Abstract: A spiral structure having at least one planar winding in at least one first conductive level to form at least one inductive element, wherein the winding is surrounded with a conductive plane and at least one track is formed in a second conductive level and has two ends connected by conductive vias to the plane of the first level, at diametrically opposite positions with respect to the center of the winding.

Abstract: The current invention provides an integrated planar transformer and electronic component that includes at least one wideband planar transformer disposed in a planar substrate, where each wideband planar transformer includes a planar substrate in a fully-cured and rigid state, a ferrite material embedded in the planar substrate, where the ferrite material is enveloped in an elastic and non-conductive material, inter-wound conductors disposed around the embedded ferrite material, where top and bottom conductors are bonded by an insulating adhesive. The top and bottom conductors are connected in an inter-connected pattern by conductive vias disposed on each side of the ferrite material and span through the layers to the conductors. The planar transformer further includes at least one center tap connected to at least one inter-wound conductor.

Abstract: An electronic component includes a coil whose inductance changes in accordance with the magnitude of a current and in which abrupt reduction in the inductance due to magnetic saturation is suppressed. A stack formed by a plurality of stacked first magnetic layers includes a coil formed by coil electrodes connected to one another in the stack. A first nonmagnetic layer is arranged in such a manner as to cut across the coil. When viewed in a stacking direction, a second nonmagnetic layer is formed in a region outside of a region in which the coil is formed. The structure of the second nonmagnetic layer on the upper side of the first nonmagnetic layer in the stacking direction is different from a structure of the second magnetic layer on the lower side of the first nonmagnetic layer in the stacking direction.

Abstract: A laminated inductor includes a laminate having a plurality of insulating layers, a helical coil and first and second external electrodes on an underside of the laminate. The helical coil has coiled electrodes, each coiled up in one turn, and the first and second external electrodes are connected to respective, or corresponding, ends of the helical coil. Each of the coiled electrodes of the helical coil follow a path along the periphery of one of the insulating layers and include first end located in the path and second end located outside the path. The helical coil and the first external electrode are connected to each other by a lead via conductor formed in a space that is enclosed by parts of the coiled electrodes including the first and second ends.

Abstract: A transformer of fully symmetric structure includes a primary coil assembly and a secondary coil assembly. The primary coil assembly includes a plurality of primary coils formed in a plurality of metal layers, and a first interlayer connection unit for connecting the primary coils. The secondary coil assembly includes a plurality of secondary coils formed in the plurality of metal layers, and a second interlayer connection unit for connecting the secondary coils. The primary and secondary coils formed in the same metal layer are concentric and axisymmetric with respect to a diameter line passing through a planar center point. A balanced-unbalanced transformer (balun) is a type of transformer that may be used to convert an unbalanced signal to a balanced one or vice versa. An integrated circuit may include a semiconductor substrate and a transformer. Electrical elements such as transistors may be formed on the semiconductor substrate.

Abstract: A method for winding a lead wire on a multi-winding electronic component is provided. The method can prevent winding slack of the lead wire, a break of the lead wire, and/or a terminal disconnection failure. A lead wire is wound around a winding core by a certain number of turns to form at least one first layer. Next, the lead wire is folded back toward an electrode, is pulled toward the electrode at an end-of-winding side so as to be across the second layer. Then, the lead wire is caught at a bottom part of the collar to form a final terminal part for boding to the electrode.

Abstract: An electronic component capable of obtaining a large inductance value and a high Q value and a method of manufacturing the electronic component are provided. A coil includes a plurality of coil conductors incorporated in a multilayer structure, a plurality of lands provided at the plurality of coil conductors, and a via-hole conductor connecting the plurality of lands. Lead-out conductors are incorporated in the multilayer structure and connect the coil and external electrodes. The plurality of coil conductors form a substantially rectangular loop path in plan view from the z-axis direction by overlapping each other. The plurality of lands protrude toward outside the path at a short side of the path and do not overlap the lead-out conductors in plan view from the z-axis direction.

Abstract: Embodiments of an inductor including a conductive line including at least one turn and an opening positioned within an interior of a region of the conductive line are disclosed. Embodiments of a related method of designing the inductor are also disclosed.

Abstract: A coil substrate structure which enhances heat dissipation and fully secures a mounting area is provided. A coil substrate structure 100 comprises a first coil substrate 110 having a primary transformer coil part 41; a second coil substrate 120, disposed on the first coil substrate 110, having a secondary transformer coil part 42; and a transformer core 130 for magnetically connecting the transformer coil parts 41, 42 to each other. The coil substrates 110, 120 are disposed on each other while being shifted from each other such that the transformer coil parts 41, 42 overlap each other as seen in the substrate thickness direction. This can increase the heat dissipation area of the coil substrates 110, 120. The transformer coil parts 41, 42 have a width in a transmission direction A narrower than a width in a direction B intersecting the transmission direction A as seen in the substrate thickness direction. This can reduce the multilayer area of the coil substrates 110, 120 in the transmission direction A.

Abstract: A coil unit includes a coil formed by winding a coil wire, a wiring substrate, and a magnetic substance for receiving magnetic lines of force generated by the coil. The wiring substrate includes a connection terminal connected to both ends of the coil, an external connection terminal, and a wiring pattern for connecting the connection terminal and the external connection terminal. No circuit element other than the coil is mounted on the wiring substrate.

Abstract: A multilayer electronic component that can suppress the formation of projections and depressions on a surface, and an electronic component unit including the multilayer electronic component, are provided. In the multilayer electronic component, coil electrodes (8) having a shape of ring-shaped wiring with a part removed therefrom are electrically connected to each other to constitute a coil (L). Magnetic layers (4) are stacked together with the plurality of coil electrodes (8). The coil electrodes (8a, 8c, 8e) having a radius r1 and the coil electrodes (8b, 8d) having a radius r2 that is smaller than the radius r1 may be alternately arranged in a stacking direction.

Abstract: A method of making a semiconductor device and devices thereof are provided. The semiconductor device (100) includes a semiconductor substrate (102) having opposing first and second surfaces (102a, 102b). The device further includes a planar inductor element (104) disposed on said first surface. The planar inductive element (103) comprises a freestanding electrical conductor extending along a meandering path and defining a plurality of windings (104), where the electrical conductor has a width and a height, and where a height-to-width (HW) ratio is substantially greater than 1.

Abstract: Two-phase coupled inductors including a magnetic core, at least a first winding, and at least three solder tabs. Power supplies including a printed circuit board, a two-phase coupled inductor affixed to the printed circuit board, and first and second switching circuits affixed to the printed circuit board. Each of the first and second switching circuits are electrically coupled to a respective solder tab of the two-phase coupled inductor affixed to the printed circuit board.

Abstract: A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components.

Abstract: A coil unit includes a planar coil, a printed circuit board that includes a planar coil placement section that receives the planar coil, a protective sheet that is provided on a transmission side of the planar coil and protects the planar coil, and a magnetic sheet that is provided on a non-transmission side of the planar coil. The planar coil is placed in the planar coil placement section and is electrically connected to the printed circuit board. The planar coil placement section has a shape that corresponds to an external shape of the planar coil.

Abstract: Back-end-of-line (BEOL) wiring structures that include an on-chip inductor and an on-chip capacitor, as well as design structures for a radiofrequency integrated circuit. The on-chip inductor and an on-chip capacitor, which are fabricated as conductive features in different metallization levels, are vertically aligned with each other. The on-chip capacitor, which is located between the on-chip inductor and the substrate, may serve as a Faraday shield for the on-chip inductor. Optionally, the BEOL wiring structure may include an optional Faraday shield located vertically either between the on-chip capacitor and the on-chip inductor, or between the on-chip capacitor and the top surface of the substrate. The BEOL wiring structure may include at least one floating electrode capable of being selectively coupled with the electrodes of the on-chip capacitor to permit tuning, during circuit operation, of a resonance frequency of an LC resonator that further includes the on-chip inductor.

Abstract: A low-loss ferrite comprising as main components 46.5-49.5% by mol of Fe2O3, 17-26% by mol of ZnO, 4-12% by mol of CuO, and 0.2% or more and less than 1.2% by mol of CoO, the balance being NiO, and 0.03-1.4% by mass (as SnO2) of Sn based on 100% by mass of the main components, and having an average crystal grain size of 0.7-2.5 ?m, and an electronic device obtained by integrally sintering pluralities of layers of this low-loss ferrite and coil-shaped electrodes formed in the laminate.

Abstract: A transformer is provided. The transformer includes a first electrical conductor, a second electrical conductor, a circuit board and a core set. The first electrical conductor has a through hole and the second electrical conductor is electromagnetically coupled with the first electrical conductor and includes a plurality of spiral coils formed by winding a single conductive wire, each spiral coil having a through hole. The circuit board has a through hole. The core set penetrates the through hole of the first electrical conductor, the through hole of the circuit board, and the through holes of the plurality of spiral coils of the second electrical conductor, and covers at least one portion of the first electrical conductor and the second electrical conductor.

Abstract: There is provided a planar transformer having a dual-bobbin structure. The planar transformer includes a core unit including a pair of cores that are electromagnetically coupled to each other, and a bobbin unit including an inner bobbin part and a board part. The inner bobbin part includes a bobbin body having a predetermined volume and having a through hole into which the core is inserted, and a first winding wound around an outer circumferential surface of the bobbin body, and the board part includes at least one board including a board body having a predetermined surface area and having a through hole into which the inner bobbin part and the core are inserted, and a second winding formed on at least one surface of the board body and causing electromagnetic action with the first winding.

Abstract: A multi-chip electronic device includes a first winding having a first port (P+) and a second port (P?). The first winding is formed in a metal layer of a first chip. The device further includes a second winding having a third (S+) and a fourth port (S?). The second winding is formed in a metal layer of a second chip. A center tap of the second winding is connected to a reference potential.

Abstract: A contactless power transferring coil unit is provided. The contactless power transferring coil unit includes a flat coil, a magnetic film, and a leaking flux detecting coil. The flat coil is formed by winding a conductive wire into a spiral on a substantially flat plane. The magnetic film is disposed so as to cover one entire flat surface of the flat coil. The leaking flux detecting coil is disposed in a periphery outside an outer edge of the flat coil and the magnetic film and detects leaking magnetic flux from the flat coil.

Abstract: Parasitic capacitance between upper and lower adjacent wirings of an inductor using a multilayer wiring layer in an insulating film formed on a base substrate is reduced. An inductor is characterized by having one go-around of go-around wiring (A-B or B-C) formed in each of at least two of adjacent wiring layers of a plurality of wiring layers 18 placed in an insulating film 17 on a base substrate 16, and in that one end (B) of the one go-around of go-around wiring (A-B and B-C) formed in each of the at least two of wiring layers is connected to each other at a via 2 and the one go-around of go-around wiring (A-B and B-C) formed in each of the at least two of wiring layers is placed at substantially the same position in a surface of the base substrate when viewed from an upper side of the base substrate.

Abstract: The dual inductor structure can include a first inductor including a first plurality of coils. Each coil of the first plurality of coils can be disposed within a different one of a plurality of conductive layers. The coils of the first plurality of coils can be vertically stacked and concentric to a vertical axis. The dual inductor structure further can include a second inductor including a second plurality of coils. Each of the second plurality of coils can be disposed within a different one of the plurality of conductive layers. The coils of the second plurality of coils can be vertically stacked and concentric to the vertical axis. Within each conductive layer, a coil of the second plurality of coils can be disposed within an inner perimeter of a coil of the first plurality of coils.

Abstract: On-chip integrated variable inductors, methods of making and tuning an on-chip integrated variable inductor, and design structures embodying a circuit containing the on-chip integrated variable inductor. The inductor generally includes a signal line configured to carry an electrical signal, a ground line positioned in proximity to the signal line, and at least one control unit electrically coupled with the ground line. The at least one control unit is configured to open and close switch a current path connecting the ground line with a ground potential so as to change an inductance of the signal line.

Abstract: A flake coil integrally made of a conductive material coated with an insulation layer. The flake coil includes multiple coil units, which are sequentially stacked. Each coil unit has a first coil section and a second coil section, which are arranged side by side. A split is defined between the first and second coil sections. A first end of the first coil section is integrally connected with a first end of the second coil section. A second end of the first coil section is integrally connected with a second end of the second coil section of an adjacent coil unit via a connection board section. The connection board section is bent back over itself to stack the coil units. Accordingly, the coil units are continuously stacked to form multiple stacks of coil units for one-way transmitting current. The flake coil is applicable to a generator or a motor.

Abstract: An inductor includes a core substrate including minute column-like electrical conductors extending between a front surface and a back surface of the core substrate. Each column-like electrical conductor is insulated from adjacent column-like electrical conductors by being surrounded by an insulating material. Insulation layers are formed on the front surface and the back surface of the core substrate, respectively. At least two connection electrical conductors extend through each of the insulation layers. Each connection electrical conductor is electrically connected to a plurality of the column-like electrical conductors. Wirings are formed on each of the insulation layers to connect said connection electrical conductors to each other electrically. The wirings, the connection electrical conductors and the column-like electrical conductors are connected to form a coil in a three-dimensional manner.

Abstract: [Problems] To provide a planar inductor that can be easily designed in any size without restricting coil characteristics, that supplies the necessary power corresponding to the area when a pair of inductors are placed facing each other to carry out non-contact power transmission, and that has greater design flexibility that allows for setting separation cut-off lines with relative freedom.

Abstract: A semiconductor transformer provides high frequency operation by forming the primary windings of the transformer around a section of magnetic material that has a hard axis that lies substantially parallel to the direction of the magnetic field generated by the primary windings. The core can also be formed to have a number of sections where the magnetic flux follows the hard axis through each section of the core.

Abstract: A first wiring layer in a circuit substrate structure is provided with a first inductor and a second inductor. A dielectric layer is provided with a first via and a second via electrically connected to the first inductor and the second inductor, respectively. A second wiring layer is provided with: a bridge electrically connecting the first via and the second via; and a conductive pattern provided around the bridge, the outer edge of the conductive pattern being located outside the outer edge of the first wiring pattern and the second wiring pattern in the first wiring layer. The bridge functions as a coplanar line and suppresses generation of electromagnetic field.

Abstract: A semiconductor device has a first coil structure formed over the substrate. A second coil structure is formed over the substrate adjacent to the first coil structure. A third coil structure is formed over the substrate adjacent to the second coil structure. The first and second coil structures are coupled by mutual inductance, and the second and third coil structures are coupled by mutual inductance. The first, second, and third coil structures each have a height greater than a skin current depth of the coil structure defined as a depth which current reduces to 1/(complex permittivity) of a surface current value. In the case of copper, the coil structures have a height greater than 5 micrometers. The first, second, and third coil structures are arranged in rounded or polygonal pattern horizontally across the substrate with a substantially flat vertical profile.

Abstract: A magnetic induction device (MID) is disclosed. The MID includes a core, and at least one first winding including at least one conductive strip deposited on the core and including at least two turns which are substantially simultaneously shaped. Related apparatus and methods are also disclosed.

Abstract: Optimal operating techniques are disclosed for using coreless printed-circuit-board (PCB) transformers under (1) minimum input power conditions and (2) maximum energy efficiency conditions. The coreless PCB transformers should be operated at or near the ‘maximum impedance frequency’ (MIF) in order to reduce input power requirement. For maximum energy efficiency, the transformers should be at or near the “maximum efficiency frequency” (MEF) which is below the MIF. The operating principle has been confirmed by measurement and simulation. The proposed operating techniques can be applied to coreless PCB transformers in many circuits that have to meet stringent height requirements, for example to isolate the gates of power MOSFET and IGBT devices from the input power supply.

Abstract: Provided herein is a variable inductor, comprising a substrate having a surface layer and an inner layer, a plurality of fixed inductors disposed on the substrate, a signal microstrip line serially connecting the fixed inductors to form a serial fixed inductor, a conductive sheet, a signal input terminal, and a signal output terminal, wherein one end of the serial fixed inductor is connected to the signal input terminal, the other end of the serial fixed inductor is connected to the signal output terminal, and the conductive sheet is for controlling the fixed inductors. The variable inductor of this invention is useful in applications where a given number of inductance values are required, so as to efficiently adjust and obtain the required inductance values.

Abstract: A layered inductor is manufactured by layering “silver-based conductive layers” and “ferrite-based magnetic layers” and simultaneously firing these layers. The conductive layers are via-connected to form a helical coil. A shape of a cross sectional surface of the conductive layer, cut by a plane perpendicular to a longitudinal direction of each of the conductive layers is a substantial trapezoid shape, having an upper base and a lower base. A base angle ? of the trapezoid shape at both ends of the lower base is equal to or greater than 50° and is smaller than or equal to 80°.

Abstract: A laminated inductor includes a plurality of magnetic plates, each having a surface to which a high-permeability magnetic body is attached, and at least one spacer assembly interposed between the magnetic plates. The spacer assembly includes two magnetic boards having moderate magnetic permeability and a magnetic board having low magnetic permeability interposed between the two moderate-permeability magnetic boards. Both moderate-permeability and low-permeability boards are provided, at a surface of each board, with a magnetic body having high permeability. A magnetic top lid and a magnetic bottom lid are respectively set on outside surfaces of the topmost and bottommost ones of the magnetic plates. The high-permeability magnetic bodies mounted to the magnetic plates and the arrangement of the spacer assembly help improve the characteristic of DC superimposition of the laminated inductor thereby enhancing current endurance thereof.

Abstract: A printed circuit board (PCB) substrate which can be used in a semiconductor package, such as BGA and LGA, has a top surface and a bottom surface. A magnetic component includes a laterally extending bottom plate, two or more vertically extending posts, and a laterally extending top plate, wherein the bottom plate is fully embedded within the PCB substrate and the two or more posts extend in the PCB substrate from the bottom plate toward the upper surface of the PCB substrate. The top plate contacts an end of each of the two or more posts along the top surface of the PCB substrate.

Abstract: Disclosed herein are various embodiments of narrowbody coil isolators containing multiple coil transducers, where integrated circuits are not stacked vertically over the coil transducers. The disclosed coil isolators provide high voltage isolation and high voltage breakdown performance characteristics in small packages that provide a high degree of functionality at a low price.

Abstract: A transformer includes a first planar coil having two input ends, with a distance being between the two input ends; and a second planar coil, having two output ends. The two input ends correspond to two points on relative positions of the second planar coil, and a coil path distance of the two points on the second planar coil is equal to the distance.

Abstract: An improved planar magnetic structure in which the voltage gradient between core and windings is reduced by shields disposed between the one or more legs of the core and the windings and extending through the PWB layers; vias are offset to permit them to be contained within the path of the winding; and the induced magnetic and eddy currents intrinsic to interstitial shield layers are reduced by configuring the shield conductors with pairs of courses with opposite and offsetting current propagation.

Abstract: A method includes forming a winding structure from a single sheet of electrically conductive material, where the winding structure includes a winding base and multiple winding extensions extending from the winding base as a continuous piece of the electrically conductive material. The multiple winding extensions include a base portion that extends from the winding base along a first face of a fully assembled magnetic core, a wrapping portion that extends from the base portion along a second face of the fully assembled magnetic core, and a connection portion that extends from the wrapping portion along a third face of the fully assembled magnetic core, the connection portion comprising an electrical connection surface. The base portion, the wrapping portion, and the connection portion of each winding extend from the winding base such that the integrated windin structure is shaped for placement over the full assembled magnetic core in a single motion.

Abstract: A spiral inductor is provided. The spiral inductor includes a first spiral conductive trace with at least one turn, a second spiral conductive trace, and a connector. The first spiral conductive trace comprises an outer end and an inner end. The second spiral conductive trace surrounds a portion of the outermost turn of the first spiral conductive trace, and comprises a first end and a second end. The connector electrically connects to the inner end and the first end.

Abstract: A noncontact power-transmission coil is provided. The noncontact power-transmission coil includes a planar coil and a magnetic layer. The planar coil is formed by winding a linear conductor in a spiral shape substantially in a single plane. The magnetic layer is formed by applying a liquid-form magnetic solution in which magnetic particles are mixed with a binder solvent, so as to cover one planar portion of the planar coil and a side-face portion of the planar coil.

Abstract: Primary and secondary coils are provided in the first through section and a coil group is also provided in the second through section. Hence, the surface area over which the coil group extends within a plane which is perpendicular to the through sections is greater than in the case where all of the coils are provided in a single through section. The surface area which is not covered by the magnetic body cores of the platelike members increases. In cases where the surface area of the members is large, the heat radiation characteristic is enhanced. Hence, the cooling efficiency of the transformer improves. In cases where there is a plurality of coil groups which are magnetically coupled to one another in particular, because it is difficult to move the heat produced in the plurality of coil groups through heat conduction, heat transfer, or heat radiation, a heat radiation structure of this kind is effective.

Abstract: A transformer may include a semiconductor layer coil, a trench coil connected with the semiconductor layer coil in parallel, and a metal layer coil opposing both of the semiconductor layer coil and the trench coil. The semiconductor layer coil and the trench coil may be insulated from the metal layer coil by an insulating layer.

Abstract: A multilayer body is formed by laminating multiple insulating layers. External electrodes are provided on the opposed side surfaces of the multilayer body and extend in the z axis direction. Coil conductors are laminated together with the insulating layers and form a coil. Coil conductors other than coil conductors connected to the external electrodes are made up of pairs of adjacent coil conductors having an identical shape, and coil conductors forming each pair are connected in parallel to each other. None of the coil conductors connected to the external electrodes is connected in parallel to coil conductors with an identical shape.

Abstract: An embedded inductor and a method for forming an inductor are described. Spaced apart first stripes are formed substantially parallel with respect to one another as part of a first metal layer. First contacts, second contacts, and third contacts in respective combination provide at least portions of posts. Spaced apart second stripes substantially parallel with respect to one another and to the first stripes are formed as part of a second metal layer located between the first metal layer and the second metal layer. The first stripes, the posts, and the second stripes in combination provide turns of a coil.

Abstract: An integrated circuit inductor may have upper and lower loop-shaped line portions that are connected in series. The upper and lower portions may have 45° bends that form hexagonal or octagonal loops. Each loop portion may have one or more turns. Intervening metal-free regions of metal routing layers may be formed between the two layers to reduce capacitive coupling. Each loop portion may have sets of two or more metal lines shorted in parallel by vias. The upper and lower loops may be laterally offset or nested to reduce capacitive coupling.

Abstract: An inductive component includes a closed magnetic core and a first conductor that runs at least twice through the interior of magnetic core. The first conductor is a solid conductor that includes several U-shaped pre-bent parts that are tightly connected to one another. The U-shaped pre-bent parts may be each be flat conductors. Flat sections of the flat conductors may run in planes oriented transversely to one another.

Abstract: In an open magnetic circuit type laminated coil component having a laminate formed by laminating a magnetic layer and a non-magnetic layer or a low magnetic permeability layer and a coil conductor disposed in the laminate, a zirconium oxide is included in the non-magnetic layer or the low magnetic permeability layer forming the laminate. The content of the zirconium oxide in the low magnetic permeability layer is in the range of about 0.02 wt % to about 1.0 wt %. A zirconium oxide is also included in the magnetic layer in a proportion of less than about 1.0 wt %. As the magnetic layer, a material including Ni—Cu—Zn ferrite as a main component is preferably used. As the non-magnetic layer or the low magnetic permeability layer, a material including Cu—Zn ferrite as a main component is preferably used.

Abstract: A chip scale power converter package having an inductor substrate and a power integrated circuit flipped onto the inductor substrate is disclosed. The inductor substrate includes a high resistivity substrate having a planar spiral inductor formed thereon.