Electrical Interconnector Patents (Class 360/99.25)
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Patent number: 11817132Abstract: According to one embodiment, a disk device includes a housing with a bottom wall, magnetic disks supported on a hub of a motor, a printed circuit board provided on an outer surface of the bottom wall, and a wiring board attached on the outer surface of the bottom wall. The bottom wall includes a recess formed in the outer surface, a step located on border between the outer surface and the recess, and through holes opened to the recess. The wiring board includes one end portion disposed in the recess and connection pads on the one end portion, connected to lead wires of a coil. An adhesive is filled into the recess and the through holes, and covers the one end and a solder joint and seals the through holes.Type: GrantFiled: November 19, 2021Date of Patent: November 14, 2023Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage CorporationInventors: Manabu Uehara, Yuu Kawai
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Patent number: 11790956Abstract: According to one embodiment, an electronic device includes a housing, a substrate, a connector, a metal member, a screw, first solder, and second solder. The substrate includes a first surface to which a second hole opens and a metal region to which a first hole opens. The region is provided on the first surface. The connector is provided with a third hole. The metal member is attached to the connector and includes a second surface to which a fourth hole opens and a joint inserted into the second hole. The screw attaches the connector and the metal member to the housing through the third hole and the fourth hole. The first solder joins the region and the second surface to each other. The second solder joins an inner surface of the second hole and the joint to each other.Type: GrantFiled: March 4, 2022Date of Patent: October 17, 2023Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage CorporationInventor: Masahide Takazawa
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Patent number: 10629244Abstract: An electrical feed-through involves a laminate structure having alternating insulator and metal layers with electrically conductive through-holes formed therethrough, by which a lower connector pad is electrically connected with a corresponding upper connector pad, and wherein the number of through-holes is less than the number of connector pads on either side. Thus, the chain of clearances associated with the through-holes on the inner metal layer(s) is reduced, which provides more leak resistant metal material within the metal layer(s), while maintaining suitable electrical performance and avoiding disruption of existing manufacturing. Such a feed-through may be used at an interface between a hermetically-sealed internal environment, such as in a lighter-than-air gas filled data storage device, and the external environment.Type: GrantFiled: May 16, 2019Date of Patent: April 21, 2020Assignee: Western Digital Technologies, Inc.Inventors: Miki Namihisa, Shin Nagahiro, Hiroshi Matsuda, Satoshi Nakamura
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Patent number: 10418070Abstract: A disk device includes a housing that includes a base with a through hole formed therein and a cover fixed to the base, wherein the housing contains a low density gas; a plurality of heads and a wiring member disposed within the housing that includes conductors that are electrically connected to the heads; a sealing substrate that is fixed to the base and covers the through hole; a control circuit board that is disposed outside the housing and adjacent to a back surface of the base; a first two-piece connector that is disposed within the housing and connects the sealing substrate and the wiring member; and a second two-piece connector that connects the sealing substrate and the control circuit board. The second two-piece connector includes a first connector mounted on the sealing substrate and a second connector that is mounted on the control circuit board.Type: GrantFiled: February 9, 2018Date of Patent: September 17, 2019Assignees: KABUSHIKI KAISHA TOSHIBA, Toshiba Electronic Devices & Storage CorporationInventor: Makoto Okamoto
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Patent number: 10289173Abstract: A heat sink can be used as part of a storage drive to perform multiple functions, both structural and thermodynamic. It can be used as a heat dissipating element and it can be used as the key mechanical mounting structure for storage drives, such as hard disk drives (HDD), and any circuit boards.Type: GrantFiled: March 10, 2017Date of Patent: May 14, 2019Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.Inventors: Wojciech Szeremeta, Ken Nguyen, Kam Cheong Chin
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Patent number: 10037783Abstract: A data storage device (DSD) is assembled with a flexible sheet of barrier material covering at least a portion of the top cover and/or bottom base of the DSD enclosure, whereby a layer of air is between the sheet of barrier material and the cover and/or base. Polyvinlyidene chloride (PVDC) may be used as the barrier material. A wrap-around structure may be used for the barrier material, enveloping the DSD so that an open end can be positioned open to a primary direction of airflow, such that a respective layer of air is created between the barrier material and each of the cover and/or base. An adhesive may be positioned around the outer edge of the cover and/or base, to adhere the sheet of barrier material to the respective cover and/or base while allowing the air layer to fill the space therebetween.Type: GrantFiled: December 22, 2016Date of Patent: July 31, 2018Assignee: Western Digital Technologies, Inc.Inventors: Yohei Asai, Kazuhide Ichikawa, Takanori Kawakami, Miki Namihisa, Isao Kobayashi
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Patent number: 9691434Abstract: Disclosed herein is one embodiment of an apparatus that includes a housing that defines an interior cavity. The housing also includes a spring aperture. The apparatus further includes a spring coupled to the housing over the spring aperture, with the spring having a deflection portion and a feedthrough aperture. The apparatus also has an electrical connector coupled to the spring and extending through the feedthrough aperture and the spring aperture. The electrical connector may have a plurality of electrical traces extending from a location external to the housing to a location within the interior cavity of the housing.Type: GrantFiled: July 29, 2016Date of Patent: June 27, 2017Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.Inventors: Toshiki Hirano, Vipin Ayanoor Vitikkate
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Patent number: 9678546Abstract: A fanless industrial computer enclosure dissipates heat generated by the hottest components on heat sinks dedicated to respective heat zones within the enclosure. Heat generated by the component that operates at the highest temperature in each heat zone is conducted to a heat sink on the exterior of the enclosure. Using a heat sink dedicated to each heat zone, heat generated by components such as an industrial computer, storage devices, power supply, or other electrical components, is dissipated on the outer surface of the enclosure to the surrounding ambient environment. Providing a low resistance heat conductive path from the hottest components to respective heat sinks to dissipate heat outside the enclosure from each heat zone creates an environment within the enclosure where disk drives do not exceed the specified upper operating temperature rating without regard to the operating temperature of other electrical components in the enclosure.Type: GrantFiled: April 6, 2016Date of Patent: June 13, 2017Assignee: Phoenix Contact Development And Manufacturing, Inc.Inventors: Stephen Dale May, Scott David Lindstrom
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Patent number: 8760987Abstract: An optical disc drive device has a metallic exterior casing and an internal unit to be housed in the exterior casing. The internal unit further includes an optical pickup unit for performing recording or reproduction of information signals on an optical disc, and a printed wiring substrate on which a connector electrically connected to the optical pickup unit and serving for transmission and reception of electrical signals from and to external electronic equipment is mounted. The exterior casing has an opening for allowing the connector to be exposed outside, the printed wiring substrate has a ground pattern formed to surround the connector, and a fringe portion of the opening of the exterior casing and the ground pattern are in electrical contact with each other. Thus, radiation noise from around wiring lines contained in the optical disc drive device or the like is reduced.Type: GrantFiled: February 16, 2012Date of Patent: June 24, 2014Assignee: Panasonic CorporationInventors: Ryo Matsubara, Hideto Soga, Tomio Yamamoto, Yasuyuki Torii
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Patent number: 8749914Abstract: A disk-enclosure base that is configured to inhibit formation of adherent solder-flux residue. The disk-enclosure base includes a casting, a through-hole fabricated in the casting, a solder channel, an E-coat layer, and an E-coat-free zone. The E-coat layer is applied to a first portion of an interior surface of the casting. The E-coat-free zone is adjacent to and surrounds the solder channel. The E-coat-free zone also includes a second portion of the interior surface of the casting lying between the solder channel and the E-coated first portion of the interior surface of the casting. The E-coat-free zone is configured to inhibit formation of adherent solder-flux residue. A disk-enclosure-base/electrical-feedthrough assembly that is configured to inhibit formation of adherent solder-flux residue, and a hard-disk drive (HDD) including the disk-enclosure-base/electrical-feedthrough assembly are also provided.Type: GrantFiled: September 8, 2011Date of Patent: June 10, 2014Assignee: HGST Netherlands B.V.Inventors: Noritaka Otake, Takako Hayakawa, Kazuhide Ichikawa, Teruhiro Nakamiya
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Patent number: 8493686Abstract: A disk-enclosure cover for a low-profile, hard-disk drive (HDD). The disk-enclosure cover includes a substantially flat, plate-like portion that includes a periphery, and a peripheral flange that is disposed at the periphery. The peripheral flange includes a recessed portion that is configured to be recessed from a SATA connector in proximity to the SATA connector. In addition, the recessed portion is configured to allow a top portion of the SATA connector to be disposed in close proximity to the peripheral flange when the SATA connector is seated on a receiving connector of the low-profile HDD.Type: GrantFiled: May 25, 2010Date of Patent: July 23, 2013Assignee: HGST Netherlands B.V.Inventors: Shinichi Kimura, Hiroki Kitahori, Nobuyuki Okunaga, Takao Suzuki
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Patent number: 8194348Abstract: A novel disk drive includes a hermetically sealed helium-filled enclosure that has an opening extending through the disk drive base. A laminated electrical connector is disposed inside the enclosure, spans the opening, and is accessible from outside the disk drive base via the opening. The laminated electrical connector has an adhesive layer that is adhered to the disk drive base continuously around the opening, and that has a hole therethrough that is aligned with the opening. The laminated electrical connector includes electrically conductive traces that are electrically connected to the actuator flex cable, and a first insulative layer that is disposed on the trace layer. The laminated electrical connector has a metal foil sealing layer that continuously spans and completely covers the opening, and that has no holes therethrough that are aligned with the opening. The metal foil sealing layer overlaps the adhesive layer continuously around the opening.Type: GrantFiled: February 26, 2010Date of Patent: June 5, 2012Assignee: Western Digital Technologies, Inc.Inventors: Jon E. Jacoby, John R. Gustafson