With Electrical Shield Patents (Class 343/841)
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Patent number: 11973277Abstract: Disclosed is a 5G NR antenna device. An antenna module includes an antenna material formed of a metal material and having a semi-planar inverted-F antenna (PIFA) structure, and a support formed in the shape of a hexahedron with side and bottom faces that are bent from the antenna material by stamping, wherein the support and the antenna material are formed as an integral body.Type: GrantFiled: February 22, 2022Date of Patent: April 30, 2024Assignee: Tyco Electronics AMP Korea Co., Ltd.Inventors: Jung-Hoon Kim, Chang Hyun Lee, Dong Wook Park
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Patent number: 11903282Abstract: A display apparatus includes a base substrate including an opening area which transmits light, an opening peripheral area which is a non-display area surrounding the opening area, and a display area surrounding the opening peripheral area, a thin film transistor disposed on the base substrate, a light emitting structure electrically connected to the thin film transistor, and a loop-type antenna electrode disposed on the base substrate in the opening peripheral area to surround the opening area.Type: GrantFiled: December 26, 2022Date of Patent: February 13, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Jae-Kyoung Kim, Ki Seo Kim, Won Sang Park, Bong Hyun You
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Patent number: 11799192Abstract: An electronic device includes: a display, an antenna structure including at least one antenna, a conductive support disposed between the display and the antenna structure, a sensor disposed between the display and the conductive support, a first printed circuit board disposed between the conductive support and the antenna structure, a second printed circuit board stacked on the first printed circuit board, a board support coupled with the conductive support and overlapping at least part of the second printed circuit board, and a first insulating member comprising an insulating material disposed between the board support and the antenna structure.Type: GrantFiled: July 10, 2020Date of Patent: October 24, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Seunggeol Baek, Jeonghoo Kim, Kemsuk Seo, Kwangsub Lee, Junkyu Park, Duckho Won
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Patent number: 11728560Abstract: An electronic device includes: a display, an antenna structure including at least one antenna, a conductive support disposed between the display and the antenna structure, a sensor disposed between the display and the conductive support, a first printed circuit board disposed between the conductive support and the antenna structure, a second printed circuit board stacked on the first printed circuit board, a board support coupled with the conductive support and overlapping at least part of the second printed circuit board, and a first insulating member comprising an insulating material disposed between the board support and the antenna structure.Type: GrantFiled: July 10, 2020Date of Patent: August 15, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Seunggeol Baek, Jeonghoo Kim, Kemsuk Seo, Kwangsub Lee, Junkyu Park, Duckho Won
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Patent number: 11646498Abstract: Embodiments include semiconductor packages and methods of forming the semiconductor packages. A semiconductor package includes a die over a substrate, a first conductive layer over the die, and a cavity resonator antenna over the first conductive layer and substrate. The cavity resonator antenna includes a conductive cavity, a cavity region, and a plurality of interconnects. The conductive cavity is over the first conductive layer and surrounds the cavity region. The semiconductor package also includes a second conductive layer over the cavity resonator antenna, first conductive layer, and substrate. The conductive cavity may extend vertically from the first conductive layer to the second conductive layer. The cavity region may be embedded with the conductive cavity, the first conductive layer, and the second conductive layer. The plurality of interconnects may include first, second, and third interconnects.Type: GrantFiled: May 16, 2019Date of Patent: May 9, 2023Assignee: Intel CorporationInventors: Kilian Roth, Sonja Koller, Josef Hagn, Andreas Wolter, Andreas Augustin
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Patent number: 11561752Abstract: Devices for mitigating or stopping noise or surface current on a display are provided. An electronic device including a display may include a display substrate, a mid-support plate that is adjacent to the display substrate, and a lower support plate that is adjacent to the mid-support plate. A space exists between the mid-support plate and the lower support plate. The mid-support plate includes one or more electromagnetic band gap (EBG) structures formed through the mid-support plate, one or more electromagnetic band gap structures mounted onto the mid-support plate, or both. The one or more electromagnetic band gap structures may mitigate or stop surface current flow across the display.Type: GrantFiled: September 20, 2021Date of Patent: January 24, 2023Assignee: Apple Inc.Inventors: Mahmoud N. Mahmoud, Cheung-Wei Lam, Ali Foudazi, Le Wang, Qianyi Zhao, Kedi Zhang, Xingchao C. Yuan, Jon F. Housour, Gary Chung
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Patent number: 11545761Abstract: A dual-band cross-polarized antenna includes first and second metal layers defining respective first and second driven patches configured to radiate at different frequencies, first and second feed pins connecting a first feed line to the first driven patch at respective first and second feed points thereof associated with orthogonal polarizations, and third and fourth feed pins connecting a second feed line to the second driven patch at first and second feed points thereof associated with orthogonal polarizations. The third feed pin extends through a first hole in the first driven patch to capacitively couple the third feed pin to the first driven patch. The fourth feed pin extends through a second hole in the first driven patch to capacitively couple the fourth feed pin to the first driven patch. Two or more antenna elements are arranged as a phased array antenna and packaged as an antenna module.Type: GrantFiled: April 19, 2021Date of Patent: January 3, 2023Assignee: Mobix Labs, Inc.Inventors: Ziming He, Oleksandr Gorbachov
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Patent number: 11495873Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.Type: GrantFiled: March 5, 2020Date of Patent: November 8, 2022Assignee: Qualcomm IncorporatedInventors: Jeahyeong Han, Rajneesh Kumar, Suhyung Hwang, Jaehyun Yeon, Mohammad Ali Tassoudji, Darryl Sheldon Jessie, Ameya Galinde
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Patent number: 11431084Abstract: A wireless communication device comprises: a substrate; an antenna circuit installed on the substrate; a communication circuit installed on the substrate electrically connected to the antenna circuit; and an energy supply unit installed on the substrate that supplies energy to the communication circuit, wherein the energy supply unit are installed on the substrate outside of a region defined around the antenna circuit; and the substrate is provided with a hole portion within the region, the hole portion passing through the substrate.Type: GrantFiled: July 28, 2020Date of Patent: August 30, 2022Assignees: OMRON Corporation, OMRON HEALTHCARE CO., LTD.Inventors: Hirokazu Tanaka, Hiroshi Miura, Shohei Iwata
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Patent number: 11428914Abstract: An optical isolator for use with high power, collimated laser radiation includes an input polarizing optical element, at least one Faraday optical element, at least two reflective optical elements for reflecting laser radiation to provide an even number of passes through said at least one Faraday optical element, at least one reciprocal polarization altering optical element, an output polarizing optical element, at least one light redirecting element for remotely dissipating isolated or lost laser radiation. The isolator also includes at least one magnetic structure capable of generating a uniform magnetic field within the Faraday optical element which is aligned to the path of the collimated laser radiation and a mechanical structure for holding said optical elements to provide thermal gradients that are aligned to the path of the collimated laser radiation and that provide thermal and mechanical isolation between the magnetic structure and the optical elements.Type: GrantFiled: December 20, 2019Date of Patent: August 30, 2022Assignee: ELECTRO-OPTICS TECHNOLOGY, INC.Inventors: David G. Scerbak, Joseph R. Mambourg
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Patent number: 11374618Abstract: Apparatuses, methods, and systems for a surface wave based wireless connection to an electronic device are disclosed. One apparatus includes a surface wave guide that supports propagation of electro-magnetic waves over a two-dimensional conductive surface of the surface waveguide, wherein the two-dimensional conductive surface is treated to increase a surface reactance of the two-dimensional conductive surface over a frequency range of the electro-magnetic waves, while maintaining an insertion loss of the surface waveguide below a threshold. A first mode converter operates to couple electro-magnetic waves of a first mode to the two-dimensional conductive surface having a second mode, wherein the electro-magnetic waves of the second mode propagate across the two-dimensional conductive surface of the surface waveguide. At least a portion of the electro-magnetic waves of the two-dimensional conductive surface is coupled to an electronic device through a second mode converter of the electronic device.Type: GrantFiled: October 19, 2019Date of Patent: June 28, 2022Assignee: Meta Platforms, Inc.Inventors: Karthik Yogeeswaran, Apoorva Sharma
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Patent number: 11316283Abstract: A dual polarized antenna includes a first antenna unit and an isolated band gap. The first antenna unit is formed on the dielectric board, and the first antenna unit being conducted is configured to receive or transmit a signal with each of a first polarization direction and a second polarization direction. The isolated band gap is formed on the dielectric board and is disposed adjacent to the first antenna unit. It forms a first included angle which is neither 0° nor 90° between the first polarization direction and the isolated band gap.Type: GrantFiled: June 17, 2020Date of Patent: April 26, 2022Assignee: DELTA ELECTRONICS, INC.Inventors: Chieh-Tsao Hwang, Yen-Ting Chen
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Patent number: 11309632Abstract: Disclosed is a low-loss and flexible curved or orthogonal transmission line-integrated multi-port antenna for an mmWave band. The low-loss and flexible curved transmission line-integrated multi-port antenna includes a multi-port antenna portion which includes a plurality of single antennas and forms multi-ports and a transmission line portion which includes a plurality of transmission lines which correspond to the single antennas, respectively, are integrated with electricity feeding portions of the single antennas to which central conductors used as signal lines of the transmission lines correspond, and has a curved shape. Here, the single antennas each include a ground plate, a dielectric substrate, formed on the ground plate, a signal conversion portion formed on the dielectric substrate, and an electricity feeding portion formed on the dielectric substrate and connected to the signal conversion portion.Type: GrantFiled: January 29, 2020Date of Patent: April 19, 2022Assignee: SENSORVIEW CO., LTD.Inventors: Byoung Nam Kim, Hong Il Yoo
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Patent number: 11262966Abstract: Devices for mitigating or stopping noise or surface current on a display are provided. An electronic device including a display may include a display substrate, a mid-support plate that is adjacent to the display substrate, and a lower support plate that is adjacent to the mid-support plate. A space exists between the mid-support plate and the lower support plate. The mid-support plate includes one or more electromagnetic band gap (EBG) structures formed through the mid-support plate, one or more electromagnetic band gap structures mounted onto the mid-support plate, or both. The one or more electromagnetic band gap structures may mitigate or stop surface current flow across the display.Type: GrantFiled: September 27, 2019Date of Patent: March 1, 2022Assignee: Apple Inc.Inventors: Mahmoud N. Mahmoud, Cheung-Wei Lam, Ali Foudazi, Le Wang, Qianyi Zhao, Kedi Zhang, Xingchao C. Yuan, Jon F. Housour, Gary Chung
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Patent number: 11231069Abstract: A wheel hub bearing for motor vehicles, comprising a hub and a bearing unit in turn comprising a radially outer ring, at least one radially inner ring, at least one crown of rolling bodies between the radially outer ring and the radially inner ring, whereas the hub has a radial stiffening. The radial stiffening of the hub has a misalignment (d) respect to a seat, i.e. a distance between a centerline axis (Y) of the seat of the radially inner ring on the hub and a centerline (Z) of the radial stiffening less than or equal to 25% of a length (l) of the seat.Type: GrantFiled: October 5, 2020Date of Patent: January 25, 2022Inventor: Mathieu Hubert
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Patent number: 11195787Abstract: A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.Type: GrantFiled: February 17, 2016Date of Patent: December 7, 2021Assignee: Infineon Technologies AGInventors: Ngoc-Hoa Huynh, Franz-Xaver Muehlbauer, Claus Waechter, Veronika Huber, Dominic Maier, Thomas Kilger, Saverio Trotta, Ashutosh Baheti, Georg Meyer-Berg, Maciej Wojnowski
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Patent number: 11196148Abstract: An electronic device such as a wristwatch may have a housing with metal portions such as metal sidewalls. The housing may form an antenna ground for an antenna. An antenna resonating element for the antenna may be formed from a stack of capacitively coupled component layers such as a display layer, touch sensor layer, and near-field communications antenna layer at a front face of the device. An additional antenna may be formed from a peripheral resonating element that runs along a peripheral edge of the device and the antenna ground. A rear face antenna may be formed using a wireless power receiving coil as a radio-frequency antenna resonating element or may be formed from metal antenna traces on a plastic support for light-based components.Type: GrantFiled: December 19, 2018Date of Patent: December 7, 2021Assignee: Apple Inc.Inventors: Rex T. Ehman, Jayesh Nath, Carlo Di Nallo, James G. Horiuchi, Erik G. de Jong, Jason C. Sauers, Makiko K. Brzezinski, Siwen Yong, Lijun Zhang, Yi Jiang, Zheyu Wang, Mario Martinis, Eduardo Da costa Bras Lima, Xu Han, Mattia Pascolini, Trevor J. Ness
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Patent number: 11166374Abstract: An electronic device includes a first circuit board, a second circuit board stacked with the first circuit board, and a connection plate connected between the first circuit board and the second circuit board. The connection plate includes a signal transmission part and at least one ground part at a spacing to the signal transmission part. The ground part can be used as a reference ground for a signal transmitted by the signal transmission part, so that the characteristic impedance of the signal transmission part is controllable, and the signal transmitted by the signal transmission part has strong continuity, thereby maintaining good matching performance and reducing an insertion loss caused by characteristic impedance mismatch.Type: GrantFiled: March 15, 2018Date of Patent: November 2, 2021Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Hui Wang, Dan Qiu, Zhijun Chen, Daiping Tang
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Patent number: 11158955Abstract: A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. The Faraday walls extends between ground planes associated with at least one of the antenna element array layer and the beamformer circuit layer.Type: GrantFiled: November 7, 2018Date of Patent: October 26, 2021Assignee: RAYTHEON COMPANYInventors: Thomas V. Sikina, John P. Haven, James E. Benedict, Jonathan E. Nufio-Molina, Andrew R. Southworth
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Patent number: 11152705Abstract: An apparatus includes two or more groups of antennas, each including two or more patches of optically tunable material providing two or more antennas. The tunable geometric metasurface also includes a control circuit including a plurality of switches providing current sources and a ground voltage. The plurality of switches are coupled to respective ones of the patches of optically tunable material in each of the groups of antennas via first electrodes. The ground voltage is coupled to respective ones of the patches of optically tunable material in each of the groups of antennas via second electrodes. The control circuit is configured to modify states of the antennas in each of the groups of antennas utilizing the first electrodes and the second electrodes to adjust reflectivity of the patches of optically tunable material to provide a tunable geometric metasurface.Type: GrantFiled: July 25, 2019Date of Patent: October 19, 2021Assignee: International Business Machines CorporationInventors: Abram L. Falk, Jessie Carrigan Rosenberg, Kafai Lai, Damon Brooks Farmer
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Patent number: 11121451Abstract: A router unit with an antenna includes a router and an antenna structure. The antenna structure is mounted in a vehicle, and includes a dielectric body with a dielectric property and a planar element with a conductive property that is provided to the dielectric body. The router includes a transferring unit and a housing. The transferring unit transfers a signal to a transfer destination. The housing houses the transferring unit and includes a shield part with a conductive property for blocking noise that affects the transferring unit. The antenna structure is provided to the shield part, connected to the transferring unit, and transmits or receives a radio wave by using the shield part as a ground of the antenna structure.Type: GrantFiled: December 23, 2019Date of Patent: September 14, 2021Assignee: Yazaki CorporationInventors: Takahiro Iwaki, Naoshi Serizawa, Tatsuya Ishikawa
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Patent number: 11101067Abstract: A wireless power transmitter can include a transmitting coil configured to wirelessly transmit power to a receiving coil. The wireless power transmitter can include a shield residing on a given side of a substrate spaced apart from the transmitting coil. The shield can be configured to filter an electric field induced by the transmitting coil.Type: GrantFiled: December 7, 2018Date of Patent: August 24, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Vladimir A. Muratov, John C. Rice
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Patent number: 11071034Abstract: An autonomous vehicle having wireless access communications access point equipment is arranged to set up a base station in a coverage “hole” by scanning to detect transmissions from another wireless communications access point, and determines a direction in which quality of coverage from the other wireless communications access point decreases, and directs the autonomous vehicle to move in the direction of decreasing coverage until it reaches a limit of coverage, at which point it hands over to another base station or, if no further base station is available, sets up as a wireless communications point connecting through the last base station to a backhaul connection.Type: GrantFiled: July 27, 2018Date of Patent: July 20, 2021Assignee: British Telecommunications Public Limited CompanyInventors: Anvar Tukmanov, Aygul Garifullina
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Patent number: 10978778Abstract: A wafer level package with integrated antenna includes a contacting layer, an antenna layer with integrated antenna as well as a chip layer having at least one chip arranged between the contacting layer and the antenna layer. Further, means for shielding are implemented between the antenna layer and the chip layer.Type: GrantFiled: January 3, 2018Date of Patent: April 13, 2021Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.Inventors: Ivan Ndip, Tanja Braun
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Patent number: 10923808Abstract: This application discloses an antenna system, includes: a ground plate, at least one antenna pair disposed on the ground plate, and a decoupling assembly disposed on a radiation surface of the antenna pair; where the antenna pair includes a first antenna and a second antenna; the decoupling assembly is configured to adjust antenna radiation directions of the first antenna and the second antenna. In this application, the following problem is resolved: A poor effect is achieved when coupling between antennas is reduced by using a slit because there are many electronic elements in a mobile terminal and the slit is easily affected by surrounding electronic elements. Antenna radiation directions of the antennas are changed by using the decoupling assembly disposed on the radiation surface of the antenna pair, thereby improving isolation between the antennas and antenna radiation efficiency.Type: GrantFiled: February 1, 2019Date of Patent: February 16, 2021Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Su Xu, Huailin Wen
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Patent number: 10916841Abstract: Techniques for providing multi-antenna devices with increased antenna-to-antenna isolation as well as methods of operating and manufacturing the same are disclosed. A multi-antenna device may include a support structure, one or more radio devices coupled to a first antenna that is coupled to the support structure at a first location, a second antenna coupled to the support structure at a second location and communicatively coupled to the one or more radio devices, and a conductive structure coupled to the support structure so that it shifts an electric field null of the first antenna from an original location toward the second location during communications using the first antenna, thereby increasing isolation between the first antenna and the second antenna. The conductive structure may have a length of approximately one half of the wavelength (e.g., of 2.4 gigahertz or 5 gigahertz) of a frequency band used for the communications.Type: GrantFiled: June 28, 2019Date of Patent: February 9, 2021Assignee: NVIDIA CorporationInventors: Siddharth Ravichandran, Srirama Murthy Raju Bhupatiraju, Joselito Gavilan
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Patent number: 10912187Abstract: A printed board including an external interface, a frame ground trace electrically connected to the external interface, a circuit member spaced from the frame ground trace, and a resonance trace disposed between the frame ground trace and the circuit member with a gap present between the resonance trace and the frame ground trace. The resonance trace is connected to the circuit member at at least two positions. The resonance trace and the circuit member together form a loop member configured in the form of a closed circuit of the resonance trace and the circuit member.Type: GrantFiled: May 31, 2018Date of Patent: February 2, 2021Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Norihiko Akashi, Yudai Yoneoka, Nobuyuki Haruna, Yoshiaki Irifune, Satoshi Ohdaira, Takashi Miyasaka
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Patent number: 10818617Abstract: Examples of a package for a flange mount device are described. In one example, the package includes a thermally conductive base, a base substrate, and a lid having a cavity. The base substrate includes a through hole and radio frequency (RF) input, RF output, and bias traces that extend to a perimeter of the through hole. The lid includes a cavity and RF input coupling, RF output coupling, and bias coupling traces. A device can be secured to the thermally conductive base, and the lid can be secured to the thermally conductive base, with the base substrate secured between the lid and the thermally conductive base, coupling the traces of the base substrate to the traces of the lid. Other components, such as biasing, blocking, and bypassing components can be easily integrated into the package. Impedance matching and electromagnetic shielding components can also be easily integrated into the package.Type: GrantFiled: September 28, 2018Date of Patent: October 27, 2020Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.Inventor: Kohei Fujii
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Patent number: 10804213Abstract: A circuit apparatus according to an embodiment includes: a wiring substrate having a wiring; a first electronic component provided on the wiring substrate; a second electronic component provided on the wiring substrate, the second electronic component having a height higher than a height of the first electronic component; a sealing member provided on the wiring substrate, the sealing member covering the first electronic component and the second electronic component, a first distance between a first surface of the sealing member above the first electronic component and the wiring substrate being shorter than a second distance between a second surface of the sealing member above the second electronic component and the wiring substrate; and a conductive member provided on the sealing member, the conductive member exposing the second surface, a third distance between a third surface of the conductive member provided above the first electronic component and the wiring substrate being equal to the second distance,Type: GrantFiled: February 25, 2019Date of Patent: October 13, 2020Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage CorporationInventor: Minoru Takizawa
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Patent number: 10798630Abstract: Mitigating co-channel interference includes instructing a first access node to deploy a first radio air interface utilizing a first frequency band over a first default coverage area, instructing the first access node to deploy a second radio air interface utilizing a second frequency band over a first reduced coverage area, instructing a second access node to deploy a third radio air interface utilizing the first frequency band over a second reduced coverage area, and instructing the second access node to deploy a fourth radio air interface utilizing a second frequency band over a second default coverage area.Type: GrantFiled: January 3, 2019Date of Patent: October 6, 2020Assignee: Sprint Spectrum L.P.Inventor: Khaled Azem
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Patent number: 10777518Abstract: A package structure includes a plurality of sub-package structures, a second encapsulant, a second RDL structure and a second conductive terminal. The sub-package structure includes a die, first TIVs, a first encapsulant and an antenna element. The die has a first side and a second side. The first TIVs are laterally aside the die. The first encapsulant encapsulates sidewalls of the die and sidewalls of the TIVs. The antenna element is on the first side of the die, and on the TIVs and the first encapsulant. The second encapsulant encapsulates sidewalls of the sub-package structures. The second RDL structure is electrically connected to the plurality of sub-package structures. The second conductive terminal is electrically connected to the sub-package structures through the second RDL structure.Type: GrantFiled: May 16, 2019Date of Patent: September 15, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chuei-Tang Wang, Chen-Hua Yu, Tzu-Chun Tang, Chieh-Yen Chen, Che-Wei Hsu
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Patent number: 10748704Abstract: Provided is a core component having a powder compact and a resin-molded portion joined to each other. In a core component including a powder compact obtained by compression molding a raw material powder containing a soft magnetic powder and a resin-molded portion formed on the surface of the powder compact, and constituting a part of a magnetic core disposed inside and outside a coil included in a reactor, an intermediate layer formed of a silane coupling agent is provided between the powder compact and the resin-molded portion. The powder compact and the resin-molded portion can be bound to each other via the intermediate layer formed of the silane coupling agent. The silane coupling agent not only binds chemically to the surface of the powder compact but also binds chemically to the resin-molded portion, and therefore, the joining the powder compact and the resin-molded portion via the intermediate layer.Type: GrantFiled: January 8, 2016Date of Patent: August 18, 2020Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventors: Tatsuo Hirabayashi, Kouji Nishi
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Patent number: 10726258Abstract: An electronic device is provided. The electronic device includes a housing including a front plate and a rear plate; a touch screen display operably coupled to the front plate; at least one through-hole operably disposed on the front plate; and an imaging sensor assembly facing the front plate at an acute angle with respect to the front plate. The imaging sensor assembly includes a barrel at least partially disposed in the through-hole; a plurality of lenses disposed inside the barrel; a sensor housing surrounding at least part of an outer surface of the barrel; an image sensor assembly comprising an image sensor disposed inside the sensor housing; and a processor electrically coupled to the image sensor and configured to detect an iris image.Type: GrantFiled: June 20, 2018Date of Patent: July 28, 2020Assignee: Samsung Electronics Co., LtdInventors: Jinwoo Park, Min-Soo Kim, Jae-Il Seo, Soonwoong Yang, Kyujin Kwak, Kijae Kim, Jin-Wan An
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Patent number: 10707556Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.Type: GrantFiled: July 5, 2019Date of Patent: July 7, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hong In Kim, Thomas A. Kim, Ho Kyung Kang
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Patent number: 10709009Abstract: One general aspect of the present disclosure includes an electrical circuit with a circuit carrier, at least one electrical component arranged on the circuit carrier, and at least one data transmission device with an antenna section. The data transmission device may be configured for wireless transmission of data and may include a housing, where the at least one electrical component, the at least one data transmission device, and at least one section of the circuit carrier are at least partially enclosed by the housing. At least the antenna section of the data transmission device may be arranged in a transmission range inside the housing and the transmission range may be spaced at a distance from the circuit carrier.Type: GrantFiled: October 19, 2015Date of Patent: July 7, 2020Assignee: ZF Friedrichshafen AGInventor: Mathias Häuslmann
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Patent number: 10607770Abstract: Provided are a shielding unit for wireless charging and a wireless power transfer module including the same. The shielding unit for wireless charging includes a first sheet for a wireless power transfer antenna, and a second sheet for another antenna operating in a different frequency band from that of the wireless power transfer antenna. The first sheet is provided in a first region which is disposed on a side of a virtual boundary line, and the second sheet is provided in a second region which is disposed on the opposite side of the first region.Type: GrantFiled: May 18, 2016Date of Patent: March 31, 2020Assignee: AMOSENSE CO., LTDInventors: Jin Won Noh, Kil Jae Jang
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Patent number: 10593452Abstract: A magnetic sheet having improved acid/base-resistant properties, corrosion-resistance, and an excellent magnetic property at NFC, WPC, and MST frequencies, has little changes in weight and thickness even if the environment changes, for example, even after an etching treatment for patterning, or a reflow or soldering process which is performed for its application to a product.Type: GrantFiled: May 31, 2017Date of Patent: March 17, 2020Assignee: SKC CO., LTD.Inventors: Tae Kyoung Kim, Jong Hwi Park, Jin Cheol Kim, Jonghak Choi, Nah Young Kim, Hyun Gon Moon
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Patent number: 10534405Abstract: An electronic device is provided. The electronic device includes a housing comprising a first plate, a second plate apart from the first plate while facing the first plate, and a side member which surrounds a space between the first plate and the second plate, a touchscreen display exposed through the first plate, a printed circuit board (PCB) disposed between the touchscreen display and the second plate, a mid-plate disposed between the touchscreen display and the PCB, and extending from the side member, and at least one integrated circuit (IC) mounted on the PCB and relating to power, wherein the mid-plate can include at least one conductive path formed on a surface facing the PCB and electrically connected to the at least one IC, and the at least one conductive path can be formed with the same metallic material as the mid-plate.Type: GrantFiled: April 9, 2018Date of Patent: January 14, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Min-Soo Kim, Kyujin Kwak, Soo-Gyu Lee, Sung-Won Park, Joon Won Chang, Jin-Wan An, Janghoon Lee
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Patent number: 10516203Abstract: A mobile terminal, including a display screen, a rear cover facing the display screen, a metal frame, and a circuit board; the metal frame and the circuit board are between the display screen and the rear cover and extend along outer profile of the rear cover. The antenna system includes at least one antenna unit. Each antenna unit includes a first gap in the metal frame and a second gap communicated with the first gap; the first gap extends along perimeter of the metal frame to form a strip-like hollow; the second gap extends from the middle of the first gap toward the rear cover until through the metal frame so as to divide the metal frame into a first section and a second section; the first section and the second section are electrically connected with the feeding point to form a first radiator and a second radiator, respectively.Type: GrantFiled: February 12, 2018Date of Patent: December 24, 2019Assignee: AAC Technologies Pte. Ltd.Inventors: Jianchuan Liu, Yuehua Yue, Wei Yan, Li Han, Chi Xie
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Patent number: 10498038Abstract: The present invention relates to a mobile terminal comprising: a terminal body having first to fourth sides; a metal frame comprising a base plate, first and second side members exposed to the exterior of the terminal body, and a slit located on the first side of the terminal body and placed between the first side member and the second side member; and a printed circuit board, wherein the first side member is located on one part of the first side end and second side, the printed circuit board comprises a first power unit, a second power unit, a first conductive pattern connected to the first power unit; and a second conductive pattern connected to the second power unit, wherein the first conductive pattern is directly connected to the first side member, and the second conductive pattern is not directly connected to the second side member.Type: GrantFiled: November 24, 2016Date of Patent: December 3, 2019Assignee: LG ELECTRONICS INC.Inventors: Jihun Ha, Byungwoon Jung, Changil Kim, Namyong Kim, Jaewoo Lee, Byungeun Jeon, Deuksu Choi, Chisang You, Yeomin Youn
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Patent number: 10498022Abstract: Coupling can be reduced between electromagnetic components in system where negative uniaxial metamaterial (MUM) can be utilized between the components and can be configured to reduce coupling. The HUM can be configured in a shape selected according to an electromagnetic field causing the coupling or by calculating a fictitious electrostatic field. An array of electromagnetic components can be decoupled using an array of spatially-variant anisotropic metamaterial. A method for decoupling electromagnetic components can include steps of determining a fictitious electrostatic field surrounding the components disposed in an environment, mathematically transforming the electromagnetic fields into a grating vector function, forming at least one spatially-variant anisotropic metamaterial according to the grating vectors, and inserting the spatially-variant anisotropic metamaterial in the environment in order to decouple the electromagnetic components.Type: GrantFiled: May 11, 2016Date of Patent: December 3, 2019Assignee: Board of Regents, The University of Texas SystemInventor: Raymond C. Rumpf
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Patent number: 10312583Abstract: According to various aspects, exemplary embodiments are disclosed of antenna systems. In an exemplary embodiment, an antenna system generally includes a ground plane and first and second antennas. A first isolator is disposed between the first and antennas. A second isolator extends outwardly from the ground plane. The antenna system is configured to be operable with low passive intermodulation.Type: GrantFiled: February 2, 2016Date of Patent: June 4, 2019Assignee: LAIRD TECHNOLOGIES, INC.Inventors: Kok Jiunn Ng, Joshua Ooi Tze-Meng, Wei Tat Ng
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Patent number: 10290928Abstract: An antenna includes: a connection device for connection with an electronic device; a cable connected to the connection device; and a high-frequency cutoff unit that is formed of a material having high impedance in a high frequency and disposed at a given position of the cable. The cable with a length defined by the high-frequency cutoff unit functions as an antenna.Type: GrantFiled: July 3, 2015Date of Patent: May 14, 2019Assignee: Sony Semiconductor Solutions CorporationInventors: Yoshitaka Yoshino, Makoto Makishima, Satoru Tsuboi, Tomomichi Murakami
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Patent number: 10236260Abstract: A semiconductor structure includes a packaged semiconductor device having at least one device, a conductive pillar, an encapsulant over the at least one device and surrounding the conductive pillar, wherein the conductive pillar extends from a first major surface to a second major surface of the encapsulant, and is exposed at the second major surface and the at least one device is exposed at the first major surface. The packaged device also includes a conductive shield layer on the second major surface of the encapsulant and on minor surfaces of the encapsulant and an isolation region at the second major surface of the encapsulant between the encapsulant and the conductive pillar such that the conductive shield layer is electrically isolated from the conductive pillar. The semiconductor structure also includes a radio-frequency connection structure over and in electrical contact with the conductive pillar at the second major surface of the encapsulant.Type: GrantFiled: June 30, 2016Date of Patent: March 19, 2019Assignee: NXP USA, Inc.Inventors: Michael B. Vincent, Gregory J. Durnan
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Patent number: 10230143Abstract: Provided is a structure including at least: a first conductor plane; a second conductor plane disposed so as to face the first conductor plane; a first transmission line that is formed in a layer different from the first conductor plane and the second conductor plane and is disposed so as to face the second conductor plane, one end of the first transmission line being an open end; a conductor via that connects another end of the first transmission line with the first conductor plane; a slit that is formed on the second conductor plane and stretches to both sides of the first transmission line from a starting point where the slit overlaps the first transmission line in a plan view. Thus, a structure that enables formation of a compact EBG structure is provided.Type: GrantFiled: January 5, 2016Date of Patent: March 12, 2019Assignee: NEC CORPORATIONInventor: Yoshiaki Kasahara
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Patent number: 10225923Abstract: Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.Type: GrantFiled: April 4, 2017Date of Patent: March 5, 2019Assignee: TDK CORPORATIONInventors: Yoshihiro Suzuki, Tomohide Yokozawa, Michitaka Okazaki, Takuro Aoki, Masashi Katsumata
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Patent number: 10211525Abstract: An antenna array assembly comprises at least a first and second antenna element, each comprising at least one radiator element in a substantially parallel relationship to a respective ground plate, and an isolator bar disposed between the respective ground plates of the first and second antenna elements, the isolator bar being elongate having a cross-section comprising a T shape, the cross-section being across a long axis. The isolator bar comprises a support bar in contact with the ground plates forming the stem of the T shape, and a cross piece forming the top of the T shape. The cross piece of the isolator bar has a width in the cross-section of at least a quarter of a wavelength at an operating frequency of the antenna array, whereby to provide radio frequency isolation between the first and second antenna elements.Type: GrantFiled: September 14, 2017Date of Patent: February 19, 2019Assignee: CAMBIUM NETWORKS LTDInventors: Paul Clark, Adam Wilkins, Carl Morrell, Nigel Jonathan Richard King
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Patent number: 10193220Abstract: Disclosed is an antenna array, including: a first antenna; a second antenna; and a dielectric substance, of which a height is determined based on a distance between the first and second antennas and forms of beam patterns of the first and second antennas. According to the antenna array according to the exemplary embodiments of the present invention, it is possible to decrease coupling between the antennas.Type: GrantFiled: March 9, 2016Date of Patent: January 29, 2019Assignee: Electronics and Telecommunications Research InstituteInventors: Juyul Lee, Jinup Kim, Myung-Don Kim
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Patent number: 10178815Abstract: An apparatus and method of making the same is presented. The apparatus may comprise a front portion comprising a front exterior panel and a front interior panel, a back portion comprising a back exterior panel and a back interior panel, the back connected along two sides of the back exterior panel to two corresponding sides of the front exterior panel; and a closure part connecting the non-connected sides of the front exterior panel and the back exterior panel. The front interior panel and the back exterior panel may each comprise a slit opening for a pocket. The closure part may comprise a zipper having a key tab. The apparatus may comprise an RF blocking material. The front may further comprise a flat portion having embossed text, and may also comprise a key chain band. The apparatus may be a wallet, handbag, or other luxury accessory, and/or a wearable item.Type: GrantFiled: January 26, 2018Date of Patent: January 8, 2019Assignee: VIEYRA INC.Inventors: Fortune Vieyra, Jamie Ibanez
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Patent number: 10028320Abstract: Among other things, a communication system and technique for transferring information between a stationary unit and a rotating unit of a computed tomography (CT) system is provided. The communication system comprises a transceiver and a contactless data-link comprising at least one physical channel. The transceiver is configured to create at least two logical channels from a single physical channel to provide for transmitting at least two types of information in a single direction and/or to provide for transmitting information bi-directionally. In this manner, an amount of data that can be transmitted over a single physical channel can be increased.Type: GrantFiled: November 2, 2012Date of Patent: July 17, 2018Assignee: ANALOGIC CORPORATIONInventor: Louis R. Poulo