Abstract: Provided are a method for providing an RF powder that is easily handled because it is used as a powder (powdery state), not used as individual elements, and is high in applicability and extensibility, extremely low in manufacturing cost in respect of the unit price of each particle, and extremely high in practicability; and an RF powder-containing liquid. In the method for providing an RF powder, an RF powder composed of a large number of RF powder particles 11a is provided to a user in a state of being stored in a container 1. The RF powder is stored in the container 1 together with a medium that prevents the large number of RF powder particles 11a from adhering to one another. The medium is a liquid having a specific color determined so as to correspond to the characteristic frequency of the RF powder.

Abstract: A method and apparatus are provided for wireless communication between an integrated circuit device and a monitoring station. Each integrated circuit device has one or more antennas that permit wireless communication with an external monitoring station. A signal destined for an integrated circuit device is transmitted by the monitoring station using an associated antenna. An antenna associated with the destination integrated circuit receives the transmitted signal. The antenna(s) may be embodied, for example, as pins that are external to the integrated circuit device, or printed or etched on the integrated circuit device itself. Greater bandwidth can be achieved, if necessary, by pooling the bandwidth of several antennas.

Abstract: An antenna module includes a main body and a three-dimensional radiator embedded in the main body. The main body is made of foamed ceramic material. A method for making the antenna is also described.

Abstract: An antenna attachment scheme is provided, according to one aspect of the invention, for mounting an antenna to a meter. The antenna attachment scheme comprises a housing mountable to a meter. The housing comprises a top surface; an open-end; and a side surface. The side surface of the housing comprising a mounting surface for the antennae to the housing.

Abstract: Embodiments relate to a system for conducting hearing aid compatibility testing of a mobile communication device. The system comprises: a simulated hand for supporting the mobile communication device during the testing; a probe; and a processor. The processor is configured to cause the probe to be positioned in a sequence of positions in proximity to the mobile communication device relative to an audio output component of the mobile communication device during the testing and to determine a field strength of a field radiated by the mobile communication device at the sequence of positions based on an output of the probe at each position.

Abstract: A method of manufacturing an antenna-embedded case for a mobile communications terminal includes providing an antenna pattern, forming a first injection-molded member covering one surface of the antenna pattern, and disposing the first injection-molded member, provided with the antenna pattern on one surface thereof, in a second mold with the antenna pattern disposed in a space inside the second mold, and injection-molding a second injection-molded member covering the other surface of the antenna pattern to embed the antenna pattern between the first injection-molded member and the second injection-molded member.

Abstract: A signal transmitting/receiving antenna device for Radio Frequency Identification (RFID) which executes contactless data communication, and a method of manufacturing the same. The antenna device includes an antenna module including a dielectric film substrate, an antenna pattern which is a conductive pattern printed on the top and bottom sides of the dielectric film substrate, the top and bottom antenna pattern parts being connected to each other through one or more via holes extending through the dielectric film substrate, and top and bottom passivation layers formed on the dielectric film substrate to cover the top and bottom antenna pattern parts; and a radio wave absorbent printed on one of the top and bottom passivation layers of the antenna module.

Abstract: An antenna shape can be inked onto a thin film and then the thin film can be shaped to form a three dimensional (3D) flex-film. The 3D flex-film can then be integrated into a carrier using conventional molding processes. The resultant housing includes a carrier that supports the 3D flex-film on an inner or outer surface of the carrier. The resultant housing thus allows for improved integration of an antenna with a housing so as to provide a more desirable housing for devices that can benefit from the corresponding antenna, such as, but not limited to, mobile devices.

Abstract: A radio-frequency integrated circuit chip package has N integrated patch antennas, N being at least one. The package includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn includes at least one generally planar ground plane spaced inwardly from the N generally planar patches and parallel thereto. The ground plane is formed without any coupling apertures therein. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and parallel thereto, and spaced outwardly from the generally planar ground plane and parallel thereto. Furthermore, the main portion includes at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, and the N generally planar patches and the chip are located in the antenna cavity. The package is formed without reflectors. Fabrication techniques are also described.

Abstract: An array antenna may include a substrate, an array of metamaterial elements including radiating elements suspended in the substrate and integrated with the array of dipoles, where the metamaterial elements include a first metal layer and a second metal layer connected by a via, an array of dipoles, a groundplane coupled with a first side of the substrate, the ground plane having a symmetric slot aperture and not contacting the array of metamaterial elements, and a stripline feed for the radiating elements, where the stripline feed passes from a groundplane first side through the symmetric slot aperture to a groundplane second side.

Abstract: A non-hermetically sealed and biocompatible multi-turn RFID loop antenna is electrically connected to a RFID chip which is enclosed within its own hermetically sealed miniature container. The hermetic seal can be very small and the loop antenna can be relatively large, wherein the entire package is both highly reliable, resistant to body fluids and completely biocompatible. The RFID structure can be implanted in a patient and later communicate with an RFID interrogator to provide information relating to the patient and/or implantable medical devices.

Abstract: An implantable radio frequency identification (RFID) tag includes a hermetically sealed biocompatible housing for an active implantable medical device (AIMD), an RFID microelectronics chip is disposed within the housing, and a biocompatible antenna extends from the RFID microelectronic chip and exteriorly of the housing. In a preferred form of the invention, the antenna is disposed within a header block of the AIMD, and the RFID chip is disposed within the AIMD housing.

Abstract: The invention provides an outer cover adapted to a communication device, a communication device including the same and a method for manufacturing the same. The outer cover according to the invention includes a cover body and an antenna. The cover body has a bottom surface. Particularly, the antenna is fixed at a predetermined position on the bottom surface by an insert molding process.

Abstract: A wireless media player and a related system and methodology are disclosed. One aspect of the wireless media player system pertains to a virtual connector system, apparatus, and method for the automatic establishment of wireless connectivity with other electronic devices. In one embodiment, the media player device employs the use of integrated Radio Frequency Identification (RFID) technology to exchange communication settings, media capability, and other parameters with an external device that also has integrated RFID technology. The automatic exchange of settings and other information via a proximity-based RFID data exchange allows a media player to quickly establish a secure communication link with another device via a commonly supported wireless protocol such as Ultra Wideband (UWB) or Bluetooth. Another aspect of the media player system pertains to a method of using the captured media capability of the connecting device to customize certain menu options and software parameters in the media player.

Abstract: A semiconductor chip integrating a transceiver, an antenna, and a receiver is provided. The transceiver is located on a front side of a semiconductor substrate. A through substrate via provides electrical connection between the transceiver and the receiver located on a backside of the semiconductor substrate. The antenna connected to the transceiver is located in a dielectric layer located on the front side of the substrate. The separation between the reflector plate and the antenna is about the quarter wavelength of millimeter waves, which enhances radiation efficiency of the antenna. An array of through substrate dielectric vias may be employed to reduce the effective dielectric constant of the material between the antenna and the reflector plate, thereby reducing the wavelength of the millimeter wave and enhance the radiation efficiency. A design structure for designing, manufacturing, or testing a design for such a semiconductor chip is also provided.

Abstract: An integrated circuit (IC) antenna structure includes a micro-electromechanical (MEM) area, a feed point, and a transmission line. The micro-electromechanical (MEM) area includes a three-dimensional shape, wherein the three dimensional-shape provides an antenna structure. The feed point is coupled to provide an outbound radio frequency (RF) signal to the antenna structure for transmission and to receive an inbound RF signal from the antenna structure. The transmission line electrically coupled to the feed point.

Abstract: An antenna device for a mobile communication system is provided, in which a post has a selected external appearance. An antenna end is formed at an upper portion of the post for installing antenna parts, and a support end is formed at a lower portion of the post for fixing the antenna device to the ground. At least part of an external body of the antenna end is formed of a material that transmits transmission and received radio signals and a ground support member is formed under the support end to make an external body of the support end stand erect on the ground. The external appearance of the antenna device may take the form of a conventional utility, lamp, or sign post or pole.

Abstract: An electronic device has a display in which the casing of the display includes a plurality of recessed cavities into which radio and antenna modules can be inserted to provide the electronic device with a wireless communication capability. The display can have cavities for one or more radios and one or more antenna modules. A radio electrically connects to one or more antenna modules via conductor(s) contained within the display and connects to the host electronic device via a serial bus (e.g., USB). Accordingly, the display can have a plurality of radio/antenna combinations thereby concurrently providing the electronic device with multiple wireless communication capabilities.

Abstract: The invention relates to a GSM antenna for transmitting or receiving information between a machine or a network of machines and a server, said antenna including a metal strand (9) embedded in a mechanically resistant flat shield (8) made of an insulating material, suitable for providing mechanical protection to and a seal around the metal strand.

Abstract: The antenna-forming insert for a chip card includes a central layer forming an antenna including a substrate and at least one conductor extending along at least one face of the substrate. At least one cover layer covering on at least one side the central layer and capable of compensating for the irregularities of the surface of the central layer. Each cover layer includes a proximal sheet located in proximity to the central layer and a distal sheet located away from the central layer, both sheets being superposed and laminated and the proximal sheet during the lamination phase has lower fluidity than that of the distal sheet.

Abstract: A transmitting device for use in a pest control station has an antenna and a housing sealingly enclosing the antenna therein.

Abstract: Disclosed herein is a mobile communication terminal casing equipped with an internal antenna. The mobile communication terminal casing includes an antenna sheet having contact terminals, and an injection-molded casing product including an inner surface having an internal groove that is coupled to the antenna sheet and an outer surface opposite to the inner surface. A second surface opposite to a first surface of the antenna sheet on which the contact terminals are located comes into contact with the internal groove of the injection-molded casing product, and the first surface is injection-molded to be exposed outside of the injection-molded casing product.

Abstract: A strain-resistant electrical connection and a method of making the same is provided. An antenna (36, 38) or other conductive lead is connected to a circuit (32) in a manner that makes the connection more resistant to mechanical stresses such as movement or rotation of the antenna (36, 38) or conductive lead relative to the circuit (32). The antenna (36, 38) or conductive lead is at least partially coiled to provide additional ability to withstand mechanical stresses. The antenna (36, 38) or conductive lead may be encase along with is connected circuit in an elastomeric material.

Abstract: A method of installing multiple over-the-air antennas is disclosed. The method includes the steps of mounting a satellite antenna to a installation surface, such that the mounting allows the satellite antenna to be aimed at a satellite, attaching a broadband access antenna to one of the installation surface and a portion of the satellite antenna, such that the attaching allows the broadband access antenna to be aimed at a broadband access source, connecting first wiring from the broadband access antenna to a first downconverter and second wiring from the satellite antenna to a second downconverter, providing outputs of the first and second downconverters to a cable in communication with at least a satellite receiver and positioning, on at least a coarse scale, the satellite antenna and the broadband access antenna such that they are approximately pointed at the satellite and the broadband access source, respectively.

Abstract: An injection-molded case and a manufacturing method thereof having antenna patterns are formed in the injection-molded case by only one insert injection molding process, without a second insert injection molding process as required in the conventional manufacture. The injection-molded case preferably includes: one or more antenna patterns fabricated by a press process; and an injection-molded case part having the antenna patterns provided therewithin, which is fabricated by fixing the antenna patterns on an injection mold and carrying out only one insert injection molding process.

Abstract: A portable electronic device includes a base, an antenna radiator, an outer layer, and at least one conductive contact. The antenna radiator is formed on the activated base by plating. The antenna radiator is sandwiched between the base and the outer layer. One end of each conductive contact is electrically connected to the antenna radiator, and the other end of the each conductive contact is exposed.

Abstract: An antenna structure includes a radiating element and an antenna radome. The antenna radome has at least one dielectric layer, which has an upper surface having many S-shaped metal patterns and a lower surface having many inverse S-shaped metal patterns corresponding to the S-shaped metal patterns. The S-shaped metal patterns are respectively coupled to the corresponding inverse S-shaped metal patterns to converge radiating beams outputted from the radiating element.

Abstract: An air-supported sandwich radome with a hemispherical top region and a prolate region has a high strength, RF transmissive, low dielectric flexible wall. There is a defined region where damaging RF radiation is reflected. At least in the defined region, a flexible high strength, RF transmissive low dielectric layer is added and there is a low dielectric gap between the wall and the layer providing a 180° phase delay between RF energy reflected off the wall and RF energy reflected off the layer to cancel the effect of said reflected RF energy on radar equipment housed by the radome.

Abstract: A phased array antenna radiator assembly that in one embodiment has a thermally conductive foam substrate, a plurality of metal radiating elements bonded to the foam substrate, and a radome supported adjacent the metal radiating elements. In another embodiment a phased array antenna radiator assembly is disclosed that has a thermally conductive substrate, a plurality of metal radiating elements bonded to the thermally conductive substrate, a radome supported adjacent the metal radiating elements, and an electrostatically dissipative adhesive in contact with the radiating elements for bonding the radome to the thermally conductive substrate.

Abstract: There are provided an antenna integrally formed with a case and a method of manufacturing the same. An antenna integrally formed with a case according to an aspect of the invention includes: a case unit formed of a dielectric material; a radiator integrally formed with the case unit and having terminal units extending from a radiation unit tightly contacting the surface of the case unit; vertical ribs each having an internal connection portion contacting an upper end of the terminal unit and extending downward from an inner surface of the case unit by a predetermined length; and outer connection portions provided on a board disposed adjacent to the case unit and electrically connected to individual lower ends of the internal connection portions.

Abstract: According to an exemplary embodiment, an overmolded semiconductor package includes at least one semiconductor die situated over a package substrate. The overmolded semiconductor package further includes a mold compound overlying the at least one semiconductor die and the package substrate. The overmolded semiconductor package further includes a conductive layer situated on an outer surface of the mold compound and having an opening. The overmolded semiconductor package further includes an antenna feed line situated in the mold compound and having a portion exposed in the opening in the conductive layer, thereby providing an antenna input on the outer surface of the mold compound.

Abstract: The radio wave transmitting decorative member and the method of producing thereof efficiently and stably of the present invention is provided with radio wave transmitting properties as well as mirror-surface like metallic luster, hardly loses its metallic luster, and can be produced at a low cost. The method of producing a radio wave transmitting decorative member, having a substrate, a transparent organic material layer, and a light reflecting layer formed of an alloy composed of either silicon or germanium and a metal provided between the substrate and the transparent organic material layer; wherein the light reflecting layer is formed from a target having an alloy composed of either silicon or germanium, and of a metal with the use of a DC magnetrons sputtering.

Abstract: An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part.

Abstract: Embodiments of a missile, an airframe and a structure comprising piezoelectric fibers and a method for active structural response control are generally described herein. In some embodiments, a housing structure includes a composite material containing a plurality of piezoelectric fibers adapted to generate an electrical signal in response to a deformation in the structure and to deform the structure to provide low frequency stiffness and strength performance while attenuating high frequency vibrations.

Abstract: To provide a coating composition which is excellent in water resistance, insulating properties and ultraviolet degradation resistance, and is also excellent in transparency of a coating film formed after coating.

Abstract: A rigid substrate including at least one electrically conducting element that provides an antenna function to transmit and/or receive electromagnetic signals, the electrically conducting element having a pattern with a fractal geometry. The electrically conducting element is formed from an electrically conductive ink or enamel that is printed directly on the substrate.

Abstract: A conformal antenna system comprising one or more proximate antenna elements for very reliable localized reception and transmission of radiowave energy and power particularly in frequency controlled VHF, UHF and microwave spectrum is described. The system incorporates effective angle or proximity dependent interference mitigation for conventional transmitters/receivers or master controlled constellations of wireless devices, and is suitable for temporary or permanent installation and use in a variety of outdoor and in-building locations. The antenna elements are configured and optimized for close proximity but unobtrusive positioning near the point of use on stages, in concert halls, movie studios, houses-of-worship, and convention centers, and are configured to be relatively unaffected by people or furniture in very close proximity. Methods for manufacturing and using close proximity antennas are disclosed, as are systems and methods for the generation and control of signals thereto.

Abstract: A method of manufacturing a film antenna includes: preparing a carrier film formed of an insulation polymer material; forming an antenna radiator on at least one side of the carrier film by one of sputtering and deposition; inserting the carrier film with the antenna radiator formed thereon into a mold having a shape of a mobile communication terminal case; and forming a mobile communication terminal case integrally formed with the carrier film by injecting a molding material into the mold.

Abstract: An antenna module is disclosed, including an electronic element, an antenna and a connecting element. The antenna includes a hole. The connecting element includes a first connecting portion, a propping portion and a second connecting portion. The first connecting portion passes through the hole and is fixed to the antenna by the propping portion. The second connecting portion is electrically connected to the electronic element.

Abstract: In order to improve a cable, comprising an inner cable body, in which at least one conductor strand of an optical and/or electrical conductor runs in the longitudinal direction of the cable, an outer cable sheath, enclosing the inner cable body and lying between an outer sheath surface of the cable and the inner cable body, and at least one information carrier unit, disposed within the outer sheath surface of the cable such that the cable also comprises a shielding, the invention proposes that the information carrier unit having an antenna unit lying in an antenna surface running approximately parallel to the longitudinal direction of the cable, by the antenna surface running at a distance from an electrical shielding of the cable and by providing, between the antenna surface and the shielding, a spacing layer, in which the electromagnetic field that couples to the antenna unit and passes through the antenna surface can extend between the antenna unit and the shielding.

Abstract: In an antenna device, a first helical part of a first antenna and a second helical part of a second antenna is disposed in a dielectric body on a ground plane. Each helical part is helically wound up in a direction perpendicular to the ground plane and includes a plurality of one-turn portions. Each one-turn portion of the first helical part has a peripheral length of M times a wavelength ? of use, where M is a positive natural number. One of the one-turn portions of the second helical part closest to the ground plane has a peripheral length Ks that is N times the wavelength ? of use, where N is a positive natural number greater than M. One of the one-turn portions of the second helical part farthest away from the ground plane has a peripheral length Ke, and (M·?)<Ke<Ks(=N·?).

Abstract: There is provided an antenna pattern frame, including: a radiator that includes an antenna pattern part transmitting and receiving signals and a connection terminal part transmitting and receiving the signals to and from a circuit substrate of an electronic device; and a radiator frame that embeds the antenna pattern part in a case of the electronic device and supports the radiator, the radiator being manufactured by injection molding, wherein the radiator frame forms a guide boss inserted into a manufacturing mould for injection-molding the case of the electronic device in which the radiator is embedded.

Abstract: There is provided an antenna pattern frame including: a radiator comprising an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; and a radiator frame manufactured by injection molding on the radiator, allowing the antenna pattern portion to be embedded in a case of the electronic device, and supporting the radiator. The radiator frame includes a hydraulic recess introducing a resin material to a mold for manufacturing a case of the electronic device in which the radiator is embedded through injection molding, so that the radiator frame contacts the mold by injection pressure.

Abstract: There is provided an antenna pattern frame according to one embodiment of the present invention, including: a radiator frame that has an insertion groove formed on one surface of the radiator frame and is provided with a through part connected from one point of the insertion groove to an opposite surface to the one surface of the radiator frame; and a wire antenna that includes an antenna pattern part formed to be inserted into the insertion groove and an interconnection part formed to be exposed to the opposite surface by extending from the antenna pattern part and penetrating through the through part.

Abstract: Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.

Abstract: Certain embodiments may take the form of an electronic device having a metal housing encapsulating operative circuitry for the device. The electronic device includes an attachment member coupled to the metal housing at an attachment point. An antenna is coupled to the attachment member and communicatively coupled to the operative circuitry in the metal housing via the attachment point to enable the electronic device to communicate wirelessly.

Abstract: An object of the present invention is providing a semiconductor device that is capable of improving the reliability of a semiconductor element and enhancing the mechanical strength without suppressing the scale of a circuit. The semiconductor device includes an integrated circuit sandwiched between first and second sealing films, an antenna electrically connected to the integrated circuit, the first sealing film sandwiched between a substrate and the integrated circuit, which includes a plurality of first insulating films and at least one second insulating film sandwiched therebetween, the second sealing film including a plurality of third insulating films and at least one fourth insulating film sandwiched therebetween. The second insulating film has lower stress than the first insulting film and the fourth insulating film has lower stress than the third insulating film. The first and third insulating films are inorganic insulating films.

Abstract: An electronic device module as described herein includes an electronic device package having device contacts. The electronic device package is fixed within encapsulating material, along with an electrically conductive ground layer. The ground layer has a device opening in which the electronic device package resides, and the ground layer also has an antenna opening spaced apart from the device opening. The device contacts and one side of the ground layer correspond to a first surface, and a patch antenna element overlies the first surface. The antenna element is coupled to the electronic device package, and a projection of the patch antenna element onto the first surface resides within the antenna opening. Also provided are methods for manufacturing such an electronic device module.

Abstract: A dual interface inlay having a bottom sheet; an antenna wire mounted to the top surface of the bottom sheet; end portions of the antenna wire formed with squiggles or meanders forming contact areas of increased surface area for subsequent attachment of a chip or chip module to the antenna wire; conductive material applied to the end portions of the antenna wire; a top sheet disposed over the bottom sheet for lamination thereto; and recesses formed in a bottom surface of the top sheet, at positions corresponding to the contact area. The antenna wire may be insulated wire, and insulation may be removed from the end portions of the antenna wire. Silicon cushions may be disposed in the bottom sheet under the contact areas.

Abstract: A wireless communication device includes: a case that includes a dielectric member made of a first dielectric material, the dielectric member being coated with a coating layer made of a second dielectric material; a wireless communication circuit that is housed in the case; an antenna element that is electrically connected to the wireless communication circuit, the antenna element being made of a conductive material and provided on a surface of the dielectric member; and an adhesive layer that is disposed between the antenna element and the dielectric member to adhere the antenna element onto the dielectric member, the adhesive layer being made of a third dielectric material.