Protective Layer Patents (Class 347/203)
  • Patent number: 11926156
    Abstract: The present disclosure provides a thermal print head and a method of fabricating the thermal print head. The thermal print head includes a substrate made of a semiconductor material and having a main surface and a convex portion, a resistor layer including a plurality of heat generating portions on the convex portion, and a wiring layer conducted to the plurality of heat generating portions and formed to contact the resistor layer. The convex portion has a top surface, a first inclined surface and a second inclined surface. At least one of two ends of the convex portion in the main scanning direction forms a third inclined surface connected to the main surface and the first inclined surface, and a fourth inclined surface connected to the main surface and the second inclined surface.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: March 12, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Satoshi Kimoto
  • Patent number: 11667117
    Abstract: An electronic device includes a switching element, a first common-electrode wiring, at least a part of the first common-electrode wiring being covered with the switching element, a plurality of second common-electrode wirings branched from the part of the first common-electrode wiring covered with the switching element, a plurality of individual power-output terminals arranged in a row in the switching element, and a plurality of individual-electrode wirings arranged in a row, the plurality of individual-electrode wirings being connected to the plurality of individual power-output terminals, respectively. Each of the plurality of second common-electrode wirings is disposed between the plurality of individual-electrode wirings.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: June 6, 2023
    Assignee: RICOH COMPANY, LTD.
    Inventor: Hitoshi Kida
  • Patent number: 11385386
    Abstract: A nanostructured material system for efficient collection of photo-excited carriers is provided. They system comprises a plurality of plasmonic metal nitride core material elements coupled to a plurality of semiconductor material elements. The plasmonic nanostructured elements form ohmic junctions at the surface of the semiconductor material or at close proximity with the semiconductor material elements. A nanostructured material system for efficient collection of photo-excited carriers is also provided, comprising a plurality of plasmonic transparent conducting oxide core material elements coupled to a plurality of semiconductor material elements. The field enhancement, local temperature increase and energized hot carriers produced by nanostructures of these plasmonic material systems play enabling roles in various chemical processes. They induce, enhance, or mediate catalytic activities in the neighborhood when excited near the resonance frequencies.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: July 12, 2022
    Assignee: Purdue Research Foundation
    Inventors: Urcan Guler, Alberto Naldoni, Alexander Kildishev, Alexandra Boltasseva, Vladimir M. Shalaev
  • Patent number: 10953663
    Abstract: A thermal head includes: an underglaze layer provided on an insulating substrate; an electrode provided on the underglaze layer; a heat generator provided on the electrode; a first protective layer containing a glass material and covering at least the heat generator; and a second protective layer provided on the first protective layer, having a melting point higher than that of the first protective layer, and made of a material whose thermal expansion coefficient at a temperature of 1000° C. or lower is substantially constant.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: March 23, 2021
    Assignee: AOI Electronics Co., Ltd.
    Inventors: Michihiro Miyashige, Noriaki Onishi, Norio Yamaji
  • Patent number: 10527407
    Abstract: Embodiments of the present disclosure relate to apparatus and methods for forming films having uniformity of thickness on substrates. Embodiments of the present disclosure may be used to measure thickness or other properties of films being deposited on a substrate without knowing beforehand the surface properties of the substrate. Embodiments of the present disclosure may be used to measure thickness or other properties of a plurality of layers being formed. For example, embodiments of the present disclosure may be used in measuring thickness of vertical memory stacks.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: January 7, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Khokan C. Paul, Edward Budiarto, Todd Egan, Mehdi Vaez-Iravani, Jeongmin Lee, Dale R. Du Bois, Terrance Y. Lee
  • Patent number: 10245843
    Abstract: A thermal head of the disclosure includes a substrate; a heat generating section disposed on the substrate; an electrode disposed on the substrate, the electrode having a connecting portion connected to the heat generating section; and a protective layer which covers the heat generating section and the connecting portion of the electrode, a part of the protective layer which is disposed on the connecting portion having a closed first void therein.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: April 2, 2019
    Assignee: KYOCERA CORPORATION
    Inventor: Yuuki Matsusaki
  • Patent number: 10160228
    Abstract: A thermal head includes a substrate, a heat storage layer disposed on the substrate and including a bulging portion, heating elements disposed on the bulging portion, a protective layer disposed on the heating elements, and a covering layer disposed on the protective layer. The covering layer includes a first portion disposed apart from the bulging portion, and a second portion disposed between the bulging portion and the first portion. The height of the second portion from the substrate is smaller than the height of the first portion from the substrate.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: December 25, 2018
    Assignee: KYOCERA CORPORATION
    Inventors: Yui Tanaka, Youichi Moto
  • Patent number: 10145007
    Abstract: [Problem] To produce a DLC film excellent in hardness and adhesiveness while preventing a film-forming rate from slowing even when the gas pressure in a chamber is a low pressure without requiring a large-scale facility such as a thermostatic device. [solution] There is provided a DLC film film-forming method being a film-forming method to film-form a DLC film on a substrate by a plasma CVD method, the method including: setting a voltage to be applied to a substrate using a DC pulse power supply to a bias voltage; using an acetylene gas or a methane gas as a film-forming gas to be supplied into a chamber; setting the total pressure of the gas in the chamber to not less than 0.5 Pa and not more than 3 Pa when the methane gas is used; setting the total pressure of the gas in the chamber to not less than 0.3 Pa and not more than 3 Pa when the acetylene gas is used; and setting the bias voltage to not less than 0.9 kV and not more than 2.2 kV.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: December 4, 2018
    Assignee: DOWA THERMOTECH CO., LTD.
    Inventors: Hiroki Tashiro, Hiroyuki Matsuoka, Motohiro Watanabe, Wataru Sakakibara, Soichiro Nogami
  • Patent number: 9744775
    Abstract: A thermal head includes a substrate; a plurality of heating elements; a plurality of electrodes; a first covering layer; and a covering member. The thermal head further includes a second covering layer extending from the first covering layer onto the end surface. The housing is in contact with the second covering layer.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: August 29, 2017
    Assignee: KYOCERA CORPORATION
    Inventors: Yuuna Ookubo, Yoichi Moto, Yui Tanaka
  • Patent number: 9440450
    Abstract: A thermal head which is capable of reducing heat concentration on heat generation portions, and a thermal printer provided with the thermal head are provided. A thermal head includes a substrate; a plurality of heat generation portions which are disposed aligned on the substrate; electrodes which are electrically connected to the heat generation portions; and a protection layer which coats the heat generation portions and a part of the respective electrodes. The protection layer includes a first protection layer which is disposed on the heat generation portions and a second protection layer which is disposed on the first protection layer and has a higher thermal conductivity than that of the first protection layer. A width of the second protection layer is larger than that of the first protection layer when seen in an arrangement direction of the heat generation portions.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: September 13, 2016
    Assignee: KYOCERA CORPORATION
    Inventors: Shigetaka Shintani, Masashi Yoneta
  • Patent number: 9315415
    Abstract: The method for depositing a film of the present invention comprises the first film deposition step of depositing a first film 103 having hardness higher than hardness of a substrate 101 on a surface of the substrate 101, the first irradiation step of irradiating particles having energy on the first film 103, and the second film deposition step of depositing an oil-repellent film 105 on a surface of the first film 103 subjected to the first irradiation step. According to the present invention, a method for depositing a film enabling production of an oil-repellent substrate comprising an oil-repellent film having abrasion resistance of a practically sufficient level can be provided.
    Type: Grant
    Filed: August 24, 2009
    Date of Patent: April 19, 2016
    Assignee: Shincron Co., Ltd.
    Inventors: Ichiro Shiono, Ekishu Nagae, Yousong Jiang, Takuya Sugawara
  • Patent number: 9238376
    Abstract: There are provided a thermal head capable of decreasing the possibility of occurrence of layer separation in a protective layer, and a thermal printer equipped with the same. A thermal head includes a substrate; an electrode disposed on the substrate; an electric resistor connected to the electrode, part of which serves as a heat-generating section; and a protective layer disposed on the electrode and on the heat-generating section. The protective layer includes a first layer containing silicon nitride or silicon oxide; and a second layer disposed on the first layer, containing tantalum oxide and silicon oxynitride.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: January 19, 2016
    Assignee: KYOCERA CORPORATION
    Inventors: Kouji Ochi, Hiroshi Masutani, Youichi Moto, Yoshihiko Fujiwara
  • Patent number: 9050826
    Abstract: A thermal head includes: a substrate; a heat storage layer disposed on the substrate; a heat-generating section disposed on the heat storage layer; an electrode electrically connected to the heat-generating section; a protection layer which coats the heat-generating section and a part of the electrode; and a first coating layer which coats a part of the protection layer and is disposed downstream in a transportation direction of a recording medium, with respect to the heat-generating section, the first coating layer including a first protrusion protruding towards a recording medium side, an end on a heat-generating section side of the first coating layer being positioned between the first protrusion and the heat-generating section, and the end on the heat-generating section side of the first coating layer being positioned in a range of L/2 from the heat-generating section, in which L is a distance between the heat-generating section and the first protrusion.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: June 9, 2015
    Assignee: Kyocera Corporation
    Inventors: Shouji Hirose, Yoshiyuki Kondou, Yuuji Kashima
  • Publication number: 20150009270
    Abstract: A thermal head includes: a substrate; a heat storage layer disposed on the substrate; a heat-generating section disposed on the heat storage layer; an electrode electrically connected to the heat-generating section; a protection layer which coats the heat-generating section and a part of the electrode; and a first coating layer which coats a part of the protection layer and is disposed downstream in a transportation direction of a recording medium, with respect to the heat-generating section, the first coating layer including a first protrusion protruding towards a recording medium side, an end on a heat-generating section side of the first coating layer being positioned between the first protrusion and the heat-generating section, and the end on the heat-generating section side of the first coating layer being positioned in a range of L/2 from the heat-generating section, in which L is a distance between the heat-generating section and the first protrusion.
    Type: Application
    Filed: January 31, 2013
    Publication date: January 8, 2015
    Applicant: KYOCERA CORPORATION
    Inventors: Shouji Hirose, Yoshiyuki Kondou, Yuuji Kashima
  • Publication number: 20140333708
    Abstract: There are provided a thermal head capable of decreasing the possibility of occurrence of layer separation in a protective layer, and a thermal printer equipped with the same. A thermal head includes a substrate; an electrode disposed on the substrate; an electric resistor connected to the electrode, part of which serves as a heat-generating section; and a protective layer disposed on the electrode and on the heat-generating section. The protective layer includes a first layer containing silicon nitride or silicon oxide; and a second layer disposed on the first layer, containing tantalum oxide and silicon oxynitride.
    Type: Application
    Filed: November 26, 2012
    Publication date: November 13, 2014
    Applicant: KYOCERA CORPORATION
    Inventors: Kouji Ochi, Hiroshi Masutani, Youichi Moto, Yoshihiko Fujiwara
  • Patent number: 8885005
    Abstract: A thermal head and a thermal printer are disclosed. The thermal head includes a substrate, an electrode on the substrate, a heating portion connected to the electrode, and a protective layer on the heating portion. The protective layer includes a first layer and a second layer. The first layer is disposed on the heating portion and includes silicon carbonitride. The second layer is disposed on the first layer and includes silicon oxide.
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: November 11, 2014
    Assignee: Kyocera Corporation
    Inventors: Hiroshi Masutani, Yoshihiko Fujiwara, Kouji Ochi
  • Publication number: 20140232807
    Abstract: A thermal head and a thermal printer are disclosed. The thermal head includes a substrate, an an electrode on the substrate, a heating portion connected to the electrode, and a protective layer on the heating portion. The protective layer includes a first layer and a second layer. The first layer is disposed on the heating portion and includes silicon carbonitride. The second layer is disposed on the first layer and includes silicon oxide.
    Type: Application
    Filed: May 15, 2012
    Publication date: August 21, 2014
    Applicant: Kyocera Corporation
    Inventors: Hiroshi Masutani, Yoshihiko Fujiwara, Kouji Ochi
  • Patent number: 8803931
    Abstract: A thermal head capable of reducing abrasion of the conductive layer and reducing damage of heat-generating portions is provided. A thermal head includes a substrate, a plurality of heat-generating portions disposed on or above the substrate, electrodes provided on or above the substrate and electrically connected to the plurality of heat-generating portions, and a protective layer provided along an arrangement direction of the plurality of heat-generating portions, the protective layer covering the plurality of heat-generating portions and the electrodes. The protective layer has an electrical insulating layer covering the plurality of heat-generating portions and the electrodes, a conductive layer provided on the electrical insulating layer, and an abrasion resistance layer provided on the conductive layer. Part of the conductive layer is an exposed portion exposed from the abrasion resistance layer.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: August 12, 2014
    Assignee: Kyocera Corporation
    Inventor: Yoichi Moto
  • Patent number: 8780153
    Abstract: A thermal head wherein abrasion of an insulating protection film of a heating resistor formed on a partial glaze layer can be suppressed. A heating resistor is provided on the partial glaze layer provided on a ceramic substrate in the longitudinal direction, and the entire surface including the heating resistor is covered by the insulating protection film. A level difference is formed between the insulating protection film over the heating resistor and a flat portion of the insulating protection film over the area outside of the partial glaze layer. The level difference is set so that the insulating protection film on the heating resistor defines a higher portion and a platen roller can press thermal paper on the insulating protection film over the heating resistor and on the flat insulating protection film outside of the partial glaze layer. Thereby, the pressing force of the platen roller can be dispersed.
    Type: Grant
    Filed: June 17, 2010
    Date of Patent: July 15, 2014
    Assignee: AOI ELectronics Co., Ltd.
    Inventor: Norio Yamaji
  • Patent number: 8619106
    Abstract: A thermal head capable of dissipating heat accumulated in a heat accumulating layer efficiently and achieving clear printing, and a thermal printer including the thermal head are provided. A thermal head includes a substrate, a heat accumulating layer disposed on part of the substrate, a heat generating portion disposed on the heat accumulating layer, an electrode electrically connected to the heat generating portion, a protective layer that covers the heat generating portion and part of the electrode, and an insulating layer having thermal conductivity, the insulating layer covering part of a region of the electrode which region is not covered with the protective layer. The insulating layer covers part of the protective layer and extends over the heat accumulating layer.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: December 31, 2013
    Assignee: Kyocera Corporation
    Inventors: Yoshihiro Inokuma, Takahiro Shimozono, Yasuyuki Tanaka
  • Publication number: 20130328988
    Abstract: A thermal head capable of reducing abrasion of the conductive layer and reducing damage of heat-generating portions is provided. A thermal head includes a substrate, a plurality of heat-generating portions disposed on or above the substrate, electrodes provided on or above the substrate and electrically connected to the plurality of heat-generating portions, and a protective layer provided along an arrangement direction of the plurality of heat-generating portions, the protective layer covering the plurality of heat-generating portions and the electrodes. The protective layer has an electrical insulating layer covering the plurality of heat-generating portions and the electrodes, a conductive layer provided on the electrical insulating layer, and an abrasion resistance layer provided on the conductive layer. Part of the conductive layer is an exposed portion exposed from the abrasion resistance layer.
    Type: Application
    Filed: February 24, 2012
    Publication date: December 12, 2013
    Applicant: Kyocera Corporation
    Inventor: Yoichi Moto
  • Publication number: 20130307916
    Abstract: A thermal head includes a substrate, a glass-made thermal storage layer disposed on one main surface of the substrate so as to extend to an edge of the substrate; electrodes disposed on or above the thermal storage layer apart from the edge of the substrate; heat-generating resistors disposed above the thermal storage layer apart from the edge of the substrate, the heat-generating resistors being connected to the electrodes; and a first covering layer disposed on or above the electrodes and the heat-generating resistors. The first covering layer extends from atop the electrodes and the heat-generating resistors toward atop the thermal storage layer on the edge of the substrate, and a protection film is disposed on or above the first covering layer disposed on or above the electrodes and the heat-generating resistors and an edge of the protection film is not disposed above the edge of the substrate.
    Type: Application
    Filed: January 25, 2012
    Publication date: November 21, 2013
    Applicant: Kyocera Corporation
    Inventors: Yuuki Matsusaki, Kouji Ochi, Tadashi Mitsuoka
  • Patent number: 8325209
    Abstract: There are provided a recording head capable of properly maintaining the function of a protective layer, and a recording apparatus provided with the recording head. A thermal head includes a substrate, a heat-generating element disposed on the substrate, and a protective layer disposed on the heat-generating element. The protective layer includes first layers and second layers. The first layers and the second layers are laminated one after another alternately multiple times. A constituent material of the second layer having higher sublimation resistance than a constituent material of the first layer.
    Type: Grant
    Filed: May 27, 2009
    Date of Patent: December 4, 2012
    Assignee: Kyocera Corporation
    Inventors: Hiroshi Masutani, Kouji Ochi, Tetsuya Ookubo
  • Publication number: 20120242773
    Abstract: A thermal-transfer laminate film includes a base film, an untransferring release layer, and an image protection layer. The untransferring release layer is provided on the base film and includes a first thermoplastic resin having a first I/O value. The image protection layer is provided on the untransferring release layer and includes a second thermoplastic resin having a second I/O value, an absolute value of a difference between the first I/O value and the second I/O value being larger than 0.40.
    Type: Application
    Filed: March 9, 2012
    Publication date: September 27, 2012
    Inventor: Ryo YASUMATSU
  • Publication number: 20120224015
    Abstract: Adopted is a thermal head, including: a heating resistor provided on a support substrate; a pair of electrode formed on the heating resistor so as to be spaced apart in a direction along a surface of the heating resistor, the pair of electrodes respectively having inclined surfaces which are spaced apart from each other as a distance from the support substrate increases; a burying film for burying a region between the pair of electrodes; and a protective film formed on the region buried by the burying film and on the pair of electrodes.
    Type: Application
    Filed: March 1, 2012
    Publication date: September 6, 2012
    Inventors: Norimitsu SANBONGI, Noriyoshi SHOJI, Toshimitsu MOROOKA, Keitaro KOROISHI
  • Publication number: 20120147118
    Abstract: A thermal print head includes a substrate, an electrode layer supported on the substrate and provided with a plurality of mutually spaced-apart portions, a resistor layer provided with a plurality of heating portions arranged along a primary scanning direction, the heating portions lying across the spaced-apart portions, and a protective layer configured to cover the resistor layer, the protective layer including a first layer made of glass matrix and a plurality of alumina grains mixed into the glass matrix.
    Type: Application
    Filed: December 8, 2011
    Publication date: June 14, 2012
    Applicant: ROHM CO., LTD.
    Inventor: Syojiro DAICHO
  • Patent number: 8009185
    Abstract: A thermal head (A) according to the present invention includes a substrate (1) on which a heat-producing resistor (5), a common electrode (3) and individual electrodes (4) for energizing the heat-producing resistor (5), and a protective layer (6) having a double-layer structure and formed on the heat-producing resistor (5) to cover at least the heat-producing resistor are provided. A second protective layer (6B) constituting the upper layer of the protective layer (6) is conductive, and a first protective layer (6A) constituting the lower layer of the protective layer (6) has thickness (t1) which is not less than three times the thickness (t2) of the second protective layer (6B).
    Type: Grant
    Filed: June 13, 2005
    Date of Patent: August 30, 2011
    Assignee: Rohm Co., Ltd.
    Inventor: Teruhisa Sako
  • Publication number: 20110187807
    Abstract: There are provided a recording head capable of properly maintaining the function of a protective layer, and a recording apparatus provided with the recording head. A thermal head includes a substrate, a heat-generating element disposed on the substrate, and a protective disposed on the heat-generating element. The protective layer includes first layers and second layers. The first layers and the second layers are laminated one after another alternately multiple times. A constituent material of the second layer having higher sublimation resistance than a constituent material of the first layer.
    Type: Application
    Filed: May 27, 2009
    Publication date: August 4, 2011
    Applicant: KYOCERA CORPORATION
    Inventors: Hiroshi Masutani, Kouji Ochi, Tetsuya Ookubo
  • Patent number: 7969459
    Abstract: A thermal printhead (A) includes an insulating substrate (1), a heating resistor (2) provided on the substrate (1) and a protective film (4) covering the heating resistor (2). The protective film (4) is made up of a first layer (41), a second layer (42) and a third layer (43). The first layer (41) is held in contact with the heating resistor (2). The second layer (42) covers the first layer (41). The second layer (42) is harder than the first layer (41) and has a higher thermal conductivity than that of the first layer (41). The third layer (43) is the outermost layer and covers the second layer (42). The third layer (43) is harder than the second layer (42) and thinner than the second layer (42).
    Type: Grant
    Filed: February 21, 2008
    Date of Patent: June 28, 2011
    Assignee: Rohm Co., Ltd.
    Inventors: Naofumi Kanei, Takumi Yamade
  • Patent number: 7969458
    Abstract: A thermal printhead (A1) includes a substrate (1) and a heating resistor (3) supported by the substrate (1). An electrode pattern (2) is formed in contact with the heating resistor (3) for applying driving voltage. The heating resistor (3) is covered with a protective film (5). The protective film (5) includes a high thermal conductivity layer (51) and a low thermal conductivity layer (52) laminated on the high thermal conductivity layer. The low thermal conductivity layer (52) is positioned farther from the heating resistor (3) than the high thermal conductivity layer (51) is.
    Type: Grant
    Filed: July 26, 2007
    Date of Patent: June 28, 2011
    Assignee: Rohm Co., Ltd.
    Inventor: Takumi Yamade
  • Patent number: 7965307
    Abstract: A thermal head is disclosed. The thermal head includes a heat generating element row in which plural heat generating elements are arrayed in a main scanning direction and a glaze that stores heat generated from the respective heat generating elements. The thermal head records an image on a recording medium by causing the respective heat generating elements to generate heat while conveying the recording medium in a sub-scanning direction. A plurality of the heat generating element rows are arrayed in the sub-scanning direction. The glaze includes plural convex portions arranged in the sub-scanning direction in association with the number of arrays of the heat generating element rows. The heat generating elements are arranged on upper sides of the convex portions, respectively.
    Type: Grant
    Filed: November 19, 2007
    Date of Patent: June 21, 2011
    Assignee: Sony Corporation
    Inventors: Takaaki Murakami, Yasushi Hirumi
  • Patent number: 7911489
    Abstract: A thermal print head A includes a substrate 1, a heat generating resistor 3 supported by the substrate 1, and a protective layer 4 which covers the heat generating resistor 3. The protective layer 4 includes a first inner layer 41 which is in contact with the heat generating resistor 3, a second inner layer 42 formed on the first inner layer 41, and an outer layer 43. Part of the second inner layer 42 is formed as a rough surface 42a which has a surface roughness of Ra 0.1 through 0.3. The rough surface 42a is disposed at a position corresponding to the heat generating resistor 3. The outer layer 43 is made of a metal nitride or a chemical compound containing a metal nitride, and has a thickness of 0.1 through 0.5 ?m.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: March 22, 2011
    Assignee: Rohm Co., Ltd.
    Inventors: Takumi Yamade, Naofumi Kanei
  • Patent number: 7903132
    Abstract: A thermal printhead (A1) includes an insulating substrate and a heating resistor element (3) formed on the substrate and elongated in the primary scanning direction. A plurality of electrodes are connected to the heating resistor element (3). The electrodes and the heating resistor element (3) are covered by a protective film (4). The protective film (4) includes a first layer (41), a second layer (42) and a third layer (43). The second layer (42) is porous and includes a plurality of pores (42a). The third layer (43) partially enters each of the pores (42a) so that the upper surface pf the protective film (4) is an irregular surface including a plurality or recesses (4a).
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: March 8, 2011
    Assignee: Rohm Co., Ltd.
    Inventors: Teruhisa Sako, Naofumi Kanei
  • Publication number: 20110032320
    Abstract: Provided is a thermal head (1) including: a substrate body (12) constituted through bonding a flat supporting substrate (13) and a flat upper substrate (11), which are made of a glass material onto each other in a stacked state; a heating resistor (14) formed on a surface of the upper substrate (11); and a protective film (18) that partially covers the surface of the upper substrate (11) including the heating resistor (14) and protects the heating resistor (14), in which a heat-insulating concave portion (32) and thickness-measuring concave portions (34), which are open to a bonding surface between the supporting substrate and the upper substrate (11) and form cavities are provided in the supporting substrate (13), the heat-insulating concave portion (32) is formed at a position opposed to the heating resistor (14), and the thickness-measuring concave portions (34) is formed in a region that is prevented from being covered with the protective film (18).
    Type: Application
    Filed: August 3, 2010
    Publication date: February 10, 2011
    Inventors: Noriyoshi Shoji, Norimitsu Sanbongi, Toshimitsu Morooka, Keitaro Koroishi
  • Patent number: 7876344
    Abstract: A photographic printing method includes the steps of thermally transferring a color material onto a recording medium; further transferring an image protection layer thermally onto the recording medium having the color material; and processing the surface of the image protection layer so as to satisfy following conditions (1) to (6), (1) The 20° specular glossiness of the surface of the image protection layer is 30% or less; (2) When the optical comb width is 2.0 mm, the image clarity value is 30% or less; (3) When the optical comb width is 1.0 mm, the image clarity value is 5.0% or more; (4) When the optical comb width is 0.5 mm, the image clarity value is 4.0% or more; (5) When the optical comb width is 0.25 mm, the image clarity value is 3.0% or more; and (6) When the optical comb width is 0.125 mm, the image clarity value is 3.0% or more.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: January 25, 2011
    Assignee: Sony Corporation
    Inventor: Yasuo Suzuki
  • Patent number: 7876343
    Abstract: A thermal printhead A includes a glaze layer 2 formed on an insulating substrate 1, a resistor layer 3 formed on the glaze layer, a conductor layer 4 formed so that part of the resistor layer is exposed to serve as a heating portion 3c and a protective film 5 formed to cover the conductor layer 4 and the heating portion 3c. The protective film 5 includes a lower first protective layer 5a, and an upper second protective layer 5b overlapping the first protective layer 5a and serving as the outermost layer. The first protective layer 5a has a hardness of 500 to 800 Hk and a thickness of 1 to 2 ?m. The second protective layer 5b has a hardness of 1000 to 2000 Hk and a thickness of 5 to 8 ?m.
    Type: Grant
    Filed: June 6, 2006
    Date of Patent: January 25, 2011
    Assignee: Rohm Co., Ltd.
    Inventor: Takumi Yamade
  • Patent number: 7859556
    Abstract: A thermal head has a heat storage layer provided on an insulating substrate and a heat generating resistance layer provided on the heat storage layer. An individual electrode and a common electrode are formed on the heat generating resistance layer, and a protective film layer covers the electrodes and the heat generating resistance layer. A resin covering layer is formed on the surface of the protective film layer by applying and drying fluorine-based resin particles dissolved in a solvent on the surface.
    Type: Grant
    Filed: February 13, 2007
    Date of Patent: December 28, 2010
    Assignee: Seiko Instruments Inc.
    Inventors: Noriyoshi Shoji, Yoshinori Sato, Hirokazu Suzuki
  • Publication number: 20100085412
    Abstract: A thermal printhead (A) includes an insulating substrate (1), a heating resistor (2) provided on the substrate (1) and a protective film (4) covering the heating resistor (2). The protective film (4) is made up of a first layer (41), a second layer (42) and a third layer (43). The first layer (41) is held in contact with the heating resistor (2). The second layer (42) covers the first layer (41). The second layer (42) is harder than the first layer (41) and has a higher thermal conductivity than that of the first layer (41). The third layer (43) is the outermost layer and covers the second layer (42). The third layer (43) is harder than the second layer (42) and thinner than the second layer (42).
    Type: Application
    Filed: February 21, 2008
    Publication date: April 8, 2010
    Applicant: ROHM CO., LTD.
    Inventors: Naofumi Kanei, Takumi Yamade
  • Publication number: 20100066798
    Abstract: A thermal print head A includes a substrate 1, a heat generating resistor 3 supported by the substrate 1, and a protective layer 4 which covers the heat generating resistor 3. The protective layer 4 includes a first inner layer 41 which is in contact with the heat generating resistor 3, a second inner layer 42 formed on the first inner layer 41, and an outer layer 43. Part of the second inner layer 42 is formed as a rough surface 42a which has a surface roughness of Ra 0.1 through 0.3. The rough surface 42a is disposed at a position corresponding to the heat generating resistor 3. The outer layer 43 is made of a metal nitride or a chemical compound containing a metal nitride, and has a thickness of 0.1 through 0.5 ?m.
    Type: Application
    Filed: March 11, 2008
    Publication date: March 18, 2010
    Inventors: Takumi Yamade, Naofumi Kanei
  • Publication number: 20090201355
    Abstract: A thermal head which forms an image on a recording medium by pressing a protruding portion on which heating elements are arranged on the recording medium while driving the heating elements to be heated includes a support substrate in which a concave gap portion facing the protruding portion is formed and a glaze layer provided on the support substrate and in which the protruding portion is formed, in which the glaze layer has a base layer stacked on the support substrate as well as forming a ceiling surface of the gap portion and a heat resistant layer stacked on the base layer and on which the heating elements are arranged.
    Type: Application
    Filed: January 29, 2009
    Publication date: August 13, 2009
    Applicant: Sony Corporation
    Inventors: Noboru Koyama, Mitsuo Yanase, Toru Morikawa, Kazunori Onuma
  • Publication number: 20090174757
    Abstract: A thermal printhead (A1) includes an insulating substrate and a heating resistor element (3) formed on the substrate and elongated in the primary scanning direction. A plurality of electrodes are connected to the heating resistor element (3). The electrodes and the heating resistor element (3) are covered by a protective film (4). The protective film (4) includes a first layer (41), a second layer (42) and a third layer (43). The second layer (42) is porous and includes a plurality of pores (42a). The third layer (43) partially enters each of the pores (42a) so that the upper surface pf the protective film (4) is an irregular surface including a plurality or recesses (4a).
    Type: Application
    Filed: June 19, 2007
    Publication date: July 9, 2009
    Applicant: ROHM CO., LTD.
    Inventors: Teruhisa Sako, Naofumi Kanei
  • Publication number: 20090115830
    Abstract: A thermal printhead (A) includes an insulating substrate (1), a glaze layer (2), a resistor layer (3), an electrode layer (4) and a protective layer (5). The electrode layer (4) has a two-layer structure made up of a lower first electrode layer (4a) and an upper second electrode layer (4b). The resistor layer (3) includes a heating portion (7). The heating portion (7) is exposed from both the first electrode layer (4a) and the second electrode layer (4b) and is positioned on a bulging portion (2c) of the glaze layer (2).
    Type: Application
    Filed: June 13, 2006
    Publication date: May 7, 2009
    Applicant: ROHM CO., LTD.
    Inventor: Takumi Yamade
  • Publication number: 20090102910
    Abstract: A thermal head (A) according to the present invention includes a substrate (1) on which a heat-producing resistor (5), a common electrode (3) and individual electrodes (4) for energizing the heat-producing resistor (5), and a protective layer (6) having a double-layer structure and formed on the heat-producing resistor (5) to cover at least the heat-producing resistor are provided. A second protective layer (6B) constituting the upper layer of the protective layer (6) is conductive, and a first protective layer (6A) constituting the lower layer of the protective layer (6) has thickness (t1) which is not less than three times the thickness (t2) of the second protective layer (6B).
    Type: Application
    Filed: June 13, 2005
    Publication date: April 23, 2009
    Inventor: Teruhisa Sako
  • Patent number: 7502044
    Abstract: A thermal head includes a substrate, heating resistors aligned on a surface of the substrate, an electrode pattern connected to the heating resistors, a protective film that covers the heating resistors and the electrode pattern, and a conductive film that covers an upper surface of the protective film. The conductive film has an opening at least in an area above the arrangement of the heating resistors, and the surface of the protective film is exposed through the opening. An edge of the conductive film adjacent to the opening is inclined outward so that the area of the opening gradually increases as the distance from the exposed surface of the protective film. The thermal head may be used as a printing device in facsimile machines and video printers.
    Type: Grant
    Filed: April 14, 2006
    Date of Patent: March 10, 2009
    Assignee: Kyocera Corporation
    Inventor: Shigetaka Shintani
  • Publication number: 20080117277
    Abstract: A photographic printing method includes the steps of thermally transferring a color material onto a recording medium; further transferring an image protection layer thermally onto the recording medium having the color material; and processing the surface of the image protection layer so as to satisfy following conditions (1) to (6), (1) The 20° specular glossiness of the surface of the image protection layer is 30% or less; (2) When the optical comb width is 2.0 mm, the image clarity value is 30% or less; (3) When the optical comb width is 1.0 mm, the image clarity value is 5.0% or more; (4) When the optical comb width is 0.5 mm, the image clarity value is 4.0% or more; (5) When the optical comb width is 0.25 mm, the image clarity value is 3.0% or more; and (6) When the optical comb width is 0.125 mm, the image clarity value is 3.0% or more.
    Type: Application
    Filed: October 29, 2007
    Publication date: May 22, 2008
    Applicant: SONY CORPORATION
    Inventor: Yasuo Suzuki
  • Patent number: 7297454
    Abstract: A colorless ink jet ink composition is provided for printers for printing on both porous and hybrid glossy or semi-glossy media. The ink composition comprises a water soluble polymer or dispersed latex. The ink formulation provides substantially air fast, stain resistant, and light fastness to the printed image. Further, the ink formulation evidences improved overall image quality.
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: November 20, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Zeying Ma, John M Gardner, Gregg A Lane
  • Patent number: 7170539
    Abstract: In a thermal head provided with a resistance layer having a plurality of heating element portions which generate heat by energization, an insulating barrier layer which determines the two-dimensional size of each heating element portion by covering each heating element portion, and electrode layers electrically connected to two end portions of each of the plural heating element portions, in the length direction of the resistance, a heat transfer layer is disposed on at least the insulating barrier layer to determine the two-dimensional surface exposure area of the insulating barrier layer by covering part of the insulating barrier layer and to dissipate the heat generated from the plural heating element portions, and surface exposure regions of the insulating barrier layer are specified as effective heating regions of the plural heating element portions by adjusting the two-dimensional size of the heat transfer layer.
    Type: Grant
    Filed: January 6, 2005
    Date of Patent: January 30, 2007
    Assignee: Alps Electric Co., Ltd.
    Inventors: Toshifumi Nakatani, Shuuichi Usami, Hirotoshi Terao
  • Patent number: 7106356
    Abstract: A method of producing a wear-resistant protective film for a thermal head comprises depositing a wear-resistant protective film by sputtering on a thermal head which includes a substrate, and a heat-developing layer and a pair of electrodes formed on either the substrate or a heat-regenerative layer formed thereon. A layer of the wear resistant protective film is formed under a RF larger bias and another layer without a bias or with a smaller bias. Good step coverage is obtained by the RF sputter layer of the wear-resistant and the protective film prevents the intrusion of water that can cause cracking, and the layer formed under no or smaller bias reduces internal stresses and inhibits the development of cracks due to internal stresses as well as the cracking by RF sputtering.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: September 12, 2006
    Assignee: TDK Corporation
    Inventors: Masatoshi Nakayama, Masahiro Nakano, Tsukimi Endo
  • Patent number: 6972782
    Abstract: In order to reduce creases of an ink film so as to offer excellent printing quality, a thermal head for use in a thermal-transfer printer includes a heat-insulating layer; a first projection serving as a part of the heat-insulating layer; a heating element formed on the first projection; common and individual electrodes connected to the heating element; a driver IC connected to these two electrodes; a sealing member sealing the driver IC; and a second projection protruding upstream, with respect to the transport route of the ink film, of the center of a section where the heating element comes into contact with a platen, so as to lie beyond a line connecting the apexes of the first projection and the sealing member.
    Type: Grant
    Filed: January 25, 2005
    Date of Patent: December 6, 2005
    Assignee: Alps Electric Co., Ltd.
    Inventors: Hirotoshi Terao, Tomoko Wauke, Hisashi Hoshino, Tsuneyuki Sasaki
  • Patent number: 6784910
    Abstract: Providing a thermal head capable of preventing the adherence of a thermally active component, a thermal activation device for thermally active sheet employing the thermal head, and a printer assembly employing the thermal activation device.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: August 31, 2004
    Assignee: SII P & S Inc.
    Inventors: Yoshinori Sato, Shinichi Yoshida, Minoru Hoshino, Norimitsu Sambongi