Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.

Abstract: A physical quantity sensor includes a substrate, a piezoresistive element that is arranged on one face side of the substrate, a wall portion that is arranged to surround the piezoresistive element on the one face side of the substrate in a plan view of the substrate, and a ceiling portion that constitutes a cavity portion with the wall portion, in which the ceiling portion includes a cladding layer that has a pore which passes therethrough in the thickness direction of the cladding layer, and a seal layer that is stacked on the opposite side of the cladding layer from the substrate and closes the pore, the seal layer in which at least a part of the outer periphery of a contact portion where the seal layer is in contact with the cladding layer is on the outside of the cavity portion in a plan view.

Abstract: An electronic device is disclosed. The electronic device may include a sealing element between a protective cover and a housing of the electronic device. The sealing element may provide a seal between the protective cover and the enclosure, as well as monitor or detect a force to the protective cover. Also, one or more support members may surround the sealing element to provide protection against a material (such as liquid) entering an opening between the protective cover and the enclosure. Alternatively, or in combination, the sealing element may include several openings, each of which may include a restraining element to limit movement of the sealing element. Also, a blocking element may be placed at or near an edge of the enclosure to provide additional reinforcement if the sealing element is laterally displaced. The blocking element may include an operational component of the electronic device, such as an antenna.

Abstract: The present invention provides a tactual sensor using a micro liquid metal droplet simultaneously having high sensitivity and good spatial resolution. A tactual sensor using a micro liquid metal droplet according to an exemplary embodiment of the present invention includes: a first film having a first electrode layer; a second film having a second electrode layer facing toward the first electrode layer; an insulating layer provided on the second film while covering the second electrode layer; and a main body disposed between the first electrode layer and the insulating layer to form a chamber corresponding to the first electrode layer and the second electrode layer and accommodating a micro liquid metal droplet in the chamber.

Abstract: A capacitive ultrasonic transducer includes a sensor head having a back plate, the structured front side of which is provided with an insulation layer, and the back side of which is provided with an electrode. In order to achieve an improved construction by means of which increased temperature resistance up to several hundred degrees Celsius can be achieved even in strongly oxidizing and reducing media, the membrane provided as a sound generator is subjected to tensile stress in a planar direction.

Abstract: A method for manufacturing a pressure measuring cell, which has a ceramic platform and a ceramic measuring membrane, wherein the measuring membrane is joined with the platform pressure tightly by an active hard solder, or braze, wherein the method includes: providing the platform, the measuring membrane and the active hard solder, or braze, positioning the active hard solder, or braze, between the platform and the measuring membrane; melting the active hard solder, or braze, by irradiating the active hard solder, or braze, by a laser, wherein the irradiating of the active hard solder, or braze, occurs through the measuring membrane; and letting the active hard solder, or braze, solidify by cooling.

Abstract: In at least one embodiment, an apparatus for diagnosing a state of a capacitive sensor is provided. The apparatus includes a control unit for being operably coupled to a decoupling device that exhibits a drift condition and to the capacitive sensor. The control unit being configured to determine an impedance of the capacitive sensor and to determine a characteristic of the capacitive sensor based on at least the impedance. The control unit being further configured to determine a characteristic of the decoupling device based on the characteristic of the capacitive sensor and to provide an estimated capacitance based on the characteristic of the decoupling device, the estimated capacitance being indicative of the state of the capacitive sensor.

Abstract: Arrangement with capacitive pressure-measuring cell has a diaphragm for measuring vacuum pressure and a printed circuit board acting as a temperature sensor and another electronic component designed as a microchip that contains a digital signal processor with a temperature-to-digital converter and a capacitance-to-digital converter using a time measuring method. The converters determine temperature and capacitance of the cell in comparison to a reference resistor for temperature arranged on the printed circuit board and reference capacitor for capacitance for the pressure to be measured dependent on deformation of the diaphragm. A temperature-corrected pressure signal derived from the two measured signals uses correlation, the measured signals having been determined in advance from a calibration process, and the temperature-corrected pressure signal is provided as a pressure signal at the signal output for further processing. In this manner there is quick pressure measurement with high measuring accuracy.

Abstract: A polymer layer system pressure sensor device includes a first polymer substrate having a first cavity and a first polymer membrane stretched over the first cavity. The first polymer membrane is configured to be deflected dependent on a pressure in the first cavity. The device further includes a first membrane metallization layer applied to the first polymer membrane above the first cavity. The first membrane metallization layer is configured to be deflected together with the first polymer membrane dependent on the pressure in the first cavity. The device further includes a second polymer substrate, arranged over the first polymer membrane, a second cavity, arranged over the first cavity, and a second polymer membrane, stretched over the second cavity. The device further includes a second membrane metallization layer applied to the second polymer membrane within the second cavity and includes a third polymer substrate arranged over the second polymer membrane.

Abstract: A MEMS device. The device includes a membrane, and a reinforced backplate having a plurality of openings. The reinforced backplate include a first layer, and a second layer coupled to the first layer.

Abstract: The disclosed embodiments include a capacitance diaphragm gauge that includes a self-heated micro-electro-mechanical-system sensor for measuring pressure. The self-heated micro-electro-mechanical-system has at least one integrated heater component and at least one membrane on the self-heated micro-electro-mechanical-system.

Abstract: A system and method for forming a sensor device includes defining an in-plane electrode in a device layer of a silicon on insulator (SOI) wafer, forming an out-of-plane electrode in a silicon cap layer located above an upper surface of the device layer, depositing a silicide-forming metal on a top surface of the silicon cap layer, and annealing the deposited silicide-forming metal to form a silicide portion in the silicon cap layer.

Abstract: According to an embodiment of the present invention, a pressure sensor includes: a pressure sensing chip, which includes a substrate, a sensing film, an insulation layer and a first bonding pad; wherein the sensing film is on the substrate, and a sagging step is formed at one side of the substrate; the insulation layer is prepared on the sensing film and the substrate; the first bonding pad is prepared on the insulation layer on a bottom surface of the step, and is connected to the region of the substrate close to the sensing film via a lead wire.

Abstract: A microelectromechanical pressure sensor structure that comprises a planar base and side walls and a diaphragm plate. The side walls extend circumferentially away from the planar base to a top surface of the side walls. The planar base, the side walls and the diaphragm plate are attached to each other to form a hermetically closed gap in a reference pressure, and a top edge of the inner surfaces of the side walls forms a periphery of a diaphragm. The diaphragm plate comprises one or more planar material layers of which a first planar material layer spans over the periphery of the diaphragm. The top surface of the side walls comprises at least one isolation area that is not covered by the first planar material layer.

Abstract: A method for operating a pressure sensor, which includes a measuring membrane, at least one platform and a capacitive transducer having two pressure dependent capacitances between electrodes on the measuring membrane. The measuring membrane divides a volume pressure-tightly into two volume portions, wherein the second volume portion is enclosed in a measuring chamber between the measuring membrane and the platform. A deflection of the measuring membrane depends on a pressure measurement variable p, which is a difference between a first pressure p1 and second pressure p2 in the volume portions. The pressure measurement variable p follows from both capacitances, wherein, for an intact pressure sensor, the second capacitance is a predetermined function of the first capacitance and, in given cases, the temperature.

Abstract: A capacitive pressure transducer of an embodiment of the present invention capacitively couples two electrodes on a substrate with a diaphragm electrode to form a transducing circuit without the need for a physical connection between the electrodes. Embodiments of the present invention have a substrate with a coupling electrode and a sensing electrode and an attached diaphragm with a diaphragm electrode. A spacer positioned between the substrate and the diaphragm provides for a cavity that defines a gap between the sensing electrode and the diaphragm electrode. A dielectric spacer may be positioned over the coupling electrode to increase the capacitance between the coupling electrode and the diaphragm electrode. The capacitive pressure transducer has similar electrical characteristics as existing capacitive pressure transducers, is easier to manufacture, and has long-term reliability and durability improvements brought about by the elimination of mechanical interconnects and additional conductive materials.

Abstract: Embodiments relate to integrated circuit sensors, and more particularly to sensors integrated in an integrated circuit structure and methods for producing the sensors. In an embodiment, a sensor device comprises a substrate; a first trench in the substrate; a first moveable element suspended in the first trench by a first plurality of support elements spaced apart from one another and arranged at a perimeter of the first moveable element; and a first layer arranged on the substrate to seal the first trench, thereby providing a first cavity containing the first moveable element and the first plurality of support elements.

Abstract: A differential pressure sensor for sensing a differential pressure of a process fluid, includes a sensor body having a sensor cavity formed therein with a cavity profile. A diaphragm in the sensor cavity deflects in response to an applied differential pressure. The diaphragm has a diaphragm profile. A gap formed between the cavity profile and the diaphragm profile changes as a function of the differential pressure. At least one of the cavity profile and diaphragm profile changes as a function of a line pressure to compensate for changes in the gap due to deformation of the sensor body from the line pressure.

Abstract: An electrostatic capacitance sensor 1 includes a semiconductor substrate 4. A first fixing plate 2 is joined to a one-side surface 4a of the semiconductor substrate 4, and a second fixing plate 3 is joined to other-side surface 4b of the semiconductor substrate 4, whereby a space portion S is formed. Then, static electricity suppressing means 70 for suppressing static electricity from being generated in the space portion S is provided in the electrostatic capacitance sensor 1.

Abstract: A wireless sensor for indicating a physical state within an environment includes a housing defining a hermetically sealed cavity. A structure located within the cavity of the housing has elements providing capacitance, the elements being arranged such that the distance and thereby the capacitance of the structure changes when a physical state of the environment changes. The structure has a resonant frequency based at least in part on the capacitance of the structure when in the presence of a fluctuating electromagnetic field. When the sensor is positioned within an environment and is subjected to a fluctuating electromagnetic field, the resonant frequency indicates the physical state of the environment.

Abstract: In an aspect, a pinch sensor is provided, comprising: an elongate non-conductive casing enclosing first, second, and third elongate conductive electrodes; the first and second electrodes being separated by a portion of the casing, a capacitance between the first and second electrodes changing when an obstacle approaches the first electrode to provide a proximity indication of the obstacle to the pinch sensor; and, the second and third electrodes being separated by an air gap formed in the casing, a resistance between the second and third electrodes changing when the second and third electrodes come into contact upon compression of the casing by the obstacle to provide a contact indication of the obstacle with the pinch sensor.

Abstract: An illustrative assembly includes a panel and a capacitive sensor. The panel is movable between an opened position and a closed position relative to a closure of a vehicle body. The sensor is positioned on the panel such that at least a portion of the sensor is perpendicular to the closure of the vehicle body as the panel moves between the opened and closed positions. The sensor capacitively couples to an electrically conductive object proximal to the closure of the vehicle body such that capacitance of the sensor changes.

Abstract: A micro electro mechanical system device has a first subassembly having sensor element including a coupler, and a second subassembly including a comb drive. The comb drive having stator plates and rotor plates and the coupler configured to displace the rotor plates relative to the stator plates providing a variable capacitance dependent on the displacement of the rotor plate.

Abstract: Pressure sensor unit for sealed attachment to a fluidic system comprising a mounting member, a membrane cavity extending through the mounting member with an opening in contact with the fluidic system when the sensor unit is attached thereto, a membrane formed at the distal end of the membrane cavity, and a membrane deflection sensor, wherein the membrane is separated from the mounting member by a stress insulating member arranged to isolate the membrane from stress and strain in the mounting member.

Abstract: Flexible force/pressure sensors for producing electrical output signals proportional to forces or pressures exerted on the sensor include a thin, elastically deformable foam pad laminated between a pair of electrically conducive fabric sheets. A piezocapacitive embodiment of the sensor utilizes an elastically deformable perforated open-cell polyurethane foam pad preferably saturated with glycerin to increase the capacitance of the sensor. The piezocapacitive sensor section is preferably stacked onto a piezoresistive section having a second open-cell foam pad containing piezoresistive carbon particles to form a hybrid piezocapacitive/piezoresistive sensor. A third, “leaky dielectric” embodiment of a sensor includes a single open-cell foam pad which contains both a dielectric liquid and conductive particles. A low frequency such as d.c.

Abstract: An MEMS pressure sensor is designed to reduce or eliminate thermal noise, such as temperature offset voltage output. The pressure sensor includes a pressure sensing element having a diaphragm, and a cavity formed as part of the pressure sensing element, where the cavity receives a fluid such that the diaphragm at least partially deflects. The pressure sensing element also includes a plurality of piezoresistors, which are operable to generate a signal based on the amount of deflection in the diaphragm. At least one trench is integrally formed as part of the pressure sensing element, and an adhesive connects the pressure sensing element to the at least one substrate such that at least a portion of the adhesive is attached to the trench and redistributes thermally induced stresses on the pressure sensing element such that the thermally induced noise is substantially eliminated.

Abstract: There is disclosed a high pressure sensing header which is relatively insensitive to mounting torque. The header generally includes an outer torque isolating shell which has a “C” shaped cross section with the cylindrical shell surrounding an inner “H” section header. The inner “H” section header has a thick diaphragm and is at least partially surrounded by the torque isolating shell. In this manner, when the header is installed, the installation force is absorbed by the outer shell and there is relatively no installation force or torque exhibited by the inner “H” section which will respond only to stress due to pressure.

Abstract: A sensor assembly includes a housing assembly, an electrode arrangement and a diaphragm having a fixed portion secured to the housing assembly and an active portion movable relative to the electrode arrangement in response to a differential pressure applied to opposite sides of the diaphragm. The fixed portion of the diaphragm is secured at one or more locations relative to at least a portion of the housing assembly; and at least one groove is formed in the fixed portion of the diaphragm between the locations at which the diaphragm is fixed relative to the housing assembly and the active portion so as to relieve any stress on the active portion of the diaphragm. A method of making the sensor assembly is also disclosed.

Abstract: A liquid micro-electro-mechanical system (MEMS) component includes a board, a channel frame, a flexible channel side, a liquid droplet, and one or more conductive elements. The channel frame is within the board and mates with the flexible channel side to form a channel within the board. The liquid droplet is contained within the channel. When a pressure is applied to the flexible side, the shape of the liquid droplet is changed with respect to the one or more conductive elements thereby changing an operational characteristic of the liquid MEMS component.

Abstract: A pressure sensor includes: a container; a pressure receiving member which forms apart of the container; a pressure sensitive element which has a pressure sensing portion and a pair of base portions connected to both ends of the pressure sensing portion, and which has a detection axis parallel to a line connecting the base portions, and in which the detection axis is parallel to a displacement direction of the pressure receiving member, and which detects pressure based on displacement of the pressure receiving member; and a gate-shaped frame which includes a pair of shock absorbing portions that interposes the pressure sensitive element and is connected to a side of the pressure receiving member close to the peripheral portion or a side of the container close to the pressure receiving member and a beam portion that connects distal ends of the shock absorbing portions.

Abstract: In an electrostatic capacitance pressure sensor provided with a pressure sensor chip of a diaphragm structure for detecting an electrostatic capacitance in accordance with a pressure of a medium to be measured, one face of a sensor diaphragm of the pressure sensor is a pressure introduction chamber side wherein the medium to be measured is introduced, and the other face is a capacitor chamber side wherein a capacitor portion is formed, where, in the sensor diaphragm, the rigidity is lower towards a center portion from a peripheral edge portion that is a boundary of diaphragm securing portions on the capacitor chamber side.

Abstract: The invention relates to a pressure sensor (6). This pressure sensor (6) comprises a flexible membrane (11) cooperating with a transmission device (10) that enables a value representing the pressure to be supplied on the basis of the deformation of the membrane (11). The membrane (11) is made from an at least partially amorphous material in order to optimise the dimensions of the sensor (6).

Abstract: An absolute piezo-resistive pressure sensor system and method employing multiple pressure sensing elements operating simultaneously to detect pressure. Both pressure sensing elements being subject to a common reference pressure within a sealed cavity. The first pressure sensing element detecting an offset voltage resulting from the progressive release of mechanical stress at an assembly interface between the sensing element and a base plate on which the sensing elements are assembled. Electronic circuitry compensates the pressure measured by the second pressure sensing element based on the offset voltage detected by the first pressure sensing element.

Abstract: A novel flexible transducer structure is suitable for attaching to curved surface such as the leading edge of an aircraft wing. The structure comprises a thin flexible sheet of an insulating material with a leadless transducer secured to the sheet. The sheet is then placed over the curved surface and assumes the curvature of the surface. The transducer secured to the sheet provides an output of pressure according the pressure exerted on the sheet. The sheet basically is fabricated from a thin material such as Kapton and is flexible so as to assume the curvature of the surface with the transducer being exposed to pressure applied to the curved surface. The sensor in conjunction with the flexible sheet allows pressure to be measured without disturbing the air flow patterns of the measuring surfaces and because of its construction, is moisture resistant over a large variety of atmospheric conditions.

Abstract: A method for manufacturing a Micro-Electro-Mechanical System pressure sensor, including forming a gauge wafer including a diaphragm and a pedestal region. The method includes forming an electrical insulation layer disposed on a second surface of the diaphragm region and forming a plurality of sensing elements patterned on the electrical insulation layer disposed on the second surface in the diaphragm region, forming a cap wafer with a central recess in an inner surface and a plurality of through-wafer embedded vias made of an electrically conductive material in the cap wafer, creating a sealed cavity by coupling the inner recessed surface of the cap wafer to the gauge wafer, such that electrical connections from the sensing elements come out to an outer surface of the cap wafer through the vias, and attaching a spacer wafer with a central aperture to the pedestal region with the central aperture aligned to the diaphragm region.

Abstract: An absolute capacitive micro pressure sensor including a pressure sensor element with a mechanically fixed electrode and a deflectable pressure sensor membrane separated from the fixed electrode by a predetermined distance. A packaging defining a chamber is formed by a cover assembled to a base plate with an opening defined therein. The chamber is filed with a fluid and/or a gas at substantially constant pressure. Within, the chamber, the pressure sensor element is mounted to the base plate to define an open cavity therebetween substantially aligned with the opening defined in the base plate. A gel is disposed in the open cavity in contact with an exposed surface of the deflectable membrane.

Abstract: A variable capacitor of a position indicator includes a dielectric, an electrode, a conductive member and a conductive portion. The dielectric has an upper surface and a lower surface opposite the upper surface. The electrode is provided on the upper surface of the dielectric. The conductive member is arranged so as to face the lower surface of the dielectric. The conductive portion is provided on the lower surface of the dielectric and is arranged so as to be electrically connectable to the conductive member. The conductive member is adapted to be elastically deformed when pressed against the lower surface by an external force, such that the capacitance of the variable capacitor changes according to a change of the external force.

Abstract: A capacitive touch device includes a transparent handheld portion and a touch portion, and the transparent handheld portion has at least one sensing structure, and the touch portion is disposed at an end of the transparent handheld portion and has a flexible conductive element, and a user can hold the handheld portion. When the flexible conductive element is contacted with the capacitive touch panel, a capacitive coupling is formed to produce current, to achieve the touch operation effect.

Abstract: A pressure sensor in contact with an aggressive fluid for a pressure measurement has a board with a pressure passage. The pressure passage is closed on one side by a sensor chip as a pressure sensing element. The board also mounts an integrated circuit and electrical contacts for electrical contacting of the pressure sensor. At least the on board arranged pressure sensing element as well as the integrated circuit are tightly enclosed by a capper made of a fluid resistant material in connection with the board, and are arranged in an encasing cavity formed by the capper and the board for fluid resistant protection.

Abstract: An electronic circuit (10) for controlling a capacitive pressure sensor (1), which capacitive pressure sensor (1) comprises a plate electrode capacitor (C) with a capacity that varies in dependence on pressure changes exerted on a deflectable diaphragm (2) forming one plate electrode of the capacitor (C), wherein the electronic circuit (10) comprises a DC voltage source (12) being adapted to generate a DC bias-voltage (UDC) to be applied across the electrodes of the capacitor (C), an AC voltage source (13) being adapted to generate an AC voltage signal (UAC) to be applied across the electrodes of the capacitor (C) and a controller (18) being adapted to receive an output signal (OUT) of the capacitor (C) and to control the DC voltage source (12) such that the DC bias-voltage (UDC) applied to the capacitor (C) adopts a value that maintains the capacity of the capacitor (C) at a desired value.

Abstract: A capacitive differential pressure sensor is described which has a simple configuration, and which provides reliable measuring results even in corrosive measuring environments. The sensor element for capacitively measuring differential pressure includes a sensor diaphragm which is implemented in a layered configuration on a semiconductor substrate and spans a cavern. A pressure connection opens into the cavern. The sensor element also includes a measuring capacitor which has a movable electrode on the sensor diaphragm, and a stationary counter electrode which is situated on the base of the cavern, opposite from the movable electrode. According to the sensor, the cavern is filled with a dielectric fluid.

Abstract: A monolithic manometer and method of sensing pressure changes may include sensing a change in parasitic capacitive coupling between multiple parasitic capacitive coupled conductive elements in response to a diaphragm disturbing the parasitic capacitive coupling between the conductive elements. A signal representative of the sensed change in parasitic capacitive coupling may be output.

Abstract: A pressure transducer includes a substrate, a piezoresistive element, a first conductive element, a first terminal, and a test structure. The substrate has a surface and a cavity. A diaphragm layer is formed over the cavity and over the surface of the substrate. The piezoresistive element is formed in the diaphragm layer. The first conductive element is formed in the diaphragm layer, and has a first conductivity type. The first conductive element is coupled to the piezoresistive element. The first terminal is formed over a surface of the diaphragm layer and coupled to the first conductive element. The test structure has the first conductivity type and is formed in the diaphragm layer. The test structure has an edge spaced apart from an edge of the first conductive element by a predetermined distance. A surface charge accumulation on the diaphragm layer is detected using the test structure.

Abstract: A semiconductor device includes a substrate including a cavity and a first material layer over at least a portion of sidewalls of the cavity. The semiconductor device includes an oxide layer over the substrate and at least a portion of the sidewalls of the cavity such that the oxide layer lifts off a top portion of the first material layer toward a center of the cavity.

Abstract: The present invention is adapted to prevent a diaphragm from being deformed by a thermal stress caused by thermal expansion coefficients of a sensor main unit and a fixing member and includes a sensor main unit to which a fixed electrode is fixed, a diaphragm structure that forms a sealed space between the diaphragm structure and the sensor main unit and a fixing member that is jointed to the diaphragm structure in a manner of surrounding a pressure receiving part of the diaphragm structure so as to lead a fluid to the pressure receiving part, wherein the diaphragm structure includes a flat plane diaphragm main unit and first and second ring members each having a known thermal expansion coefficient that are respectively provided on both sides of a circumference of the diaphragm main unit.

Abstract: A pressure or force sensor has a sensor housing, a measuring element in the housing, and a sensor membrane. The membrane is delimited by an inner edge and an outer edge, which is connected in a pressure-resistant manner to the sensor housing. The inner edge transitions in a pressure-resistant manner into a movable plunger, the travel of which can be detected by the measuring element. The membrane has one or more elastic regions between the outer edge and the inner edge, each region having a thinnest point, wherein the material thickness inside the elastic region increases steadily on both sides of this thinnest point. The cross-section of the membrane has an arched shape in each elastic region, and the arched shape has a convex outer and concave inner contour relative to the arch orientation.

Abstract: A pressure sensor micromachined by using microelectronics technologies includes a cavity hermetically sealed on one side by a silicon substrate and on the other side by a diaphragm that is configured to be formed under the effect of the pressure outside the cavity. The sensor includes at least one resistance strain gage fastened to the diaphragm and has resistance that varies as a function of the deformation of the diaphragm. The diaphragm is fastened to the resistance strain gages. The gages are located inside the sealed cavity. The diaphragm has an insulting layer deposited on a sacrificial layer and may cover integrated measurement circuits in the silicon substrate.

Abstract: An absolute piezo-resistive pressure sensor system and method employing multiple pressure sensing elements operating simultaneously to detect pressure. Both pressure sensing elements being subject to a common reference pressure within a sealed cavity. The first pressure sensing element detecting an offset voltage resulting from the progressive release of mechanical stress at an assembly interface between the sensing element and a base plate on which the sensing elements are assembled. Electronic circuitry compensates the pressure measured by the second pressure sensing element based on the offset voltage detected by the first pressure sensing element.

Abstract: A micro-deformable piezoresistive material is provided, including a hard plastic body, a micro-deformable rough texture surface, and a plurality of conductive particles. The micro-deformable rough texture surface is formed on a side of the hard plastic body, wherein the maximum deformation of the rough texture surface is far less than the thickness of the hard plastic body. Additionally, the conductive particles are evenly dispersed in the plastic body.

Abstract: In accordance with the invention, there are micro-electromechanical devices and methods of fabricating them. An exemplary micro-electromechanical device can include a first dielectric layer; a buried conductive trace disposed over the first dielectric layer, such that the buried conductor trace is electrically connected to an outside power source; a second dielectric layer disposed over the buried conductive trace; at least one conductive electrode disposed over the second dielectric layer and electrically connected to the buried conductive trace; and at least one conductive membrane including membrane anchors disposed over the second dielectric layer, such that the at least one conductive membrane is electrically isolated from the at least one conductive electrode and the buried conductor trace, wherein the at least one conductive electrode is electrically connected to the power source through the buried conductive trace.