Abstract: A printing apparatus includes a printing section configured to perform printing onto a medium while reciprocating in a movement area, and an attachment section to which a circuit board can be attached. The attachment section is movable between a first position above the movement area and a second position which is at least partially within the movement area.

Abstract: A discharge channel and a non-discharge channel are formed to have a similar shape, that is, to include extension portions and raise-and-cut portions continuing from end portions of both the extension portions, respectively. Then, imparting of a catalyst, washing of an unnecessary catalyst, plating, and the like are performed on a target surface, as a plating step. In an embodiment, an electrode clearance groove is formed after the plating step. Since channel grooves for the discharge channel and the non-discharge channel have a similar shape, it is possible to cause a water flow to uniformly flow in the channels when washing is performed, and thus to avoid an occurrence of a situation in which a lump is formed in the channel groove by plating.

Abstract: A testing probe including a base, an elastic extensible element and a probe needle. The probe needle is disposed on the base through the elastic extensible element, and the elastic extensible element is in a stretched state. The testing probe requires only coating silver adhesive on the testing area of the liquid crystal screen previously, eliminating the need to make solder wire, fix solder wire, etc., thereby simplifying preparation before testing and ensuring reliable connections, which greatly reduces testing time and improves testing efficiency. A testing device including the above testing probe.

Abstract: A fluid ejection die is described. The fluid ejection die comprises at least one nozzle to dispense fluid and is coupled to a support manifold. The support manifold has at least one channel passing therethrough to communicate fluid to the fluid ejection die for dispensation. The at least one channel has a fluid contact surface, and the support manifold comprises at least one recessed structure that is spaced apart from the fluid contact surface.

Abstract: A liquid discharge apparatus includes a first head unit configured to discharge a liquid, a second head unit configured to discharge a liquid, a first drive circuit configured to drive the first head unit, a second drive circuit configured to drive the second head unit, a circuit board on which the first drive circuit and the second drive circuit are provided, and a case that accommodates the circuit board. The case includes an inlet through which gas outside the case flows inside the case, and an outlet through which gas inside the case flows to the outside the case, and the first drive circuit generates more heat than the second drive circuit, and a distance between the first drive circuit and the inlet is shorter than a distance between the second drive circuit and the inlet.

Abstract: A semiconductor device is provided. The device comprises discharge units each including a discharge element and a driving unit configured to drive the discharge element, and a terminal unit configured to supply power to the discharge units via a wiring line. The discharge units include a first discharge unit including a first discharge element of the discharge elements and a first driving unit of the driving units and a second discharge unit including a second discharge element of the discharge elements and a second driving unit of the driving units. A length of a current path from the terminal unit to the first discharge unit is longer than a length of a current path from the terminal unit to the second discharge unit and a resistance of the first driving unit is lower than a resistance of the second driving unit.

Abstract: A method of forming a printbar module may include providing a printed circuit board (PCB) having a plurality of recesses extending partially through the PCB and a plurality of dams surrounding the plurality of recesses. An adhesive material may be applied to each of the plurality of recesses and a plurality of printhead die slivers may be positioned in the plurality of recesses. The Plurality of printhead die slivers may be bonded with the PCB and the plurality of printhead die slivers and the PCB may be encapsulated with a molding compound. In response to encapsulating, a plurality of slots, extending through the PCB and the adhesive material may be formed, wherein the plurality of slots are in fluidic communication with fluid feed holes of the plurality of printhead die slivers to provide direct fluidic communication without fan-out.

Abstract: A semiconductor device is provided. The device comprises discharge units each including a discharge element and a driving unit configured to drive the discharge element, and a terminal unit configured to supply power to the discharge units via a wiring line. The discharge units include a first discharge unit including a first discharge element of the discharge elements and a first driving unit of the driving units and a second discharge unit including a second discharge element of the discharge elements and a second driving unit of the driving units. A length of a current path from the terminal unit to the first discharge unit is longer than a length of a current path from the terminal unit to the second discharge unit and a resistance of the first driving unit is lower than a resistance of the second driving unit.

Abstract: In one example, a printhead structure includes multiple printhead dies and a printed circuit board embedded in a single monolithic molding with fully encapsulated wire bonds that electrically connect the dies to conductive routing in the printed circuit board. Fluid may pass through a slot in the molding directly to the dies.

Abstract: A piezoelectric device includes a substrate that includes a piezoelectric element formed by stacking a piezoelectric layer, a first electrode and a second electrode such that the piezoelectric layer is interposed between the first electrode and the second electrode; and a wiring substrate that includes a driving element providing a signal for driving the piezoelectric element to the substrate. The substrate has an inspection region where a piezoelectric element for inspection which is a portion of the piezoelectric element is disposed. The wiring substrate has an electrode inspection region including an electrode to be inspected that is electrically connected to the piezoelectric element for inspection and is disposed on a surface side opposite to the substrate, and a flexible substrate mounting region which is disposed on the surface side opposite to the substrate, and is connected to a flexible substrate.

Abstract: In example implementations, an apparatus with an interposer is provided. The apparatus may include an epoxy molded compound (EMC). A print head die and a drive integrated circuit (IC) may be embedded in the EMC. An interposer may also be embedded in the EMC. The print head die, the drive IC and the interposer may be wire bonded within the EMC.

Abstract: An actuator device includes an actuator substrate having actuators, individual conductors electrically connected with the actuators respectively, and dummy conductors; and a bonding member bonded to a surface of the actuator substrate provided with the individual conductors and the dummy conductors. The individual conductors are aligned in an alignment direction to form a first row and a second row arranged in an orthogonal direction orthogonal to the alignment direction. In a first end portion of the actuator substrate on one side in the alignment direction, first individual conductors are aligned in the alignment direction without intervening second individual conductors therebetween. In a second end portion of the actuator substrate on the other side in the alignment direction, the second individual conductors are aligned in the alignment direction without intervening the first individual conductors therebetween.

Abstract: Examples of an apparatus for flexible flat cable, installable within a print device, are described. The flexible flat cable may be connected to a print carriage assembly of the print device.

Abstract: An actuator device includes: an actuator including a first element contact; and a wire member including (a) a first contact connected to the first element contact and (b) a first wire configured to conduct with the first contact. A first wide portion is formed at a distal end portion of the first wire at an edge portion of the wire member. The first wide portion is disposed beyond the first element contact in a wire direction of the first wire. The first contact is disposed at a basal end portion of the first wire. The basal end portion is located further from the edge portion of the wire member than the first wide portion. The first contact is connected to the first element contact.

Abstract: An ink cartridge for an inkjet printer includes a bottom face and a front face; an ink interface on the front face of the ink cartridge for connection to a cartridge receiving structure; a guide interface in the bottom face for guiding the cartridge along a straight line during insertion into the cartridge receiving structure for connecting the ink interface; a latch track disposed in the bottom face of the ink cartridge to guide a latch of the cartridge receiving structure; a latch stop disposed in the latch track for engaging the latch, where the latch track comprises a locking track and an unlocking track to accommodate movement of the latch with respect to the latch stop, the locking track being at least partly separate from the unlocking track; and a latch guide for redirecting the latch towards the locking track, rather than the unlocking track.

Abstract: A liquid discharging head includes a print element substrate including an energy-generating element that generates energy used to discharge a liquid from a discharge port, and an electric wiring member including a plurality of contact pads arranged thereon. The plurality of contact pads are disposed in a contact area and include a first contact pad to which power for driving the energy-generating element is supplied and a second contact pad that has an electrostatic capacity lower than an electrostatic capacity of the first contact pad and that is disposed on an outer circumferential side of the contact area. The electric wiring member is connected to a ground of the print element substrate and includes a guard pad extending linearly outside the second contact pad.

Abstract: In an example implementation, a printhead includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding and flush with the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.

Abstract: A liquid discharge head includes a head body, a wiring member, a connector, and a protector. The head body discharges liquid. The wiring member transmits a signal to the head body. The connector is disposed at the wiring member to connect the wiring member to the head body. The protector covers the head body and the connector. The head body includes a fitting portion. The protector includes a fitting portion to fit the fitting portion of the head body in a fitting direction. The connector is disposed more backward than a leading end of the fitting portion of the protector in the fitting direction.

Abstract: In one example, a printhead includes: a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel; an electrical contact exposed outside the molding to connect to circuitry external to the printhead; a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; and an electrical connection between the die and the printed circuit board conductor fully encapsulated in the molding.

Abstract: An information processing apparatus includes a login screen display processing unit that causes a display device to display a login screen for enabling a request for login to an online shopping service that sells the consumables through a network to be made; a login request transmitting unit transmits the request for login to the online shopping service based on authentication information input through the login screen; a model identification information transmitting unit transmits model identification information for identifying a model of the information processing apparatus; and a screen display processing unit that, in response to a response to the login request, causes the display device to display a screen for enabling use of the online shopping service. The screen display processing unit displays, as articles to be sold, consumables extracted based on the transmitted model identification information from the consumables being sold by the online shopping service.

Abstract: There is provided a head module including: a head which has an inlet, a plurality of nozzles, and a plurality of driving elements, and in which the nozzles are aligned in rows in a longitudinal direction of a nozzle surface orthogonal to a attaching/detaching direction of the head module; a plurality of driver ICs; a heat spreader; a flexible substrate; and a rigid substrate. In the attaching/detaching direction, the driver ICs are arranged between the head and the heat spreader; the rigid substrate and the head are arranged side by side in the attaching/detaching direction; the rigid substrate and the heat spreader are arranged side by side in a short direction of the nozzle surface; and the rigid substrate has a thickness along the short direction of the nozzle surface.

Abstract: According to an aspect of the present disclosure, a liquid discharge head substrate includes a substrate having a parallelogram shape, a plurality of liquid discharge elements disposed on the substrate, a plurality of power supply terminals disposed along a first side of the substrate, and a first wiring, having a lattice shape, connected to the plurality of power supply terminals. On the substrate, the first side and a third side form an obtuse angle, and the first side and a fourth side form an acute angle. In the plurality of power supply terminals, the number of power supply terminals at positions closer to the third side than to the fourth side is larger than the number of power supply terminals at positions closer to the fourth side than to the third side.

Abstract: An electronic circuit board has at least one copper trace, at least one array of contact pads connected to the copper trace, a heater connected to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads will reflow. An electronic circuit board system has an electronic circuit board. The electronic circuit board includes at least one copper trace, at least one array of contact pads connected to the copper trace, a heater connection to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads with reflow, and a heater to connect to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads will reflow.

Abstract: A liquid discharge head includes a recording element substrate including a recording element, an electronic substrate disposed outside the recording element substrate, an electric element mounted on the electronic substrate, a housing that supports the recording element substrate and the electronic substrate and is made of a first resin material, and a cover member that surrounds and shields the electric element and is made of a second resin material, wherein the second resin material has higher heat resistance than the first resin material.

Abstract: A display device including a display panel including a substrate having one side on which a first conductive pattern is arranged, a flexible printed circuit board having one side on which a second conductive pattern that is connected to the first conductive pattern is arranged, and a dam pad positioned between the substrate and the flexible printed circuit board to be spaced apart from an area to which the second conductive pattern is connected.

Abstract: An electronic device includes a first substrate including a structure body protruded from one surface; and a second substrate stacked and disposed facing the one surface through a spacer, in which the first substrate and the spacer are bonded to each other by an adhesive, and in which the adhesive is extended up to the structure body along the one surface.

Abstract: One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.

Abstract: A piezoelectric device includes a substrate that includes a piezoelectric element formed by stacking a piezoelectric layer, a first electrode and a second electrode such that the piezoelectric layer is interposed between the first electrode and the second electrode; and a wiring substrate that includes a driving element providing a signal for driving the piezoelectric element to the substrate. The substrate has an inspection region where a piezoelectric element for inspection which is a portion of the piezoelectric element is disposed. The wiring substrate has an electrode inspection region including an electrode to be inspected that is electrically connected to the piezoelectric element for inspection and is disposed on a surface side opposite to the substrate, and a flexible substrate mounting region which is disposed on the surface side opposite to the substrate, and is connected to a flexible substrate.

Abstract: A printing fluid cartridge includes a front face oriented toward a first direction, a printing fluid supply portion positioned at the front face, a rear face positioned opposite the front face and oriented toward a second direction opposite the first direction, at least one electrical interface positioned between the front face and the rear face, and an engagement surface facing in the second direction. The at least one electrical interface is offset from the printing supply portion with respect to a third direction perpendicular to the first direction and the second direction. The at least one electrical interface is positioned closer to the front face than the engagement surface is, and the at least one electrical interface and the engagement surface intersect a plane which is parallel with the first direction, the second direction, and the third direction.

Abstract: A MEMS device includes a plurality of movable regions, wiring lines extending along a first direction from the movable regions, and electrodes connected to the wiring lines. The electrodes include connection regions for connecting other electrode terminals to the connection regions. A plurality of the connection regions are disposed along a second direction intersecting the first direction. A distance between centers of connection regions that are adjacent in the second direction is longer than a distance between centers of movable regions that are adjacent in the second direction.

Abstract: In one example, a printhead assembly includes multiple printheads arranged along a line in a staggered configuration in which each printhead in a group of far printheads overlaps a printhead in a group of near printheads. Each printhead includes a pedestal, a printhead die mounted to the pedestal, an IC to drive fluid ejector elements in the printhead die, and a flex circuit. The IC is connected to the printhead die and mounted to the pedestal next to the die. The body of a flex circuit is connected to and covers the IC. The tail of each flex circuit from a far printhead extends past a pedestal in a near printhead.

Abstract: A liquid ejecting head and a liquid ejecting apparatus that can suppress the influence of noise on a control signal includes a plurality of terminals for being electrically connected with a contact point provided in a liquid ejecting apparatus, and a liquid ejecting element substrate having a liquid ejecting element formed for ejecting liquid in response to a control signal transmitted from the liquid ejecting apparatus. The plurality of terminals includes signal terminals and ground terminals for control, for controlling the liquid ejecting element, and the signal terminals and the ground terminals for control are arranged at positions closer to the liquid ejecting element substrate than other terminals.

Abstract: In one example, a printhead structure includes multiple printhead dies and a printed circuit board embedded in a single monolithic molding with fully encapsulated wire bonds that electrically connect the dies to conductive routing in the printed circuit board. Fluid may pass through a slot in the molding directly to the dies.

Abstract: A valve comprises an orifice plate (1) having one or more orifices (4) through which a fluid may flow, and one or more piezo-electric elements (2). Each element (2) has a face positioned to contact the orifice plate at an orifice. Each element has a first state in which it abuts the plate to prevent flow of fluid through the associated orifice and a second state in which the face is spaced from the plate to allow flow through the associated orifice. A controller (50) selectively applies a first voltage to an elements to cause it to adopt the first state and applies a second voltage to the one or more elements to cause the elements to adopt the second state.

Abstract: A connector pin assembly configured to engage an electrical interface. The connector pin assembly comprises a conductive outer cylinder configured to be connected to a power supply that supplies current or voltage; a conductive inner cylinder located at least partially within the outer cylinder; and a biasing member disposed within the inner cylinder. The connector pin assembly further comprises a conductive plunger slidably disposed within and engaged with the inner cylinder and the biasing member; a non-conductive member disposed within the inner cylinder, the non-conductive member operable to restrict a current or voltage flowing through the connector pin along a path from the outer cylinder through the inner cylinder to the plunger without contacting the biasing member.

Abstract: Embodiments of the present disclosure are directed to a microfluidic delivery system that includes a microfluidic semiconductor die coupled to a flexible interconnect substrate to form an assembly. At least one embodiment is directed to a semiconductor die having an active surface that includes a layout that has electrically active bond pads along one side of the active surface of the die. A second side of the active surface of the die includes one or more mechanical pads.

Abstract: An inkjet head includes a substrate that defines a cavity in which ink is stored, a vibrating membrane that is supported by the substrate and that defines the cavity, and a piezoelectric device that is disposed on the vibrating membrane and that changes a volume of the cavity by displacing the vibrating membrane. A driving IC is mounted on the actuator substrate and drives the piezoelectric device.

Abstract: A liquid container mounted on a recording apparatus and containing a liquid in a liquid containing portion, including a first surface which faces the recording apparatus when the liquid container is mounted on the recording apparatus, and a second surface opposite to the first surface, wherein the liquid containing portion has, on a bottom surface which is a lower surface in a gravity direction when the liquid container is mounted on the recording apparatus, a first inclined surface inclining downward in the gravity direction from the first surface side to the second surface side and a second inclined surface inclining upward in the gravity direction from the first surface side to the second surface side in this order from the first surface side.

Abstract: A liquid discharge head includes a head body, a cover, a wiring member, and a grounding pattern. The head body has a liquid discharge face in which a nozzle to discharge liquid is disposed. The cover is disposed on the liquid discharge face of the head body. The wiring member has a wiring pattern connected to the head body. The wiring member includes a portion disposed on a side wall of the head body. The grounding pattern on the wiring member is electrically conducted to the cover with the wiring member interposed between the side wall of the head body and the cover.

Abstract: The present invention relates to an ink cartridge for an inkjet printer, the ink cartridge comprising a head chip of a print head to be surface-mounted on an FPCB by means of BGA so as to have each contact terminal, which is formed on the FPCB and the head chip, to be formed over a relatively wide area and therefore not require a high level of integration technology. Therefore, the ink cartridge enables easy manufacturing of the FPCB and the head chip and lowering of manufacturing cost. Also, since relatively low precision needs to be maintained during the mounting of the head chip on the FPCB such that each contact terminal comes into contact, the ink cartridge enables more convenient and faster manufacturing of the print head.

Abstract: In one example, a molded printhead includes a printhead die in a molding having a channel therein through which fluid may pass directly to a back part of the die. The front part of the die is exposed outside the molding surrounding the die. Electrical connections are made between terminals at the front part of the die and contacts to connect to circuitry external to the printhead.

Abstract: A piezoelectric device includes an actuator substrate that includes a plurality of piezoelectric element rows having a plurality of piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include a common electrodes common to the plurality of the piezoelectric elements. The actuator substrate includes a plurality of first common wirings connected to each of the common electrodes of the plurality of the piezoelectric element rows. The wiring substrate includes a plurality of second common wirings connected to each of the first common wirings of the plurality of piezoelectric element rows, and a plurality of auxiliary wirings buried in a groove portion formed in the wiring substrate. The auxiliary wirings are connected to each of the second common wirings, and the plurality of auxiliary wirings are not connected to each other.

Abstract: A liquid ejection head and a liquid ejection apparatus are configured to suppress degradation in the insulation property of an electrical wiring substrate while preventing an ejection element substrate from being cracked or a wiper from being abraded. As one configuration, a step portion with a step surface having a step between an ejection opening surface and a surface for mounting an electrical wiring substrate thereon in a second support member is provided and a gap between the ejection element substrate and the step portion and a region between the electrical wiring substrate and a stepped surface are sealed by a sealant.

Abstract: A microfluidic refill includes a reservoir having a hollow body and an opening; a transport member in fluid communication with the reservoir; and a lid enclosing the opening of the reservoir. The lid is in fluid communication with the transport member. The lid comprises a rigid microfluidic delivery member. The rigid microfluidic delivery member includes a die and electrical traces that are in electrical communication with the die, wherein the electrical traces terminate at electrical contacts, wherein the electrical traces are disposed on only one plane. The die has a fluid chamber in fluid communication with the transport member at an inlet of the fluid chamber and with an orifice at an outlet of the fluid chamber and.

Abstract: A lens module for autofocus of a camera in passive mode includes a lens barrel containing a first lens, a second lens, a pressure sensor, an image sensor, and a processor. In the passive autofocus mode, the first lens is located at a first end of the lens barrel and moves within the lens barrel when a distance to a target object changes. The pressure sensor between the first and the second lenses senses both pulling and pushing pressures which the first lens applies. The image sensor is adjacent to an end of the lens barrel and is behind the first and second lenses. The processor can apply formulas to calculate a distance between the target object and the lens module.

Abstract: A print head includes a substrate having a hole, a circuit on the substrate, the circuit having traces and a hole corresponding to the hole in the substrate, the hole forming a fluid path, and a raised structure on the substrate around the fluid path, the raised structure positioned to seal the circuit from the fluid path.

Abstract: A liquid discharge head includes a plurality of nozzles to discharge a liquid; a plurality of pressure generators corresponding to the plurality of nozzles; a driver IC to output a drive waveform to each of the plurality of pressure generators; a substrate on which the driver IC is mounted; and a drive voltage supply wire to supply drive voltage to the plurality of pressure generators, disposed on the substrate. In plan view, the driver IC has a rectangular shape and at least part of the drive voltage supply wire crosses over a longer side of the driver IC.

Abstract: In an example, a method for determining an issue in an inkjet nozzle includes providing an initial fire pulse for firing a nozzle, and receiving the initial fire pulse as a delayed fire pulse at a primitive of the nozzle. The method includes firing the nozzle with the delayed fire pulse, and determining a first time instant following the delayed fire pulse for taking a first impedance measurement across the nozzle.

Abstract: A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.

Abstract: A module placement device and method enable the precision mating of a module to a substrate. The device and method can be effectively used, for example, to mate a light source such as an LED module to the back side of an automotive mirror having portions that permit light to pass therethrough.