Abstract: An immersion lithography apparatus includes a projection system having a final optical element, a movable stage that is movable below the projection system such that a gap exists between the final optical element and a surface of the stage, an immersion liquid being filled in the gap, a liquid confinement member and a liquid diverter. The liquid confinement member maintains the immersion liquid in the gap, and includes a liquid recovery portion that faces the stage surface and recovers liquid from the gap. The liquid recovery portion includes a first porous portion through which a first suction force is applied and a second porous portion through which a second suction force less than the first suction force is applied, the second portion being located outward of the first portion. The liquid diverter is positioned between the stage and at least the first porous portion.

Abstract: A table is disclosed in which measures are taken to seal between the table and an edge of an object, in use, supported on the table. In particular, a capillary passage is formed between the object on the table and the table itself. A meniscus pinning feature and/or the presence of an overpressure at the radially inward side of the capillary passage holds the liquid in the passage and helps prevent it from advancing further radially inwardly. The features to perform this function may be associated with or formed in a member surrounding the object. The member may be thermally decoupled from a part of the table.

Abstract: An exposure apparatus exposes a substrate by projecting a pattern image onto the substrate through a liquid. The exposure apparatus includes a projection optical system by which the pattern image is projected onto the substrate, and a movable member which is movable relative to the projection optical system. A liquid-repellent member, at least a part of a surface of which is liquid-repellent, is provided detachably on the movable member, the liquid-repellent member being different from the substrate.

Abstract: System and method for improving immersion scanner overlay performance are described. One embodiment is a method of improving overlay performance of an photolithography immersion scanner including a wafer table having lens cooling water (“LCW”) disposed in a water channel therein, the wafer table having an input for receiving the LCW into the water channel and an output for expelling the LCW from the water channel. The method includes providing a water tank that connects to at least one of the wafer table input and the wafer table output; monitoring a pressure of water in the water tank; and maintaining the pressure of the water in the water tank at a predetermined level.

Abstract: The present invention has disclosed a dual stage positioning and switching system, which comprises at least a base, a first object stage positioning unit disposed on the base for a first workstation, and a second object stage positioning unit for a second workstation. Each of the object stage positioning units comprises at least a supporting structure, an X-direction guide bar, a Y-direction guide bar, and a motion positioning detector, wherein, the supporting structure comprises an object stage, and an object stage connector moving relative to the object stage. The object stage positioning unit further comprises a driver connecting to the object stage connector and driving the connector to move along the X-direction guide bar. The X-direction guide bars are positioned on and movable along the Y-direction guide bars.

Abstract: An apparatus for manufacturing a semiconductor device and a method for manufacturing a semiconductor device using the apparatus may be provided. The manufacturing apparatus may include a liquid supplying portion for forming a liquid film, and a gas supplying unit that may rotate to discharge gas at a wide range of angles. The manufacturing method may include forming a shape and size of a liquid film common to the shape and size of an exposure region through adjusting the direction and pressure in which gas may be discharged to the substrate. Thus, the speed at which a substrate may be moved may be increased, and morphology differences of a substrate may be reduced.

Abstract: To provide a substrate holding apparatus which can prevent a liquid from entering into a rear surface side of a substrate. A substrate holding apparatus (PH) is provided with a base material (PHB), a first holding portion (PH1) formed on the base material (PHB) for holding the substrate (P), and a second holding portion (PH2) formed on the base material (PHB) for holding a plate member (T) by surrounding the circumference of a processing substrate (P) held by the first holding portion (PH1). The second holding portion (PH2) holds the plate member (T) so as to form a second space (32) on the side of the rear surface (Tb) of the plate member (T). On the rear surface (Tb) of the plate member (T), an absorbing member (100) is arranged for absorbing the liquid (LQ) entered from a gap (A) between the substrate (P) held by the first holding portion (PH1) and the plate member (T) held by the second holding portion (PH2).

Abstract: A support structure for positioning an exchangeable object (e.g., patterning device) in a lithographic apparatus. The support structure has a chuck and at least two clamp mechanisms spaced from one another in a first direction. Each clamp mechanism has a plurality of vacuum sections to support the object and apply a localized clamping force to the object to hold the object. The separation between the vacuum sections is in a second direction different from the first direction. The support structure may have a chuck and a clamp mechanism having a plurality of clamp sections to support the object and apply a clamping force to the object. The sections may move relative to each other. Each section may include a channel to communicate a low pressure to hold the object. The stiffness of the clamp mechanism(s) reduces and/or avoids stress and/or slip at the interface of the chuck/clamp and object.

Abstract: A substrate holding apparatus includes a base part and a support part that is formed on the base part and supports a rear surface of the substrate. A first circumferential wall is formed on the base part, has a first upper surface that opposes the rear surface of the substrate, which is supported by the support part, and surrounds a first space that is between the substrate, which is supported by the support and the base part. A second circumferential wall is formed on the base part, has a second upper surface that opposes the rear surface of the substrate, which is supported by the support part, with a gap interposed therebetween, and surrounds the first circumferential wall. A third circumferential wall is formed on the base part, has a third upper surface that opposes the rear surface of the substrate, which is supported by the support part; and surrounds the support part and the second circumferential wall.

Abstract: System and method for improving immersion scanner overlay performance are described. One embodiment is a method of improving overlay performance of an photolithography immersion scanner including a wafer table having lens cooling water (“LCW”) disposed in a water channel therein, the wafer table having an input for receiving the LCW into the water channel and an output for expelling the LCW from the water channel. The method includes providing a water tank that connects to at least one of the wafer table input and the wafer table output; monitoring a pressure of water in the water tank; and maintaining the pressure of the water in the water tank at a predetermined level.

Abstract: Substrate processing methods and apparatus are disclosed. In some embodiments a substrate processing apparatus may comprise a support structure and a moveable stage including first and second stages. The moveable stage has one or more maglev units attached to the first stage and/or second stage proximate an edge of the first stage. The first stage retains one or more substrates and moves with respect to a first axis that is substantially fixed with respect to the second stage. The second stage translates along a second axis with respect to the support structure. In other embodiments, a primary motor may maintain a rotary stage at an angular speed and/or accelerate or decelerate the stage from a first angular speed to a second angular speed. A secondary motor may accelerate the stage from rest to the first angular speed and/or decelerate the stage from a non-zero angular speed.

Abstract: There is provided an optical imaging device, in particular for microlithography, comprising at least one optical element and at least one holding device associated to the optical element (109), wherein the holding device holds the optical element and a first part (109.1) of the optical element contacts a first atmosphere and a second part (109.2) of the optical element at least temporarily contacts a second atmosphere. There is provided a reduction device at least reducing dynamic fluctuations in the pressure difference between the first atmosphere and the second atmosphere.

Abstract: A method including mixing using a mixer a first component and a second component to form a liquid before supply to a space between the projection system and a substrate, measuring a property of the liquid using a measuring device and making the feedback available to a controller, based on the feedback, controlling with the controller a physical property of the liquid by controlling the amount of the first and/or second component used to form the liquid, supplying the liquid to the space between the projection system and the substrate, and projecting a patterned beam of radiation, using the projection system, through the liquid onto a target portion of the substrate.

Abstract: An exposure apparatus including a moving member movable with a substrate, an interferometer configured to measure a position of the moving member, a blower device for blowing temperature-conditioned air, a plurality of supply openings communicating with the blower device, and a flow rate adjusting device configured to adjust a gas flow rate blown through the plurality of supply openings based on an operation of the moving member.

Abstract: A lithographic apparatus arranged to transfer a pattern from a patterning device onto a substrate is disclosed, the apparatus including a substrate table constructed to hold a substrate, a first clamping system configured to clamp the substrate table to a substrate table support structure, and a second clamping system configured to clamp a substrate to the substrate table after the substrate table has been clamped to the substrate table support structure.

Abstract: The present invention relates to a transfer device that can feed a work in a stable condition without applying it any excess loads. The transfer device for feeding a tape-shaped work to a process stage standing in an upright position, which is placed on one side of the process stage and which includes a supply reel, a take-up reel and a work feeding mechanism. Specifically, the supply reel, around which the work and a protective sheet are wound, is adapted to feed the work and the protective sheet therefrom. The take-up reel is adapted to wind the work and the protective sheet that have been fed from the supply reel, and it is located below the supply reel. The work feeding mechanism is adapted to forward the work from the supply reel to the take-up reel through the process stage.

Abstract: A method for examining at least one wafer (13) with regard to a contamination limit, in which the contamination potential of the resist (13a) of the wafer (13), which resist (13a) outgasses contaminating substances, is examined with regard to a contamination limit before the wafer (13) is exposed in an EUV projection exposure system (1). The method preferably includes: arranging the wafer (13) and/or a test disc coated with the same resist (13a) as the resist (13a) of the wafer (13) in a vacuum chamber (19), evacuating the vacuum chamber (19), and measuring the contamination potential of the contaminating substances outgassed from the wafer (13) in the evacuated vacuum chamber (19), and also comparing the contamination potential of the wafer (13) with a contamination limit. An EUV projection exposure system (1) for carrying out the method is also disclosed.

Abstract: A lithographic projection apparatus includes a support structure configured to hold a patterning device, the patterning device configured to pattern a beam of radiation according to a desired pattern; a substrate table configured to hold a substrate; a projection system configured to project the patterned beam onto a target portion of the substrate; a liquid supply system configured to provide liquid to a space between the projection system and the substrate; and a shutter configured to isolate the space from the substrate or a space to be occupied by a substrate.

Abstract: The present invention provides a mask alignment mechanism which reduces the occurrence of particles and which aligns a mask with high accuracy, and a vacuum processing apparatus including such a mask alignment mechanism. A mask alignment mechanism according to one embodiment of the present invention includes a substrate holder which is movable up and down when a substrate is transferred and on which four taper pins are formed, and a mask in which grooves are formed. The taper pins can be inserted into the grooves, respectively. The taper pins include a pair of long taper pins and a pair of short taper pins. The taper pins in each pair are disposed to face each other across the substrate. Tapered surfaces formed in the long taper pins and tapered surfaces formed in the short taper pins are located at different heights.

Abstract: A lithographic apparatus is provided in which exposure is carried out by projecting through an aqueous solution of alkali metal halide(s), the solution being in contact with the substrate to be exposed.

Abstract: There are provided a wafer stage and methods for chucking a wafer using the same. The wafer stage includes a wafer chuck adapted to hold a wafer; lift pins adapted to pass through the wafer chuck, move vertically, and support the wafer; and an air expulsion unit adapted to expel air towards an edge of the wafer. The method for attaching a wafer to a wafer chuck comprises lowering lift pins supporting the wafer; and expelling air towards an edge of the wafer using an air expulsion unit.

Abstract: One pair each of a Y linear motor (a total of four) on the +X side and the ?X side that drive a reticle stage include one pair each of a stator section (a total of four) and three each of a mover section (a total of six) on the +X side and the ?X side. In this case, the three each of the mover sections on the +X side and the ?X side configure one each of a mover. The mover section located in the center in the Z-axis direction of each of the movers is used in common by each pair of the Y linear motors. Therefore, the weight of the mover section (reticle stage) of the reticle stage device is reduced, which allows a higher acceleration. Further, the mover section located in the center in the Z-axis direction of each of the movers coincides with a neutral plane of the reticle stage.

Abstract: A robot positions a workpiece within a vacuum chamber of a lithographic apparatus. A first component of the robot is located within a vacuum chamber to position a workpiece along a translational axis. A shaft supports the first component such that an axis of symmetry of the shaft is perpendicular to the translational axis, and a second component rotates the shaft about the axis of symmetry and moves the shaft in a direction parallel to the axis of symmetry. The second component includes a gas bearing configured to introduce gas along a circumferential surface of the shaft and a scavenging seal configured to evacuate the gas introduced by the second component gas bearing. The robot substantially reduces, or eliminates the out-gassing of hydrocarbon molecules in a range from about 0 to 200 a.m.u., thus rendering the robot suitable for use in extreme ultra-violet (EUV) photolithography applications.

Abstract: The substrate conveyance method of the present invention includes an adjusting step further includes a suction time monitoring sub-step in which the suction pressure of a suction mechanism is upward raised to a predetermined threshold value after a lifting of a hand from a standby position on a mounting section is initiated in a vacuum suction state and its driving time is monitored, an adjustment determining sub-step of determining whether or not an adjustment of a receiving position is necessary based on a monitor time period that has been obtained by the suction time monitoring sub-step, and a position setting sub-step of automatically setting the receiving position to the position at which a tolerance range is satisfied, if it has been determined in the adjustment determining sub-step that the monitor time period and the suction pressure of the suction mechanism are not in a predetermined tolerance range.

Abstract: In an apparatus for supporting a wafer, the apparatus may remove particles thereon. The apparatus may include a conductive support configured to support the wafer, and a power source electrically connected to the conductive support, the power source configured to provide at least one current to the conductive support to remove particles from the conductive support.

Abstract: A contact lithography apparatus, system and method use a hydraulic deformation to facilitate pattern transfer. The apparatus, system and method include a spacer that provides a spaced apart proximal orientation of lithographic elements, and a hydraulic force member that provides the hydraulic deformation. One or more of the lithographic elements and the spacer is deformable, such that hydraulic deformation thereof facilitates the pattern transfer.

Abstract: A substrate holding platen has a top surface having a plurality of openings, an enclosed plenum area below the top surface, and a large orifice valve connecting the plenum area to a high flow vacuum pump. The plurality of openings may include snubber slots on the top surface, and/or openings for automatic shims. The high flow vacuum pump preferably pulls between 100-150 cubic feet per minute (cfm) of air from the plenum through the large orifice valve.

Abstract: An automatic substrate transport system having adjustable mechanisms to guide and float substrates on a film of air along a sloped path, permits smooth movement with significantly reduced contact and abrasion damage to imaged surfaces on the substrates. This allows for the transportation of any substrates including those coated with somewhat tacky coatings, thus reducing machine downtime associated with clearing line blockages, as well as transport mechanism cleaning.

Abstract: A liquid confinement structure configured to contain a liquid in a space between a projection system and a substrate has a recess in its lower surface which is open to both a relatively low pressure source and a relatively high pressure source and through which liquid and/or gas from between the liquid confinement structure and the substrate is extracted.

Abstract: An exposure apparatus to be used with an exposure mask having an elastically deformable holding member and a light blocking film provided on the holding member and being formed with an opening pattern. For exposure, the mask is flexed, to be brought into contact with an object to be exposed. The apparatus includes a distance detecting device for detecting a distance between the exposure mask and the object to be exposed. The distance detecting device is adapted to detect the distance between the exposure mask and the object to be exposed before the exposure mask is flexed. The apparatus also includes a distance controlling device for controlling the distance between the exposure mask before the mask is flexed and the object to be exposed, on the basis of a signal from the distance detecting device.

Abstract: An immersion lithographic apparatus has a barrier member surrounding a space between the projection system and the substrate so as to at least partly confine liquid in the space. A jet of liquid is directed radially inwardly in a gap between the barrier member and the substrate and/or between the barrier member and the projection system, to help prevent escape of liquid.

Abstract: A lithographic apparatus can include an illumination system that conditions a radiation beam, a patterning device that modulates the radiation beam, a substrate table that supports a substrate, and a projection system that projects the modulated radiation beam onto a target portion of the substrate. The lithographic apparatus can also include a substrate handler that loads and/or unloads a substrate on/from the substrate table. The substrate handler supports the substrate in a support plane and can include a conveyor device for moving the substrate in a direction substantially parallel to the support plane. The conveyor device can include a gripping device configured to push or pull the substrate in the indicated direction and a driving device for driving the gripping device in the indicated direction.

Abstract: There are provided a wafer stage, an exposure apparatus having the same, and a wafer flatness correction method using the same. The wafer stage includes a chuck having first and second vacuum holes, a first vacuum pump applying a vacuum suction force to the first vacuum holes and a second vacuum pump applying a vacuum suction force to the second vacuum holes. Further, the exposure apparatus and the wafer flatness correction method using the same are disclosed.

Abstract: The present invention has disclosed a dual stage positioning and switching system, which comprises at least a base, a first object stage positioning unit disposed on the base for a first workstation, and a second object stage positioning unit for a second workstation. Each of the object stage positioning units comprises at least a supporting structure, an X-direction guide bar, a Y-direction guide bar, and a motion positioning detector, wherein, the supporting structure comprises an object stage, and an object stage connector moving relative to the object stage. The object stage positioning unit further comprises a driver connecting to the object stage connector and driving the connector to move along the X-direction guide bar. The X-direction guide bars are positioned on and movable along the Y-direction guide bars.

Abstract: A substrate processing apparatus and method are disclosed.

Abstract: A porous member is used in a liquid removal system of an immersion lithographic projection apparatus to smooth uneven flows. A pressure differential across the porous member may be maintained at below the bubble point of the porous member so that a single-phase liquid flow is obtained. Alternatively, the porous member may be used to reduce unevenness in a two-phase flow.

Abstract: A lithographic apparatus includes an illumination system configured to condition a radiation beam and a support constructed to support a patterning device. The patterning device is configured to impart the radiation beam with a pattern in its cross-section to form a patterned radiation beam. A substrate table is constructed to hold a substrate, and a projection system is configured to project the patterned radiation beam onto a target portion of the substrate. The projection system includes a vacuum chamber and a controller configured to control an actuator of an optical device arranged in the vacuum chamber. The vacuum chamber includes a hermetically sealed housing in which the controller is accommodated. The housing is provided with an electrical connection configured to electrically connect the controller to the optical device, and is connected to an exterior wall of the vacuum chamber via a fluid cooling channel configured to cool the controller.

Abstract: An immersion lithographic projection apparatus is disclosed in which liquid is provided between a projection system of the apparatus and a substrate. The use of both liquidphobic and liquidphilic layers on various elements of the apparatus is provided to help prevent formation of bubbles in the liquid and to help reduce residue on the elements after being in contact with the liquid.

Abstract: An immersion lithographic projection apparatus is disclosed. The apparatus includes a substrate table for holding a substrate, the substrate table being constructed and arranged to allow liquid to flow off the substrate and over an edge of a top surface of the substrate table, and a gutter for collecting the liquid flow under the edge. Several features for improving liquid retrieval are described.

Abstract: An immersion lithographic projection apparatus is disclosed. The apparatus includes a substrate table for holding a substrate and a liquid supply system for supply liquid to the substrate. The apparatus is constructed and arranged to allow the liquid to flow off the substrate and over at least two edges of a top surface of the substrate table. The geometry of the edge may be optimized to reduce a static thickness of a layer of liquid on the top surface.

Abstract: A stage device includes a stage and a frame-shaped member that move in three degrees of freedom directions in a two-dimensional plane while floating above a surface plate. The stage also holds an object. First fixed elements and second fixed elements are fitted to the frame-shaped member, and cooperate with first movable elements and second movable elements to generate drive forces to drive the stage in the two-dimensional plane. A reaction force generated by the driving of the stage acts on the first and/or second fixed elements, and causes the frame-shaped member to move in the two-dimensional plane. Because the reaction force caused by the movement of the stage is substantially completely cancelled, and because the movement of a center of gravity of a system including the stage and the frame-shaped member does not occur, no unbalanced load acts on the surface plate.

Abstract: A guide includes a brittle material layer and a magnetically attracting magnetic body, e.g., a metal layer. A recess and a projection are formed on the metal layer. The brittle material layer is made of, e.g., a sprayed ceramic material and covers the recess formed on the magnetically attracting metal layer. A movable body moves as it levitates above the surface of the brittle material layer.

Abstract: A clamping device can be configured to clamp an object on a support. The clamping device can include a first device configured to exert an attracting force on the object, and a second device configured to exert a rejecting force on the object. The first device and second device can be configured to simultaneously exert an attracting and a rejecting force on the object to shape the object to a desired shape before clamping of the object on the support. A method is provided for loading an object on a support, comprising the steps of shaping the object in a desired shape spaced from the support. The shaping can include subjecting the object simultaneously to an attracting force pulling the object toward the support and a rejecting force pushing the object away from the support, and clamping the object on the support.

Abstract: The invention relates to a method of loading a first object on a second object in a lithographic apparatus. The method includes: a) loading the first object on the second object, b) waiting a predetermined time interval and c) performing a relaxation action. The first object may be a substrate and the second object a substrate table. The first object may also be a substrate table and the second object a support structure, supporting the substrate table.

Abstract: The invention relates to a lithography system, for example for projecting an image or an image pattern on to a target (1) such as a wafer, said target being included in said system by means of a target table (2), clamping means being present for clamping said target on said table. Said clamping means comprises a layer of stationary liquid (3), included at such thickness between target and target table that, provided the material of the liquid (C) and of the respective contacting faces (A, B) of the target (1) and target table (2), a pressure drop (PCap) arises.

Abstract: The present invention relates to a clamping device configured to clamp an object on a support, comprising a first device configured to exert an attracting force on said object, and a second device configured to exert a rejecting force on said object, wherein said first device and second device are configured to simultaneously exert an attracting and a rejecting force on said object to shape said object to a desired shape before clamping of said object on said support. The invention further relates to a method for loading an object on a support, comprising the steps of shaping said object in a desired shape spaced from said support, wherein said shaping comprises subjecting said object simultaneously to an attracting force pulling said object towards said support and a rejecting force pushing said object away from said support, and clamping said object on said support.

Abstract: A simulator of an optical intensity distribution includes a field divider dividing an exposure field on a substrate into a first and second fields, the first field being to be directly exposed to a light incident at the maximum incident angle, the second field being prevented from being directly exposed to the light by a protrusion on the substrate, a first optical intensity calculator calculating an optical intensity of the first field by using a direct incident light component of the light, a second optical intensity calculator calculating an optical intensity of the second field by using a reflected light component of the light reflected from a sidewall of the protrusion, and a projected image simulation engine simulating an optical intensity distribution of a projected image of a mask pattern on the substrate, based on the optical intensities of the first field and the second field.

Abstract: An air bearing sheet heater assembly is provided for heating a sheet in an ink imaging printer. It includes a heater plate that has a heating element and defines a first side of a sheet path through the heater assembly. It also includes at least one movable platelet that defines a second side of the sheet path, as well as, an air bearing assembly mounted to the at least one platelet. The air bearing assembly controllably creates an air bearing between the second side and the first side of the sheet path for moving and pneumatically spacing the front surface of the at least one movable platelet from the front side of the heater plate, thereby reducing stiction forces and friction along the sheet path through the air bearing sheet heater assembly.

Abstract: An apparatus according to the present invention includes a vacuum chamber (5) and processes a substrate (4) in the vacuum chamber (5). The apparatus includes pumps (8A, 8B; 9A, 9B) which exhaust the vacuum chamber (5), a first cryopump (7A) accommodated in the vacuum chamber (5), a second cryopump (7B) accommodated in the vacuum chamber (5), and a controller (15) which alternatively stops the first cryopump (7A) and the second cryopump (7B).

Abstract: An apparatus for supporting a mask comprises a pair of members. The mask held against each member by a vacuum arrangement which prevents relative motion between the mask and members. The members are compliant such that they accommodate flatness variations in the mask but without deforming the mask.