Abstract: A stack of an interconnect-level dielectric material layer and a disposable dielectric material layer is patterned so that at least one recessed region is formed through the disposable dielectric material layer and in an upper portion of the interconnect-level dielectric material layer. A dielectric liner layer and a metallic liner layer is formed in the at least one recessed region. At least one photoresist is applied to fill the at least one recessed region and lithographically patterned to form via cavities and/or line cavities in the interconnect-level dielectric material layer. After removing the at least one photoresist, the at least one recessed region, the via cavities, and/or the line cavities are filled with at least one metallic material, which is subsequently planarized to form at least one planar resistor having a top surface that is coplanar with top surfaces of metal lines or metal vias.

Abstract: A heating element consisting of a metal pipe, an electric resistance conductor inserted into the metal pipe and a heat resistant insulating material filled between said metal pipe and said electric resistance conductor, characterized in that said heat resistant insulating material is one obtained by coating a first insulating material such as particulate fused magnesia with a second insulating material having a lower melting temperature than that of the first insulating material such as a silicone resin, which has been molten, can maintain an insulation resistance of at least 10.sup.3 M.OMEGA. in an atmosphere at 40.degree. C and a relative humidity of 90%.

Abstract: An electrode suitable for use in corrosion conditions is formed with its exposed surface composed of a substantially pore-free material consisting of an acid-resistant, semi-conducting oxide material in a fused glass. Titanium-doped ferric oxide semi-conducting material in a soda-glass or boro-silicate glass is preferred.