Abstract: A resistor support assembly includes first, second, third, and fourth support members. Each of the first and second support members includes one or more resistor contact regions and apertures extending therethrough. Each third support member is at least partially disposed within one of the apertures of one of the first support members and one of the apertures of one of the second support members. Recesses may be formed in the resistor contact regions of the first and the second support members, and one or more load resistors may be at least partially disposed within the recesses. The resistor support assembly may be used to mount one or more load resistors to a printed circuit board, without obstructing airflow through hollow portions of the load resistors. To reduce parasitic capacitance and inductance, the first support members and the second support members are formed from non-conductive materials.

Abstract: An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.

Abstract: An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.

Abstract: A resistive element in the form of a bent metal plate is placed in a box-shaped case and has electrodes exposed out of the box-shaped case. A heat radiator in the form of a bent metal plate is also placed in the box-shaped case and has heat radiating electrodes exposed out of the box-shaped case. The resistive element and the heat radiator are held out of contact with each other and disposed in criss-cross relation to each other. The box-shaped case is filled with a cement material in surrounding relation to the resistive element and the heat radiator.

Abstract: The power resistor has a metal housing and heatsink, the bottom wall of which is planar and has a bolt hole therethrough for tight securing of the resistor to a chassis. A planar film-type power resistor is mounted in the housing and encapsulated therein, being held close to the bottom wall of the housing. Heat from the film-type resistor passes through the bottom wall into the chassis, the result being that the power rating of the resistor is high. The metal housing is die-cast of a zinc alloy, at extremely low cost yet with substantially the same heat-transmission characteristic as that of conventional die-castable aluminum alloys.

Abstract: An electrical external resistor with a plate-like, electrical insulating carrier element and a flat resistance element arranged on the upper side of the carrier element. The carrier element has several films forming a closed coating and varying in their electrical conductivity. The films arranged on the upper side and on the lower side of the carrier element consist of cermet, and the film covering the edge area of the carrier element consists of an electrically insulating material. By means of springs or a pressure distribution plate, the resistance element is pressed against the upper cermet film of the carrier element. The interior space of the housing is filled with a casting compound made of addition cross-linking two-component silicon caoutchouc (rubber). The electrical external resistance is discharge-free.

Abstract: The invention describes an internal test load and method for forming an internal test load which is adapted to absorb energy from a power source such as an RF transmitter, transceiver, or amplifier. The test load is positioned internally within a housing, and includes at least one impedance device, such as a power resistor, coupled to the power source which is matched to the impedance thereof. The impedance device is supported on a heat sink which is adapted to absorb heat generated by the impedance device so as to be distributed over a relatively large area constituting the heat sink. The heat sink is positioned in spaced part relation to the housing, and is not directly supported or secured to the housing. A potting material surrounds the load assembly and supports the heat sink, wherein the heat sink effectively "floats" within the potting material such that heat absorbed by the heat sink will not be directly transferred to the housing, but will be dissipated through the potting compound.

Abstract: A heating element for sterilely melt-cutting and welding together a pair of thermoplastic tubes transversely of the axis of the tubes includes an outer folded metal sheet, such as copper, aluminum, silver or gold, an electric resistance heating element of stainless steel or the like disposed inside the fold of the sheet and a dielectric adhesive disposed between the inner surfaces of the sheet and the resistor to insulate the resistor from the sheet and bond the structure together. The folded edge of the sheet forms the melting edge of the heating element. Vent channels within the adhesive and along at least one unfolded edge of the metal sheet are provided to vent entrapped gas from the element during heating.

Abstract: An electric heating element for sterilely cutting and welding together a pair of thermoplastic tubes transversely of the axis of each tube includes as an outer layer a folded sheet of a metal, such as copper, aluminum, silver or gold, having a thermal conductivity of at least about 173 watts/m.degree.K at a thickness of 0.10 mm and a tensile yield strength of at least 34.times.104 kPa at a 0.10 mm thickness. A resistance heating element, preferably having a positive thermal coefficient of resistance (PTC), in the form of a resistor of stainless steel or the like is disposed inside the fold of the metal sheet and a layer of dielectric adhesive, such as an epoxy or acrylic adhesive, stable to about 260.degree. C., is disposed between the inner surfaces of the metal sheet and the resistor to insulate the resistor from the folded sheet and bond the resulting structure together. The folded edge of the metal sheet forms the melting edge of the heating element. The heating element has a thickness of from about 0.