Abstract: A process for feeding a slurry of thermoplastic synthetic polymer particles such as polyethylene terephthalate homopolymers and copolymers in combination with a liquid such as water at a liquid temperature greater than the normal boiling point of the liquid, under a pressure greater than the vapor pressure of the liquid at the liquid temperature, into a separation zone such as a centrifugal dryer, and within the separation zone: a. separating the liquid from the particles, and b. drying the particles; while under a high pressure equal to or greater than the vapor pressure of the liquid. There is also provided a process for decoupling the dried particles from the separation zone to an atmosphere having a pressure less than the vapor pressure of the liquid while maintaining the vapor pressure of the particles prior to decoupling equal to or above the vapor pressure of the liquid at the liquid temperature.

Abstract: A centrifugal bowl separator, including a bowl, a source of pressurized gas in selective flow communication with the bowl and operable to selectively supply pressurized gas to an interior portion of the bowl, and first and second pressure seals selectively established to provide a zone within a portion of the bowl such that when the pressurized gas is introduced, pressure within the portion of the bowl increases for enhanced removal of moisture and drying of solids within the portion of the bowl.

Abstract: The invention relates to a method for removing water from a mixture containing at least one compound having at least one group reactive towards isocyanate and containing water, the mixture being applied to the surface of a rotating body A, the mixture flowing over the surface of the rotating body A to an outer region of the surface of the rotating body A and water evaporating from the mixture. In particular, this method is suitable for removing water from alcohols and amines.

Abstract: The invention provides methods and apparatus for drying the backside of semiconductor wafers in a spin-coating environment. Solvent is evaporatively dried from a semiconductor wafer held in a spin mechanism. The undried wafer is sprayed with one or more jets of pressurized gas from gas ports disposed about the spin mechanism.

Abstract: It is an object of the present invention to provide a rotation type silicon wafer cleaning device to further raise the stability of a silicon wafer by providing a better hydrogen termination on the silicon wafer after completion of chemical and pure water cleaning treatments. According to the present invention, a rotation type silicon wafer cleaning device has a silicon wafer support/rotation driving mechanism inside the case body for cleaning the silicon wafer at the post chemical cleaning with pure water, drying and hydrogen termination treatments on the outer surface of a silicon wafer is performed by means of installing a silicon wafer drying device comprising a gas supply panel attached to a case body to supply a mixed gas of the hydrogen gas and inactive gas containing a hydrogen gas of more than 0.

Abstract: The present invention relates to a process for drying protein crystals starting from an aqueous protein crystal suspension, which comprises drying the protein crystal suspension in a centrifugal dryer, where the protein crystals, after they have been filtered off from the protein crystal suspension, are brought into contact with a drying medium which consists of a mixture of water and a nonaqueous solvent which is miscible with water in any ratio and which has a lower vapor pressure than water. In the process, a drying gas which has been moistened with water is advantageously used. The protein crystal suspension is advantageously converted into a fluidized bed for the purpose of drying.

Abstract: A cover is provided to an opening of a chamber in such a manner to open and close the opening and when the cover closes the opening, the chamber and the cover form a sealed drying process space. In this drying process space, nitrogen gas is supplied to purge the gas in the drying process space to turn into an inert gas filled space. Thereafter, substrates to be treated are brought into the drying process space. nitrogen gas is further supplied to the drying process space and then the substrates are being rotated to dry the same.

Abstract: A spin dryer assembly for drying workpieces such as semiconductor wafers includes a workpiece platform for receiving a workpiece to be dried. A motor is coupled to and spins the platform to effect removal of water and particulates from the workpiece. Gripping fingers are pivotally mounted around the platform and securely grip the workpiece during drying. Spring loaded plungers maintain the gripping fingers in a secured position during drying. A cam ring is vertically movable into and out of contact with the gripping fingers to bias the gripping portions of the fingers outwardly to a release position after drying.

Abstract: Apparatus for drying and/or treating powdered, granular, or flaked material in combination with a containment room or glove box under controlled atmospheric conditions, which may have an oven in the room with a chamber with a vessel therein to carry material, the chamber having a door to seal it off and vacuum creation and gas supplying features directly therefor, the vessel which carries material for drying and/or treating is supported on a frame with provisions for rotation by motor equipment, with heater elements around the outside of the chamber to provide heat if required, and vanes inside the vessel to fluidize the material upon rotation and the application to the vessel of vacuum, heat, and/or gas for drying and/or treating the material as required.