends from an end of the flexible substrate to a center of the flexible substrate, and at least a part of which is fixed to the first part; a second pad that extends from the end of the flexible substrate to the center at a position adjacent to the first pad, and at least a part of which is fixed to the first part; a signal line that connects a tip of the first pad and the second part and that is narrower in width than the first pad; and a coverlay that covers an area where the signal line is arranged and that includes a protrusion protruding, at a position at which the first pad is arranged, toward the end of the flexible substrate relative to the area where the signal line is arranged.

Abstract: The present application discloses embodiments that relate to a radar system. The embodiments may include a plurality of radiating waveguides each having a waveguide input. The embodiments also include an attenuation component, which can be located on a circuit board. The embodiments further include a beamforming network. The beamforming network includes a beamforming network input. The beamforming network also includes a plurality of beamforming network outputs, where each beamforming network output is coupled to one of the waveguide inputs. Additionally, the beamforming network includes an attenuation port, wherein the attenuation port is configured to couple the beamforming network to the attenuation component. The attenuation component dissipates received electromagnetic energy.

Abstract: A light communication device further includes a rigid substrate, a package, and a flexible substrate. The rigid substrate includes a first terminal arranged on a surface thereof and a second terminal having a first hole opened at the surface. The package includes a third terminal and a fourth terminal being provided on a side wall thereof and being electrically coupled to a signal electrode and a ground electrode of the signal processor, respectively. The flexible substrate includes a fifth terminal and a sixth terminal being electrically coupled to the third terminal and the fourth terminal, respectively. The fifth terminal is electrically coupled to the first terminal on the surface, and the sixth terminal, with being placed into the first hole, is electrically coupled to the second terminal.

Abstract: A semiconductor device may include a first metal line; a second metal line; a first insulating layer formed between the first metal line and the second metal line; a first driving unit coupled to the first metal line, the first driving unit being suitable for driving the first metal line in response to first data; and a second driving unit coupled to the second metal line, the second driving unit being suitable for driving the second metal line in response to second data obtained by inverting and delaying the first data.

Abstract: An integrated superconductor device may include a substrate base and an intermediate layer disposed on the substrate base and comprising a preferred crystallographic orientation. The integrated superconductor device may further include an oriented superconductor layer disposed on the intermediate layer and a conductive strip disposed on a portion of the oriented superconductor layer, The conductive strip may define a superconductor region of the oriented superconductor layer thereunder, and an exposed region of the oriented superconductor layer adjacent the superconductor region.

Abstract: Discussed herein is an antenna system that comprises a feed element and a radiating element that are formed on a dielectric substrate positioned above a circuit board which includes a feed circuit and a ground layer. Specifically, the feed element is disposed within an outer periphery defined by the radiating element. A capacitive coupling is formed between the feed element and the radiating element. With the aforesaid configuration, the antenna system is less affected by the circuit board and interference from other elements that are mounted on the circuit board. Further, manufacturing costs are reduced as compared to the case where the feed element and the radiating element are respectively formed on a front and rear surface of a resin layer.

Abstract: Dielectric waveguide comprising dielectric body having an exterior coated with an electrically conductive film. Region in one side surface couples to another dielectric waveguide, and slot in bottom surface exposes the dielectric body in an L-shape in two adjacent side surfaces, except for the one side surface. Front surface of printed circuit board has a ground pattern opposed to the slot, which includes opening with outer shape greater than slot, and a back surface having a ground pattern surrounding a strip line disposed to cross through the slot. A distal end of the strip line and the front surface-side ground pattern are coupled together by a via hole. The opening is surrounded by a via hole group which couples the front and the back surface-side ground patterns together. The dielectric waveguide is disposed to allow the opening and the slot to be opposed to each other.

Abstract: A differential transmission line includes a positive conductor on which a positive complementary component of a differential signal is transmitted, and a negative conductor parallel to the positive conductor on which a negative complementary component of the differential signal is transmitted. A quarter wavelength differential coupler is inserted along a length of the positive and negative conductors. The quarter wavelength differential coupler has a length corresponding to a frequency of common mode noise on the positive and negative conductors. The quarter wavelength differential coupler reduces the common mode noise at the frequency as the differential signal passes through the quarter wavelength differential coupler.

Abstract: A printed wiring board is provided with a wiring layer, a first ground layer, a second ground layer, a grounding through-hole, a signal through-hole, a first clearance, and a second clearance. The wiring layer has a signal line. The first ground layer has a first ground plane. The second ground layer is positioned between the wiring layer and the first ground layer and has a second ground plane. The grounding through-hole passes through the wiring layer, the first ground layer, and the second ground layer and is connected to the second ground plane. The signal through-hole passes through the wiring layer, the first ground layer, and the second ground layer and is connected to the signal line. The first clearance is formed in the first ground layer, is positioned in the vicinity of the signal through-hole and the grounding through-hole, and separates the first ground plane from the signal through-hole and the grounding through-hole.

Abstract: A system and method of isolating a layer-to-layer transition between conductors in a multilayer printed circuit board includes formation of a first ground via at least partially surrounding a first signal conductor in at least one layer of the printed circuit board and formation of a second ground via at least partially surrounding a second signal conductor in another layer of the printed circuit board. The first and second ground vias are plated with a conductive material.

Abstract: A diplex filter having tunable inductors. Preferably the tunable inductors include pads that may each selectively receive one end of a jumper.

Abstract: A filter configuration including a substrate, a primary microstrip line and a first defected ground structure is disclosed. The substrate has a first face and a second face. The second face is a ground face. The primary microstrip line is arranged on the first face and extends in a first direction. The first defected ground structure is arranged on the second face. The first defected ground structure includes a first section, a first circular section, a second section, a second circular section and a third section that are connected to each other in sequence in a second direction perpendicular to the first direction. The second section is covered by the primary microstrip line in a vertical direction perpendicular to the first and second faces. The primary microstrip line has a width equal to a minimum length of the second section. As such, the filtering effect can be improved.

Abstract: According to the invention there is provided a balun including: a slotline which is coupled to an input line and an output line, in which at least a portion of the slotline is sandwiched between a first and a second layer of dielectric material.

Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

Abstract: Disclosed are techniques for model-based electronic design implementation with a hybrid solver. These techniques generate an extruded via from a linkage node to a reference metal plane that is added to an analysis model for at least a portion of an electronic design. The analysis model for the at least the portion is generated at least by re-establishing interconnection between the at least the portion and a linkage circuit element with the extruded via. At least the portion of the electronic design may further be implemented using the analysis or simulation results that are generated by using the hybrid solver on the model, without using three-dimensional solvers, for a three-dimensional model of the electronic design.

Abstract: A radio frequency electric power conversion mechanism of the present invention includes a circuit board including a fiber reinforced resin board, instead of an expensive ceramic circuit board. The radio frequency electric power conversion mechanism has a combined configuration of a plurality of fiber reinforced resin boards laminated to each other with a conductive foil therebetween, a via hole array made of an electric conductor passing through the boards, a transmission line closely adhered to the surface of a board, and a waveguide having a notch in a part of the waveguide on the aperture side. The radio frequency electric power conversion mechanism further has other structural features.

Abstract: In general the embodiments described herein can provide alternating-current (AC) resonating filters. These resonating filters comprise a transmission line, a first resonator, and a second resonator. The first resonator is configured to block AC signals in a first frequency range, while the second resonator is configured to block AC signals in a second frequency range, where the second frequency range is higher than the first frequency range. The transmission line has a first node coupled to an AC source, and the first resonator is coupled to the transmission line a first distance from the first node, and the second resonator is coupled to the transmission line a second distance from the first node, where the second distance is greater than the first distance. When so configured the resonating filter can effectively block signals in multiple selected frequency bandwidths.