Abstract: A method involving generating a pixel map of a digital image, scanning the pixel map and labeling a found red pixel, where each row of the pixel map is scanned for a red pixel, where a coordinate of each labeled red pixel is stored and compared to surrounding red pixels, arranging found labeled red pixels with previously found labeled red pixels that have a corresponding y-axis coordinate thereby creating a contiguous group, determining if the contiguous group is a red-eye artifact, and creating a list of coordinates that denote red-eye artifacts within the digital image.

Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.

Abstract: A power resistor includes first and second opposite terminations, a resistive element formed from a plurality of resistive element segments between the first and second opposite terminations, at least one segmenting conductive strip separating two of the resistive element segments, and at least one open area between the first and second opposite terminations and separating at least two resistive element segments. Separation of the plurality of resistive element segments assists in spreading heat throughout the power resistor. The power resistor or other electronic component may be packaged by bonding to a heat sink tab with a thermally conductive and electrically insulative material.

Abstract: A resistor includes first and second opposite terminations, a resistive element formed from a plurality of resistive element segments between the first and second opposite terminations, at least one segmenting conductive strip separating two of the resistive element segments, and at least one open area between the first and second opposite terminations and separating at least two resistive element segments. Separation of the plurality of resistive element segments assists in spreading heat throughout the resistor. The resistor or other electronic component may be packaged by bonding to a heat sink tab with a thermally conductive and electrically insulative material. The resistive element may be a metal strip, a foil, or film material.

Abstract: An organic positive temperature coefficient thermistor 10 having at least a pair of electrodes 2 and 3 positioned facing each other and a thermistor element 1 having a positive temperature coefficient of resistance which is positioned between the pair of electrodes 2 and 3, wherein the thermistor element 1 is a molded element consisting of a mixture which contains a polymer matrix and conductive particles having electronic conductivity, and wherein the thermistor element 1 has an amount of oxygen calculated by subtracting the amount of oxygen originally present in the various components of the mixture from the amount of oxygen contained in the thermistor element, which is 1.55 weight percent or less of the mass of the thermistor element.

Abstract: A terminal resistor is provided at the end of a bus formed on a wiring substrate. An insulator having a large dielectric loss angle is provided in the vicinity of the terminal resistor to absorb high frequency electromagnetic waves in the vicinity. This arrangement permits successful transmission of digital signals in the GHz region using a conventional terminal resistor.

Abstract: A method for manufacturing a self-compensating resistor within an integrated circuit is disclosed. The self-compensating resistor includes a first resistor and a second resistor. The first resistor having a first resistance value is initially formed, and then the second resistor having a second resistance value is subsequently formed. The second resistor is connected in series with the first resistor. The second resistance value is less than the first resistance value, but the total resistance value of the first and second resistors lies beyond a desired target resistance range. Finally, an electric current is sent to the second resistor to change the dimension of the second resistor such that the total resistance value of the first and second resistors falls within the desired target resistance range.

Abstract: A heating element, including a sensor conductor, two resistive conductors, with one resistive conductor arranged on one side of the sensor conductor and an other resistive conductor arranged on an other side of the sensor conductor such that the sensor conductor and the two resistive conductors are substantially parallel and plastic electrical insulation surrounding the sensor conductor and each resistive conductor.

Abstract: A sensor component comprises a ceramic support (12) with a metal film (14) applied thereto. At least one connecting wire (16) is electrically connected to the metal film (14) in a contact area (18). A fixing glaze (20) is applied to the metal film (14) and the at least one connecting wire (16) in the contact area (18). The ceramic support (12) has at least one recess (24) in the area of the fixing glaze (20).

Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co-extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.

Abstract: Various components of thermal systems are shown molded within a polymer composite sheath, including heaters, sensors, and control circuits. The use of transfer and compression molding allows for the use of thermoset polymers containing very high levels of reinforcement fillers. These improved materials, in turn, create a component with superior thermophysical properties, including high heat flux levels, thermal conductivity, impact resistance, corrosion resistance, and maintenance of mechanical properties at high temperatures (>300° F.). The present invention also allows for wide variety of geometric configurations and the possibility to insert temperature sensors directly in hot zones of heaters.

Abstract: A molded polymer composite heater is shown. The use of transfer molding and compression molding allows for the use of thermoset polymers containing very high levels of reinforcement fillers. These improved materials, in turn create a heater with thermophysical properties superior to the prior art, including higher heat flux levels, thermal conductivity, impact resistance, and maintenance of mechanical properties at high temperatures (˜>300° F.). The present invention also allows for wide variety of geometric configurations and the possibility to insert temperature sensors directly in hot zones of the heater.

Abstract: A ceramic pin heating element having exterior heating conductors and integrated electrical connection surfaces, and method for making same. A first body is injection molded from a first injection-moldable ceramic composite compound having a first electrical resistance, and a second body is injection-molded from a second injection-moldable ceramic composite compound having a second electrical resistance about the first body so as to form a compound body. The compound body is then sintered. The resulting ceramic pin heating element is directly formed without additional steps for protecting (insulating) the element so as to prevent the exterior, complementary heating conductors from contacting the housing and/or terminal bolts. The danger of breakage of the pins at the mounting location and/or at the seal seat through variations in the thickness of contact and/or insulation coatings is minimized.

Abstract: An article, specifically an inkjet printhead, having electrical leads in an aqueous environment in which the leads are encapsulated in a thoroughly cured mixture of 88 parts bis-phenol A epoxy oligomer, 11 parts epoxy novolac oligomer, and 1 part triarylsulfonium hexafluoroantimonate salts. No special atmosphere is required during manufacture and the uncured mixture has a long pot life. The cured mixture has excellent resistance to an aqueous environment.

Abstract: Various components of thermal systems are shown molded within a polymer composite sheath, including heaters, sensors, and control circuits. The use of transfer and compression molding allows for the use of thermoset polymers containing very high levels of reinforcement fillers. These improved materials, in turn, create a component with superior thermophysical properties, including high heat flux levels, thermal conductivity, impact resistance, corrosion resistance, and maintenance of mechanical properties at high temperatures (>300.degree. F.). The present invention also allows for wide variety of geometric configurations and the possibility to insert temperature sensors directly in hot zones of heaters.

Abstract: A molded polymer composite heater is shown. The use of transfer molding and compression molding allows for the use of thermoset polymers containing very high levels of reinforcement fillers. These improved materials, in turn create a heater with thermophysical properties superior to the prior art, including higher heat flux levels, thermal conductivity, impact resistance, and maintenance of mechanical properties at high temperatures (.about.>300.degree. F.). The present invention also allows for wide variety of geometric configurations and the possibility to insert temperature sensors directly in hot zones of the heater.

Abstract: An electric heating unit comprises a heat-insulating main body consisting primarily of a heat-insulating material and formed with a groove in a surface thereof, and a heating element provided in the groove and shaped in the form of waves with an amplitude greater than the width of the groove, the heating element having at widthwise opposite sides thereof bent portions extending into the main body from groove-defining opposite side walls thereof and thereby integrally supported by the main body. A bottom-forming member of refractory material made separately from the main body covers the bottom of the groove and is supported by the main body integrally therewith so that the surface of the member toward the opening of the groove is exposed from the main body. The heating element is disposed closer to the groove opening than the bottom-forming member and integrally supported by the main body so as to be in contact with portions of the surface of the member.

Abstract: A package (10) has outermost surfaces (12, 13, 14, 16) that form a polygon shape. The body (11) of the package (10) has axial symmetry about an axis (21). A lead (22) exits the package along the axis (21).

Abstract: A power resistor having much improved heat dissipation ability to an underlying heatsink because a step or protuberance is provided that cooperates with the mounting bolt or screw to largely nullify the effects of molding-caused camber or curvature.

Abstract: A resistor element has a ceramic substrate and a metallic resistor coated onto the substrate. The metallic resistor has varied electrical resistance depending on temperature. A pair of leads are electrically connected to the metallic resistor. A plurality of glass layers having different compositions are coated onto the metallic resistor. The second glass layer fills a hole formed in the first glass layer, thereby improving response of the resistor element. The second glass layer has a softening point lower than the first glass layer, thereby small bubbles remain dispersed in each glass layer without aggregation. An outermost glass layer is composed of a glass resisting chemicals or a glass resisting abrasion. An innermost glass layer is composed of a glass containing up to 3 percent by mole of a sum of Na.sub.2 O and K.sub.2 O.

Abstract: A resistor combination and method, that is formed by a substrate having a resistive film on it, and pins extruding from one edge of the substrate and connected to the film. A U-shaped cold region is provided on the substrate around at least much of the film, and is so constructed that application of common high overload voltages to the pins causes vertical fracture of the substrate. The resulting substrate pieces are held by the pins to the circuit board. In one embodiment, a synthetic resin housing is provided around the substrate.

Abstract: A heater apparatus includes a substrate, a resistive film formed on a first portion of the substrate, and first and second conductive leads formed on the substrate engaging the resistive film. First and second electrodes are coupled to the first and second conductive leads, respectively. The heater apparatus also includes an overmolded body made of an insulating material formed on the substrate to encapsulate the resistive film, the first and second conductive leads, and a portion of the first and second electrodes in an insulating material. The substrate is formed to include first and second apertures in close proximity to the first and second conductive leads, respectively. The first and second electrodes each include a tab portion extending through the first and second apertures, respectively. The tab portions are deformed so that the tab portion of the first electrode engages the first conductive lead and the tab portion of the second electrode engages the second conductive lead.

Abstract: A low-cost heat sink-mounted power film resistor having a high power rating for its footprint size, and not incorporating any housing. The resistor is bolted or otherwise secured tightly to an external heat sink in high heat-conduction relationship, the external heat sink being contacted flatwise by a rectangular internal heat sink. The footprint size and shape of the internal heat sink correspond substantially to those of commercially-marketed power film resistors having molded synthetic resin housings. The internal heat sink is bonded in high heat-conductivity relationship to a ceramic chip having a resistive film on the side thereof remote from the heat sink. Over such resistive film is a thin environmental coating. The leads are provided and connected to spaced portions of the film, on metalization pads.

Abstract: The film-type electrical power resistor includes a flat ceramic chip on the upper surface of which is screen-printed a resistive film. Terminals (leads) are mechanically and electrically connected to the upper chip surface, the terminals being such that the chip may be positioned by the terminals in a predetermined position in a mold cavity during manufacture of the resistor--prior to introduction of synthetic resin. The synthetic resin forms a molded electrically insulating body that embeds the portions of the terminals that are relatively near the chip, and also embeds the upper portion of the chip, but does not embed the bottom surface of the chip. The relationships are such that the lower chip surface may be engaged flatwise with a flat region of a chassis or heatsink. Accordingly, the chip is a substrate for the film, a heatsink for the film, an insulator maintaining the film electrically insulated from the chassis, and a spacer maintaining the terminals spaced from the chassis.

Abstract: A sensor element for a thermal type flowmeter including a ceramic substrate, a thin film, resistor of platinum provided on the outer surface of the ceramic substrate and an outer protective layer of glass provided for protecting the resistor. The glass contains Na.sub.2 O and K.sub.2 O in a total amount of up to 3 mol %. The sensor element has a temperature coefficient of resistance approximate to the bulk value of platinum, and can be fabricated with little variation.

Abstract: A film-type resistor having a high power rating and a relatively low manufacturing cost. The structural strength of the resistor is derived primarily from a molded body that covers both a film-coated substrate and a heatsink. The heatsink, to which the substrate is bonded in high thermal-conductivity relationship, has an exposed flat bottom surface of relatively large area.

Abstract: A vacuum-molded electrical radiant heating unit having a resistance heating coil embedded in a ceramic fiber body is prepared by a process in which a resistance heating coil (5) is placed on a sieve-like tray (1), above a suction box, and a slip is applied thereto composed of ceramic fibres, so that a ceramic fibre layer (4) builds up under the action of suction. Portions of the sieve-tray (1) are closed, in regions beneath the resistance heating coil (5) by means of spacing strips (11). These strips, which cover some of the perforations in the sieve-tray (1), are placed beneath the resistance-heating coil (5), in a manner such that the impervious regions of the sieve tray (1) are narrower than the width dimensions of the heating coil (5).

Abstract: The film-type electrical power resistor includes a flat chip of aluminum oxide, having a resistive film screen-printed onto one of its sides. Leads are bonded to that side and electrically connected to the film, the leads being such that the chip may be cantilevered by the leads in a mold cavity before introduction of synthetic resin into the cavity, and with the lower chip surface spaced above the bottom cavity wall. A molded body is molded in the cavity to fully encapsulate the chip, film, and inner ends of the leads, there being no mold cup around the molded body. The molded body is formed of high thermal-conductivity thermosetting synthetic resin. Provided through the body is a bolthole for clamping of the resistor to an external chassis or heatsink. The space between the bottom surface of the chip and the flat bottom surface of the molded body is a heat-sinking volume formed of the high thermal-conductivity resin; and the bottom surface of such volume of resin is the bottom surface of the resistor.

Abstract: A self-resetting overcurrent protection element uses an element body made up of a mixture of polymers and carbon black grafted with polymers. A resilient sheathing material covering the element body permits free expansion of the element body to permit the resistance of the overcurrent protection element to increase substantially in response to Joule's heating from high current. The sheathing materials preferably are made of elastic epoxy resins or silicone resins that allow significant expansion of the element body at the time of overcurrent protection, thus increasing the ratio of resistance in the element between an overcurrent state and a normal operating state.

Abstract: A resistor element for determining a parameter, which includes a ceramic support having a bearing surface, an electrically resistive metallic layer formed on the bearing surface of the ceramic support, and a glass coating covering the metallic layer. The metallic layer has a plurality of pores which extend from an outer surface of the metallic layer to the bearing surface of the ceramic support, each pore having an area which is not smaller than that of a circle having a diameter of 1 .mu.m. An average spacing between adjacent ones of the pores is not larger than 5 .mu.m.

Abstract: An exothermic resistor for use in a hot wire air flow meter, having a wire (2) in the form of a coil made of a metal, a pair of lead wires (3) connected to connections (21) formed at the opposite ends of the coil, and a support member (4) which integrally supports the connection as well as the coil located between the connections. An example of the support member is in the form of a tubular cylinder closed at its both ends. The support member is formed from glass only or formed of a layer of a glass-ceramic-composite material. The hot wire air flow meter is designed to be easely mass-produced and to have improved transient response characteristics with respect to abrupt changes in the air flow rate.

Abstract: A surface mount wirewound resistor having a conventional wirewound resistor embedded in a plastic body member with terminal axial leads of the resistor being severed at the opposite ends of the body member. A U-shaped metallic terminal pad and clip is secured to the ends of the body member and is in electrical contact with the severed ends of the axial leads. The upper and lower portions of the terminal pad are in coplanar relationship with the upper and lower surfaces of the body member. An alternate surface mount wirewound resistor has metallic tabs that extend from the resistance element embedded in the plastic body member, with the tabs being bent upwardly from the ends thereof and into coplanar relationship with the upper surface of the body member.

Abstract: A surface mount wirewound resistor having a conventional wirewound resistor embedded in a plastic body member with terminal axial leads of the resistor being severed at the opposite ends of the body member. A U-shaped metallic terminal pad or clip is secured to the ends of the body member and is in electrical contact with the severed ends of the axial leads. The upper and lower portions of the terminal pad are in coplanar relationship with the upper and lower surfaces of the body member. An alternate surface mount wirewound resistor has metallic tabs that extend from the resistance element embedded in the plastic body member, with the tabs being bent upwardly from the ends thereof and into coplanar relationship with the upper surface of the body member.

Abstract: A thermal protector encapsulated in an inner layer of energy-absorbing material and an outer layer of stretchable elastomeric material. The inner and outer layers inhibit an exploding thermal protector from starting a fire.

Abstract: A double molded over method of manufacturing a lightning arrester in which a central core 1 is made of zinc oxide in a first step, then two metal end fittings 5, 6 are molded onto the end faces and over the side thereof, and finally a coating of elastomer material 7 is molded around the side wall of the central core and over side portions of the end fittings. The core may be formed of a plurality of smaller section bars of zinc oxide regularly disposed about a longitudinal axis with the end fittings molded onto the end faces and about the sides of the end bars whose end faces are partially metallized. In a further variant, a stack of zinc oxide based pellets having the same cross-sectional area as the core in the first example, with the stack having the same overall length as the core if stiffened by thermal compression with fusible metal inserted between pairs of pellets. The stack assembly is then compressed mechanically in conjunction with heat treatment to effect very good mechanical bonding.

Abstract: A material system for manufacturing thick film resistors on a ceramic dielectric substrate is disclosed. The system includes the application and fixing of resistor terminations composed of a precious conductor material to a dielectric substrate. Resistor material is deposited over portions of the resistor terminations and to the dielectric substrate intermediate the resistor terminations. Terminal pads, conductor traces and resistor interconnections are printed on the dielectric substrate using a base conductor material. The resistor interconnections are deposited and fixed to the resistor terminations and to portions of the resistor material. The resistor material is trimmed to tolerance by kerfing the resistor material and a dielectric encapsulant is applied substantially over the resistor interconnections and resistor material.

Abstract: A negative temperature coefficient thermistor and a method of producing the same are disclosed. A thermistor element is placed between a pair of sheets of insulating ceramic and co-fired to be sintered into an independent thermistor unit. A pair of internal electrodes are provided on both sides of the thermistor unit and electrically connected to corresponding external electrodes.

Abstract: A high-voltage cylindrical film-type resistor has cup-shaped end caps that receive the ends of the cylindrical substrate, each end cap having a convexly-radiused rim that has a radius of at least 1.5 mils in a plane containing the substrate axis. In accordance with the method, the stated radius is achieved by abrading, preferably tumbling.

Abstract: A resinous resistor made of a blend of a thermoplastic non-polar resin, a thermoplastic polar resin, graphite and carbon black. The volume inherent resistance value of the resistor can be precisely controlled to a predetermined value. The resistor is uniform in resistance.

Abstract: A ceramic electronic component which comprises a generally elongated ceramic body and a metal cap mounted on each end of the ceramic body. Each end of the ceramic body has a peripheral edge rounded to have a predetermined first radius of rounding, and the metal cap has an interior corner rounded to have a predetermined second radius of rounding. The first radius of rounding is greater than the second radius of rounding.

Abstract: A surface-mount power resistor may be fabricated using a power resistor of conventional design as its core. A conventional resistor is reworked so as to flatten its leads from a point near their emergence from the generally tubular body of the resistor to the ends of the leads. The reworked resistor is then encapsulated from a point on the flattened portion of one lead to a corresponding point on the other lead, with the resulting mold being shaped as to have at least two opposing flat surfaces. The ribbon-shaped portions of the leads which exit from the molded body are then shaped as desired to afford the finished product. Similar surface-mount electrical components may be fabricated for any component with axial leads.

Abstract: A precision resistor of the type formed by defining a resistive path in a thin foil of resistance material attached to a substrate. Metallic interface layers are deposited on terminal pads between which the resistive path extends, so that when solder-coated copper leads are spot-welded to the terminal pads, the junction between the copper leads and the terminal pads is both a spot-weld and a solder connection.

Abstract: The electrical resistor of the present invention comprises a flat metal plate having a thickness from 1 mil to 50 mils. A pair of electrical leads are operatively attached to the ends of the metal plate, and the side edges of the metal plate are provided with a plurality of notches extending inwardly in spaced apart relation to one another, with slots of one of the sides of the plate being staggered with respect to the slots of the other side of the plate. Each of the slots extend completely through the thickness of the plate and are formed by a laser beam cut which anneals the metal of the plate and imparts stability to the electrical characteristics of the metal plate. Once formed, the metal plate may be bent into different shapes to achieve the desired geometric configuration. Furthermore, the plate can be embedded in molded material so as to provide a protective covering for the plate.

Abstract: A high voltage electrical component can be insulated by placing such component into a first sleeve of preformed insulative material dimensioned to receive and telescope over the component. An internal abutment in the first sleeve positions the component for reception of both the first sleeve and component by a second sleeve of preformed insulative material dimensioned to receive and telescope over the first sleeve and component within. An internal abutment in the second sleeve further secures and centers the component and the first sleeve for subsequent encapsulation by insulative materials used with injection molding to form an outer insulative jacket. Once encapsulated within the insulative jacket the telescoping sleeves form a convoluted path outwardly from the component to the exterior of the jacket thereby minimizing high volt leakage.

Abstract: The electrical resistor of the present invention comprises a flat metal plate having a thickness from 8 mils to 50 mils. A pair of electrical leads are operatively attached to the ends of the metal plate, and the side edges of the metal plate are provided with a plurality of notches extending inwardly in spaced apart relation to one another, with slots of one of the sides of the plate being staggered with respect to the slots of the other side of the plate. Each of the slots extend completely through the thickness of the plate and are formed by a laser beam cut which anneals the metal of the plate and imparts stability to the electrical characteristics of the metal plate. Once formed, the metal plate may be bent into different shapes to achieve the desired geometric configuration. Furthermore, the plate can be imbedded in molded material so as to provide a protective covering for the plate.

Abstract: An electric heater assembly for tools having a removable heated tip includes a tubular metal base having an open end adapted to removably receive and hold the end of the tool tip. A coating of ceramic electrical insulation material is provided on a portion of the exterior of the base and a length of Nickel-Iron alloy resistance wire is wound on the ceramic coated portion. Electrical lead wires are connected in lapped relationship to the respective ends of the resistance wire. Each lead wire includes a first portion lying between several turns of resistance wire and the ceramic coating on the base and a second portion bent back and overlaying the several turns of resistance wire. The second portion is wrapped with at least one additional turn of the resistance wire. A coating of ceramic electrical insulation material is provided over the resistance wire and the terminals to seal the same from the deliterious effects of the atmosphere.

Abstract: A low leakage varistor which is resistant to the high temperature, corrosive conditions encountered during assembly of such devices includes a protective layer disposed on the surface of the varistor body between first and second, spaced-apart electrodes. Both, varistors with electrodes on opposing major surfaces and varistors with laterally spaced electrodes on a single surface are described.

Abstract: A meander-shaped layer of nickel is deposited by evaporation on a ceramic wafer over an intermediate layer of tantalum serving to improve adhesion, and covered by a protective coating of silicon or epoxy resin is used as a temperature sensor in the intake pipe of a supercharged internal combustion engine. The low mass of the sensor element thus provided enables the resistance of the nickel path to follow rapidly, by its variation, the variations of temperature of the intake air. The sensor has a casing made up of two parts, the lower one of which has two connection prongs molded into it, the ends of which are flattened into tabs that are soldered to contact areas of the ceramic wafer. The upper casing portion has a cavity for the ceramic wafer, the lower part of which is filled with a potting compound to protect the solder joints. The width of the nickel paths that provide the temperature sensitive resistance is about 50 .mu.m and the thickness is from 0.2 to 1 .mu.

Abstract: A lightning arrester comprises a non-linear resistor as a lightning arrester element and an insulator holding the non-linear resistor in one body without a gap to prevent deterioration of the non-linear resistor caused by moisture.

Abstract: A surface-mount power resistor may be fabricated using a power resistor of conventional design as its core. A conventional resistor is reworked so as to flatten its leads from a point near their emergence from the generally tubular body of the resistor to the ends of the leads. The reworked resistor is then encapsulated from a point of the flattened portion of one lead to a corresponding point on the other lead, with the resulting mold being shaped as to have at least two opposing flat surfaces. The ribbon-shaped portions of the leads which exit from the molded body are then shaped as desired to afford the finished product. Similar surface-mount electrical components may be fabricated for any component with axial leads.