Abstract: An external cathode terminal (16) is adhered to one surface of a capacitor element while a prepreg (25) is adhered to another surface of the capacitor element. A reinforcement plate (26) is adhered to the prepreg. Heat and pressure are applied to the external cathode terminal, the prepreg, and the reinforcement plate to elute thermosetting resin from the prepreg in the side of the capacitor element, thereby sealing the side of the capacitor element with eluted material (27A, 27B). Inasmuch as transfer molding is not used as exterior package, the element never deforms by injection pressure of resin. It is possible to thin by a thickness of exterior package resin. Inasmuch as eluted thermosetting resin does not include a mold release agent, it has good adhesion for the external cathode terminal.

Abstract: A pot-shaped housing with a cover for capacitors has the pot-shaped housing and cover both being extruded as single workpieces and having different spatial dimensions along two principal axes so that they form either a rectangular or square. The cover is provided with two electrical terminals, preferably with one of the terminals being conducted through an opening in the cover and the other terminal preferably being integrally formed with the cover. The cover has a bent-up edge on its periphery in an interlocking fashion with the opening in the housing pot.

Abstract: A harmonic wave distortion suppressor includes a main body, at least a connecting pin and a coating. The main body is made of a first material and covered with a second material for absorbing an instantaneous high voltage or sharp wave. The connecting pin is coupled to two lateral sides of the main body respectively so as to form a capacitor. The coating is coated on the main body locally with a clearance being exposed and the clearance provides a function of charging and discharging locally. When the high voltage or sharp wave passes through the harmonic wave distortion suppressor, peak discharging effect of the clearance can not only isolate the high voltage or sharp wave from entering an electronic device but also prevent an iron core in the electronic device from occurring magnetization effect resulting from the high voltage or sharp wave so that quality of signal transmission and receiving can be secured.

Abstract: During molding of a brush holder which is a resin-molded part in an alternator, a capacitor component is molded integrally with a capacitor positive electrode terminal and a capacitor negative electrode terminal joined by crimping to a positive terminal and a negative terminal, respectively. The capacitor component is thereby embedded in a first resin portion.

Abstract: An inter-digital capacitor may be used in a power socket for a microelectronic device. In one embodiment an integrated, low-resistance power and ground terminal configuration is disclosed. The capacitor plates are alternatively coupled to the power and ground terminals. Two polarity types are disclosed. A method of operation is also described.

Abstract: The present invention concerns the field of solid state capacitors and relates particularly to massed production methods for manufacturing solid state capacitors.

Abstract: A high voltage capacitor has a monolithic body made of layers of dielectric material and further has first and second external contacts located on the body. First and second nonoverlapping electrodes electrically connected to the respective first and second contacts are located on respective first and second layers of dielectric material within the body. A floating electrode not connected to either of the contacts is located on a different, third layer of dielectric material. The floating electrode overlaps the first and second electrodes and forms two serially connected capacitors therewith.

Abstract: A pot-shaped housing with a cover for capacitors has the pot-shaped housing and cover both being extruded as single workpieces and having different spatial dimensions along two principal axes so that they form either a rectangular or square. The cover is provided with two electrical terminals, preferably with one of the terminals being conducted through an opening in the cover and the other terminal preferably being integrally formed with the cover. The cover has a bent-up edge on its periphery in an interlocking fashion with the opening in the housing pot.

Abstract: A self-leaded, surface mountable component package is provided for holding a wide variety of electrical components having widely variant conductor wire sizes in a manner achieving standardized conductor contact positioning. The general box-like configuration provides for component style variability and has a set of progressively stepped or tapered winding bosses to position and secure component conductors of multiple wire size, thereby ensuring proper registration with conductive traces of surface mount printed circuit boards and substrates.

Abstract: In an MIM capacitor element, a leak guard that covers an upper layer electrode layer is provided between upper layer electrode layer and a reflection prevention film and, therefore, a region is not formed wherein upper layer electrode layer and reflection prevention film make a direct contact with each other. As a result, it becomes possible to completely prevent the generation of a leak current between upper layer electrode layer and reflection prevention film. Thus, an improvement in the structure of the MIM capacitor element and an improvement in a manufacturing process for the same can be achieved, thereby it becomes possible to provide a semiconductor device wherein the reliability of the MIM capacitor element can be enhanced.

Abstract: The present invention relates to an apparatus for producing a comb-like capacitor element member including a guide member and a plurality of rectangular metal foil pieces bonded to the guide member, comprising an automatic feed mechanism for feeding tape-like foil by a constant lenght toward the guide member, a bonding mechanism for bonding the metal foil to the guide member, and a cutting mechanism for cutting the bonded metal foil. According to the apparatus of the present invention, a comb-like capacitor element member having a plurality of rectangular metal foil pieces bonded can be produced efficiently, by bonding the elongated tape-like metal foil without damaging it.

Abstract: A protective cap or top for a capacitor associated with a dynamoelectric machine is provided in a form which prevents electrical contact with foreign objects or the dynamoelectric machine shell if the capacitor is mechanically disassembled from the dynamoelectric machine. In the preferred embodiment, the cap and capacitor are mounted to one another in a manner that prevents separation without destruction of the capacitor.

Abstract: A capacitor includes a capacitor element having leads accommodated along with electrolyte solution in a metallic case, and a sealing plate that seals the opening of the metallic case. In the capacitor, a center axis of a threaded portion provided in a terminal block on the sealing plate is constituted to be parallel to a planar portion of the sealing plate. Hence, the center axis of the threaded portion is vertical to a circuit board when mounting the capacitor onto the circuit board. Thereby, a series of operation from the insertion to the tightening of the mounting screw is done very easily.

Abstract: A capacitor comprising a capacitor element, a case for housing the capacitor element, and a fixing section having projections for attaching the case to electrical equipment. In an exemplary embodiment of the present invention, the case and the fixing section are unitarily molded. The fixing section and the capacitor case are formed of flame-resistant thermoplastic resins as required. This structure eliminates the need of components and tools for fixing the capacitor. Thus, the structure can improve workability, and reduce man-hours and manufacturing cost.

Abstract: The present invention discloses a surface mountable device comprising a current-sensitive element and two electrodes. The current-sensitive element is composed of a PTC conductive composite, comprising at least one polymer and a conductive filler. The feature of the present invention is that the current-sensitive element is a three-dimensional bent structure so that the shape, length and height of the device can be varied according to the space of the circuit board and the resistance of the surface mountable device. Therefore, the mountable surface of the circuit board can be used more efficiently. Moreover, the area of the current-sensitive element of the present invention is larger than that of the conventional surface mountable device. Consequently, the normal resistance of the surface mountable device of the present invention is smaller than that of the conventional surface mountable device and the voltage endurance of the surface mountable device of the present invention is increased.

Abstract: A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e.g., chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layer's outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.

Abstract: An apparatus cover case structure which includes a sheet-like core layer which includes an electric element, laminate film layers which are respectively arranged on upper and lower surfaces of the core layer, and cover case layers which are respectively arranged on an upper surface of the upper laminate film layer and a lower surface of the lower laiminate film layer, thereby to form a sandwich structure. The apparatus cover case structure can make an electronic apparatus, such as portable telephone, smaller in size, lighter in weight and thinner in structure.

Abstract: During molding of a brush holder which is a resin-molded part in an alternator, a capacitor component is molded integrally with a capacitor positive electrode terminal and a capacitor negative electrode terminal joined by crimping to a positive terminal and a negative terminal, respectively. The capacitor component is thereby embedded in a first resin portion.

Abstract: This invention relates to a unipolar or multipolar electrical filter feedthrough device (1) to be introduced into an aperture of housing (26) of an implantable electronic therapeutic device with a feedthrough body (2) to be inserted in the aperture and comprising a fixing means (3) to connect with the housing wall, and with filter means (7) designed as capacitors, that are, on one side, connected—in an electrically conductive manner—with one of the electrical pins (8) that are mutually electrically separated, and, on the other side, with the housing of the therapeutic device carrying a reference potential. Filter means (7) are arranged outside the feedthrough body (2) and are connected with this body in such a manner that they basically stick out into the inside (4) of housing (26) in a freely suspended manner.

Abstract: A potted electrical component and a manufacturing method therefor including at least one electrical component at least partially encapsulated in a potting compound. A basket is at least partially disposed between an outer surface of the potting compound and the electrical component. The potted electrical component may include a plate. The plate may have no electrical components, at least one integral electrical component, at least one electrical component mounted to the plate, or any combination thereof. Additionally, the basket may be attached to an assembly.

Abstract: The present invention aims at providing an electronic component that can be readily reduced in size. Further, even when the electronic component is reduced in size, the miniaturized electronic component has (i) a wide range in capacitance, (ii) is allowed to be produced easily, (iii) has excellent electrical characteristics and (iv) can prevent defects due to a poor connection between the electronic component and a circuit board caused by warpage of the circuit board and the like when the electronic component is connected to the circuit board. The electronic component includes a capacitor element with a pair of lead terminals and an exterior packaging material disposed so as to encapsulate the capacitor element. The maximum length of the exterior packaging material is 7.5 mm or less and the maximum length of the capacitor element is 5.5 mm or less. Capacitance C of the capacitor element satisfies an inequality of 4 pF≦C≦4700 pF and a DC break down voltage BDV satisfies an inequality of BDV≧4.5 KV.

Abstract: A multilayer electronic device comprised of a capacitor body in which a plurality of internal electrodes are separately arranged in a plurality of blocks via ceramic layers. At least one lead is led out from each internal electrode. The terminal electrodes connected to each lead is arranged at the side faces of the capacitor body. The polarities of the voltages supplied to the nearby terminal electrodes in the same side face differ.

Abstract: A chip type capacitor having a casing cover, a dielectric, an elastomer, and a cover plate. The casing cover is formed as the outer casing of a capacitor. An open receiving chamber is provided in the casing cover. A plurality of lines capable of being broken are formed at a bottom of the casing cover. The dielectric is received in the receiving chamber of the casing cover. The dielectric has two lead pins. The elastomer has two first through holes. The lead pins pass through the first through holes of the elastomer so that the elastomer covers the dielectric. The cover plate has two second through holes. The lead pins of the dielectric pass through the second through hole of the cover plate so that the cover plate covers the elastomer. An outer diameter of the elastomer is slightly larger than the inner diameter of an inner wall of the receiving chamber. The elastomer is compressed by a fixture and then the elastomer is placed in the receiving chamber for enhancing the sealing of the capacitor.

Abstract: The present invention relates to an electric capacitor and, more specifically, to its electrical terminals. One problem that occurs while mounting the capacitor provided with the standard terminals on a pc board, is that the capsule is positioned to close to it and thus leaving no space between said board and the capsule resulting in a big difficulty to clean the board after the electrical components that have been welded to it. This problem is especially critical since, after the welding stage, the pc board has to be washed with a cleaning solution that can be stuck on said terminals resulting in malfunction of the electrical circuit. The solution that is known so far is the use of steps assembled in the cover disc.

Abstract: The present invention aims at providing an electronic component that can be readily reduced in size. Further, even when the electronic component is reduced in size, the miniaturized electronic component has (i) a wide range in capacitance, (ii) is allowed to be produced easily, (iii) has excellent electrical characteristics and (iv) can prevent defects due to a poor connection between the electronic component and a circuit board caused by warpage of the circuit board and the like when the electronic component is connected to the circuit board. The electronic component includes a capacitor element with a pair of lead terminals and an exterior packaging material disposed so as to encapsulate the capacitor element. The maximum length of the exterior packaging material is 7.5 mm or less and the maximum length of the capacitor element is 5.5 mm or less. Capacitance C of the capacitor element satisfies an inequality of 4 pF≦C≦4700 pF and a DC break down voltage BDV satisfies an inequality of BDV≧4.5 KV.

Abstract: A partial discharge analysis (PDA) coupling device contains a shell, a potting material in the shell encapsulating at least two capacitors and a conductive, flexible joint connecting the capacitors. The joint may be a hose clamp or a spring which expands during the thermal expansion of the potting material while providing an electrical connection between the capacitors.

Abstract: An improved structure of a capacitor having a housing comprising two copper plates mounted at two lateral sides of the housing having a capacitor element in between, and a securing rubber filled within the remaining space of the housing, characterized in that a plurality of downwardly slanting elastic plates mounted at the corresponding plate of the two copper plates for the engagement with the capacitor element, the lower section of the copper plates is inwardly bent to connect with a 90 degree connection pins, the top of the connection pins are provided with solder for soldering onto a circuit board, the connection pins are punched to form a fine insertion pin for optionally mounting onto any circuit board, thereby the elastic plates clip the capacitor element to provide and/or to secure a stable soldering and contact.

Abstract: An internally-fused capacitor includes a capacitor housing, at least one capacitor module, and at least one fuse assembly. The capacitor module is positioned in the housing and includes capacitor elements. Each capacitor element includes a first extended foil edge on a first end and a second extended foil edge on a second end. The fuse assembly is positioned in the housing and includes a fuse wire. The fuse wire is connected at a first end of the fuse wire to the first extended foil edge by a crimped connection.

Abstract: A structure of connection pins of a capacitor includes a housing, connection pins positioned at the lateral sides of the interior of the housing, and a capacitor element located between two pins, and the remaining space of the housing being filled with fixing glue, characterized in that one opening of the housing holds the capacitor element at a larger surface thereof and the two pins are located at the sides of the housing a plurality of elastic plates with a slanting angle are provided to the connection pins, and the lower section of the connection pins are bent to form a contact plate for contacting with a circuit board, the contact plate is a hook-like structure and is provided with solder at appropriate position, an insertion leg is provided on the contact plate for mounting with the circuit board, thereby the elastic plate clips the capacitor element to provide a good position and stable contact.

Abstract: A monolithic capacitor assembly is provided that is designed to easily and efficiently attach to an external device, such as a motor. The capacitor assembly comprises a capacitor body and an electrical termination electrically coupled to the capacitor body. The capacitor body and electrical termination are inserted into a cylindrical nylon shell that is sized and configured to receive the capacitor body and electrical termination such that the electrical termination extends through an indentation located along the open end of the nylon shell. In another embodiment of the present invention, the electrical termination is an electrical termination device. The electrical termination device rests within the indentation located along the open end of the nylon shell and is substantially flush with mounting surface of the nylon shell.

Abstract: An electronic device has a plurality of capacitors in an ultra-small integrated package. The device has a plurality of terminal structures on one terminal side of the package to permit inverted mounting to a printed circuit board. The terminals are widely spaced, with the individual capacitors being located entirely in between. The device is produced on a suitable substrate using thin film manufacturing techniques. A lead-based dielectric having a high dielectric constant is preferably utilized for each capacitor to provide a relatively high-capacitance value in a relatively small plate area.

Abstract: A capacitor of the present invention includes a hollow capacitor element prepared by winding a pair of flat electrodes with a separator sandwiched in-between in such a way that both ends of each respective electrode protrude in a direction opposite to each other, an electrode connecting member connected to each respective end surface of the electrode of the above, by metal plasma-spraying, welding, soldering and adhesion using a conductive adhesive, and a terminal for external connection is connected to the electrode connecting member. A cylindrical metal case contains the capacitor element together with a driving electrolyte and a sealing plate closing the opening of the metal case. A reduction in resistance of electrodes is made possible and, in addition, the capacitor can be made smaller in size and the number of the components can be decreased.

Abstract: In a nonflammable and disaster prevention type capacitor, the sealing property of the capacitor container is increased, a plurality of capacitor elements are collected, is accommodated in the container, and its inside is vacuum deaerated, the perfluorocarbon liquid deaerated by a deaeration apparatus is filled, and a capacitor which maintains an amount of residual air in the perfluorocarbon liquid to be not larger than 5%, is formed. A fluoride liquid to be filled in the container, consisting of a connection of carbon, fluorine and oxygen, and which includes per fluoropolyether by not smaller than 90% and whose boiling point is not lower than 120° C. and not higher than 270° C., and whose dynamic viscosity at 25° C. is from 0.9 mm2/s to not larger than 14 mm2/s, is impregnated into the capacitor element. An absolute pressure in the container is not smaller than 120 kPa and not larger than 300 kPa.

Abstract: The present invention provides a chip capacitor, a fabrication method for the same, and a metal mold that can prevent the occurrence of the chip standing phenomenon even when carrying out soldering using reflow soldering, and that be applied to further down-sizing an decreasing of weight. Curved parts 26 and 36 that extend beyond the connecting tongue pieces 21 and 31 of side piece parts 22 and 23 rising in an upward diagonal direction with respect to the connecting tongue pieces 21 and 31 are formed by press bending processing, and thereby the side piece parts 22 and 32 are exposed in an upward rising direction relative to the connecting tongue pieces 21 and 31 at the external end surfaces 15b and 15c of the external resin packaging.

Abstract: The present invention provides a method of patterning top and bottom electrodes of a capacitor. The method comprises the steps of: selectively forming a first mask made of a first material which has a barrier property to hydrogen on a top electrode of the capacitor; selectively etching a top electrode layer and a capacitive dielectric film by use of the first mask; without removing the first mask from the top electrode, selectively forming a second mask made of a second material which has a barrier property to hydrogen so that the second mask covers the first mask, the top electrode and the capacitive dielectric film and also covers a bottom electrode layer; and selectively etching a bottom electrode layer.

Abstract: A surface mounted capacitor comprises a casing, an inner board, a dielectric medium, aid an outer board. The inner board and the dielectric medium are mounted in the casing with two leads of the dielectric medium extended out of the casing. Resin glue and electrolyte are filled into a compartment defined in the casing and the outer board is mounted to seal an opening of the casing. The leads are bent and then positioned in grooves defined in the casing.

Abstract: A capacitor integrated with connector having a capacitor element 11 from which at least two lead wires extend, a terminal board 10 having at least two connectors 13 and at least two connecting terminals 14, 15 electrically connected to each connector 13, respectively. A groove narrower than a lead wire 16 is formed in each of connecting terminals 14, 15, and a lead wire 16 is trapped in the groove. The capacitor integrating connector can be assembled with ease regardless of a shape of mounting board 4, and can substantially improve assembly efficiency and achieve lead-free connection.

Abstract: A power capacitor has at least one capacitor unit, each capacitor unit formed of at least one winding, having at least two foils of insulating material, wherein the capacitor unit(s) is (are) housed in a casing of which at least the body is made of extruded aluminum, which body surrounds said capacitor unit(s).

Abstract: A capacitor module capable of forming assembly of capacitors is disclosed. The capacitor is contained into a housing and the housing has a male connector and a female connector formed on the opposite sides thereof. The housings can combine each other by the engagement of the male and female connectors so as to achieve the housing assembly. After that, link bars are used to connect the corresponding electrodes of each capacitor, and a cover and a base are mounted on the top and the bottom of the capacitor module.

Abstract: A capacitor for a car AC generator which improves assembly work efficiency and reduces a vibration load on the connection portions of the element terminals of the capacitor element and the terminals of the resin part, wherein a resin part installed in the inside space of a generator case has a one-end open bottomed cylinder-like container portion and resin side terminals around the opening portion of the container portion, a capacitor element for absorbing a surge generated by the voltage control of a voltage regulator is inserted into the inside of the container portion, the element side terminals of the capacitor element are connected to the respective resin side terminals on an insertion side, and the capacitor element is supported in the container portion by a solidified resin which is charged into a gap between the container portion and the capacitor element.

Abstract: A chip type solid electrolytic capacitor of the present invention has a section formed in a step-wise manner on a cathode lead frame that is connected with a capacitor element. An anode lead wire of the capacitor element is resistance welded to the top of a reversed V-letter shaped structure formed by folding part of an anode lead frame into halves. Further, with the chip type solid electrolytic capacitor of the present invention, part of respective cathode and anode lead frames is exposed outside in such a way as being made flush with the periphery of a resin package, thereby each serving as a terminal. Accordingly, a space problem due to the terminals has been eliminated and the anode lead wire can be made short, thus allowing the volume of a capacitor element employed to be increased. As a result, a chip type solid electrolytic capacitor having a large capacity with its outer dimensions is kept the same as a prior art capacitor can be obtained.

Abstract: A capacitor includes a housing, a connector disposed within the housing and having an end provided with a first U-shaped terminal and another end provided with a second U-shaped terminal, the first U-shaped terminal having a first leg extending downwardly from a lower end of the first U-shaped terminal, the second U-shaped terminal having a second leg extending downwardly from a lower end of the second U-shaped terminal, an ebonite member mounted between the first and second U-shaped terminals, a grounding terminal arranged intermediate of the ebonite member, an insulating material mounted between the first leg of the first U-shaped terminal and the second leg of the second U-shaped terminal, a first voltage sensitive resistor having a leg soldered to the first U-shaped terminal and another leg soldered to a lower end of the grounding terminal, and a second voltage-sensitive resistor having a leg soldered to the second U-shaped terminal and another leg soldered to the grounding terminal.

Abstract: In a power capacitor with a plurality of round, wound elements accommodated in a common housing at least one wound element group consisting of three round, wound elements is accommodated in the housing, with the wound elements of the group being arranged in star-form alongside one another, with their axes parallel to one another. The housing has in cross-section in general the shape of a triangle having rounded corners, with a radius of curvature which corresponds at least substantially to the radius of the round, wound elements.

Abstract: A high voltage ceramic capacitor includes a capacitor device, which is connected to a pair of metal terminals and which is housed in a ceramic housing. A first resin layer and a second resin layer separated by a space in the connecting direction of the two metal terminals are arranged such that the capacitor device and the contact portions between the capacitor device and the metal terminals are sealed airtight.