Terminal Tapped On Resistance Element Patents (Class 338/323)
  • Patent number: 11626219
    Abstract: A glass protective film 4 is formed such that boundaries of top surface electrodes 3a and 3b do not exist at the base of corner portions of the rectangular glass protective film 4 so as to eliminate level differences generating due to thicknesses of the electrodes. Use of such a structure may resolve the problem that when printing glass paste individually over chip elements of a chip resistor on a large substrate from which multiple chips will be obtained, corner portions of the glass protective film bleed (flow) to the outer side (dividing grooves).
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: April 11, 2023
    Assignee: KOA Corporation
    Inventor: Kazuhisa Ushiyama
  • Patent number: 10775215
    Abstract: To obtain a flow meter with which it is possible to facilitate establishing an electrical connection with a conductor exposed in a location through which a gas to be measured passes. A flow meter that is provided with a lead and a circuit component placed on the lead, and that has a package in which part of the lead is molded from a resin, wherein the package is provided with an exposure portion for exposing part of the lead from the resin member, the exposure portion being electrically connected to a conductor that constitutes part of an auxiliary passage.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: September 15, 2020
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Akira Uenodan, Shinobu Tashiro, Takeshi Morino, Masatoshi Ogata, Tsubasa Watanabe, Norio Ishitsuka
  • Patent number: 10242789
    Abstract: A manufacturing method that is capable of forming an electrode on any part of a surface of a sintered ceramic body in accordance with a simple approach, and a ceramic electronic component manufactured by the method. The method for manufacturing a ceramic electronic component includes steps of preparing a sintered ceramic body containing a metal oxide, irradiating an electrode formation region on a surface of the ceramic body with a laser to partially lower resistance of the ceramic body, thereby forming a low-resistance portion, and subjecting the ceramic body to plating to deposit a plated metal serving as an electrode on the low-resistance portion, and growing the plated metal to extend over the entire electrode formation region.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: March 26, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshifumi Maki, Takuya Ishida, Hirotsugu Tomioka, Shinya Hirai, Daisuke Katayama
  • Patent number: 8970340
    Abstract: A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.
    Type: Grant
    Filed: January 3, 2013
    Date of Patent: March 3, 2015
    Assignee: Rohm Co., Ltd.
    Inventors: Torayuki Tsukada, Kentaro Naka
  • Patent number: 8610534
    Abstract: A component includes a component body and a contact-connection element composed of sheet metal having a contact region, which has an outer contour line and at least one hole. The contact region is arranged on a side of the component body having a side edge and the outer contour line has straight regions running along straight regions of the side edge. The straight regions of the outer contour line are connected by rounded corners.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: December 17, 2013
    Assignee: Epcos AG
    Inventors: Franz Rinner, Christoph Auer, Shaoyu Sun, Yihai Sun
  • Patent number: 7936243
    Abstract: An adjustable resistor embedded in a multi-layered substrate and method for forming the same. The adjustable resistor comprises: a planar resistor, having a plurality of terminals; and a plurality of connecting lines connected to the planar resistor, each of the connecting lines being drawn from each of the terminals of the planar resistor so as to form a resistor network, wherein the connecting lines are selectively broken by a process for drilling the substrate to form a number of combinations of opened connecting lines such that the resistance value of the adjustable resistor is varied and thus the resistance value of the adjustable resistor can be precisely adjusted.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: May 3, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Ying-Jiunn Lai, Chang-Sheng Chen, Chin-Sun Shyu, Uei-Ming Jow, Chang-Lin Wei
  • Patent number: 7456075
    Abstract: A resistance dividing circuit including silicide layers respectively formed only on branch portions of a linear polysilicon resistance wiring having the branch portions. Contact plugs are connected to the resistance wiring via the silicide layers, and fetching electrodes are respectively connected to the contact plugs.
    Type: Grant
    Filed: November 13, 2006
    Date of Patent: November 25, 2008
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Seiichiro Sasaki
  • Patent number: 7446286
    Abstract: A heater strip for use as a heating element in an electric heater is made up of a profiled strip made of a flat metallic material forming a resistor section and of mounting elements extending over one common longitudinal side and they are manufactured as one piece with the resistor section for mounting the heater strip to a support. The strip has a zigzag-shaped structure. The mounting elements are provided only on the flat leg sections of the zigzag-shaped heater strip.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: November 4, 2008
    Assignee: Electrovac AG
    Inventors: Josef Reithofer, Christian Auradnik
  • Patent number: 7154374
    Abstract: Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.
    Type: Grant
    Filed: June 1, 2004
    Date of Patent: December 26, 2006
    Assignee: AVX Corporation
    Inventors: Andrew P. Ritter, Robert Heistand, II, John L. Galvagni, Sriram Dattaguru
  • Patent number: 7135376
    Abstract: A resistance dividing circuit including silicide layers respectively formed only on branch portions of a linear polysilicon resistance wiring having the branch portions. Contact plugs are connected to the resistance wiring via the silicide layers, and fetching electrodes are respectively connected to the contact plugs.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: November 14, 2006
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Seiichiro Sasaki
  • Patent number: 7053749
    Abstract: A metal plate resistor includes a resistive body comprising a metal plate, and at least a pair of electrodes joined respectively to opposite ends of the resistive body, the electrodes being made of a highly conductive metal conductor. The resistive body has a main section positioned between the electrodes and a pair of electrode sections progressively wider than the main section in directions away from the main section. The electrodes are disposed respectively beneath the electrode sections and identical in shape to the electrode sections.
    Type: Grant
    Filed: May 19, 2005
    Date of Patent: May 30, 2006
    Assignee: KOA Corporation
    Inventors: Kazuhiro Ishida, Satoshi Chiku
  • Patent number: 6166620
    Abstract: A resistance wiring board having a cavity disposed on an insulated substrate, a resistance disposed in the cavity, a protective film disposed on a top face of the resistance, and electrodes electrically connected at near both ends of the resistance, wherein surfaces of the electrodes and a surface of the protective film are the same level as or lower than a surface of the wiring board. A method for manufacturing a resistance wiring board comprising the steps of forming a green sheet, forming an electrode pattern on the green sheet, forming a dented pattern on the green sheet, firing the green sheet, forming a resistance by filling a resistance material in the dent of the green sheet, and forming a protective film on a top face of the resistance.
    Type: Grant
    Filed: April 8, 1999
    Date of Patent: December 26, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsutomu Inuzuka, Satoshi Tomioka, Shigeo Furukawa, Tsuyoshi Himori, Suzushi Kimura
  • Patent number: 6150920
    Abstract: The present invention is to offer a resistor which can be mounted exactly on the terminals disposed on a circuit board regardless the sides of the resistor, and to offer its manufacturing method by forming the surface of the side-electrode layer at a height higher than the surface of protection layer, or by forming the surface of the second surface electrode layer at a height higher than the surface of protection layer. By these, the resistor can be mounted exactly on the terminal of circuit board at a high yield. Furthermore, since the first surface electrode layer and the second upper electrode layer are electrically connected together through a window provided on the protection layer, a higher connection reliability can be obtained.
    Type: Grant
    Filed: May 29, 1997
    Date of Patent: November 21, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masato Hashimoto, Shogo Nakayama, Shoji Mori, Naohiro Takashima, Seiji Tsuda, Takumi Shirai
  • Patent number: 5469131
    Abstract: A resistive body of a hybrid integrated circuit has a resistance pattern on a resin film. Bonding pads permit connection of current through the resistance pattern. The resistance pattern may form part of a detecting bridge for overcurrent detection. One embodiment of the invention uses a rectangular resistance pattern with an opening in the center to force current to flow on a perimeter path for minimizing maximum temperature. Another embodiment uses a serpentine resistance pattern. A face-down resistance patter reduces interference. A direct-connection bonding pad reduces the voltage generated in a parasitic capacitance to improve the resistance of the resin film to voltage breakdown.
    Type: Grant
    Filed: August 30, 1993
    Date of Patent: November 21, 1995
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Ryoichi Takahashi, Katsumi Okawa, Yusuke Igarashi
  • Patent number: 5339067
    Abstract: An apparatus and method is provided for dividing a voltage with a resistor voltage divider and for employing the voltage divider in an integrated circuit. The resistor voltage divider utilizes inaccessible compensation taps that are placed between nonlinearly spaced output taps. The compensation taps reduce the impact of tap resistance on the voltage divider transfer function. The number of inaccessible compensation taps placed between output taps is dependant upon a chosen tap density that is substantially maintained across the body of the resistor voltage divider. The resistor may be used in integrated circuits employing amplifiers, such as volume control circuitry.
    Type: Grant
    Filed: May 7, 1993
    Date of Patent: August 16, 1994
    Assignee: Crystal Semiconductor Corporation
    Inventors: Larry L. Harris, Baker P. L. Scott, III
  • Patent number: 5334967
    Abstract: A voltage divider which can be manipulated so as to vary the output voltage thereof, prevents mechanical wear of the voltage divider element, provides continuous contact, and can be sealed so as to prevent interaction with the ambient atmosphere including first and second non-conductive substrates with a predetermined spaced portion therebetween. A first conductive strip on the second substrate is depressed across the spaced portion so as to contact at least one of a plurality of conductive taps on the first substrate, each of which are in contact with a voltage divider element so as to complete a desired circuit. By sliding while depressing the second substrate along its surface where the conductive strip is positioned, one or more successive taps are contacted so as to vary the voltage supplied to the circuit.
    Type: Grant
    Filed: June 29, 1993
    Date of Patent: August 2, 1994
    Assignee: Illinois Tool Works Inc.
    Inventor: George Paszkiewicz
  • Patent number: 5257005
    Abstract: The effective parasitic end resistance of small-value precision integrated circuit resistors is reduced by providing N resistors connected in parallel and causing at least two of the resistors to share a terminal contact. The resulting integrated circuit resistor includes multiple terminal contacts of any number n greater than two. Of the n terminal contacts, N-1 terminal contacts are shared amongst said resistors. The parasitic end resistances are diminished by a factor equal to the number of resistors connected in parallel. By increasing the length of the active area of the N resistors by a factor equal to the number of the resistors, the desired resistance value remains undiminished. As a result, the parasitic end resistances may be made negligible compared to the desired resistance even for small value resistors.
    Type: Grant
    Filed: August 18, 1992
    Date of Patent: October 26, 1993
    Inventors: Alan R. Desroches, Domingo A. Figueredo
  • Patent number: 5039975
    Abstract: A resistor substrate for a variable resistor of the enclosed type which may be employed in a throttle sensor of an automobile. The resistor substrate has a disk portion and a rectangular apron provided at a circumferential portion of the disk portion. The apron is stepped with respect to the disk portion to form a reduced thickness portion, and a plurality of projections each having an arcuate section in a widthwise direction are formed at end portions of the reduced thickness portion of the apron. A plurality of terminals are embedded at base portions thereof in the disk portion and extend along a surface of the reduced thickness portion of the apron. The terminals individually have arcuate protruded portions formed therein in accordance with a configuration of the projections of the apron, and the projections individually have lateral holes formed therein in an opposing relationship to the protruded portions of the terminals such that they extend to the protruded portions.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: August 13, 1991
    Assignee: Alps Electric Co., Ltd.
    Inventor: Kanji Ishihara
  • Patent number: 4845462
    Abstract: An integrated resistor is constituted by a doped resistance body in a semiconductor substrate which is coated with a layer of insulating material having local apertures in which metal end contacts (2a, 3a) and tapping contacts (4a, 5a, 6a) are provided. The width of each tapping contact (4a, 5a, 6a) is smaller than the width of the doped zone and, viewed in the longitudinal direction of the resistance body, the tapping contacts (4a, 5a, 6a) do not overlap.
    Type: Grant
    Filed: July 8, 1988
    Date of Patent: July 4, 1989
    Assignee: U.S. Philips Corporation
    Inventors: Robert E. J. van de Grift, Martien van der Veen
  • Patent number: 4485370
    Abstract: A thin film bar resistor comprises: an insulative substrate, a pair of conductive thin film resistor terminals spaced apart on the substrate, an approximately square thin film resistance body disposed on the substrate between the terminals to be separated from them by guard margins, the body consisting of lower and upper layers of unanodized and anodized tantalum nitride, thin film regions of unanodized tantalum nitride in the guard margins to connect such body to the terminals, and thin film conductive leads connected to the terminals.
    Type: Grant
    Filed: February 29, 1984
    Date of Patent: November 27, 1984
    Assignee: AT&T Technologies, Inc.
    Inventor: C. Edward Poisel
  • Patent number: 4447747
    Abstract: Waveform generating apparatus for synthesizing a non-linear waveform by sampling voltage levels along a series string of resistances. The series string of resistances is a linear resistance fabricated in a monolithic integrated circuit structure and includes a series of contiguous resistance elements of approximately the same physical configuration and of approximately equal resistance value. Each resistance element has a projection or nub. Particular ones of the nubs serve as source regions for MOS switching transistors at the sampling point. The intervening nubs are unconnected. The symmetry of the structure compensates for errors otherwise introduced by the presence of source region nubs at sampling points spaced in a non-linear relationship.
    Type: Grant
    Filed: March 2, 1981
    Date of Patent: May 8, 1984
    Assignee: GTE Laboratories Incorporated
    Inventor: David P. LaPotin
  • Patent number: 4323726
    Abstract: An electroconductive laminated window having an electroconductive coating applied to one interior substrate surface with a pair of bus bars electrically connecting a source of electrical potential thereto. The bus bars include an electroconductive layer having volume resistivity less than about 10.sup.-2 ohm-cm interposed between and conformable to the surface configurations of the electroconductive coating and a flexible metallic current carrying member. The metallic current carrying member is preferably a mesh of thin copper foil which is substantially bendable in its own plane, and the electroconductive layer is preferably a metallic layer substantially free of non-metallic components, consisting of a mixture of finely divided electroconductive particles and finely divided metal alloy particles having a fusion temperature between about 70.degree. C. and about 150.degree. C.
    Type: Grant
    Filed: July 24, 1980
    Date of Patent: April 6, 1982
    Assignee: PPG Industries, Inc.
    Inventors: Russell C. Criss, Edward J. Stofka
  • Patent number: 4191880
    Abstract: A heating element for electrical appliances which include a meander-form winding of resistance heating wire, two or more supporting plates arranged parallel to an incident flow direction of air produced by the blower and having openings in which turns of the winding are located. Metallic spacer elements are provided for connecting the supporting plates with a voltage tap being provided on at least one of the turns of the winding. At least one of the spacer elements is provided with a prolongation which projects beyond one of the supporting plates and is deformable to constitute a sleeve engaging about a turn of the winding.
    Type: Grant
    Filed: May 11, 1978
    Date of Patent: March 4, 1980
    Assignee: Firma Fritz Eichenauer
    Inventors: Klaus Meywald, Helmut Ohnmacht
  • Patent number: 4174513
    Abstract: In the present device, a base member is included which has channels formed therein to hold lead wires. In the preferred embodiment a metal foil resistor member, having termination land sections, is secured to the base member to form a fourth side for each channel, thereby securely locating the lead wires in the channels and the lead wires are firmly connected to the termination land sections of the foil resistor. Accordingly with respect to the foil resistor assembly: there is good physical strength to withstand external forces; the resistor reliability is enhanced; the fabrication is simplified; and the resistance range capability is increased.
    Type: Grant
    Filed: April 5, 1978
    Date of Patent: November 13, 1979
    Assignee: American Components Inc.
    Inventor: Charles L. Wellard
  • Patent number: 4122329
    Abstract: An electric air heating appliance includes a housing defining an air flow path in which is positioned a resistance heater assembly which includes a plurality of air vanes for reducing air swirling. The heater assembly includes a semi-rigid assembly of mica plates in a cruciform arrangement and stiffened by use of a corrugated resistance heating element helically wound about the plates. An improved terminal means provides a tap intermediate the ends of the helical heating element. Additional terminals means are provided for connecting the ends of the heating element to a power source. The terminal means, which are in the form of metallic strips defining extending leg segments, cooperate with an impeller fan tube surrounding an air impeller in the housing to support and captivate the heater assembly in the housing.
    Type: Grant
    Filed: June 21, 1976
    Date of Patent: October 24, 1978
    Assignee: Palmor International Corporation
    Inventor: Siegfried Godel
  • Patent number: 4117589
    Abstract: A method of manufacturing a passive hermetically sealed electronic component having a coupling element of soft alloy material between the component element and the leads for providing strain relief. The component element is composed of a passive element having coated ends composed of a refractory metallic material for providing reliable electrical and mechanical connection to the coupling element.
    Type: Grant
    Filed: March 3, 1977
    Date of Patent: October 3, 1978
    Assignee: North American Philips Corporation
    Inventors: Gaylord Lee Francis, Amedeo John Morelli
  • Patent number: 4075459
    Abstract: A heater element for an electrical appliance (especially one having a blower, such as a fan heater, hair drier or the like) consists of a resistance heating wire looped in linear formation (e.g. zig-zag) and held transversely of the air flow direction by at least one support plate disposed parallel to said direction. The element has a voltage tapping point at the tip of one of the loops which projects beyond the other loops and has its tip fixed to an insulating panel parallel to said support plate. Said tip may be riveted or secured by an eye in a recess in said insulating plate.
    Type: Grant
    Filed: December 23, 1975
    Date of Patent: February 21, 1978
    Assignee: Firma Fritz Eichenauer
    Inventor: Ludwig Lieber
  • Patent number: 4032752
    Abstract: Heating elements comprising a ceramic article of a honeycomb structure having a positive temperature coefficient of electric resistance and composed of barium titanate are provided with channels, in which a pair of ohmic electrodes consisting mainly of silver as a metallic component and having a surface resistivity of the electrode per se of not more than 10 m.OMEGA./cm.sup.2 are provided on both end surfaces thereof and the ohmic electrodes are coated with an electrical insulating and thermostable material.
    Type: Grant
    Filed: August 23, 1976
    Date of Patent: June 28, 1977
    Assignee: NGK Insulators, Ltd.
    Inventors: Akira Ohmura, Shigetaka Wada
  • Patent number: 4016527
    Abstract: A hermetically sealed fixed film resistor including a coupling element of soft alloy material between the resistive element and the leads for providing strain relief. The resistive element is composed of a resistive film having coated ends composed of a refractory metallic material for providing reliable electrical and mechanical connection to the coupling element.
    Type: Grant
    Filed: September 25, 1975
    Date of Patent: April 5, 1977
    Assignee: North American Philips Corporation
    Inventors: Gaylord L. Francis, Amedeo J. Morelli