Abstract: An audio reproducing apparatus includes a power supply, an amplifier, a speaker, and a controller. The power supply is for supplying a voltage. The amplifier is for receiving the voltage and audio signals, amplifying the audio signals, and outputting amplified audio signals. The speaker is for reproducing sound after receiving the amplified audio signals. The controller is for receiving the voltage and generating a control signal to enable the amplifier. The controller includes a generator and a delay unit. The generator is for receiving the voltage and generating the control signal. The delay unit is for delaying the time of transferring the voltage from the power supply to the generator.

Abstract: An exemplary circuit for turning on a motherboard comprises a first switch module comprising a first terminal arranged to receive a standby power and connected to a sixth terminal of a computer front panel header, a second terminal arranged to receive the standby power, and a control terminal; a timing circuit charged by a system power; and a second switch module comprising a first terminal connected to the control terminal of the first switch module via the timing circuit, a second terminal arranged to receive the standby power, and a control terminal arranged to receive the system power, wherein, when the system power is lost, the second switch module discharges the timing circuit for turning on the first switch module after a discharge time, and the motherboard is turned on when the first switch module is turned on to ground the sixth terminal of the computer front panel header.

Abstract: Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader.