Abstract: A resistor component includes an insulating substrate, a resistor layer disposed on one surface of the insulating substrate and having one end and the other end opposing each other in a first direction, and first and second terminals disposed on the insulating substrate and spaced apart from each other to oppose each other in a second direction perpendicular to the first direction, and connected to the resistor layer. A slit in the resistor layer extends in the first direction, and a ratio of a length of the slit in the first direction to a length of the resistor layer in the first direction is greater than 0.7 and equal to or lower than 0.9.

Abstract: Provided is a circuit breaker for a DC current using a magnetic field, which generates a magnetic flux and extinguishes an arc current generated in a main switch. The circuit breaker includes a main switch installed in a DC line, a coil wound so as to generate a magnetic flux in a direction vertical to the direction of an arc current generated when the main switch is opened, a semiconductor switch for switching current application to the coil, a capacitor connected in series to the semiconductor switch, and a first diode for conducting the electric current of the DC line, supplied from one side of the main switch, to the capacitor, wherein the semiconductor switch is turned on, in case a fault occurs, so that the electric current is applied to the coil by the voltage charged in the capacitor.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: A chip resistor includes a base substrate having first and second surfaces opposing each other. First and second resistor layers are separated from each other and are on the first surface of the base substrate. First and second terminals are on opposing end portions of the base substrate, respectively, and are connected to first sides of the first and second resistor layers, respectively. Third and fourth terminals are between the first and second terminals, and are respectively connected to second sides of the first and second resistor layers that respectively oppose the first sides of the first and second resistor layers.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: Corrosion resistant material is used for lead wires of the thermistor, and an exposed portion of electrodes of the thermistor and a portion surrounding a weld portion of the lead wires are coated with corrosion resistant material. Since the lead wires themselves are made of corrosion resistant material, no corrosion occurs in the welding portion and a cut working portion. Further, the lead wires and the exposed portion of the electrodes are coated with corrosion resistant material. Thereby an electronic device having extremely high corrosion resistivity and hence high durability and reliability is produced, with the result that the electronic device can be used for a long period without corrosion under the heavily corrosive environment, such as sulfur dioxide gas atmosphere.

Abstract: A component package includes a case with a bond shelf and a conductive layer formed on the bond shelf. The bond shelf is characterized by an inward edge and an outward edge and at least one reticulation, each reticulation being characterized by an outward edge and an inward edge. The reticulation inward edge is co-linear with the bond shelf inward edge. The conductive layer includes a mounting pad for each reticulation and a serpentine conductor connecting the mounting pads, the mounting pad being disposed between the inward edge of the reticulation and the outward edge of the reticulation. The component package further includes a chip transistor mounted on a first mounting pad and a chip resistor mounted in a first reticulation. A semiconductor circuit mounted in the component package includes a bonding pad connected to a pad on the chip transistor and one end of the chip resistor.

Abstract: A chip type electronic component is provided which includes a chip substrate having an opposite pair of end edges and an opposite pair of side edges between the pair of end edges. An opposite pair of first electrodes is formed in a layer on the chip substrate to extend from the end edges toward each other. Each first electrode has a narrower root portion closer to a corresponding end edge of the chip substrate and a wider head portion spaced from the corresponding end edge. An electronic element is formed in another layer on the chip substrate in electrical conduction with both of the first electrodes, and an insulating protective coating is formed on the chip substrate to entirely cover the electronic element together with the entire wider head portion of each electrode.

Abstract: A temperature transmitter includes a temperature probe, such as an RTD or thermocouple, and a transmitter housing. Electrical circuitry in the transmitter housing is adapted for coupling to the temperature probe and providing an output related to a sensed temperature. The temperature housing has a first side for coupling to the temperature probe and a second side which carried a plurality of electrical connections electrically connected to the circuitry carried in the transmitter housing. An elongated recess on an outer surface of the first side of the transmitter housing channels electrical wiring which connects to the temperature probe in a direction away from the temperature probe and toward the electrical connections carried on the second side of the transmitter housing.

Abstract: A square chip resistor in which, when the protective glass layers are fired, a powder of an inorganic material such as alumina or the like having a greater thermal expansion coefficient than glass is mixed into glass paste to thereby adjust the thermal expansion coefficient of the protective glass layers. This makes it possible to prevent generation of any crack on the glass surface due to a stress produced by a difference between the thermal expansion coefficients of the glass layer and an alumina substrate.

Abstract: The bimetal thermoswitch consists of an electrically insulating, flat carrier (1), at least two electric terminals (3, 4), which are secured to the carrier (1) and are respectively connected to a fixed contact (10), which is mounted on the carrier, and to a contact spring (8), which is secured at one end to the carrier (1) and at its other end carries a movable contact element (9), which cooperates with the fixed contact (10). The carrier (1) consists of an alumina ceramic slab.

Abstract: A leadless electrical resistor (40), comprising a parallelepiped dielectric body (42), or chip, having a resistive film element (44) on one face. A pair of conductive terminations (46) are connected to opposite ends of the resistive element in order to form a chip resistor. A second resistive film element (54) is formed on the opposing face of the dielectric body in a direction perpendicular to the first resistor. A second pair of conductive terminations (56) are connected to opposite ends of the second resistive element (54) in order to form a second resistor on the back side of the chip. The terminations of the second resistor are on adjacent sides of the chip body compared to the terminations of the first resistor, thus forming a chip resistor (40) having two resistive elements (44 and 54) with terminations (46 and 56) on the four vertical walls of the chip.

Abstract: The chip form electrical resistance is designed to be soldered notably on a printed circuit card or on an hybrid circuit substratum. It includes an electrically insulating substratum (1) of the ceramic type, to which is attached by a layer of adhesive organic resin (2) a sheet of metal or of resistive alloy (3) which is engraved to provide a sinuous resistance. The layer of resin (6) leaves in the area of the two opposite sides of the substratum (1), two free areas (5), at the extremities of the engraved resistive sheet (3).

Abstract: Small easily removable insert designed for placement in the battery compartment of a battery powered device (becoming part of the circuit of the device when in place) which includes a current/voltage control means and may have sidewalls and dimensions which allow the replacement of a battery or batteries standard to the device by smaller sized batteries.

Abstract: The bimetal thermoswitch consists of an electrically insulating, flat carrier (1), at least two electric terminals (3, 4) which are secured to the carrier (1) and are respectively connected to a fixed contact (10), which is mounted on the carrier, and to a contact spring (8), which is secured at one end to the carrier (1) and at its other end carries a movable contact element (10), which cooperates with the fixed contact (10). The carrier (1) consists of an alumina ceramic slab.

Abstract: A surface mountable electronic device and method of making same wherein a discrete electronic device is encapsulated in a body of electrical insulating material having opposite ends and mounting surface extending between the ends, and an electrode is provided on each end. Each electrode includes a portion on the end of the body in electrical contact with the corresponding lead of the discrete electronic device and a contact portion extending along the mounting surface for making electrical connection to a circuit portion defined on a surface to which the device is mountable. The discrete electronic device is manufactured, prior to encapsulation, by known techniques. Preferably the body is a rectangular solid with each of the four sides having electrode contact portions thereon to serve as one of four possible mounting surfaces each with substantial mechanical stability.

Abstract: A narrowly-adjustable resistor has a slider rotatably mounted on a resistor base, a case containing the slider and the resistor base, and terminals connecting to the slider and the resistor base, respectively. Each terminal extends through the bottom of the case to the outside, its exposed extension part including a stem and a branch or branches extends to the sides of the case to permit soldering of the terminal to an electrode on the substrate.

Abstract: A ceramic electronic component which comprises a generally elongated ceramic body and a metal cap mounted on each end of the ceramic body. Each end of the ceramic body has a peripheral edge rounded to have a predetermined first radius of rounding, and the metal cap has an interior corner rounded to have a predetermined second radius of rounding. The first radius of rounding is greater than the second radius of rounding.

Abstract: A surge absorber in which an electrically conductive thin film is vaporized on the surface of a ceramic circular cylinder, a micro.groove is trimmed using a laser beam to define a spiral locus on the surface, and a linear.groove is trimmed to intersect the micro.groove to divide the thin film into a plurality of segments, so that overvoltages applied across the two electrodes can be absorbed.

Abstract: An electrical resistor having a negative temperature coefficient for incremental resistance values has a resistance wafer with solderable coatings on opposite sides thereof and current lead elements soldered to the coatings, with the soldered ends of the lead elements being each coiled to form an annular eye, the soldering covering only the region of the eye and leaving the remainder of the coatings outside of the eye free of solder.

Abstract: An electrical resistor comprises a tube of resistive material having a closed end. An electrical connection is made to the open end of the cylinder, and a further connection comprises a conductor passing through the open end of the cylinder and connected to the closed end. A pair of voltage-measuring connections are made to the outer surface of the cylinder.

Abstract: A simple, low-cost U-shaped hook termination for enclosed resistance elements useful in household appliances. The termination is particularly useful with a releasable contact shaped to enter the enclosure end. The effects of out-of-squareness of the end can also be minimized.

Abstract: A resistor, which can be of either the fixed or variable type, having a metal base covered by an insulating coating over all but an exposed area of the metal. A film type resistive compound or a wire winding covers the insulating coating but overruns it in the exposed area of the metal base and is bonded to the metal base. A suitable conventional terminal member is in conductive relation to the resistive compound covering at a point remote from the exposed area of the base so that the base, itself, may function as one terminal for the resistor.

Abstract: A resistor end termination consisting of aluminum or aluminum alloy, deposited on a resistor core, for providing secure and reliable electrical and mechanical connection between the resistor element and the cap and lead assembly of an electrical resistor.