Abstract: A system and method for reducing charge on a workpiece disposed on a platen is disclosed. The system includes an ionizer to generate ionized gas from the source of backside gas. The ionizer may be used to introduce ionized gas into the backside gas channels of the platen. A controller is used to selectively allow backside gas and/or ionized gas into the backside gas channels. In certain embodiments, the platen also includes an exhaust channel in communication with an exhaust valve to ensure that the pressure within the volume between the top surface of the platen and the workpiece is maintained in a desired range. In one embodiment, the system includes a valving system in communication with the source of backside gas and also in communication with the ionizer. In another embodiment, the amount of ionization performed by the ionizer is programmable.

Abstract: Methods of cleaning a substrate support comprise: introducing a cleaning gas into a processing chamber containing the substrate support; applying a radio frequency (RF) power to a remote plasma source that is in fluid communication with the processing chamber to establish a reactive etching plasma from the cleaning gas in the processing chamber; reacting deposits on the substrate support with the reactive etching plasma to form a by-products phase; and evacuating the by-products phase from the processing chamber.

Abstract: Methods, apparatuses, and systems for substrate processing for lowering contact resistance in at least contact pads of a semiconductor device are provided herein. In some embodiments, a method of substrate processing for lowering contact resistance of contact pads includes: circulating a cooling fluid in at least one channel of a pedestal; and exposing a backside of the substrate located on the pedestal to a cooling gas to cool a substrate located on the pedestal to a temperature of less than 70 degrees Celsius. In some embodiments in accordance with the present principles, the method can further include distributing a hydrogen gas or hydrogen gas combination over the substrate.

Abstract: Disclosed are a lift pin assembly, an electrostatic chuck with the lift pin assembly, and a processing apparatus where the electrostatic chuck is located. The lift pin assembly comprises: a lift pin, a lift pin receiving channel connected to a pressure control device, one end of the lift pin receiving channel proximal to a wafer being provided with a sealing ring, an upper surface of the sealing ring being in contact with a back face of the wafer during processing to avoid a gas at the back face of the wafer from entering the lift pin receiving channel, thereby enabling the pressure control device to independently control the pressure in the lift pin receiving channel.

Abstract: A wafer placement table includes: a ceramic member having a wafer placement surface; a mesh electrode buried in the ceramic member; a conductive connection member in contact with the mesh electrode and exposed to outside from a surface of the ceramic member on the opposite side of the wafer placement surface; and an external current-carrying member joined to a surface of the connection member exposed to outside. The mesh electrode has a mesh opening in a region that faces the connection member, and the mesh opening is filled with a sintered conductor being a sintered body of a mixture containing a conductive powder and a ceramic raw material.

Abstract: An electrostatic chuck device comprising a mounting table having a mounting surface, a focus ring; and a cooling element, wherein the mounting table has a holding portion surrounding the mounting surface, the holding portion has an annular groove portion having a through-hole, the holding portion has inner and outer peripheral surfaces which hold the focus ring and are located on both sides of the groove portion, the holding surface satisfies conditions (i) and (ii), (i) a straight line connecting a first point corresponding to an innermost periphery of the holding surface and a second point corresponding to an outermost periphery of the holding surface has a positive or a negative inclination from the innermost periphery toward the outermost periphery, wherein a difference between a height of the first point and a height of the second point is 0 ?m to 10 ?m, and (ii) leak areas of the inner peripheral surface and the outer peripheral surface are less than 0.7 mm2.

Abstract: Ozone generating machine for generating ozone in a ship, including: an ozone generator (OG), a liquid cooling circuit portion, a frame, comprising a base (B) for laying on the ground, a top subframe (TSF) supporting the ozone generator (OG), and at least one pair of pillars (P) arranged between the base (B) and the top subframe (TSF), characterized in that the frame comprises: at least one pair of cross-brace beams (CB), for linking the pillars (P) and a plurality of dampers (D) attached to a bottom of the base (8).

Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and first and second electrode layers. The ceramic dielectric substrate includes first and second major surfaces. The first and second electrode layers are provided inside the ceramic dielectric substrate. The first electrode layer includes first and second portions. The first portion is positioned more centrally of the ceramic dielectric substrate than is the second portion. The first portion includes first and second surfaces. The second portion includes third and fourth surfaces. A distance between the third surface and the first major surface is constant. A thickness of the second portion between the third and fourth surfaces varies such that the thickness at a circumferential end portion of the second portion which is less than that at a central portion of the second portion.

Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and first and second electrode layers. The ceramic dielectric substrate includes first and second major surfaces. The first and second electrode layers are provided inside the ceramic dielectric substrate. The first electrode layer includes first and second portions. The first portion is positioned more centrally of the ceramic dielectric substrate than is the second portion. The first portion includes first and second surfaces. The second portion includes third and fourth surfaces. A distance between the fourth surface and the first major surface is constant. A thickness of the second portion between the third and fourth surfaces varies such that the thickness at a circumferential end portion of the second portion which is less than that at a central portion of the second portion.

Abstract: A variable stiffening device that includes a flexible envelope having a fluid chamber, a dielectric fluid housed within the fluid chamber, and an electrode stack that includes a plurality of electrodes and one or more abrasive strips. The electrode stack is housed within the fluid chamber and is configured to receive voltage. In addition, the one or more abrasive strips are each positioned between adjacent electrodes, such that when voltage is applied to the electrode stack thereby electrostatically drawing adjacent electrodes together, the one or more abrasive strips generate frictional engagement between adjacent electrodes to actuate the variable stiffening device from a relaxed state to a rigid state.

Abstract: An electrostatic clutch is described comprising a plurality of micron-scale thickness electrodes, adjacent electrodes being separated by a thin film of dielectric material. A power source and controller apply a voltage across two electrodes, causing an electrostatic force to develop. When engaged, a force can be transferred through the clutch. A tensioning device maintains the alignment of the clutch when the electrodes are disengaged, but permits movement in at least one direction. In some embodiments, multiple clutches are connected to an output to provide variable force control and a broad range of torque input and output values. Moreover, the clutch can be used as an energy-recycling actuator that captures mechanical energy from negative work movements, and returns energy during positive work movements.

Abstract: A power supply apparatus includes: a detection circuit configured to feed back a voltage to a generation circuit. The detection circuit includes: a first resistor, a second resistor connected in series with the first resistor, a first conductive pattern configured to connect the first resistor and the second resistor in series, a first capacitor connected in parallel to the first resistor, a second capacitor connected in parallel to the second resistor and connected in series with the first capacitor, a second conductive pattern configured to connect the first capacitor and the second capacitor in series, and a third conductive pattern configured to electrically connect the first conductive pattern and the second conductive pattern. A thermal resistance of the third conductive pattern is greater than a thermal resistance of the first conductive pattern.

Abstract: An electrostatic clutch is described comprising a plurality of micron-scale thickness electrodes, adjacent electrodes being separated by a thin film of dielectric material. A power source and controller apply a voltage across two electrodes, causing an electrostatic force to develop. When engaged, a force can be transferred through the clutch. A tensioning device maintains the alignment of the clutch when the electrodes are disengaged, but permits movement in at least one direction. In some embodiments, multiple clutches are connected to an output to provide variable force control and a broad range of torque input and output values. Moreover, the clutch can be used as an energy-recycling actuator that captures mechanical energy from negative work movements, and returns energy during positive work movements.

Abstract: Examples of a cooling system include a flow channel through which a cooling medium flows, a valve that is provided in the flow channel and configured to adjusts a flow rate of the cooling medium, a thermometer for measuring temperature of the cooling medium, a flowmeter for measuring a flow rate of the cooling medium passing through the valve, and a controller for determining cooling capacity of the cooling medium from measurement results of the thermometer and the flowmeter, and adjusting the valve so that the cooling capacity of the cooling medium approaches to a target value when the determined cooling capacity is different from the target value.

Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.

Abstract: An electrostatic clutch is described comprising a plurality of micron-scale thickness electrodes, adjacent electrodes being separated by a thin film of dielectric material. A power source and controller apply a voltage across two electrodes, causing an electrostatic force to develop. When engaged, a force can be transferred through the clutch. A tensioning device maintains the alignment of the clutch when the electrodes are disengaged, but permits movement in at least one direction. In some embodiments, multiple clutches are connected to an output to provide variable force control and a broad range of torque input and output values. Moreover, the clutch can be used as an energy-recycling actuator that captures mechanical energy from negative work movements, and returns energy during positive work movements.

Abstract: A mobile electrostatic carrier (MESC) provides a structural platform to temporarily bond a semiconductive wafer and can be used to transport the semiconductive wafer or be used to perform manufacturing processes on the semiconductive wafer. The MESC uses a plurality of electrostatic field generating (EFG) circuits to generate electrostatic fields across the MESC that allow the MESC to bond to compositional impurities within the semiconductive wafer. A layer of patterned material is superimposed across the bonding surface of MESC so that the cavities integrated into the layer of patterned material are able produce micro-vacuums that further adhere the semiconductive wafer to the MESC.

Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.

Abstract: A tri-modal carrier provides a structural platform to temporarily bond a semiconductive wafer and can be used to transport the semiconductive wafer or be used to perform manufacturing processes on the semiconductive wafer. The tri-modal carrier includes a doped semiconductive substrate, a plurality of electrostatic field generating (EFG) circuits, and a capacitance charging interface. A positive pole and a negative pole from each EFG circuit are embedded into the doped semiconductive substrate. An exposed portion of the doped semiconductive substrate is located between the positive pole and the negative pole, which is used as a biased pole for each EFG circuit. The combination of these poles for each EFG circuit is used to generate a non-uniform electrostatic field for bonding the semiconductive wafer. The tri-modal carrier also uses flat surface properties and the removal of trapped gas particles to strengthen the bond between the tri-modal carrier and the semiconductive wafer.

Abstract: An inertial electrode launcher may be configured to project charged particles or a voltage comprising an inertial electrode proximate a flame or combustion gas produced by the flame.

Abstract: An underwater pendant or accent light in contact with a body of water is provided. The underwater pendant or accent light has a housing. The housing has an at least one water tight end fitting at a first end of the housing and an at least one lens at a second end of the housing. An electronics section is further provided. The electronics section including an at least one controller contained within the housing and coupled to a power source. An at least one LED is coupled to the electronics section. An at least one heat sink is coupled to the at least one LED and the electronics section, the heat sink thermally coupled to and mounting the at least one LED and thermally coupled to the electronics section such that heat is communicated through the at least one heat sink.

Abstract: A tri-modal carrier provides a structural platform to temporarily bond a semiconductive wafer and can be used to transport the semiconductive wafer or be used to perform manufacturing processes on the semiconductive wafer. The tri-modal carrier includes a doped semiconductive substrate, a plurality of electrostatic field generating (EFG) circuits, and a capacitance charging interface. A positive pole and a negative pole from each EFG circuit are embedded into the doped semiconductive substrate. An exposed portion of the doped semiconductive substrate is located between the positive pole and the negative pole, which is used as a biased pole for each EFG circuit. The combination of these poles for each EFG circuit is used to generate a non-uniform electrostatic field for bonding the semiconductive wafer. The tri-modal carrier also uses flat surface properties and the removal of trapped gas particles to strengthen the bond between the tri-modal carrier and the semiconductive wafer.

Abstract: An insertion device is proposed for at least partly inserting a subcutaneous device, more particularly a subcutaneous sensor for detecting at least one analyte, into body tissue. The insertion device has at least one insertion aid and at least one subcutaneous device. The insertion aid has at least one substantially rigidly designed base body, more particularly an insertion needle, for insertion into the body tissue. The insertion device is designed to generate an adjustable holding force between the base body and the subcutaneous device. The insertion device is designed to set the holding force during the insertion such that the subcutaneous device is held against the base body. The insertion device is furthermore designed to set the holding force after the insertion such that the subcutaneous device is detachable from the base body.

Abstract: A heat dissipation apparatus includes an insulating plate, a conductive plate located on the insulating plate and a power source with an anode connected with the insulating plate and a cathode connected with the conductive plate. A conductive element is received in the insulating plate and is connected to the anode of the power source. When the heat dissipation apparatus is activated, the conductive element ionizes air closing to the insulating plate to produce positive ions. The conductive plate attracts the positive ions to move fast towards the conductive plate, which cause the air to flow in a direction in which the positive ions move.

Abstract: An image forming apparatus, comprising: an attachment unit to which a load for image formation is attached; an applying circuit configured to apply an applying voltage to the load; a voltage detection circuit configured to detect the applying voltage; a current detection unit configured to detect a load current; and a control device, wherein the control device is configured to: subject the applying circuit to constant current control in accordance with a detected value of the current detection unit so that the load current becomes a target current; and switch to a constant voltage control by which the applying voltage is controlled to become a target voltage when an absolute value of the load current is smaller than a determination value and an absolute value of the applying voltage is larger than or equal to a threshold during execution of the constant current control.

Abstract: A method for fabricating a microelectromechanical system (MEMS) device of the present invention includes the following steps: providing a substrate, comprising a circuit region and a MEMS region separated from each other; forming an interconnection structure on the substrate in the circuit region, and simultaneously forming a plurality of dielectric layers and a first electrode on the substrate in the MEMS region, wherein the first electrode comprises at least two metal layers formed in the dielectric layers and a protection ring formed in the dielectric layers and connecting two adjacent metal layers, so as to define an enclosed space between the two adjacent metal layers; forming a second electrode on the first electrode; and removing the dielectric layers outside the enclosed space in the MEMS region to form a cavity between the electrodes.

Abstract: According to one embodiment, an electrostatic chuck includes: a ceramic dielectric substrate, an electrode, and a conductive member. The ceramic dielectric substrate has a first major surface on which a material to be adsorbed is to be mounted and a second major surface on a side opposite the first major surface. The electrode is interposed between the first major surface and the second major surface of the ceramic dielectric substrate. The conductive member is provided in a recess formed in the second major surface of the ceramic dielectric substrate. A tip end of the recess has a curved surface.

Abstract: A substrate processing apparatus includes an electrostatic chuck enclosing an electrostatic electrode plate and a chamber having a ground potential and housing the electrostatic chuck. DC discharge is generated between a wafer and the chamber by setting the potential of the electrostatic electrode plate of the electrostatic chuck which is maintained at a first predetermined potential during a plasma etching process to a ground potential after the plasma etching process to increase the absolute value of the potential difference between the wafer and the chamber. DC discharge is then re-generated by applying, to the electrostatic electrode plate, DC voltage having the same potential as a second predetermined potential which is generated at the wafer after the DC discharge is generated, and by increasing the absolute value of the potential difference between the wafer and the chamber. The wafer is then easily removed from the electrostatic chuck.

Abstract: In a component mounting device (1) which has a first mounting lane (L1) and a second mounting lane (L2) and which is structured so as to be able to select either an independence mounting mode or an alternation mounting mode, when device type changing operation is performed with change of the type of boards which are the mounted objects, if a tape feeder float detecting sensor (17) that is provided in proximity of an opening (19) through which a part of the body or the foreign object enters in the component supplying part is, detects a part of the body such as a finger (26) of the operator or the foreign object, operation of the component mounting mechanism which belong to the mounting lane opposite to the mounting lane to which the component supplying part, in which the optical sensor is provided, belongs is stopped.

Abstract: Various embodiments of the invention reduce stiction in a wide range of MEMS devices and increase device reliability without negatively impacting performance. In certain embodiments, stiction recover is accomplished by applying electrostatic forces to electrodes via optimized voltage signals that generate a restoring force that aids in overcoming stiction forces between electrodes. The voltage signals used within a stiction recovery procedure may be static or a dynamic, and may be applied directly to existing electrodes within a MEMS device, thereby, eliminating the need for additional components. In some embodiments, the voltage is estimated or calibrated and swept through a range of frequencies that contains one or more resonant frequencies of the mechanical structure that comprises the parts to be detached.

Abstract: A computer implemented method, apparatus, and computer usable program code for brokering a charging process of an electric vehicle. In one embodiment, a process extracts event data associated with the charging process from a charge notification in response to receiving the charge notification indicating that the charging process of the electric vehicle is complete. The event data may include, but is not limited to, duration of the charging process, quantity of electricity transferred, or rate at which electricity was transferred during the charging process. The process then identifies, from an energy transaction plan, a set of payees participating in the charging process. Thereafter, the process disburses a payment owed to the set of payees. An amount of the payment is calculated using payment terms in profiles of the set of payees. The payment includes funds from at least one of a payer fund and an incentive fund.

Abstract: Systems and methods are presented for a peripheral RF feed and symmetric RF return for symmetric RF delivery. According to one embodiment, a chuck assembly for plasma processing is provided. The chuck assembly includes an electrostatic chuck having a substrate support surface on a first side, a facility plate coupled to the electrostatic chuck on a second side that is opposite the substrate support surface, a peripheral RF feed configured to deliver RF power, the peripheral RF feed having a first portion contacting a periphery of the facility plate and an RF strap coupling the peripheral RF feed to an RF source.

Abstract: An electrostatic chuck for clamping a warped workpiece has a clamping surface comprising a dielectric layer. The dielectric layer has a field and one or more zones formed of differing dielectric materials. One or more electrodes are coupled to a power supply, and a controller controls a clamping voltage supplied to the one or more electrodes via the power supply. An electrostatic attraction force associated with each of the field and one or more zones of the dielectric layer of the electrostatic chuck is induced, wherein the electrostatic attraction force varies based on the dielectric material of each of the field and one or more zones. The electrostatic attraction force is greater in the one or more zones than in the field, therein attracting warped regions of the workpiece to the clamping surface and clamping the warped workpiece to the clamping surface across a surface of the warped workpiece.

Abstract: In an ion generator, a flexible discharge electrode 44 composed of one wire is provided to a base 43, and a turning motion of a free end 44b of the discharge electrode 44 about a fixed end 44a of the discharge electrode 44 is performed by repulsive force of a corona discharge generated by supplying a high voltage to the fixed end 44a. Therefore, in comparison with a discharge electrode composed of a bundle of thin wires, it is possible to significantly reduce dust emission from the free end 44b of the discharge electrode 44, and to further improve the ion generator 30 in maintenance interval. Since the discharge electrode 44 is compose of one wire, it is possible to reduce the discharge electrode 44 in size, easily observe the state of the discharge electrode 44, and simplify its maintenance. Since the discharge electrode 44 performs a turning motion, it is possible to transport the generated air ions EI to a wide area of a packaging film 10, and to enhance ionizing efficiency.

Abstract: In a component mounting device (1) which includes a first mounting lane (L1) and a second mounting lane (L2) and for which an independence mounting mode and an alternation mounting mode are selectable, a first limited movable area (R1A) and a first limited movable area (R1B) in which the movements in the horizontal direction of a first mounting head (13A) and a second mounting head (13B) of the mounting lanes are permitted in the independence mounting mode, are set as areas different from second limited movable areas in the alternation mounting mode, to prevent the mounting head of the mounting lane which is continuously operating from entering into the area of the mounting lanes for which the device type changing operation is being performed.

Abstract: When performing the device type changing operation with the change of the board type to undergo mounting, the component mounting device, which has a first mounting lane and a second mounting lane and which is structured so as to be able to select either an independent mounting mode or an alternate mounting mode, moves a mounting head of the mounting lane to and thereafter positions and fixes to a previously-set predetermined withdraw position [P] where entry of a portion of a body of an operator by way of an opening (19) formed in a protective cover (18a) can be prevented and where safety of the operator is not impaired even if a mounting head of a mounting lane on the other side has undergone collision.

Abstract: A production method of an electronic component includes: forming a sheet having a resin layer and a metal layer formed under the resin layer; bonding the sheet to a substrate so that the metal layer is arranged on a functional portion of an acoustic wave element formed on the substrate, a frame portion surrounding the functional portion is formed between the metal layer and the substrate, a cavity is formed on the functional portion by the metal layer and the frame portion, and the resin layer covers the metal layer and the frame portion.

Abstract: A part mounting method of mounting first mounting parts and a second mounting part to a board includes taking an image of a configuration of the second mounting part and performing an image-recognition, mounting the first mounting parts to the board based on a result of the image-recognition of the configuration of the second mounting part, and mounting the second mounting part to the board based on a result of an image-recognition of the first mounting parts mounted to the board.

Abstract: A corona ignition system 20 includes a corona drive circuit 26 and an auxiliary energy circuit 28. The energy circuit 28 stores energy during a standard corona ignition cycle. When arc discharge occurs or corona discharge switches to an arc discharge, the energy circuit 28 discharges the stored energy to the electrode 30 to intentionally maintain a robust arc discharge 29 and thus provide reliable ignition. The stored energy is transmitted to the electrode 30 over a predetermined period of time. The arc discharge is detected and an arc control signal 60 is transmitted to the energy circuit 28, triggering discharge of the stored energy to the electrode 30. The stored energy can be transmitted to the electrode 30 along a variety of different paths. The voltage of the stored energy is typically increased by an energy transformer 70 before being transmitted to the electrode 30.

Abstract: A developer supply device includes a developer-carrying body having a developer-carrying surface that faces an intended device in a first position and moves in a moving direction, a first transfer board that faces the developer-carrying surface in a second position upstream relative to the first position in the moving direction and transfers the developer to the second position in a direction opposite to the moving direction in the second position, an electrification member facing the developer-carrying surface in a third position downstream relative to the second position and upstream relative to the first position in the moving direction, and a second transfer board that faces the developer-carrying surface in a fourth position downstream relative to the first position and upstream relative to the second position in the moving direction and transfers the developer to a developer storage section in a direction identical to the moving direction in the fourth position.

Abstract: A multi-sectional linear ionizing bar with at least four elements is disclosed. First, disclosed bars may include at least one ionization cell with at least one axis-defining linear ion emitter for establishing an ion cloud along the length thereof. Second, disclosed bars may include at least one reference electrode. Third, disclosed bars may include a manifold for receiving gas or air from a source and for delivering same past the linear emitter(s) such that substantially none of the gas/air flows into the ion cloud. Fourth, disclosed bars may include means for receiving the ionizing voltage and for delivering same to the linear emitter(s) to thereby establish the ion cloud. In this way, disclosed ionizing bars may transport ions from the plasma region toward a charge neutralization target without inducing substantial vibration of the linear emitter and without substantial contaminants from the gas/air flow reaching the linear emitter.

Abstract: Embodiments of the present invention comprise different methods and equipment for efficiently and relatively inexpensively producing Casimir cavities for use in quantum vacuum energy extraction. The methods include without limitation, sintering; submicron porous filter materials; web roll-to-roll produced mesh or foil layers; nanotube arrays; web roll-to-roll produced porous membranes such as graphene, metallically doped; web roll-to-roll produced metallic crystals with self assembling arrays of nano-channels; three-dimensional prototyping; charged particle deposition; metal wire bundles; metal tube bundles; and metallically doped or metallically coated glass or polymer wire bundles.

Abstract: Embodiments of the present invention comprise different equipment for efficiently and relatively inexpensively producing Casimir cavities for use in quantum vacuum energy extraction. The equipment includes without limitation, sintered materials; submicron porous filter materials; web roll-to-roll produced mesh or foil layers; nanotube arrays; web roll-to-roll produced porous membranes such as graphene, metallically doped; web roll-to-roll produced metallic crystals with self assembling arrays of nano-channels; materials produced by three-dimensional prototyping; materials produced by charged particle deposition; metal wire bundles; metal tube bundles; and metallically doped or metallically coated glass or polymer wire bundles.

Abstract: The method for binding a sensor and an actuator can be categorized into three types: manual binding, automatic binding and semi-automatic binding. Manual binding methods increase users' operational burden when a great number of sensors and actuators are to be bound. The current hard-coded automatic binding method suffers from lack of versatility. The template-based semi-automatic binding method still requires users to input some information manually. The disclosure provides an automatic binding method, which can automatically and reasonably bind the functions of a sensor and an actuator without user input, in a sensor network comprising a plurality of sensors and actuators.

Abstract: A sterilizing apparatus and an ion generating apparatus, which generate sufficient amount of cations in a short period of time and also maintain the amount of ions generated at a level that is harmless to the human body. The sterilizing apparatus and the ion generating apparatus optimize the position of an electrode to maximize the generation of active hydrogen. The ion generating apparatus includes a first electrode for generating hydrogen ions and a second electrode located such that the second electrode is separated from the first electrode by a designated distance for generating electrons and superoxide anions. The hydrogen ions generated from the first electrode react with the electrons generated from the second electrode to produce hydrogen atoms, and the hydrogen atoms react with the superoxide anions generated from the second electrode to sterilize the air.

Abstract: There is provided a cell driven by an electric field including a first electrode and a second electrode spaced from each other and an actuator moving between the first electrode and the second electrode. The actuator does not have permanent electric charges and a DC voltage or a pulse voltage is applied to the first electrode and the second electrode.

Abstract: A method of modifying the airflow to the inlet of an axial fan. The method includes operating an axial fan to move air longitudinally through an air inlet opening of the axial fan, and, during operation of the axial fan, applying an electrical potential between an emitter and a collector to cause ionic air movement radially outwardly away from a central axis of the axial fan, wherein the radially outward air movement is caused upstream of the axial fan before the air reaches the air inlet opening.

Abstract: A cleaning device includes a support and a cleaning arm partly embedded in the support. The cleaning arm includes a flexible polymer matrix and a carbon nanotube film structure at least partly embedded into the flexible polymer matrix. The carbon nanotube film structure includes a number of carbon nanotubes combined by van der Waals attractive force therebetween.

Abstract: A first insulated planar metallic surface is formed under a surface of a substrate which is orientated a first way to an edge of the substrate. A Faraday shield is formed when a second insulated planar metallic surface is juxtaposed to and segregates the first insulated planar metallic surface from the remained of the substrate. The first way can be parallel or perpendicular forming either an edge or surface Coulomb island, respectively. Both planar surfaces can be charged either by mechanical contact or induced charging, Fowler-Nordheim and ion implantation. A Coulomb force is generated between two charged Coulomb islands each located on a different substrate. In addition, these Coulomb islands can also be used as capacitors to transfer signals between the substrates. The Faraday shield can be used to increase the Coulomb force while the potential applied to the shield can alter the Coulomb force.

Abstract: A multi-sectional linear ionizing bar with at least four elements is disclosed. First, disclosed bars may include at least one ionization cell with at least one axis-defining linear ion emitter for establishing an ion cloud along the length thereof. Second, disclosed bars may include at least one reference electrode. Third, disclosed bars may include a manifold for receiving gas or air from a source and for delivering same past the linear emitter(s) such that substantially none of the gas/air flows into the ion cloud. Fourth, disclosed bars may include means for receiving the ionizing voltage and for delivering same to the linear emitter(s) to thereby establish the ion cloud. In this way, disclosed ionizing bars may transportions from the plasma region toward a charge neutralization target without inducing substantial vibration of the linear emitter and without substantial contaminants from the gas/air flow reaching the linear emitter.