Abstract: A radio-frequency module includes: boards; interconnect parts that are conductor layers on the individual boards, at least one of the conductor layers being connected to an RF chip; a land that is a conductor layer connected to one of the interconnect parts; a transmission unit disposed between the boards, connected to the boards through the land to transmit a signal; a ground conductor disposed around the land and the interconnect part connected to the land; an isolation part disposed between the interconnect layer connected to the land and the ground conductor to isolate the interconnect layer connected to the land from the ground conductor; and a coupling part disposed between the land and the ground conductor to short-circuit the land and the ground conductor.

Abstract: The coaxial cable assembly generally has a coaxial cable; and a connector assembled to an end of the coaxial cable, the connector having a dielectric body having a connecting surface, a longitudinal groove recessed in the connecting surface and having a groove end spaced from an edge of the connecting surface, and a coplanar waveguide along the connecting surface, the coplanar waveguide having a signal conductor extending from the groove end to the edge and between ground conductors each extending from a respective lateral side of the longitudinal groove to the edge; the end of the coaxial cable being received in the longitudinal groove and having an inner conductor electrically connected to the signal conductor and an outer conductor electrically connected to the ground conductors in a manner allowing connection of the coaxial cable with another coplanar waveguide of an integrated circuit.

Abstract: Provided is a circuit board including inspection terminals, the circuit board including: a connection terminal, which is arranged on a front surface or in an inner layer of the circuit board, and is electrically connected to an object to be inspected; and three or more inspection terminals, which are electrically connected to the connection terminal, and are configured to measure a resistance value of the object be inspected, each of the three or more inspection terminals being arranged on a side surface of the circuit board.

Abstract: A coaxial connector includes a body having a longitudinal axis passing through first and second opposed body ends, the second body end for engaging a male coaxial connector, within the body a coil spring, a connector center conductor, and a second body end insulator supporting the connector center conductor, and a spring for urging an electromagnetic shield to protrude from the body.

Abstract: The invention relates to a contactless connector (100), a system including the contactless connector (100) and a corresponding mating connector (200), and a manufacturing method for the contactless connector. In order to enable the contactless connector (100) to transmit/receive power to/from the corresponding mating connector (200), the invention suggest providing at the contactless connector an inner ferrite element (102) and an inductive coupling element (110) arranged to at least partially surround the inner ferrite element. An outer ferrite element (107) of the contactless connector is arranged to at least partially surround the inductive coupling element (110), wherein a front end (108) of the outer ferrite element (107) facing the mating (101) end of the contactless connector is recessed in an axial direction of the contactless connector with respect to a front end (103) of the inner ferrite element (102) facing the mating end.

Abstract: A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level.

Abstract: A carrier module of a cable connector includes a circuit board and a connecting clip clamping the circuit board. The circuit board has a first surface and a second surface. The connecting clip has a clamping portion and a plurality of positioning arms. The clamping portion has a connecting sheet and two clamping sheets curvedly extended from the connecting sheet. The clamping sheets are respectively abutted against the first and second surfaces. The positioning arms are respectively connected to the clamping sheets and respectively arranged at two opposite sides of the clamping portion. The positioning arms are respectively configured to fix a plurality of cables disposed on the clamping sheets. Thus, the carrier module of the instant disclosure provides a positioning effect for the cables by the connecting clip fixed firmly on the circuit board with good common grounding performance. Besides, the instant disclosure also provides a cable connector.

Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.

Abstract: The invention relates to contactless plug connectors and contactless plug connector systems for electromagnetically connecting a correspondrng mating plug connector. In order to allow for an electromagnetic connection, the invention suggest providing at least one antenna element arranged within the mating end of the contactless plug connector to transmit and/or to receive radio waves modulated with a predetennined carrier frequency, a transmitting/receiving circuit for modulating an inputted baseband input signal onto the predeteimined carrier frequency and transmitting the modulated baseband input signal and/or for demodulating a received radio wave into a baseband output signal.

Abstract: A cable connection structure includes cables and a substrate having an electrode thereon. The cables are configured to be connected to the electrode. Each cable includes: a core wire formed of conductive material; a tubular inner insulator for covering an outer circumference of the core wire; a shield which extends along a longitudinal direction of the inner insulator and includes conductors for covering an outer circumference of the inner insulator, and has an exposed portion for exposing the inner insulator; and an outer insulator for covering an outer circumference of the shield. The shield including a region where the exposed portion is formed, the inner insulator, and the core wire are exposed in a stepped manner toward a distal end of each cable. The substrate includes a first electrode configured to be electrically connected to the core wire, and a second electrode configured to be electrically connected to the shield.

Abstract: An RF connector includes a conductive pin for carrying an RF signal. The conductive pin has a first longitudinal end that serves to interface with a male RF connector to receive the RF signal. The pin also includes a second longitudinal end for connecting with a printed circuit board (PCB). The second longitudinal end may be tapered, and the pin may have a groove formed above the tapered end. A housing encircles the conductive pin. The housing is shaped and sized to accept the male RF connector. A grounding element may be positioned on the bottom of the housing. The grounding element is to contact the PCB when the connector is connected to the PCB. The grounding element may be ring-shaped and soldered to the housing or epoxied to the housing.

Abstract: Right angle transition to circuit. A system includes a conductive plate, coaxial transmission line, a circuit, parallel to the conductive plate, and a right angle transition from the coaxial transmission line to the circuit. The transmission line includes a center pin protruding through a hole in the plate, an outer conductor formed by a conductive surface of the hole, and air dielectric between. The circuit includes a top conducting layer (TCL), ground plane with cutout, and an insulating substrate between the TCL and ground plane that abuts the pin. The transition includes the pin, a conductive element connecting the center pin to the TCL, the outer conductor, the air dielectric, the abutment of the substrate against the pin, and the cutout. The abutment and cutout minimize manufacturing variations regarding distance between the pin and the ground plane. The transition tunes out inductance introduced by bonding the pin to the TCL.

Abstract: An electrical raft 200 comprising electrical conductors 252 embedded in a rigid material are provided to a gas turbine engine. The raft 200 is used to transport electrical signals (which may be, for example power and/or control signals) around a gas turbine engine. The electrical raft 200 has an electrical connector 700 embedded therein which is used to connect the electrical raft to an electrical unit, such as an EEC of a gas turbine engine The electrical connector 700 is resiliently biased so as to ensure a reliable electrical connection.

Abstract: A coaxial cable is disclosed that may include an inner conductor and an outer conductor surrounding the inner conductor in a coaxial relationship. The coaxial cable may also include an insulative material located between the inner conductor and the outer conductor. A thickness of the insulative material between the inner conductor and the outer conductor may be increased in every direction at a bent portion of the coaxial cable as compared to the thickness of the insulative material between the inner conductor and the outer conductor at a non-bent portion of the coaxial cable.

Abstract: A dielectric waveguide socket is provided with a dielectric waveguide (DWG) stub having a dielectric core member surrounded by dielectric cladding, the DWG stub having an interface end and an opposite mating end. A socket body is coupled to the DWG stub, such that a mounting surface of the socket body is configured to mount the socket body on a substrate such that the core member of DWG stub forms an angle of inclination with the substrate. The socket body is configured to couple with the end of a DWG cable, such that the end of the DWG cable is held in alignment with the mating end of the DWG stub.

Abstract: A device for transmitting energy comprises: a wall separating two media; and at least one conductive element passing through the wall, the conductive element comprising an energetically conductive material extending in a longitudinal direction. The conductive element is joined to the wall and comprises a hole passing through the wall and extending in a direction substantially parallel to the longitudinal direction on either side of the surfaces of the wall, over respective lengths that are larger than or equal to the largest dimension of a cross section of the conductive element considered level with the wall, the maximum ratio of the area of the cross section of the conductive element with the hole to the area of the cross section of the conductive element without the hole level with the wall being higher than or equal to a threshold comprised between 0.85 and 0.95.

Abstract: A board assembly for transmitting a high-speed signal and a method of manufacturing the same. The board assembly may include a submount board, a base board, and a contact member for a signal line. The submount board may include at least one first high-speed signal line formed on the surface thereof. The base board may include the submount board on one part of the upper surface thereof, and at least second high-speed signal line on the other part of the upper surface thereof, wherein the second high-speed signal lines corresponds to the first high-speed signal lines, respectively. The contact member for the signal line may be installed on the side of the submount board, and have an upper portion contacting the first high-speed signal line and a lower portion contacting the second high-speed signal line such that the first high-speed signal line contacts the second high-speed signal line.

Abstract: A rigid electrical panel has both a flexible printed circuit and an electrically conductive grounding layer embedded therein. The electrically conductive grounding layer is electrically connected to a grounding insert which is also embedded in the rigid material. The grounding insert has a base portion and an exposed portion. The electrically conductive grounding layer is connected to the base portion, and the exposed portion allows the grounding insert, and thus the electrically conductive grounding layer, to be electrically connected to a grounding point, for example on a gas turbine engine.

Abstract: A high frequency device includes a base plate having a main surface, a dielectric on the main surface, along a first side of the base plate, a signal line on the dielectric and extending from the first side toward a central portion of the main surface, an island pattern of a metal on the dielectric, a metal frame having a contact portion contacting the main surface and a bridge portion on the signal line and the island pattern, together enclosing the central portion, a lead frame connected to an outside signal line of the signal line and which is located outside the metal frame, a semiconductor chip secured to the central portion, and a wire connecting the semiconductor chip to an inside signal line of the signal line and which is enclosed within the metal frame.

Abstract: Disclosed herein, among other things, are methods and apparatuses that provide a manufacturable RF transmission line to go through the bend area of a flexible circuit to be used in a compact design, such as in a compact hearing aid design. One aspect of the present subject matter relates to using multiple inner layers of the flexible circuit to route RF transmission. By not using outer layers, the RF transmission line will be less susceptible to delamination from the polyimide dielectric layer. One aspect of the present subject matter relates to choosing copper transmission line to have dimensions that allow for narrower transmission lines with good RF return loss. The copper transmission line dimensions also allow for manufacturing in a standard process without adding extra cost.

Abstract: A power semiconductor device comprising a first housing having a cutout with an opening, and a second housing. The device has a load element having external and internal sections, and a feedthrough section pressing through the opening. The feedthrough section has a first outer edge region which tapers laterally towards a first outer edge thereof and a second outer edge region which tapers laterally towards a second outer edge thereof. The first and second outer edge regions face away from one another. The first outer edge is near the lateral first end of the opening and the second outer edge is near the lateral second end of the opening. A first seal is positioned between the first housing and the feedthrough section and a second seal is positioned between the second housing and the feedthrough section. The seals contact one another laterally from the first and second outer edges.

Abstract: Systems (100) and methods (900) for providing a compliant micro-coaxial interconnect with an integrated circuit or other electronic device. The methods comprise: forming a well (108) in a first substrate (102) having a first Coefficient of Thermal Expansion (“CTE”); forming at least one three-dimensional micro-coaxial interconnect (100) on the first substrate so as to have a cantilevered end portion (110) disposed over the well; and using a first coupler (606) to electrically couple the cantilevered end portion to a second substrate (604) having a second CTE different from the first CTE. The cantilevered end portion has an angled joint (302) so that at least one of a pushing force and a pulling force applied thereby to the first coupler is minimized when mismatching movements of the first and second substrates occur.

Abstract: A superconducting magnet includes a superconducting coil, a helium tank that accommodates the superconducting coil and stores liquid helium therein, a radiation shield that surrounds a periphery of the helium tank, a vacuum vessel that accommodates the radiation shield, an exhaust port that is connected to the helium tank and exhausts gasified helium, a lead that electrically connects an external power supply and the superconducting coil and is attachable to and removable from the vacuum vessel, a connector that connects the lead and the superconducting coil, and a thermal conductive member having one end in contact with at least one of the connector and the exhaust port, and having the other end located outside the vacuum vessel and attachable to and removable from the vacuum vessel.

Abstract: An inner contact of a coaxial connector has a body with a plurality of spring fingers, the spring fingers each provided with a contact surface. A plurality of transitions from the contact surfaces are provided as curved surfaces. The curved surfaces may be formed, for example, by chamfer, electrical discharge machining or the like, such that an edge to a slot between the spring fingers does not contact the contact surface.

Abstract: A coaxial connector includes an outer conductive member including a board mounting portion and a main body portion; an insulation member disposed in the outer conductive member; a central conductive member supported with the insulation member; and a metal member disposed in the outer conductive member below the insulation member. The metal member includes a through hole for retaining the central conductive member therein. The central conductive member is situated in the through hole away from an inner surface of the through hole by a first distance at an upper portion of the through hole. The central conductive member is situated in the through hole away from the inner surface of the through hole by a second distance at a lower portion of the through hole. The first distance is greater than the second distance.

Abstract: A cable connection structure includes a cable that has an outer skin and at least one conducting wire, and a substrate to which the cable is connected at a main surface side having a hard wiring, wherein the substrate includes, at the main surface side, a first flat section having flatness and a second flat section having flatness thinner than the first flat section via a level difference surface from the first flat section and an end part of the outer skin is arranged on the second flat section and at least one of the conducting wire is connected to a connecting electrode formed on the second flat section.

Abstract: A microwave connector is provided. The microwave connector includes an outer conductor, an inner conductor disposed within the outer conductor and dielectric materials interposed between the outer conductor and the inner conductor, the dielectric materials including a non-dissipative dielectric material and a dissipative dielectric material.

Abstract: A printed circuit board comprising: a plurality of dielectric core layers comprising at least a top dielectric core layer and a bottom dielectric core layer; a thermally-conductive coin embedded in at least one of the dielectric core layers; and a high frequency material inlaid in at least one of the dielectric core layers.

Abstract: A coaxial cable connector for connection to a terminal includes inner and outer spaced concentric sleeves configured to cooperate in retaining an end of a coaxial cable, at least one of the inner and outer sleeves having a flange at its forward end and a coupling member configured to draw the flange toward an end of the terminal. The coupling member and the flange have confronting surface portions therebetween. The connector further includes an annular electrically conductive member disposed between the confronting surface portions for establishing conductivity between the coupling member and the flange when the coupling member and the flange are drawn into proximity with one another.

Abstract: The application concerns a surface mount module adapted for transfer of a microwave signal between the module and a motherboard, the module comprising a substrate with a first microstrip conductor and a second microstrip conductor, wherein the two conductors are connected with a connection through the module. The module is distinguished in that the connection comprises the first microstrip conductor connected to a foil of electrically conducting material coated on the first side, the foil being surrounded by electrically conducting trenches running through the substrate from the first side to the second side forming a substrate integrated waveguide, wherein the trenches on the second side surrounds a second foil of electrically conducting material coated on the second side of the substrate and connected the second microstrip conductor. The application also concerns a coupling arrangement.

Abstract: A circuit board includes layers, a pair of vias filled with a conductive material and extending through the layers, first and second pairs of conductive signal paths, and holes extending at least partially through the layers and located between the pair of vias. The first pair of conductive paths is connected to the pair of vias within a first layer; the second pair of conductive paths is connected to the pair of vias within a second layer. The pair of vias has a pair of via stubs defined between the second layer and a bottom layer. A differential signal is to be transmitted between the first and second pairs of conductive signal paths via the pair of vias. The holes have a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal.

Abstract: An integrated chip (IC) package may include a waveguide that comprises a cavity, a first chip and a second chip. The first chip includes a first radio frequency (RF) transceiver that may be coupled to a first probe that extends into the cavity of the waveguide and/or a first antenna that is positioned over a first opening in the waveguide. The second chip includes a second RF transceiver that may be coupled to a second probe that extends into the cavity of the waveguide and/or a second antenna that is positioned over a second opening in the waveguide. The first and second chips may be configured to communicate with one another exclusively by the first and second RF transceivers transmitting and receiving RF signals through the cavity of the waveguide via the first and second probes and/or the first and second antennas.

Abstract: A switch board of a blade server, a port configuring method thereof, and a blade server. The switch board includes a port configuring unit and a plurality of ports, where the port configuring unit is configured to divide the switch board into more than one virtual sub-switch-board, allocate the ports to the virtual sub-switch-boards, and configure each port of each virtual sub-switch-board to a first-type port or a second-type port, where the first-type port and the second-type port have different bandwidth; and each of the ports is configured to connect a server blade according to a configuration on the port configuring unit. The technical solutions of the present invention can meet a requirement for flexible port bandwidth configuration.

Abstract: Interconnect feed devices (10) are provided for electrically connecting first and second electrical components (17, 21). The interconnect feed devices (10) can include a dielectric shell (23) with an electrically-conductive coating (40), and leads (22) positioned within individual conduits (30) of the shell. Each lead (22) and its associated conduit (30) can act as a coaxial cable for transmitting radio frequency (RF) energy between the first and second electrical components (17, 21). The shell (23) can be manufactured using a process, such as stereolithography, that allows the shell to be formed with relatively complicated geometries, which in turn can facilitate relatively complicated cable routing.

Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

Abstract: A transmission line includes an insulator as a base member, a transmission conductor, and a ground layer. A connector is provided at a wiring substrate to fix the transmission line. The transmission line includes a signal columnar conductor having a solid columnar shape integrated with the transmission conductor, and ground columnar conductors having solid columnar shapes integrated with the ground layer. The connector has a through hole corresponding to the signal columnar conductor, and through holes corresponding to the ground columnar conductors. Conductive films are respectively provided on the inner peripheral surfaces of the through holes. The signal columnar conductor is inserted into the through hole, and the ground columnar conductors are respectively inserted into the through holes.

Abstract: Communication between chips is provided using a transmission line. Any one of the chips may tap into the transmission line, and communicate with another chip tapped into the transmission line by transmitting a radio frequency (RF) signal to the other chip via the transmission line or receiving an RF signal from the other chip via the transmission line. The transmission line may include a microstrip transmission line, a waveguide, a stripline transmission line, or another type of transmission line. The chips may use the transmission line to communicate data, control and/or clock signals with one another.

Abstract: A differential circuit topology that produces a tunable floating negative inductance, negative capacitance, negative resistance/conductance, or a combination of the three. These circuits are commonly referred to as “non-Foster circuits.” The disclosed embodiments of the circuits comprises two differential pairs of transistors that are cross-coupled, a load immittance, multiple current sources, two Common-Mode FeedBack (CMFB) networks, at least one tunable (variable) resistance, and two terminals across which the desired immittance is present. The disclosed embodiments of the circuits may be configured as either a Negative Impedance Inverter (NII) or a Negative Impedance Converter (NIC) and as either Open-Circuit-Stable (OCS) and Short-Circuit-Stable (SCS).

Abstract: A rigid RF coaxial transmission line is positioned within a wellbore in a subterranean formation. The rigid RF coaxial transmission line includes a series of rigid coaxial sections coupled together in end-to-end relation and to be positioned within the wellbore of the subterranean formation. Each rigid coaxial section includes an inner conductor, a rigid outer conductor surrounding the inner conductor, and a dielectric therebetween. Each of the rigid outer conductors has threaded ends. The rigid RF coaxial transmission line includes a respective connector between adjacent ones of the series of rigid coaxial sections, each connector having a rigid outer layer threadingly secured to respective threaded ends of adjacent rigid outer conductors, and an electrically conductive liner carried by the rigid outer layer and defining an electrical joint between the adjacent rigid outer conductors.

Abstract: The present disclosure relates to a cavity filter, a connector and manufacturing processes thereof. The cavity filter comprises a cavity, a cover plate and a connector disposed on the cavity or the cover plate; an end of the connector is connected with internal devices inside the cavity filter and the other end of the connector is connected with external communication devices; and the connector comprises an inner conductor and a metal enclosure disposed coaxially and an insulation medium disposed between the metal enclosure and the inner conductor, and a non-metal layer is disposed on an outer peripheral surface of the metal enclosure. The connector of the present disclosure is formed with a non-metal layer on the outer peripheral surface of the metal enclosure thereof, which can improve the moisture-proof capability, the salt-mist-proof capability, the mould-proof capability and the reliability of the connector and the cavity filter.

Abstract: The self-keying waveguide interconnection system for repeatable waveguide calibration and connection comprises a plug with a centrally disposed aperture, a jack provided with a counterbore to accept a plug diameter. The jack includes a plurality of self-keying channels. A shim having a shape complementary to the plurality of self keying thru slots has a plurality of self keying thru slots for aligning the centrally disposed aperture of the plug to the centrally disposed aperture of the jack. The system identifies the orientation and flange face polarity of the line or adapter without the use of alignment pins as two or more of these independent waveguide interfaces are coupled. In use, the device functions as a self-keying shim/spacer/adapter for a calibration kit or adapter in waveguide sections.

Abstract: In one embodiment, a vertical microcoaxial interconnect includes a dielectric substrate having a top side and a bottom side, an inner conductor extending through the substrate from its top side to its bottom side, an outer conductor that extends through the substrate from its top side to its bottom side, the outer conductor surrounding the inner conductor, a signal line extending to the inner conductor without contacting the outer conductor, and a ground line extending to the outer conductor without contacting the inner conductor or the signal line.

Abstract: A rigid radio frequency (RF) coaxial transmission line to be positioned within a wellbore in a subterranean formation may include a series of rigid coaxial sections coupled together in end-to-end relation. Each rigid coaxial section may include an inner conductor, a rigid outer conductor surrounding the inner conductor, and a dielectric therebetween. Each of the rigid outer conductors may include a rigid outer layer having opposing threaded ends defining overlapping mechanical threaded joints with adjacent rigid outer layers. Each of the rigid outer conductors may also include an electrically conductive inner layer coupled to the rigid outer layer and having opposing ends defining electrical joints with adjacent electrically conductive inner layers.

Abstract: A DC blocking device of a small size is disclosed. The disclosed DC blocking device may include: an internal conductor where RF signals are inputted; and an external conductor electrically connected to a ground; wherein the internal conductor has an insertion groove, and an insertion conductor is inserted into the insertion groove without touching the internal conductor and at a designated distance, and the diameter of the external conductor in the portion where the insertion conductor is inserted is set to be different from the diameter of another portion. The disclosed DC blocking device has the advantages of minimizing the spatial constraint when the DC blocking device is mounted on a mobile communication device, and of achieving suitable coupling even if the length of the part where coupling is achieved is reduced in the DC blocking device.

Abstract: An antenna apparatus comprises a substrate with a microstrip-to-waveguide transition comprising a microstrip feedline extending between a first terminal point and a second terminal point at a first metal layer and comprising a microstrip element and a probe element. The microstrip element includes a connection segment extending from the first terminal point to a second point, a taper segment extending from the second point to a third point, and a continuous-width segment extending from the third point to a fourth point. The probe element extends from the fourth point to the second terminal point and has a width which is narrower than the continuous-width segment. The substrate further includes a waveguide opening comprising a region surrounding the probe element and includes a plurality of metal vias disposed at the perimeter of the waveguide opening and which extend from the first metal layer to the second metal layer.

Abstract: A system includes an electronic device coupled to a mating end of a dielectric wave guide (DWG). The electronic device has a multilayer substrate that has an interface surface configured for interfacing to the mating end of the DWG. A conductive layer is etched to form a dipole antenna disposed adjacent the interface surface. A reflector structure is formed in the substrate adjacent the dipole antenna opposite from the interface surface. A set of director elements is embedded in the mating end of the DWG. Specific spacing is maintained between the dipole antenna and the set of director elements.

Abstract: A microwave connector is provided. The microwave connector includes an outer conductor, an inner conductor disposed within the outer conductor and dielectric materials interposed between the outer conductor and the inner conductor, the dielectric materials including a non-dissipative dielectric material and a dissipative dielectric material.

Abstract: A method including receiving power, from a power line, at a device configured to communicate via the power line. The power from the power line is received at the device via a power cord of the device being connected, via a connector, to a power outlet from which the power of the power line is supplied. The connector is coupled to a first end of the power cord. The device is coupled to a second end of the power cord. The method further includes supplying a signal generated by the device to a choke located on the power cord. The choke is located closer to the first end of the power cord than to the second end of the power cord. The method further includes transmitting the signal from the choke to the power line for communication via the power line.

Abstract: A transmission line transition that couples RF energy between a coaxial cable and an air dielectric microstrip is provided. In some embodiments, the transition can combine a thin printed circuit board substrate and an insulating surface to form an effective capacitive coupling transition that can couple RF energy from the center conductor of a coaxial cable to an air microstrip. In some embodiments, the transition can include an insulating system affixed to a metallic surface, and the insulating system can secure an airstrip conductor in close proximity to an inner conductor of a coaxial cable to capacitively couple the airstrip conductor to the inner conductor of the coaxial cable. In some embodiments, the transition can employ a metallic body coated with an insulating surface to capacitively couple RF energy from the center conductor of the coaxial cable to the air microstrip.

Abstract: Communications plugs are provided that include a housing that receives the conductors of the communication cable. A printed circuit board is mounted at least partially within the housing. A plurality of plug contacts are on the printed circuit board, and the printed circuit board includes a plurality of conductive paths that electrically connect respective ones of the conductors to respective ones of the plug contacts. First and second of the conductive paths are arranged as a first differential pair of conductive paths that comprise a portion of a first differential transmission line through the communications plug, where the first differential transmission line includes a first transition region where the impedance of the first differential transmission line changes by at least 20% and a second transition region impedance of the first differential transmission line changes by at least 20%.