Abstract: Disclosed are a dielectric substance-electrode assembly in which an electrode is coated with a dielectric and a method for manufacturing the same. The dielectric substance-electrode assembly is formed by forming a lower dielectric electrode constituting a lower portion of an assembly body, sealing a capsule filled with a treated powder and a lower dielectric in which an electrode is formed, and forming an upper dielectric constituting an upper portion of the assembly body using the treated powder which is diffused on and bonded to surfaces of the lower dielectric and the electrode due to sintering heat treatment which is performed by applying an isostatic pressure in a state in which the sealed capsule is placed in a pressure vessel of a heat treatment equipment.

Abstract: A multilayer capacitor includes a body including a dielectric layer and a plurality of internal electrodes stacked on each other with the dielectric layer interposed therebetween; and external electrodes disposed externally on the body, and respectively including a first layer connected to the internal electrode and a second layer covering the first layer, wherein the first layer includes a metal particle including an element A, an oxide of an element Z, formed on the metal particle, and an A-Z intermetallic compound phase, and here, the element Z has a higher ionization tendency than the element A.

Abstract: A capacitor according to an embodiment of the present disclosure is provided with a capacitor body in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately laminated. The dielectric layers each includes crystal particles, grain boundaries and metal particles. An average particle size of the metal particles is smaller than an average particle size of the crystal particles and larger than an average width of interfacial grain boundaries among the grain boundaries. Observation of the longitudinal cross section of the dielectric layer shows that the metal particles are distributed along the width direction and the thickness direction of the dielectric layer.

Abstract: A dielectric material includes a perovskite as a main phase, an A site of the perovskite including at least Ba, a B site of the perovskite including at least Ti, and Eu having +2 valence and +3 valence. A ratio of +2 valence of Eu is 21% or more.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of crystal grains and a grain boundary disposed between adjacent crystal grains. A ratio (C2/C1) of an Mg content (C2) of the grain boundary to an Mg content (C1) of at least one of the plurality of crystal grains is 3 or more.

Abstract: A ceramic electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. At least a region of the dielectric layer includes tin (Sn) and a lanthanide rare earth element (RE) including dysprosium (Dy). In the at least a region of the dielectric layer, a molar ratio of tin (Sn) to dysprosium (Dy) is from 0.15 to 0.30.

Abstract: A multilayer ceramic capacitor includes a ceramic body including first and second surfaces opposing each other, and third and fourth surfaces connecting the first and second surfaces, a plurality of internal electrodes disposed inside the ceramic body, exposed from the first and second surfaces, and having an end exposed from the third surface or the fourth surface, and a first side margin and a second side margin respectively disposed on the first and second surfaces, from which end portions of the plurality of internal electrodes are exposed. The first and second side margins include a base material powder of a barium titanate-based base powder and a subcomponent. The subcomponent includes terbium (Tb) as a first subcomponent including a lanthanide rare earth element, and a content ratio of the terbium (Tb) to a content of the first subcomponent (RE) excluding the terbium (Tb) satisfies 0.110?Tb/RE?2.333.

Abstract: A dielectric composition includes: a BaTiO3-based main component and a first accessory component, wherein the first accessory component includes dysprosium (Dy) and terbium (Tb), the sum (Dy+Tb) of contents of dysprosium (Dy) and terbium (Tb) is more than 1.5 mol and 2.0 mol or less based on 100 mol of Ti of the main component, and 0.1?Tb/Dy<0.15 in which Tb/Dy is a ratio of the content of terbium (Tb) to the content of dysprosium (Dy).

Abstract: A manufacturing method of a ceramic electronic device includes forming a multilayer structure by stacking a plurality of stack units, each of the stack units having a structure in which a pattern of metal conductive paste is provided on a dielectric green sheet including a dielectric material, the metal conductive paste including a metallic material of which a main component is Ni and a co-material of which a main component is barium titanate, the metal conductive paste of each of the stack units being alternately shifted, and firing the multilayer structure. FWHM of the metallic material)/(FWHM of the co-material) is 0.550 or less. The FWHM is of a (111) face evaluated by powder X-ray diffraction. An average particle diameter of the metallic material before the firing is 120 nm or less.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, each exposed to the first and second surfaces and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on the first and second surfaces, in which a metal or a metal oxide is disposed in the dielectric layer, and a ratio of a diameter of the metal or the metal oxide to a thickness of the dielectric layer is 0.8 or less.

Abstract: A multilayer capacitor includes a capacitor body having an active region, upper and lower cover regions, and width margins on opposing sides of the active region. The width margin includes a first region on an internal side thereof adjacent the first and second internal electrodes and a second region on an external side between the first region and a respective external surface of the capacitor body, and the upper and lower cover regions each include a third region on an internal side thereof adjacent the internal electrodes and a fourth region on an external side between the third region and a respective external surface of the capacitor body. The active region, the second region, and the fourth region have a same dielectric constant A, and the first and third regions have a same dielectric constant B, and A and B are different from each other and satisfy 0.5?B/A.

Abstract: A multi-layer ceramic capacitor includes: a first region including a polycrystal including, as a main component, crystal grains free from intragranular pores; a second region that includes a polycrystal including, as a main component, crystal grains including intragranular pores and includes a higher content of silicon than a content of silicon in the first region; a capacitance forming unit including ceramic layers laminated along a first direction, and internal electrodes disposed between the ceramic layers; and a protective portion including a cover that covers the capacitance forming unit and constitutes a main surface facing in the first direction, a side margin constituting a side surface facing in a second direction orthogonal to the first direction, and a ridge constituting a connection portion, the connection portion connecting the main surface and the side surface to each other. The ceramic layers include the first region. The ridge includes the second region.

Abstract: To provide a fine nickel powder for an internal electrode paste of an electronic component, the nickel powder obtained by a wet method and having high crystallinity, excellent sintering characteristics, and heat-shrinking characteristics. The nickel powder is obtained by precipitating nickel by a reduction reaction in a reaction solution including at least water-soluble nickel salt, salt of metal nobler than nickel, hydrazine as a reducing agent, and alkali metal hydroxide as a pH adjusting agent and water; the reaction solution is prepared by mixing a nickel salt solution including the water-soluble nickel salt and the salt of metal nobler than nickel with a mixed reducing agent solution including hydrazine and alkali metal hydroxide; and the hydrazine is additionally added to the reaction solution after a reduction reaction initiates in the reaction solution.

Abstract: A dielectric ceramic composition and a multilayer ceramic electronic component are provided, the dielectric ceramic composition includes a barium titanate base material main component and a subcomponent, a microstructure after sintering includes a first crystal grain including 3 or less domain boundaries and a second crystal grain including 4 or more domain boundaries, and an area ratio of the second crystal grain to the total crystal grains is 20% or less.

Abstract: A multilayer body of a multilayer ceramic capacitor includes first and second side margin portions that each have an average amount of grain boundary segregation of Ni larger than that an average amount of grain boundary segregation of Ni in a plurality of dielectric layers at a portion located in an inner layer portion of the multilayer body.

Abstract: A multilayer ceramic capacitor includes a ceramic body including first and second surfaces opposing each other, and third and fourth surfaces connecting the first and second surfaces, a plurality of internal electrodes disposed inside the ceramic body, exposed from the first and second surfaces, and having an end exposed from the third surface or the fourth surface, and a first side margin and a second side margin respectively disposed on the first and second surfaces, from which end portions of the plurality of internal electrodes are exposed. The first and second side margins include a base material powder of a barium titanate-based base powder and a subcomponent. The subcomponent includes terbium (Tb) as a first subcomponent including a lanthanide rare earth element, and a content ratio of the terbium (Tb) to a content of the first subcomponent (RE) excluding the terbium (Tb) satisfies 0.110?Tb/RE?2.333.

Abstract: A dielectric ceramic composition includes a base material main component of barium titanate and a subcomponent. A microstructure of the dielectric ceramic composition after sintering includes a first grain having a Ca content of less than 3.5 at % and a second grain having a Ca content of 3.5 to 13.5 at %, and an area ratio of the second grain to an area of the total grains is 70% to 95%.

Abstract: A multilayer ceramic capacitor includes: a ceramic body in which dielectric layers and first and second internal electrodes are alternately stacked; and first and second external electrodes formed on an outer surface of the ceramic body and electrically connected to the first and second internal electrodes, respectively. In a microstructure of the dielectric layer, dielectric grains are divided by a dielectric grain size into sections each having an interval of 50 nm, respectively, a fraction of the dielectric grains in each of the sections within a range of 50 nm to 450 nm is within a range of 0.025 to 0.20, and a thickness of the dielectric layer is 0.8 ?m or less.

Abstract: A multi-layer ceramic capacitor includes a first region, a second region, a multi-layer unit, and a side margin. In the first region, crystal grains including intragranular pores are dispersed. In the second region, crystal grains including intragranular pores are not dispersed. The multi-layer unit includes ceramic layers that are laminated in a first direction and include the second region, and internal electrodes disposed between the ceramic layers. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction and includes a region, the region being adjacent to the multi-layer unit and including the first region.

Abstract: A dielectric ceramic composition and a multilayer ceramic capacitor including the same are provided, the dielectric ceramic composition includes a BaTiO3-based base material main component and a subcomponent, wherein the subcomponent includes zinc oxide (ZnO) as a first subcomponent, and the content of the ZnO is 0.1 mol % or more and less than 0.4 mol % with respect to 100 mol % of the base material main component.

Abstract: A dielectric ceramic composition and a multilayer ceramic capacitor comprising the same includes a barium titanate (BaTiO3)-based base material main ingredient and an accessory ingredient, and the accessory ingredient includes a third trivalent lanthanide rare earth element A and terbium (Tb) as rare earth elements, and a molar ratio (Tb/A) of a content of terbium (Tb) to the content of the trivalent lanthanide rare earth element A satisfies 0.15?Tb/A<0.50.

Abstract: A multilayer ceramic capacitor includes a ceramic body having a dielectric layer disposed between two internal electrodes. The dielectric layer includes a plurality of dielectric grains. A grain boundary between at least two dielectric grains of the plurality of dielectric grains has a ratio Si/Ni of a weight of Si to a weight of Ni in the grain boundary that is at least 1 and 6 or less.

Abstract: A multilayer electronic component includes a body including dielectric layers, and first and second internal electrodes alternately stacked in a first direction, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, a resistor disposed on the second surface, a via electrode exposed to the second surface and connecting the second internal electrode and the resistor to each other, a first external electrode disposed on the third surface and connected to the first internal electrode, and a second external electrode disposed on the fourth surface and connected to the resistor.

Abstract: A dielectric ceramic composition includes, as a main component, a perovskite compound containing Sr and Zr and may contain Ca and/or Ti, further contains Li and Si, and may contain Mn. When a total content of Zr and Ti is 100 parts by mol, a total content (100×m) of parts by mol of Sr and Ca is 0.8?m?1.3, a content a of parts by mol of Mn is 0?a?10, a content b of parts by mol of Li is 5?b?15, a content c of parts by mol of Si is 20?c?40, a molar ratio x of Ca/(Sr+Ca) is 0?x?0.8, and a molar ratio y of Ti/(Zr+Ti) is 0?y?0.5.

Abstract: A dielectric composition having a high relative dielectric constant and high Q value even at high frequencies, and an electronic component including a dielectric film configured from the dielectric composition. This dielectric composition includes the composite oxide represented by general formula (aCaO+bSrO)—ZrO2 as a main component, and by a and b satisfying the relationships a?0, b?0, and 1.50<a+b?4.00.

Abstract: A multilayer ceramic electronic component includes an element body. The element body includes a capacitance region and an exterior region. The capacitance region is formed by alternately laminating inner dielectric layers and internal electrode layers having different polarities. The exterior region is laminated outside the capacitance region in a laminating direction and formed by outer dielectric layers. The internal electrode layers contain a main component of copper and/or silver. An exterior void ratio is larger than a capacitance void ratio, in which the exterior void ratio is an area ratio of voids contained in the exterior region, and the capacitance void ratio is an area ratio of voids contained in the capacitance region.

Abstract: A dielectric ceramic composition includes a barium titanate-based base material main ingredient and an accessory ingredient, and the accessory ingredient includes dysprosium (Dy) and gadolinium (Gd) as first accessory ingredient elements, and a content ratio of gadolinium (Gd), based on a total content of the first accessory ingredient elements, is 25% or higher.

Abstract: A metal oxynitride thin film having a perovskite structure, in which the metal oxynitride thin film has a composition represented by a compositional formula A1+?BOx+?Ny wherein ? is larger than zero and 0.300 or less, x+? is larger than 2.450, and y is 0.300 or more and 0.700 or less, an AO structure having a layered structure parallel to a plane perpendicular to a c-axis of the perovskite structure and having a composition represented by a general formula AO, and the AO structure is bonded with the perovskite structure and incorporated in the perovskite structure.

Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers alternately stacked, and an outer electrode electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite to each other in a stacking direction, first and second side surfaces opposite to each other in a width direction, and first and second end surfaces opposite to each other in a length direction. The outer electrode includes first outer electrodes disposed on the first and second end surfaces, and at least one second outer electrode disposed on at least one of the first and second side surfaces. The at least one second outer electrode is directly connected to the inner electrodes at positions spaced away from the at least one of the first or second side surface toward the inside of the multilayer body.

Abstract: A dielectric ceramic composition having improved insulation specific resistance and a highly accelerated lifetime. The dielectric ceramic composition includes a dielectric particle having a core-shell structure including a main component expressed by a general formula ABO3, where A is Ba and the like, and B is Ti and the like), and a rare earth element component R, in which a shell part of the core-shell structure has an average rare earth element concentration C of 0.3 atom % or more. The rare earth element has a specified concentration gradient or concentration variation.

Abstract: A multi-layer ceramic capacitor includes: a ceramic body including a multi-layer chip and a side margin, the multi-layer chip including a capacitance forming unit including internal electrodes laminated in a first direction, positions of end portions of the internal electrodes in a second direction orthogonal to the first direction being aligned with one another within a range of 0.5 ?m, and a cover covering the capacitance forming unit in the first direction, the side margin covering the multi-layer chip in the second direction, the ceramic body having a main surface facing in the first direction, a side surface facing in the second direction, an end surface facing in a third direction orthogonal to the above directions, and a corner portion connecting those surfaces; and an external electrode covering the end surface and the corner portion, the corner portion having a surface roughness of 30 nm or more.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively. The external electrode includes electrode layers electrically connected to the internal electrodes, and plating layers disposed on the electrode layers. At least one point, at which slopes of tangent lines of one of the electrode layers and the plating layers are opposite to each other, is disposed in a region within a range of ±0.2 BW around a point (0.5 BW) that is a halfway point of an overall width BW of the electrode layers disposed on the first surface or the second surface of the ceramic body.

Abstract: An integrated circuit device includes a lower electrode, an upper electrode, and a dielectric layer structure between the lower electrode and the upper electrode, the dielectric layer structure including a first surface facing the lower electrode and a second surface facing the upper electrode. The dielectric layer structure includes a first dielectric layer including a first dielectric material and a plurality of grains extending from the first surface to the second surface and a second dielectric layer including a second dielectric material and surrounding a portion of a sidewall of each of the plurality of grains of the first dielectric layer in a level lower than the second surface. The second dielectric material includes a material having bandgap energy which is higher than bandgap energy of the first dielectric material.

Abstract: A dielectric composition includes a base material powder including barium titanate (BaTiO3), and zirconium (Zr) within a range from greater than 0.5 moles to 1.5 moles, with respect to 100 moles of the base material powder. In addition, a multilayer capacitor includes the dielectric composition.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, each exposed to the first and second surfaces and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on the first and second surfaces, in which a metal or a metal oxide is disposed in the dielectric layer, and a ratio of a diameter of the metal or the metal oxide to a thickness of the dielectric layer is 0.8 or less.

Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are alternately stacked and the internal electrode layers are alternately exposed to two end faces; and external electrodes formed on the two end faces; wherein: the external electrodes have a structure in which a plated layer is formed on a ground layer including Mo; and “M?0.003185×(Ew×Et)?0.5921 is satisfied when “Et” is a height from a bottom one of the internal electrode layers to a top one of the internal electrode layers, “Ew” is a width of the internal electrode layers in a direction in which side faces of the multilayer chip face with each other, and “M” is a Mo concentration (atm %) with respect to a main component ceramic of a total of the multilayer chip and the pair of external electrodes.

Abstract: A multilayer ceramic substrate that includes a first layer positioned at a surface of the multilayer ceramic substrate, a second layer adjacent the first layer and positioned inward of the first layer, and a surface layer electrode disposed on a surface of the first layer. The first layer has a porosity of 13% or less and a maximum pore size of 10 ?m or less. The second layer has a porosity of 14% or less and a maximum pore size of 11 ?m or less.

Abstract: A ceramic electronic component that includes a ceramic insulator and an inner conductor layer disposed in the ceramic insulator. The inner conductor layer contains a metal and a metal oxide containing at least one first metal element selected from Ti, Mg, and Zr, first insulator regions that contain at least one second metal element selected from Ti, Mg, and Zr and that are discontinuous from the ceramic insulator and present in a dispersed state in the inner conductor layer, and a second insulator region containing a third metal element the same as the second metal element contained in the first insulator regions and present around the inner conductor layer.

Abstract: A multi-layered ceramic electronic component includes a ceramic body including a dielectric layer, and a plurality of first and second internal electrodes opposing each other with the dielectric layer interposed therebetween; and first and second external electrodes arranged outside of the ceramic body and electrically connected to the first and second internal electrodes, wherein the dielectric layer comprises a dielectric ceramic composition containing: a base material represented by (Ba1-xCax)TiO3 (0<x?0.09) as a main component, Y as a first accessory component, Mg as a second accessory component, Ba or Zr, or a mixture thereof, as a third accessory component, Mn, Ni, W, V, or Fe, or mixtures thereof, as a fourth accessory component, and Si as a fifth accessory component.

Abstract: A coil electronic component includes a body including a plurality of insulating layers and coil patterns disposed on the insulating layers, and external electrodes formed on external surfaces of the body and connected to the coil patterns, wherein the external electrodes include first layers being electroless plating layers and second layers formed on the first layers and having a form in which metal particles are dispersed in a polymer base, respectively.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a first plating portion disposed on the electrode layer and having a thickness ranging from 0.3 ?m to 1 ?m, and a second plating portion disposed on the first plating portion.

Abstract: A multilayer capacitor includes: a first internal electrode layer including first and second internal electrodes disposed to face each other with an insulating portion interposed therebetween; a second internal electrode layer including a third internal electrode and a lead portion connected to the third internal electrode; a body including the first and second internal electrode layers alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively; and a third external electrode disposed on the body to be connected to the lead portion.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes: preparing a plurality of first ceramic sheets; forming internal electrode patterns on the first ceramic sheets using a conductive paste, respectively; stacking the first ceramic sheets on which the internal electrode pattern is formed to form a ceramic body including internal electrodes disposed therein to face each other; forming electrode layers by transferring a nickel-containing sheet on both end surfaces of the ceramic body in a length direction of the ceramic body so as to be connected to the internal electrodes, respectively; forming electrically insulating layers by attaching a second ceramic sheet for forming an electrically insulating layer to the electrode layers, respectively; and preparing external electrodes by forming plating layers on one surface of the ceramic body in a thickness direction of the ceramic body, to be connected to the electrode layers, respectively.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 includes external electrodes 12 on both of first-direction ends of a capacitor body 11. Also, groups of metal grains 13 are provided on one third-direction face and another third-direction face of the capacitor body 11. Both of the first-direction ends of the groups of metal grains 13 provided on the other third-direction face of the capacitor body 11 are covered by second parts 12c of the respective external electrodes 12, while both of the first-direction ends of the groups of metal grains 13 provided on the one third-direction face of the capacitor body 11 are covered by first parts 12b of the respective external electrodes 12. The multilayer ceramic electronic component can offer excellent heat dissipation property.

Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

Abstract: A chip varistor includes two functional layers (that is, a first functional layer and a second functional layer) inside an element body, and the two functional layers have substantially the same electrostatic capacitance. In the chip varistor, the element body is made highly resistive from an outer surface due to alkali metal containing portion. However, the alkali metal containing portion does not reach the first functional layer and the second functional layer. Therefore, the alkali metal containing portion curbs a parasitic capacitance of the chip varistor without affecting the electrostatic capacitances of the first functional layer and the second functional layer. Accordingly, the chip varistor includes the two functional layers in which variations in capacitance are curbed.

Abstract: A multilayer ceramic capacitor includes: a ceramic body in which dielectric layers and first and second internal electrodes are alternately stacked; and first and second external electrodes formed on an outer surface of the ceramic body and electrically connected to the first and second internal electrodes, respectively. In a microstructure of the dielectric layer, dielectric grains are divided by a dielectric grain size into sections each having an interval of 50 nm, respectively, a fraction of the dielectric grains in each of the sections within a range of 50 nm to 450 nm is within a range of 0.025 to 0.20, and a thickness of the dielectric layer is 0.8 ?m or less.

Abstract: A multilayer ceramic capacitor includes a body including first and second dielectric layers and having first to sixth surfaces; a second internal electrode disposed on the second dielectric layer to face the first internal electrode with the first or second dielectric layer interposed therebetween, exposed to the fourth, fifth, and sixth surfaces, and disposed to be spaced apart from the third surface by a second space; a first dielectric pattern disposed in at least a portion of the first space; a second dielectric pattern disposed in at least a portion of the second space; a side insulating layer disposed on the fifth and sixth surfaces; a first external electrode disposed on the third surface; and a second external electrode disposed on the fourth surface, in which the first and second dielectric patterns have a color different from the first and second dielectric layers.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, each exposed to the first and second surfaces and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on the first and second surfaces, in which a metal or a metal oxide is disposed in the dielectric layer, and a ratio of a diameter of the metal or the metal oxide to a thickness of the dielectric layer is 0.8 or less.

Abstract: A perovskite ceramic composition that contains Sn, Ba, and Ti, and where the Sn content is within a range of about 0.001 parts by mol?Sn?about 0.999 parts by mole with respect to 100 parts by mole of the Ti. The perovskite ceramic composition can be used in a composition that further includes a rare earth element R, Mn, and Si, and optionally Mg, where proportions of the R, the Mn, the Si, and the optional Mg, satisfy R: 0<R?about 10 parts by mole, Mn: 0<Mn?about 5 parts by mole, Si: 0<Si?about 5 parts by mole Mg: 0<Mg?about 5 parts by mole with respect to 100 parts by mole of Ti.