Abstract: A low profile magnetic element used in cooperation with a multilayer printed circuit board has two or more core arms penetrating the board from one outer surface to the other and a series of magnetic core elements, at least one on each side of the board, bridging pairs of the core arms to form a closed, unbranched flux path. Series-connected windings form a transformer primary and are wound on the core arms that penetrate the board. Parallel-connected windings form a transformer secondary and are also wound on the core arms. The series-connected windings and the parallel-connected windings may be buried windings printed on internal surfaces of the multilayer board. The connected in series primary windings all have the same number of turns and the parallel-connected secondary windings all have the same number of turns. The parallel secondary windings are connected in current additive fashion to afford a high current transformer output.

Abstract: An inductor of the present invention includes a plurality of insulating layers being stacked and coil patterns respectively provided on predetermined layers of the insulating layers. The coil patterns are provided on at least two of the insulating layers, and electrically connected to each other. With this arrangement, it is possible to improve Q of the inductor without increasing the size of the inductor.

Abstract: An apparatus and method for reducing common mode noise capacitive coupling from a primary winding to a secondary winding in a transformer. In an embodiment, the primary winding has two terminals and a plurality of coil turns therebetween formed by a plurality of PCB layers sandwiched together, each having at least one of the coil turns formed thereon. The coils turns are connected in a predetermined way to form the primary winding. One terminal of the primary winding is connected to a coil turn on a first one of the PCB layers, and the other terminal is connected to a coil turn on a second one of the PCB layers. The PCB layers are stacked to form the primary winding. The secondary winding or windings are positioned adjacent to a selected one of the stacked PCB layers that is in a position between the first and second PCB layers.

Abstract: A stressed metal technology may fabricate high-Q, three-dimensional microelectronic inductors and transformers. The fabrication method may allow the production of inductors and transformers on high-resistivity silicon substrate and with metal deposition of Au and Cr that is fully compatible with semiconductor fabrication technologies. The produced inductors and transformers exhibit Q factors>60 at frequencies of 3 to 7 GHz. High efficiency, high-Q transformers with coupling factors 0.6<k<0.9 may be created with very high self-resonance frequencies.

Abstract: Each of first and second coil conductors has a spiral form and is disposed between first and second magnetic substrates. The first and second coil conductors include first parts arranged so as to extend along each other with a predetermined gap therebetween on a first insulating layer, and second parts intersecting each other three-dimensionally. The first and second coil conductors intersect each other in their middle part as seen from a direction orthogonal to the principal face of the first magnetic substrate (second magnetic substrate).

Abstract: The magnetic element includes a core (20) provided with a through hole (21) passing through a tubular portion, a linear conductor (30) having a plated surface, which is to be inserted through the through hole (21), and a mounting terminal with its one end side is electrically connected to the conductor and another end side positioning on a bottom surface (22a) of the core (20), the mounting terminal being mounted to an external mounting substrate facing the bottom surface (22a). Further, the conductor (30) is provided integrally with the mounting terminal composed of a downward extension (31) extending from the one end side of the conductor (30) to the bottom surface (22a) side and formed by bending itself and a mounting portion (32) positioning on the bottom surface (22a) and formed by bending itself.

Abstract: The present invention relates to transformer inductor devices and to the methods of construction for inductive components such as inductors, chokes, and transformers. Plural via holes 12 are formed through a ferromagnetic substrate 10. Primary 32 and secondary 34 conductors are placed through common vias to form a plurality of cell transformers have a 1:1 turns ratio. Circuits connect these primary and secondary winding in parallel and serial combustion to provide a transformer having the desired turns ratio.

Abstract: Manufacturing of miniaturized three-dimensional electric components are presented, as well as components manufactured by the methods. The manufacturing methods comprise micro-replication of at least one master structure, e.g. via a mould structure, in at least one polymer layer onto which layer at least one conductive path is provided.

Abstract: A multi-layer board having a superior decoupling function in a low frequency band and a radio frequency band. The multi-layer board includes a board body having a plurality of stacked dielectric layers, power terminals connected through a via, ground terminals connected through a via and an integrated circuit component connected to the power and ground terminals. The multi-layer board also includes a power line unit connected to the power terminals and the integrated circuit component and a ground line unit connected to the ground terminals and the integrated circuit component. The multi-layer board further includes at least one multilayer chip capacitor mounted on the board body and connected between the power terminal and the ground terminal formed on the board body and at least one thin film capacitor mounted inside the board body and connected between the power line unit and the ground line unit.

Abstract: Embodiments of the present invention provide a thin-film coil assembly. The coil assembly includes a substrate, at least two layers of conductive material on top of the substrate, and one layer of insulating material between the two layers of conductive material, wherein the two layers of conductive material are in contact with two interconnects, respectively, which extends substantially vertical to the substrate.

Abstract: A multi-layer printed circuit board. The multi-layer printed circuit board includes a first winding, and a first via connected to the first winding. The first winding includes a first edge. The first edge defines a first footprint. The first footprint surrounds and is proximate an opening defined by the printed circuit board. At least a portion of the first via is between the first footprint and the opening.

Abstract: A method for making an embedded toroidal inductor (118) includes forming in a ceramic substrate (100) a first plurality of conductive vias (102) radially spaced a first distance from a central axis (101) so as to define an inner circumference. A second plurality of conductive vias (104) is formed radially spaced a second distance about the central axis so as to define an outer circumference. A first plurality of conductive traces (110) forming an electrical connection between substantially adjacent ones of the first and second plurality of conductive vias is formed on a first surface (106) of the ceramic substrate. Further, a second plurality of conductive traces (110) forming an electrical connection between circumferentially offset ones of the first and second plurality of conductive vias is formed on a second surface of the ceramic substrate opposed from the first surface to define a three dimensional toroidal coil.

Abstract: A common-mode choke coil has first and second coil parts, a first inductance part, and a second inductance part. The first coil part and the second coil part are magnetically coupled to each other. The first inductance part is electrically connected in series to the first coil part and is not substantially magnetically coupled to the first coil part. The second inductance part is electrically connected in series to the second coil part and is not substantially magnetically coupled to the second coil part. The first inductance part and the second inductance part are not substantially magnetically coupled to each other.

Abstract: Certain exemplary embodiments can provide an electrical coil for an electromagnetic machine, said coil comprising: a first electrically conductive winding wound about a central axis in a first spiral, said first winding defining a first winding width and a first winding thickness; a first electrically insulating tape wound about the central axis in a second spiral, said first tape defining a first tape width and a first tape thickness, said first tape located width-wise adjacent said first winding; and a corrosion-resistant shell encasing said first spiral and said second spiral.

Abstract: Method of forming a ferromagnetic layer on at least one surface of a dielectric material that may be serve as an inductive core on a printed circuit board or a multichip module. Conductive leads can form two separate coils around the core to form a transformer, and a planar conducing sheet can be placed on or between one or more of the dielectric layers as magnetic shielding. The core can be formed at least in part by electroless plating, and electroplating can be used to add a thicker layer of less conductive ferromagnetic material. Ferromagnetic layers are formed by dipping the dielectric surface in a solution containing catalytic metal particles having a slight dipole, and placing the surface in a metal salt to cause a layer containing metal to be electrolessly plated upon the dielectric. Surface roughening techniques can be used before the dipping to help attract the catalytic particles.

Abstract: A planar type ferrite core having a rectangular shaped flat part, a pair of outside legs projecting out from two ends of the flat part in a direction substantially perpendicular to a plane of the flat part, and a center leg positioned between the pair of outside legs and projecting out from the flat part in the same direction as the outside legs, wherein the two ends of the center leg are formed with arc surfaces of a predetermined radius of curvature, and a length of the center leg in the longitudinal direction is at least 90% of a width of the flat part.

Abstract: A method of forming a surface mount transformer. The method comprises winding insulated wire around a magnetic core to form at least one secondary transformer coil, winding insulated wire around the magnetic core to form at least one primary transformer coil, attaching wire ends of the at least one primary coil to at least first and second vias of a printed circuit board (PCB), attaching wire ends of the at least one secondary coil to at least third and fourth vias of the PCB, affixing the coils and the magnetic core to the first side of the PCB, and attaching the coil wire ends flush to a surface of the vias on the second side of the PCB.

Abstract: A low cost, low EMI air core inductor fabricated on printed circuit board for power conversion circuits is described. The inductive element combines the advantages of high efficiency and minimum board height requirements. It allows high frequency switching without adding undesired magnetic losses and minimizing the electro-magnetic interferences in form of radiated energy. The absence of any magnetic layer adds to the simplicity of the manufacturing process resulting in lower cost. This inductive element allows operation for the conventional and higher frequency step-up and step-down switching voltage converters minimizing the size and cost of output capacitors and reducing the output voltage ripple.

Abstract: The invention relates to a coil component used as a major component of a common mode choke coil or transformer and a method of manufacturing the same, and the invention is aimed at providing a compact and low-profile coil component having a high common mode filtering property and a method of manufacturing the same. A common mode choke coil has a configuration in which a first insulation film, a first coil conductor, a second insulation film, a second coil conductor and a third insulation film are stacked in the order listed between magnetic substrates provided opposite to each other. A top portion of the first coil conductor is formed in a convex shape. The second insulation film is formed so as to follow the shape of the top portion of the first coil conductor. A bottom portion of the second coil conductor is formed in a concave shape such that it follows the shape of a top portion of the second insulation film.

Abstract: Conductor layers 2A and insulating layers 4A are alternately stacked so as to prepare a base material 17. A plurality of grooves 18 having a predetermined width are formed in a surface of the base material 17 in such a manner that these plural grooves 18 are located parallel to each other along a stacking layer direction in order to form a coil inner peripheral portion. Embedding materials 5 are filled into the grooves 18. Surfaces 16 of the base material into which the embedding materials 5 have been filled are flattened by polishing. The conductor layers 2A located adjacent to each other are connected to each other, so that helical coils which constitute inductive elements are constructed. Then, both the front plane and the rear plane of the resultant base material are covered by an insulating layer, which is cut so as to obtain respective chips.

Abstract: Some embodiments provide a first portion of an inductor disposed in a first layer of a multilayer substrate, a second portion of the inductor disposed in a second layer of the multilayer substrate, the second portion coupled to the first portion, and a shielding plane disposed between the first portion and the second portion.

Abstract: Method for forming a transformer (118) in a ceramic substrate. The method can include the steps of forming at least one conductive coil (119a, 119b) comprising a plurality of turns about an unfired ceramic toroidal core region (120a, 120b) defined within an unfired ceramic substrate (100). The method can also include the step of co-firing the unfired ceramic toroidal core region (120a, 120b), the unfired ceramic substrate (100), and the conductive coil (119a, 119b) to form an integral ceramic substrate structure with the conductive coil at least partially embedded therein.

Abstract: A core material-including organic core board or inorganic sintered board 1 having a plurality of band-shaped conductor patterns 2 formed on its front and rear surfaces is sliced in a direction crossing the band-shaped conductor patterns 2. End portions of the band-shaped conductor patterns 2 exposed on each of cut surfaces of the core board 1 are connected to one another by bridging conductor patterns formed on the cut surfaces. In this manner, at least one helical coil is provided. The inner diameter of the helical coil can be kept constant while coil pitch accuracy can be kept good.

Abstract: Method and apparatus are provided for fabricating a planar transformer assembly for use in an implantable medical device. The planar transformer assembly includes a board, a first core, and a second core. The board has a first side, a second side, and an embedded winding, wherein the embedded winding includes a primary winding and a secondary winding and is at least partially embedded in the board between the first and second sides.

Abstract: A laminated coil is constructed such that an inner space of each via hole can be increased while the spacing between adjacent via holes in the axial direction of a coil is prevented from being narrowed. In the via holes of the laminated coil, through-holes formed in ceramic layers and filled with a conductor are arranged in a row in the lamination direction X, and, in each of the through-holes, the difference between the diameter in the axial direction of the coil on the opening surface of one opening of a ceramic layer and the diameter in the axial direction of the coil on the opening surface of the other opening is smaller than the difference between the diameter in the direction Z that is substantially perpendicular to the axial direction Y of the coil on the opening surface of one opening of the ceramic layer and the diameter in the direction Z that is substantially perpendicular to the axial direction Y of the coil on the opening surface of the other opening.

Abstract: An inductor formed on a substrate having a dielectric layer thereon is disclosed. The inductor includes a first inductor pattern, a second inductor pattern a third inductor pattern. The first inductor pattern is formed within the dielectric layer, the second inductor pattern is formed on the first inductor pattern and electrically connected thereto, and the third inductor pattern is formed on the second inductor pattern and electrically connected thereto, wherein the first inductor pattern, the second inductor pattern, and the third inductor pattern have similar pattern. Because the thickness of the inductor can be increased by forming a multi-layer inductor structure, the resistance of the inductor, therefore, is reduced.

Abstract: An integrated transformer with a stack structure comprises a middle dielectric layer, a bottom dielectric layer, a first winding and a second winding. A portion of the first winding is disposed over a surface of the middle dielectric layer and the remaining portion of the first winding is disposed over a surface of the bottom dielectric layer. A portion of the second winding is disposed over the surface of the middle dielectric layer and the remaining portion of the second winding is disposed over the surface of the bottom dielectric layer. The second winding doesn't intersect with the first winding. The portions of the first and second windings over the surface of the middle dielectric layer connect with the remaining portions of the first and second windings over the surface of the bottom dielectric through via plugs.

Abstract: The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.

Abstract: An inductor element having a high quality factor, wherein the inductor element includes an inductor helically formed on a semiconductor substrate and a magnetic material film on a surface of the inductor for inducing magnetic flux generated by the inductor. The magnetic material film preferably includes a first magnetic material film disposed on a lower surface of the inductor, between the substrate and the inductor, and a second magnetic material film disposed on an upper surface of the inductor. The magnetic material film may be patterned according to a direction along which the magnetic flux flows, for example, radially. Since the magnetic flux proceeding toward the upper part and lower part of the inductor is induced by the magnetic material film, the effect of the magnetic flux generated in the inductor on external circuits may be reduced and the efficiency of the inductor may be enhanced.

Abstract: A circuit substrate includes an inductor element and a reference plane. The inductor element includes a first conductive column, a second conductive column, a first trace, and a second trace. The first and second conductive columns penetrate the circuit substrate from a first surface to a corresponding second surface. The first conductive includes a left conductive column and a right conductive column. The second conductive column is adjacent to one side of the first conductive column. The first trace electrically connects a first lower portion of the left conductive column and a second lower portion of the second conductive column. The second trace electrically connects a first upper portion of the right conductive column and a second upper portion of the second conductive column. The reference plane is disposed on the second surface. Accordingly, the magnetic line of force produced by the inductor element is parallel to the reference plane.

Abstract: Integrated circuit inductors may be formed using a spiral layout on the surface of an interconnect dielectric stack. Conductive lines from two or more metal layers in the interconnect stack may be electrically connected using one or more via trenches. The via trench interconnection arrangement reduces the resistance of the inductor and increases the inductor's Q-factor. The Q-factor of the inductor may also be increased by placing a region of n-type and p-type wells or a metal plate region beneath the inductor to reduce power losses during operation. Shallow trench isolation may be used to reduce eddy currents and increase Q. The effects of copper dishing and trench blow-out may be used during inductor fabrication. A dual damascene fabrication process may be used.

Abstract: To reduce pattern resistance including a secondary winding in a power supply module having a pair of secondary windings transformer-coupled with a primary winding. The pair of secondary windings coupled with a primary winding through a transformer is drawn out in both directions each other, and further disposed on different layers. Also, output pattern films are disposed on both sides of the second and third layers, so that pattern films of wide shape can be produced.

Abstract: The present invention is to provide a process for the preparation of coil for an electric appliance by which a coil for electric appliances comprising an edgewise wound square coil having small intervals between coils and high quality can be easily prepared in good productivity and low-cost.

Abstract: An electrical wiring structure, such as a planar coil, includes a set of wiring formed of an electrical conductor and formed on an insulating surface of a substrate. A dam-up wall structure is provided around an outermost peripheral portion of the set of wiring on the substrate. The dam-up wall structure is electrically disconnected from the set of wiring. An insulating layer is formed over an area from the set of wiring to the dam-up wall structure on the substrate, wherein the dam-up wall structure dams up the insulating layer.

Abstract: A printed circuit board includes a first layer on which a first stationary contact terminal is formed and one or more second layers spaced apart from the first layer by at least one intermediate layer. A portion of the one or more second layers extends into a recess formed by a discontinuity of the intermediate layers. The portion is flexible and has a second terminal which can be brought into contact with the first stationary terminal.

Abstract: A highly compact inductor formed on opposite faces of a dielectric substrate. Sets of parallel spaced conductive traces formed on the opposite faces of the substrate are interconnected by metallized vias through the substrate, in such a way as to form a continuous spiral conductive path. The inductor is preferably formed as two closely adjacent segments, each with conductive traces on each face of the substrate and each having metallized vias interconnecting the conductive traces. The segments are electrically connected in series and produce a magnetic field that extends through each segment in opposite directions and is closely coupled from one segment to the other. The inductor is, therefore, electromagnetically similar to a wire-wound toroidal inductor, providing high inductance and contourable Q values, but is highly compact, especially in the z-axis direction normal to the substrate.

Abstract: A variable inductor includes an insulating substrate (1), a thermally softenable spiral coil (2) provided on the insulating substrate (1), and a pair of input/output terminals (3, 4) each connected electrically to a respective end of the coil (2). Preferably, the coil (2) is made from a non-crystalline thin film metallic glass which softens in a supercooled liquid phase.

Abstract: A method of fabricating a chip type power inductor includes the steps of: preparing green sheets: forming cutting lines on a magnetic layer green sheet and a non-magnetic layer green sheet; forming via holes on the non-magnetic layer green sheet where the cutting lines are formed, and forming an electrode pattern at an upper surface of the non-magnetic layer green sheet; stacking a plurality of layers by constituting the magnetic layer and the non-magnetic layer where via holes and electrode patterns are formed as one unit in a state that a non-magnetic layer where cutting lines and electrode patterns are not formed is inserted; stacking a cover layer composed of a magnetic layer at upper and lower surfaces of the stacked layers; firing the stacked body; and forming external electrodes at an outer surface of the fired stack body.

Abstract: A coplanar transformer with a capacitor that has the advantage of high space utilization is provided. The coplanar transformer comprises a primary coil and a secondary coil constructed by many conductor segments in a first metal layer and connectors in a second metal layer. The upper plate and lower plate of the capacitor are electrically coupled with the two terminals of the primary coil separately. The upper plate comprises the extended plate from the connected terminal toward the other terminal and the connected conductor segment in the first metal layer, and the lower plate locates in the second metal layer corresponding to the upper plate.

Abstract: An inductor and a method of forming and the inductor, the method including: (a) providing a semiconductor substrate; (b) forming a dielectric layer on a top surface of the substrate; (c) forming a lower trench in the dielectric layer; (d) forming a resist layer on a top surface of the dielectric layer; (e) forming an upper trench in the resist layer, the upper trench aligned to the lower trench, a bottom of the upper trench open to the lower trench; and (f) completely filling the lower trench at least partially filling the upper trench with a conductor in order to form the inductor. The inductor including a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending a fixed distance into a dielectric layer formed on a semiconductor substrate and an upper portion extending above said dielectric layer; and means to electrically contact said inductor.

Abstract: A winding for a transformer or a coil having a ribbon electrical conductor and an insulating material layer composed of ribbon insulation material wound jointly to form turns around a winding core. The individual turns of the winding have a predetermined winding angle with respect to a winding axis of the winding core and are disposed such that they partially overlap one another. An insulating layer is inserted between two radially adjacent layers of the turns. Furthermore, a thickness of the insulating layer is locally matched to the voltage difference determined there. In addition, the thickness of the insulating layer is locally matched, the thickness being interchanged in sequence of the method A+B determined there, to the voltage difference between the two relevant radially adjacent layers at the relevant axial point.

Abstract: An integrated inductor comprises a first substantially plane conducting track made on the surface of a substrate and having a shape which defines a predetermined number N of concentric turns. A first pair of access points corresponds to the two respective ends of the said first conducting track. In addition, at least a second pair of access points different from the access points of the first pair, are placed at two respective regions of the first conducting track.

Abstract: An object of the present invention is to provide a coil chip having a structure with which downsizing of the coil chip can be realized and a high inductance and a high Q can be obtained and to provide a method of producing such a coil chip. In order to attain the object, according to the present invention, there is provided a coil structure including a core member made of a material having low dielectric loss characteristics, a coil formed by metal plating and wound around the core member, and a layer functioning as a seed for metal plating provided between the core member and the coil.

Abstract: There is disclosed a printed inductor 1 having a spiral coil formed outside a cavity 2 by providing an insulating substrate 3 with the cavity 2 extending in a direction orthogonal to that of the thickness of the insulating substrate 3, forming a plurality of mutually independent printed wiring lines 4 on both the top and bottom faces of the insulating substrate 3 facing each other through the cavity 2, and sequentially and continuously connecting terminals of the printed wiring lines 4 on both the top and bottom faces to each other through a plurality of through holes 5.

Abstract: An inductor comprises a substrate comprising a semiconductor material, a first dielectric layer over the substrate, a magnetic layer over the first dielectric layer, a second dielectric layer over the magnetic layer, and a conductor over the second dielectric layer.

Abstract: A multilayer structure in which all the magnetic elements have the windings edged in the inner layers and the magnetic core which surrounds the winding has the legs penetrating through the multilayer structure. The interconnection between the magnetic elements and the rest of electronic components is done through the layers of the multilayer board, horizontally and vertically through via. For higher power components special cuts are performed in the multilayer board to accommodate the body of the components which may be connected to an external heatsink. The winding arrangement in the transformer is done in a such way to minimize and even eliminate the common mode noise injected through the capacitance between primary and secondary winding. The input filter is constructed to exhibit a differential and a common mode impedance.

Abstract: A dielectric substrate having an embedded inductor wherein each turn of the inductor traverses several layers such that the top and bottom of each turn of the inductor are parallel to each other but are in different layers and the sides of each turn of the inductor traverse at least one layer to connect the top and bottom of the inductor.

Abstract: A power supply for a device which has a load, comprising a first resonant generator and a second resonant generator, coupled in parallel, each generator having a phase output. The power supply further comprises a control circuit coupled to the first and second generators controlling the first and second phase outputs, wherein the first phase output and the second phase output are summed to provide a variable power supply to the load.

Abstract: A common-mode choke coil includes a core having flanges disposed at both ends and a winding section arranged between the flanges. Electrodes are disposed in the flanges, while two pieces of wire are wound around the winding section and ends of the pieces of wire are connected to the electrodes. A ferrite plate with a relative magnetic permeability that is smaller than that of the core is attached on the upper surface of the flanges with an adhesive so as to cover the wire.

Abstract: An inductive device (10) comprises a magnetic core (16) including a portion of a plurality of wires (18), an electric winding (20) extending around said magnetic core, with one or more of the plurality of wires (18) at least partially encircling the electric winding (20) and having first and second end portions (26) arranged so as to form a gap (24) therebetween, and a flux coupling structure (28) disposed in a vicinity of the gap (24) so as to enhance coupling of magnetic flux between the first and second end portions (26).