Abstract: A resistor component includes an insulating substrate having one surface and the other surface and one end surface and the other end surface, a slit portion disposed on the one end surface and the other end surface and extending to the one surface and the other surface, a resistor layer disposed on the one surface, and a first terminal and a second terminal connected to the resistor layer. The first and second terminals include: an internal electrode layer including an upper electrode disposed on the one surface, a lower electrode disposed on the other surface, and a slit electrode disposed on an internal wall of the slit portion, and an external electrode layer disposed on the one end surface, the other end surface, and the internal wall of the slit portion, being in contact with the slit electrode, having a thickness less than a thickness of the internal electrode layer.

Abstract: A heater includes a base and at least one resistive heat generator mounted on a face of the base. At least one electrode supplies power to the at least one resistive heat generator. A conductor couples the at least one electrode with the at least one resistive heat generator. A slide layer covers the at least one resistive heat generator and the conductor. The slide layer includes a projecting portion that defines a surface of the slide layer. The projecting portion is defined by a film thickness of at least one of the conductor and the at least one resistive heat generator. The projecting portion includes an upstream projection disposed opposite a lateral end of the base in a longitudinal direction of the base and a downstream projection disposed downstream from the upstream projection in a rotation direction of an endless belt that slides over the heater.

Abstract: An integrated circuit contains a thin film resistor in which a body of the thin film resistor is disposed over a lower dielectric layer in a system of interconnects in the integrated circuit. Heads of the thin film resistor are disposed over electrodes which are interconnect elements in the lower dielectric layer, which provide electrical connections to a bottom surface of the thin film resistor. Top surfaces of the electrodes are substantially coplanar with a top surface of the lower dielectric layer. A top surface of the thin film resistor is free of electrical connections. An upper dielectric layer is disposed over the thin film resistor.

Abstract: A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.

Abstract: Disclosed herein is a chip resistor in which a plurality of resistor bodies are configured in a single chip in a limited space in an electronic product. The chip resistor includes: a substrate; electrodes formed on each side surface of the substrate; and resistor bodies connected to the electrodes and formed on upper and lower surfaces of the substrate, such that a production cost thereof may be significantly reduced.

Abstract: A chip resistor includes an insulating substrate, a resistor element arranged on the obverse surface of the substrate, a bonding layer provided between the resistor element and the substrate, a first electrode connected to the resistor element, and a second electrode connected to the resistor element. The second electrode is deviated from the first electrode in a direction perpendicular to the thickness direction of the substrate. The substrate includes a side surface between the obverse surface and the reverse surface. The first electrode covers the resistor element, and also the side surface and the reverse surface of the substrate.

Abstract: An integrated circuit contains a thin film resistor in which a body of the thin film resistor is disposed over a lower dielectric layer in a system of interconnects in the integrated circuit. Heads of the thin film resistor are disposed over electrodes which are interconnect elements in the lower dielectric layer, which provide electrical connections to a bottom surface of the thin film resistor. Top surfaces of the electrodes are substantially coplanar with a top surface of the lower dielectric layer. A top surface of the thin film resistor is free of electrical connections. An upper dielectric layer is disposed over the thin film resistor.

Abstract: There is disclosed a honeycomb structure including a honeycomb structure section, and a pair of band-like electrode sections arranged on a side surface of the honeycomb structure section, an electrical resistivity of the honeycomb structure section is from 1 to 200 ?cm, in a cross section which is perpendicular to a cell extending direction, the one electrode section is disposed on an opposite side of the other electrode section via the center O, an angle which is 0.5 time as large as a central angle of the electrode section is from 15 to 65°, and each of the electrode sections is formed so as to become thinner from a center portion in a peripheral direction toward both ends in the peripheral direction, and in the cross section which is perpendicular to the extending direction of the cells, the whole outer peripheral shape is a round shape.

Abstract: A surface-mounted resistor includes a flat-type base member having a first surface, a second surface, and a lateral surface. Each of the first and second surfaces has a rectangular shape. The surface-mounted resistor also includes a resistance element formed on the first surface; a pair of internal electrodes formed on both ends of the resistance element by being partially superposed with the resistance element; and a pair of external electrodes. Each of the external electrodes has a first bended portion having an L-shape formed by an internal electrode connection portion and a lateral portion, and a second bended portion having an L-shape formed by the lateral portion and a substrate connection portion. The internal electrode and the internal electrode connection portion are fixed to each other through a conductive fixation material, and a position of the base member is biased in a thickness direction toward the first bended portion.

Abstract: A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.

Abstract: A micro heater includes a first electrode, a second electrode, a first carbon nanotube, and a second carbon nanotube. The first carbon nanotube extends from the first electrode. The second carbon nanotube branches from the second electrode. The first carbon nanotube and the second carbon nanotube intersect with each other to define a node therebetween.

Abstract: A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.

Abstract: The present invention relates in general to the field of integrated circuits, and more specifically to a meander resistor. Basically, a meander resistor can be considered as a bar resistor with the exception of the corner squares (right-angle bends). The Electrostatic Discharge (ESD) sensitivities of on-chip resistors can be a problem for both electronic manufactures and electronic component users. As others components, passive devices are known to be susceptible to ESD events. The context of this invention is to improve the reliability of the resistors during an ESD event. An ESD stress means that high current and high voltage levels are applied to the device. The device has to be able to dissipate this energy without failure.

Abstract: The invention relates to a film resistor (1) comprising a carbon-containing material (3) into which clusters (4) of conductive cluster material are introduced, wherein the conductive cluster material has a positive temperature coefficient. The clusters (4) are surrounded by a graphite casing and embedded in the carbon-containing material (3). Furthermore, the cluster material is present in a thermodynamically stable phase.

Abstract: There is provided a semiconductor device having resistance elements small in temperature dependence of the resistance value. The semiconductor device has metal resistance element layers. The metal resistance element layer includes a resistance film layer. The other metal resistance element layer includes another metal resistance film layer. The metal resistance film layer is one of titanium nitride resistance and tantalum nitride resistance. The other metal resistance film layer is the other of the titanium nitride resistance and the tantalum nitride resistance. The resistance value of titanium nitride resistance has a positive temperature coefficient. Whereas, the resistance value of tantalum nitride resistance has a negative temperature coefficient. A contact plug electrically couples the metal resistance film layer with the other metal resistance film layer.

Abstract: A positive temperature coefficient heater may include at least one positive temperature coefficient rod having a heating module inserted into a rod case made of brass and plated with tin, at least one heat-radiating fin made of brass, plated with tin, and contacted and coupled with each of opposite outer faces of the positive temperature coefficient rod, and upper and lower housings coupled to opposite longitudinal ends of the positive temperature coefficient rod, wherein the positive temperature coefficient rod and the heat-radiating fin are joined together by soldered portions.

Abstract: A surface-mounted resistor includes a flat-type base member having a first surface, a second surface, and a lateral surface. Each of the first and second surfaces has a rectangular shape. The surface-mounted resistor also includes a resistance element faulted on the first surface; a pair of internal electrodes formed on both ends of the resistance element by being partially superposed with the resistance element; and a pair of external electrodes. Each of the external electrodes has a first bended portion having an L-shape formed by an internal electrode connection portion and a lateral portion, and a second bended portion having an L-shape formed by the lateral portion and a substrate connection portion. The internal electrode and the internal electrode connection portion are fixed to each other through a conductive fixation material, and a position of the base member is biased in a thickness direction toward the first bended portion.

Abstract: A Hall device includes: a main plate, formed as a first metal plate, including first and second terminals that can be selectively connected to a power source terminal, third and fourth terminals that can be selectively connected to a ground, fifth and sixth terminals that can be connected to first and third terminals, respectively, a first resistor disposed between the first and second terminals, a second resistor disposed between the fifth and sixth terminals, a third resistor disposed between the third and fourth terminals, and a fourth resistor disposed between the second and fourth terminals, all of which being formed on the first metal plate; and a first auxiliary plate, formed as a second metal plate adjacent to the first metal plate of the main plate, including first and second auxiliary terminals that can be connected to the first and third terminals, and a fifth resistor disposed between the first and second auxiliary terminals, all of which being formed on the second metal plate.

Abstract: A heating system in the form of a multi-layer, yet relatively thin and flexible panel. The panel contains a number of layers including first, second and third electrically insulating layers. A first electrically conductive resistive layer (heater layer) is sandwiched between the first and second insulating layers. A second electrically conductive resistive layer (resistive neutral plane layer) is sandwiched between the second and third insulating layers. The heater layer has a neutral electrical connection and a live electrical connection. The neutral and live electrical connections are electrically connected to each other at the panel only by electrically resistive material of the heater layer extending between the neutral and live electrical connections. The resistive neutral plane layer has a neutral electrical connection electrically connected with the neutral connection of the heater layer.

Abstract: The present invention relates in general to the field of integrated circuits, and more specifically to a meander resistor. Basically, a meander resistor can be considered as a bar resistor with the exception of the corner squares (right-angle bends). The Electrostatic Discharge (ESD) sensitivities of on-chip resistors can be a problem for both electronic manufactures and electronic component users. As others components, passive devices are known to be susceptible to ESD events. The context of this invention is to improve the reliability of the resistors during an ESD event. An ESD stress means that high current and high voltage levels are applied to the device. The device has to be able to dissipate this energy without failure.

Abstract: An apparatus and methods for attaching electrical leads (22, 24) to a heating layer (16) of a heater are provided. An attachment material (50) is thermally sprayed over cords (32) of the electrical leads (22, 24), which are in contact with the heating layer (16) over a contact area (20). The attachment material (50) and the heating layer 16 are further thermally sprayed with a layer (52), which is an isolating material. The thermal sprayed connection between the electrical leads (22, 24) and the heating layer (16) thus provides more intimate contact and an improved electrical connection.

Abstract: An embedded resistor device includes a resistor, a ground plane located near a first side of the resistor and electrically coupled to a first end of the resistor, at the ground plane a hole is provided, a first dielectric layer exists between the resistor and the ground plane, a conductive wire, which is electrically coupled to a second end of the resistor different from the first end of the resistor and partially surrounds the resistor, is used as an auxiliary for supporting a resistor-coating process of the resistor and to provide a terminal of the embedded resistor device at the conductive wire, a conductive region located near a second side of the ground plane different from the first side of the resistor, a second dielectric layer exists between the ground plane and the conductive region, and a conductive path to electrically couple the conductive wire to the conductive region through the hole.

Abstract: A ceramic heater includes a core material and a ceramic sheet covering the core material, and wherein a side of the ceramic sheet opposite the core material is an outer side of the ceramic heater. A method for manufacturing the ceramic heater includes forming a through hole in a ceramic sheet which is diametrically enlarged from a first surface toward a second surface of the ceramic sheet, forming a via conductor, forming on the second surface a heating portion and lead portion for connecting the heating portion and the via conductor, and covering a core material with the ceramic sheet such that the first surface faces an outer side of the ceramic heater.

Abstract: A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.

Abstract: A method of fabricating a thin film resistor including providing a substrate, using a low-temperature pulsed-laser deposition process to deposit a titanium carbide (TiC) layer on the substrate, removing portions of the TiC layer with an etching process to leave a TiC pattern on the substrate, and depositing conductive material on opposite ends of the TiC pattern to provide a thin film resistor.

Abstract: A resistor (14) and a resistive link (1,15) are provided in an integrated circuit structure, and a dielectric layer (30-2) is formed over the resistive link. The resistor and the resistive link are connected in parallel. The resistance of the resistor is trimmed by forming a cut entirely through the resistive link, by advancing a laser beam (3) through a trim region (4,4-1) of the resistive link in a direction at an angle in the range of approximately 0 to 60 degrees relative to a longitudinal axis of the resistive link so as to melt resistive link material. The advancing laser beam tends to sweep the melted material in the direction of beam movement. Re-solidified link debris accumulates sufficiently far apart and sufficiently far from a stub (15A) of the resistive link to prevent significant leakage current in the resistive link.

Abstract: A ceramic heater according to the present invention includes a heating portion made of ceramics, and a cooling plate portion. In the heating portion, a belt like printed electrode is formed continuously in a spiral shape along a circumferential direction, and in the printed electrode, slits extended in a width direction of the printed electrode are provided. In such a way, a ceramic heater in which uniform heating performance in the heating surface is high can be obtained.

Abstract: The invention relates to a resistor (18), particularly an SMD resistor, including a planar, metallic support element (19) that has a top surface and a bottom surface, a planar resistor element (21) which is made of a resistive material and is disposed on the bottom surface of the support element (19), and at least two separate metallic connecting parts (23, 23) which electrically contact the resistor element (21) and are arranged in part on the bottom surface of the support element (19). The connecting parts (22, 23) are laterally exposed on the resistor (18) and can be laterally wetted in a visible manner by a solder. The invention further relates to a corresponding production method.

Abstract: A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. Compared with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the capacitive reactance effect caused by two connectors of the conventional resistors is avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.

Abstract: A resistor and design structure including a pair of substantially parallel resistor material lengths separated by a first dielectric are disclosed. The resistor material lengths have a sub-lithographic dimension and may be spacer shaped.

Abstract: A film-like temperature sensor for more accurately measuring the temperatures at plural locations on the surface of a semiconductor wafer comprises a base film made of an insulating material; plural thin-film thermal elements for sensing temperature; plural thin-film leads, connected to the thermal elements; and plural thin-film terminals connected to the ends of the leads. The thermal elements, leads, and terminals are integrally formed either on the surface or in the thickness of the base film. The base film has a flat shape like a paddle, and comprises a head portion to be attached to the surface of a semiconductor wafer, and a strip-shaped tail portion extending outwardly of the semiconductor wafer. The plural thermal elements are arranged on the head portion in the form of either a concentric circle, spiral, matrix, or raster, and the plural terminals are arranged on the tail portion.

Abstract: A resistance adjusting method, a resistance adjusting element, and a resistance adjusting device are disclosed. The method includes first, second, and third cut-off steps that leave a part having a length capable of preventing cracking of a remaining resistance film. The resistance adjusting element includes first, second, and third cut-off parts. The resistance adjusting device includes a carrier portion, a laser irradiating portion, a drive portion, an image recognition portion, and a final resistance adjustment portion.

Abstract: The heating device includes a conductive layer which is positioned on an electrically insulative substrate. Preferably, the conductive layer is screen printed onto the substrate. The substrate is designed to limit elongation of the conductive layer, thereby improving the durability of the conductor and enabling the heating device to be used in flexible applications, such as automobile seats. The substrate can include at least one aperture passing therethough to further improve flexibility, fatigue resistance, and breathability of the heater. The conductive layer is configured to include a buss structure with a first buss ground inwardly adjacent from the periphery of the heating device and a first buss with serpentine paths extending from one edge of the heating device to another edge. The buss structure further includes a second buss with L-shaped portions positioned between the serpentine paths and the first buss ground. The second buss ground is located in a central location between the serpentine paths.

Abstract: Electric heating/warming composite fabric articles have at least a fabric layer having inner and outer surfaces, and an electric heating/warming element, formed, e.g., of die cut, metallized textile or plastic sheeting or metal foil, affixed at the inner surface of the fabric layer and adapted to generate heating/warming when connected to a power source. A barrier layer may be positioned, for example, adjacent to the inner surface of the fabric layer; e.g., with the electric heating/warming element formed thereupon, including to protect the electric circuit, e.g. against abrasion.

Abstract: In order to create a heating device which can operate in different power stages, but only has to be contacted from one side, the invention provides a heating device with at least two plate-like ceramic heating elements, which are electrically contacted on opposite flat sides and on at least one side is provided at least one flat, electrical conductor, in which on one side of the elements there are at least two conductors electrically insulated from one another, each of the conductors being in contact with at least one heating element.

Abstract: Electric heating apparatus and manufacturing method for an electric heating apparatus, wherein prefabricated constructional units are used. The prefabricated constructional units consist of PTC heating elements fastened to contact sheets by means of a lacquer. This simplifies production and enhances protection against corrosion.

Abstract: A novel method for interconnecting leads in a high pressure transducer without the use of solder employs a ceramic disc containing a number of through holes. Each hole has a tube inserted therein, which tubes are connected to the disc by brazing or a high temperature attachment. Each tube protrudes from both sides of the ceramic. The ceramic is coated in appropriate areas with molymanganese film, which is over plated with gold. This overcoat forms a brazed compound surface attached to the tubes of the ceramic. A semiconductor pressure transducer has output leads which are inserted through the ceramic into each tube. The other side end of the tube receives high temperature wires from a suitable connecting device. Each tube is then crimped and spot-welded to hold both the lead from the transducer and the high temperature leads to produce a strong bond without the use of solder. The header itself it typically welded to a pressure point.

Abstract: The heating device includes a conductive layer which is positioned on an electrically insulative substrate. Preferably, the conductive layer is screen printed onto the substrate. The substrate is designed to limit elongation of the conductive layer, thereby improving the durability of the conductor and enabling the heating device to be used in flexible applications, such as automobile seats. The substrate can include at least one aperture passing therethough to further improve flexibility, fatigue resistance, and breathability of the heater. The conductive layer is configured to include a buss structure with a first buss ground inwardly adjacent from the periphery of the heating device and a first buss with serpentine paths extending from one edge of the heating device to another edge. The buss structure further includes a second buss with L-shaped portions positioned between the serpentine paths and the first buss ground. The second buss ground is located in a central location between the serpentine paths.

Abstract: A heatable mirror having a transparent surface element made from a substrate of inorganic material and at least one reflective layer as well as at least one heat-conducting layer applied to the substrate and/or the reflective layer and which has contact elements. The heat-conducting layer is formed by conductive particles having an average diameter of 3 to 100 &mgr;m at least partially embedded in the surface of the substrate and/or the reflective layer and the heat-conducting layer is designed to be over the entire surface or strip-like, wherein the non-conductive region for the strip-like embodiment is an insulating separating layer between the strips.

Abstract: A resistor is produced so that dispersity of carbon black in the resistor is low in a surface of the resistor and high in an inner part thereof. In the surface of the resistor, current paths are formed by the carbon black with poor dispersity to minimize a contact resistance of a sliding contact or the like. In the inner part of the resistor, the carbon black is uniformly dispersed to increase a resistance. Accordingly, a total resistance value can be prevented from lowering.

Abstract: Radiation source for emitting radiation in pulses with a duration and at intervals within chosen ranges, comprising at least one plate-shaped radiant element (1), and at least two electrical conductors coupled to the element(s). The source also includes at least one plate-shaped surrounding, thermally conductive element (2) being thermally coupled to a radiation element at its inner edge, and being thermally coupled to a cooling device (3) at its outer surface.

Abstract: Thin films of Ti—Cr—Al—O are used as a resistor material. The films are rf sputter deposited from ceramic targets using a reactive working gas mixture of Ar and O2. Resistivity values from 104 to 1010 Ohm-cm have been measured for Ti—Cr—Al—O film <1 &mgr;m thick. The film resistivity can be discretely selected through control of the target composition and the deposition parameters. The application of Ti—Cr—Al—O as a thin film resistor has been found to be thermodynamically stable, unlike other metal-oxide films. The Ti—Cr—Al—O film can be used as a vertical or lateral resistor, for example, as a layer beneath a field emission cathode in a flat panel display; or used to control surface emissivity, for example, as a coating on an insulating material such as vertical wall supports in flat panel displays.

Abstract: An electrical resistive heating system having a Nitinol heater element in the form of wire, rod strip or tube, is flexible, ductile, tough aid chemically non-reactive. The element has connectors at each end for leads from a controller that controls the flow of current through the heater element from a source of electrical power. The Nitinol heater element is treated to have an electrically insulating surface that is also hard and chemically non-reactive, so the heater element can be put in intimate contact with the materials or substrate to be heated without shorting or electrical shock to people or equipment. The controller uses temperature data feedback from a separate temperature sensor such as a thermocouple, or uses the resistance of heater element itself as a temperature sensor, since the resistance of the Nitinol changes with temperature in a predictable way.

Abstract: Crack formation is to be avoided in a press-molded body, in particular for a cooking surface radiant heating arrangement, comprising a heat-insulating material. For that purpose, in a transitional zone 8 between a more compacted region 6 and a less compacted region 3, the heat-insulating material is compacted to an even greater degree than in the more compacted region.

Abstract: A chip device and a manufacturing method therefor are disclosed, in which the resistivity of the chip resistor device is constantly maintained even without using silver for lowering the self resistance in portions other than the upper electrode, thereby curtailing the manufacturing cost of the chip resistor. The chip resistor device 1 includes a chip block 10 having an upper face 12 and a pair of mutually oppositely facing side faces 14. An electrode part 20 has an upper electrode 22 formed on the upper face 12 of the chip block 10, and a side electrode 24 formed on the side faces 14 of the chip block 10. A special electrical property layer 30 is connected to the upper electrode 22 of the chip block 10. A protecting layer 40 is formed upon the special electrical property layer 30 to protect it. A terminal electrode layer 50 is formed on the electrode part 20 of the chip block 10, and a terminal connection part S is necessarily provided to form a signal bypassing path.

Abstract: A heating device for heating a windshield of a vehicle includes a first layer adapted to be mounted to a fourth surface of a windshield. The heating device also includes at least one resistance element embedded in the first layer for connection to a source of power to heat a predetermined area of the windshield.

Abstract: An infrared radiating panel includes a wall made from ceramic fiber material. An electric heating element is adapted for connection to an electric current source for heating the element to a high temperature at which it will emit infrared radiation is fastened to the wall with the aid of staples. The heating element is mounted in spaced relationship with the surface of the wall and is retained between pairs of ceramic rods that engage opposite faces of the heating element.

Abstract: Thin films of Ti--Cr--Al--O are used as a resistor material. The films are rf sputter deposited from ceramic targets using a reactive working gas mixture of Ar and O.sub.2. Resistivity values from 10.sup.4 to 10.sup.10 Ohm-cm have been measured for Ti--Cr--Al--O film <1 .mu.m thick. The film resistivity can be discretely selected through control of the target composition and the deposition parameters. The application of Ti--Cr--Al--O as a thin film resistor has been found to be thermodynamically stable, unlike other metal-oxide films. The Ti--Cr--Al--O film can be used as a vertical or lateral resistor, for example, as a layer beneath a field emission cathode in a flat panel display; or used to control surface emissivity, for example, as a coating on an insulating material such as vertical wall supports in flat panel displays.

Abstract: The invention provides an integrated circuit die containing a metal heater resistor. In an embodiment of the invention, the metal heater resistor is disposed around the periphery of the die, with one end of the metal heater resistor connected to a first bond pad, and the other end of the heater resistor connected to a second bond pad. In alternative embodiments, metal-to-substrate contacts disposed along the heater resistor between the first and second ends provide improved thermal contact between the heater resistor and the die substrate. In other alternative embodiments, the metal heater resistor is disposed around the periphery of a circuit whose temperature coefficient is to be measured, such as a voltage reference circuit that is included as part of a larger integrated circuit containing other circuitry.

Abstract: A thick film resistive heating element having a thick film resistive track applied to the surface of an electrically insulative substrate. An encapsulating insulating layer is applied over the track to protect it while an area of the element is left uncovered by the encapsulating layer so as to define a window. A portion of a temperature sensitive control device is then placed in direct contact with the track and/or the electrically insulative substrate through the window. The window in the element is located in that area of the element which will be uncovered by the liquid prior to the rest of the element as the liquid boils away or is evacatuated from the vessel.