Abstract: A feedthrough flat-through capacitor includes a capacitor having a first and second set of electrode plates, a first feedthrough passageway through the capacitor, a first lead disposed within the first feedthrough passageway and conductively coupled to the first set of electrode plates, a second feedthrough passageway through the capacitor disposed remote from the first feedthrough passageway, and a second lead disposed within the second feedthrough passageway and conductively coupled to the first set of electrode plates. The second set of electrode plates are typically conductively coupled to a ground. An EMI shield may be provided to electromagnetically isolate the first lead from the second lead.

Abstract: There are provided a multilayer ceramic electronic component that does not require a heat treatment under a reduction atmosphere, and a manufacturing method thereof, wherein a conductive oxide is used as a material of internal and external electrodes and conductive layers having elasticity are formed on the external electrodes. In the case of the multilayer ceramic electronic component, a firing process may be performed under an air atmosphere, such that a manufacturing process may be simplified and manufacturing costs may be reduced.

Abstract: To provide a thin-film capacitor capable of preventing the degradation of electrical characteristics caused by direct contact between an adhesion layer of a terminal electrode and a dielectric layer, to increase the reliability.

Abstract: Sensing elements for sensing organic chemical analytes are disclosed. The sensing elements include a first electrode and a second electrode, and a substantially microporous, amorphous, hydrophobic, analyte-responsive organosilicate material in proximity to the first and second electrodes.

Abstract: Provided is a flat Ni particle which has a large specific surface area, permitting efficient binder removal when the flat Ni particle is used for internal electrodes of a laminated ceramic electronic component. The flat Ni particle has a thickness t (m), a specific gravity ? (g/m3), and a radius r (m), and a specific surface area S1 (m2/g), such that the specific surface area S1 is adapted to have a relationship of 1.5×S0<S1<1.9×S0 with a theoretical specific surface area in the case of assuming a surface to be completely smooth, represented by S0=2/(?×t)+2?2/(?×r) (m2/g).

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic main body including a dielectric layer; and inner electrodes disposed to face each other within the ceramic main body, with the dielectric layer interposed therebetween, wherein, when an average thickness of the dielectric layer is td and an average thickness of the inner electrodes is te, 0.1 ?m?te?0.5 ?m and (td+te)/te?2.5 are satisfied, and when an average surface roughness on a virtual surface roughness center line of the inner electrode is Ra and an average roughness of ten points of the inner electrode is Rz, 5 nm?Ra?30 nm, 150 nm?Rz?td/2, and 8?Rz/Ra?20 are satisfied. The multilayer ceramic electronic component has excellent reliability by improving adhesion strength between the dielectric layer and the inner electrodes and withstand voltage characteristics.

Abstract: An interdigitated capacitor having digits of varying width is disclosed. One embodiment of a capacitor includes a first plurality of conductive digits and a second plurality of conductive digits positioned in an interlocking manner with the first plurality of conductive digits, such that an interdigitated structure is formed. The first plurality of conductive digits and the second plurality of conductive digits collectively form a set of digits, where the width of a first digit in the set of digits is non-uniform with respect to a second digit in the set of digits.

Abstract: A multilayer feedthrough capacitor has a capacitor element body of a substantially rectangular parallelepiped shape, a signal internal electrode, a ground internal electrode, first and second signal terminal electrodes, and a first ground terminal electrode. The capacitor element body includes first and second end faces opposed in a longitudinal direction thereof, and a mounting surface perpendicular to a direction in which a plurality of insulator layers are laminated. The first signal terminal electrode and the first ground terminal electrode are arranged in proximity to each other in a first region near the first end face in the mounting surface. The second signal terminal electrode is arranged in a second region near the second end face in the mounting surface. No conductor is arranged in a third region between the first region and the second region in the longitudinal direction of the capacitor element body, in the mounting surface.

Abstract: A thin-film device system includes a substrate and a plurality of pillars. The plurality of pillars project from a surface of the substrate. Each of the plurality of pillars have a perimeter that includes at least four protrusions that define at least four recessed regions between the at least four protrusions. Each of the at least four recessed regions of each of the plurality of pillars receives one protrusion from an adjacent one of the plurality of pillars. A thin-film device is fabricated over the plurality of pillars.

Abstract: Provided is a package type multi-layer thin film capacitor for large capacitance, including: a ceramic sintered body formed with slots on one side and another side thereof, respectively; a plurality of first internal electrode layers formed within the ceramic sintered body; a plurality of second internal electrode layers formed within the ceramic sintered body to be positioned between the plurality of first internal electrode layers; a pair of first main connection electrode members inserted into the slots to be connected to the first internal electrode layers or the second internal electrode layers, respectively; a pair of first main lead members inserted into the slots and to be connected to the first main connection electrode members, respectively; and a sealing member sealing the ceramic sintered body to partially expose each of the pair of first main lead members.

Abstract: There is provided a chip type laminated capacitor, including: a ceramic body including a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 ?m or less; first and second outer electrodes formed on both ends of the ceramic body in a length direction; first and second band parts formed to extend inwardly of the ceramic body in the length direction on a length-width (L-W) plane from the first and second outer electrodes and having different lengths; and third and fourth band parts formed to extend inwardly of the ceramic body in the length direction on a length-thickness (L-T) plane from the first and second outer electrodes and having different lengths.

Abstract: Provided are an electrode structure which is excellent in adhesiveness between an aluminum material as a base material and a dielectric layer and adhesiveness between the dielectric layers and allows a higher capacitance than the conventional one to be obtained, even when a thickness of the dielectric layer is thick; a method for manufacturing the above-mentioned electrode structure; and a capacitor and a battery, each of which includes the above-mentioned electrode structure. An electrode structure comprises: an aluminum material; a dielectric layer formed on a surface of the aluminum material; and an interposing layer formed in at least one part of a region of the surface of the aluminum material between the aluminum material and the dielectric layer and including aluminum and carbon, the dielectric layer includes dielectric particles including valve metal, and an organic substance layer is formed on at least one part of a surface of the dielectric particle.

Abstract: A system and method for sealing a capacitor bottom in a filtered feedthrough. The feedthrough comprises a ferrule, a capacitor, at least one terminal pin and a support structure. The support structure includes at least one projection that extends into an aperture of the capacitor. The projection includes an opening through which the at least one terminal pin extends such that, in an assembled state, the terminal pin extends through the opening of the projection and the aperture of the capacitor.

Abstract: An electronic component has an element body, an external electrode, and an insulating material. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed on the end face side of the element body and covers a partial region of the principal face and/or a partial region of the side face adjacent to the end face. The insulating material covers a surface of the element body except for one face which is the principal face or the side face and at least a part of which is covered by the external electrode, and the external electrode formed on the surface.

Abstract: A lower electrode film is formed above a substrate. A ferroelectric film is formed above the lower electrode film. An amorphous intermediate film of a perovskite-type conductive oxide is formed above the ferroelectric film. A first upper electrode film comprising oxide of at least one metal selected from a group of Pt, Pd, Rh, Ir, Ru, and Os is formed on the intermediate film. The intermediate film is crystallized by carrying out a first heat treatment in an atmosphere containing an oxidizing gas after the formation of the first upper electrode film. After the first heat treatment, a second upper electrode film comprising oxide of at least one metal selected from a group of Pt, Pd, Rh, Ir, Ru, and Os is formed on the first upper electrode film, at a temperature lower than the growth temperature for the first upper electrode film.

Abstract: Provided is a laminated ceramic electronic component which has excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes: a laminate which has a plurality of laminated ceramic layers and Al/Mn alloy internal electrodes at a plurality of specific interfaces between the ceramic layers and an external electrode formed on the outer surface of the laminate, wherein the Al/Mn ratio of the Al/Mn alloy is 80/20 or more.

Abstract: A power capacitor is described herein. The power capacitor includes a housing and at least one capacitor winding. The power capacitor also includes at least one mechanical spring element between the housing and the at least one capacitor winding.

Abstract: A capacitor includes a substrate, a plurality of first storage electrodes, a plurality of second storage electrodes, a first supporting layer pattern, a dielectric layer and a plate electrode. A plurality of contact pads is formed I the substrate. The first storage electrodes are arranged along lines parallel with a first direction and electrically connected to the contact pads, respectively. The second storage electrodes are respectively stacked on the first storage electrodes. The first supporting layer pattern extends in a direction parallel with the first direction between adjacent second storage electrodes and makes contact with the adjacent second storage electrodes to support the second storage electrodes. The dielectric layer is formed on the first and second storage electrodes. The plate electrode is formed on the dielectric layer.

Abstract: A method of manufacturing a thin film capacitor, having: a base electrode; dielectric layers consecutively deposited on the base electrode; an internal electrode deposited between the dielectric layers; an upper electrode deposited opposite the base electrode with the dielectric layers and the internal electrode being interposed therebetween; and a cover layer deposited on the upper electrode, has depositing an upper electrode layer which is to be the upper electrode, and a cover film which is to be the cover layer on the unsintered dielectric film which is to be the dielectric layer, to fabricate a lamination component, and sintering the lamination component.

Abstract: An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.

Abstract: An electrostatic capacitor device is disclosed including first and second spaced apart electrode structures separated by a dielectric structure in which the first and second electrode structures are each formed from a composite material which includes electrically conductive fibres in a binder matrix.

Abstract: A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates and said second base metal plates and the dielectric has a first coefficient of thermal expansion. A first termination is in electrical contact with the first plates and a second termination is in electrical contact with the second plates. Lead frames are attached to, and in electrical contact with, the terminations wherein the lead frames have a second coefficient of thermal expansion and the second coefficient of thermal expansion is higher than said first coefficient of thermal expansion. The lead frame is a non-ferrous material.

Abstract: An electrolytic capacitor sealer is formed of a modified butyl rubber composition obtained by using an organic peroxide to crosslink a modified butyl rubber composition which has been modified by reacting butyl rubber with a compound (a) having in the molecule a nitroxide free radical that is stable at room temperature even in the presence of oxygen, a radical initiator (b), and a bifunctional or higher radical polymerizable monomer (c), and of a modified butyl rubber composition obtained by compounding a radical polymerizable monomer (c) with a modified butyl rubber composition that has been obtained by reacting butyl rubber with a compound (a) having in the molecule a nitroxide free radical that is stable at room temperature even in the presence of oxygen and a radical initiator (b), and then crosslinking the composition thus obtained with an organic peroxide.

Abstract: The present invention relates to composite materials with a high dielectric constant and high dielectric strength and to methods of producing the composite materials. The composite materials have high dielectric constants at a range of high frequencies and possess robust mechanical properties and strengths, such that they may be machined to a variety of configurations. The composite materials also have high dielectric strengths for operation in high power and high energy density systems. In one embodiment, the composite material is composed of a trimodal distribution of ceramic particles, including barium titanate, barium strontium titanate (BST), or combinations thereof and a polymer binder.

Abstract: A capacitor forming method includes forming an electrically conductive support material over a substrate, with the support material containing at least 25 at % carbon. The method includes forming an opening through at least the support material where the opening has an aspect ratio of at least 20:1 within a thickness of the support material. After forming the opening, the method includes processing the support material to effect a reduction in conductivity, and forming a capacitor structure in the opening.

Abstract: A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.

Abstract: A multilayer ceramic capacitor includes: a ceramic element; a plurality of first and second inner electrodes formed at the interior of the ceramic element and including capacity contribution portions facing each other and capacity non-contribution portions extending from the capacity contribution portions and having one end alternately exposed from the side of the ceramic element; first and second outer electrodes formed at the side of the ceramic main body and electrically connected with the first and second inner electrodes, wherein the thickness of the capacity non-contribution portion is greater than that of the capacity contribution portion and connectivity of the capacity non-contribution portion is higher than that of the capacity contribution portion at one or more of the first and second inner electrodes.

Abstract: Devices for storing energy at a high density are described. The devices include a solid dielectric that is preformed to present a high exposed area onto which an electrode is formed. The dielectric material has a high dielectric constant (high relative permittivity) and a high breakdown voltage, allowing a high voltage difference between paired electrodes to effect a high stored energy density.

Abstract: Dielectric elastomer or electroactive polymer film transducers configured to minimize high electrical field gradients that can lead to partial discharge and corona.

Abstract: A capacitor structure includes: a first electrode configured to include a plurality of openings; a second electrode formed in each center of the openings; and a dielectric layer formed to surround the second electrode and fill the openings of the first electrode.

Abstract: A ceramic electronic component includes a ceramic body, a first external electrode, and a second external electrode. The first and second external electrodes are disposed on a principal surface, which is directed to the mounting surface side, of the ceramic body so as to face each other with a predetermined gap region therebetween. The external electrodes each include a base layer and a Cu plating layer which covers the base layer. In each of the first and second external electrodes, an expression 0.1?t/d?0.5 is satisfied, where t is a thickness of the Cu plating layer at an end of the base layer on a gap region side, and d is a distance from the end of the base layer on the gap region side to an end of the Cu plating layer on the gap region side.

Abstract: The present invention relates to methods of making capacitors for use in surveillance/identification tags or devices, and methods of using such surveillance/identification devices. The capacitors manufactured according to the methods of the present invention and used in the surveillance/identification devices described herein comprise printed conductive and dielectric layers. The methods and devices of the present invention improve the manufacturing tolerances associated with conventional metal-plastic-metal capacitor, as well as the deactivation reliability of the capacitor used in a surveillance/identification tag or device.

Abstract: A film capacitor is provided which has a smaller size and improved capacity while securing a sufficient withstand voltage. The film capacitor comprising a basic element 10 containing a plurality of dielectric layers and at least one vapor-deposited metal film layer 14a, 14b, where the plurality of dielectric layers consisting of a resin film layer 12 and at least one vapor-deposited polymer film layer 16a, and the at least one vapor-deposited polymer film layer 16a is formed on at least one of the resin film layer 12 and the at least one vapor-deposited metal film layer 14a, 14b.

Abstract: A thin-film device comprises a base electrode made of a metal, a first dielectric layer, a first inner electrode, a second dielectric layer, a second inner electrode, and a third dielectric layer. Letting T1 be the thickness of the lowermost first dielectric layer in contact with the base electrode in the plurality of dielectric layers, and Tmin be the thickness of the thinnest dielectric layer in the plurality of dielectric layers excluding the first dielectric layer, T1>Tmin. Making the first dielectric layer thicker than the thinnest, dielectric layer in the other dielectric layers can increase the distance between a metal part projecting from a metal surface because of the surface roughness of the base electrode and the inner electrode mounted on the lowermost dielectric layer, thereby reducing leakage currents.

Abstract: An electrode foil includes a structure a structure in which metal particles and ceramic particles, which primarily include at least one of valve metal particles having a dielectric constant and ceramic particles, are deposited on a surface of a metal foil.

Abstract: There are provided a conductive paste composition for a termination electrode, and a multilayer ceramic capacitor including the same and a manufacturing method thereof. The conductive paste composition includes 100 parts by weight of conductive metal powder and 0.1 to 10 parts by weight of ceramic powder having an average particle size of 50 to 500 nm. The conductive paste composition described above may achieve a high firing density even in the case that it is used in the manufacturing of a thin film, and inhibit the occurrence of blisters, a delamination failure of the termination electrode during calcination of the electrode, thereby producing a compact and thin film.

Abstract: There are provided a conductive paste composition for an internal electrode, and a multilayer ceramic capacitor comprising the same and a manufacturing method thereof. The conductive paste composition includes a metal powder, a dispersant made of an acrylic polymer having a weight average molecular weight of 500 to 5,000, and at least one organic binder selected from a group consisting of a polyvinylbutyral resin and a cellulose resin. The conductive paste composition for an internal electrode has superior dispersibility of the metal powder in the paste.

Abstract: A water-based coating formulation for an electrode plate of an electricity storage device, said water-based coating formulation being adapted to form a coating film layer on the electrode plate, contains at least one resin binder having a saponification degree of 40% or higher and selected from unmodified and modified polyvinyl alcohols and unmodified and modified ethylene-vinyl alcohol copolymers, a conductive material, and a specific polybasic acid or its acid anhydride in a water-based medium containing water as a polar solvent. Per parts by mass of the conductive material (2), the resin binder is from 0.1 to 3 parts by mass and the polybasic acid or the like is from 0.01 to 6 parts by mass. The coating formulation has a solids content of from 0.02 mass % to 40 mass %.

Abstract: A semiconductor device and a method of fabricating the same include an electrode having a nickel layer with impurities. The electrode having a nickel layer with impurities can be a gate electrode or a capacitor electrode. The electrode having a nickel layer with impurities may include a combination of a pure nickel layer and a nickel layer with impurities.

Abstract: A glass ceramic composition is provided which can be fired at a temperature of 1,000° C. or less to form a sintered body having a low relative dielectric constant, a small temperature coefficient of resonant frequency, a small change in capacitance before and after a loading test, a high Qf value, high electrical insulating reliability, and a high flexural strength. A glass ceramic composition forming glass ceramic layers laminated to each other in a multilayer ceramic substrate is also provided. The glass ceramic composition includes a first ceramic powder containing forsterite as a primary component; a second ceramic powder containing SrTiO3 and/or TiO2 as a primary component; a third ceramic powder containing BaZrO3 as a primary component; a fourth ceramic powder containing SrZrO3 as a primary component; and a borosilicate glass which contains Li2O, MgO, B2O3, SiO2, and ZnO, and also which contains at least one of CaO, BaO, and SrO.

Abstract: There is provided a multi-layered ceramic capacitor having a dual layer-electrode structure formed by applying a dual layer of electrode paste to the multi-layered ceramic capacitor. The multi-layered ceramic capacitor having a dual layer-electrode structure includes a capacitor body having a preset length and width and having a plurality dielectric layers stacked therein, an internal electrode unit formed on the plurality of dielectric layers and having a preset capacitance, and an external electrode unit including first external electrodes respectively formed on both sides of the capacitor body to be electrically connected to internal electrodes, and second external electrodes formed on the first external electrodes.

Abstract: A discoidal feedthrough capacitor has its active electrode plates disposed within a dielectric body so that an edge of the active electrode plates is exposed at a surface of a through-hole for a conductive lead. The conductive lead is conductively coupled to the exposed edge of the electrode plates without an intervening conductive termination surface. Similarly, a ground electrode plate set of the feedthrough capacitor may have an edge exposed at the outer periphery of the capacitor for conductively coupling the exposed edge of the ground electrode plate to a conductive ferrule without an intervening conductive termination surface.

Abstract: Structures and methods of forming an ideal MIM capacitor are disclosed. The single capacitor includes a first and a second metal structure overlying a substrate, a first dielectric material disposed between a first portion of the first metal structure and a first portion of the second metal structure. A second dielectric material is disposed between a second portion of the first metal structure and a second portion of the second metal structure. No first dielectric material is disposed between the second portion of the first and second metal structures, and no second dielectric material is disposed between the first portion of the first and second metal structures. The first and second dielectric material layers include materials with opposite coefficient of capacitance.

Abstract: A metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof is provided.

Abstract: A capacitor includes a substrate made of an organic film, a first conductive layer provided on an upper surface of the substrate, a first dielectric layer provided on an upper surface of the first conductive layer, a second dielectric layer provided on an upper surface of the first dielectric layer, and a second conductive layer provided on an upper surface of the second dielectric layer. The first dielectric layer is made of plural metal oxide chips spread over on the upper surface of the first conductive layer. The second dielectric layer is made of plural metal oxide chips spread over on a lower surface of the second conductive layer. This capacitor can have a large capacitance.

Abstract: A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a first plating layer on exposed surfaces of the internal electrodes of the component main body, applying a water repellant at least on a surface of the first plating layer and on a section in the external surface of the component main body at which an end edge of the first plating layer is located, and then forming a second plating layer on the first plating layer having the water repellant applied thereon.

Abstract: A film capacitor comprises a wound body, a first terminal part electrically connected to one end of the wound body, and a second terminal part electrically connected to the other end of the wound body. The wound body is structured by winding into a laminate a first film laminate formed of a laminate of dielectric films and having therein a floating electrode and a second film laminate formed of a laminate of first and second metal films sandwiching the first film laminate and dielectric films and having therein a floating electrode (22). Each of the floating electrodes (22) is composed of integrated small electrodes independent of each other.

Abstract: The present disclosure discloses a titanium system composite comprising a lithium titanium composite oxide and a lithium compound cladding the lithium titanium composite oxide. The present disclosure further discloses a preparation method of the titanium system composite and an electrode material for batteries or capacitors comprising a titanium system composite.

Abstract: A conductive composition comprises a ? conjugated conductive polymer, a dopant, and a nitrogen-containing aromatic cyclic compound. A capacitor comprises an anode composed of a porous material of valve metal, a dielectric layer formed by oxidizing the surface of the anode, and a cathode provided on the dielectric layer and having a solid electrolyte layer containing a ? conjugated conductive polymer, which comprises an electron donor compound containing an electron donor element provided between the dielectric layer and the cathode. Another capacitor is based on the above-described capacitor, wherein the solid electrolyte layer further comprises a dopant and a nitrogen-containing aromatic cyclic compound. An antistatic coating material comprises a ? conjugated conductive polymer, a solubilizing polymer containing an anion group and/or an electron attractive group, a nitrogen-containing aromatic cyclic compound, and a solvent. An antistatic coating is formed by applying the antistatic coating material.

Abstract: In a capacitor structure and method of forming the same, a first electrode, a second electrode, and a first insulation layer are sequentially formed on a substrate. The first and second electrodes and the first insulation layer are covered with a second insulation layer on the substrate. A first plug is in contact with the second electrode through the second insulation layer. A second plug is in contact with the first electrode through the first and second insulation layer. A third insulation layer is formed on the second insulation layer. Third and fourth comb-shaped electrodes are formed in the third insulation layer. The third electrode is contact with the first plug and the fourth electrode is contact with the second plug while facing the third electrode. Thus, the teeth of the comb-shaped electrodes are alternately arranged and spaced apart in the third insulation layer.