Aluminum Or Tantalum Patents (Class 361/529)
  • Patent number: 7656647
    Abstract: Surface mount electrolytic capacitors are provided with anode and cathode terminations having respective first termination portions provided on the bottom surface of a molded package in a generally coplanar configuration. A second cathode termination portion is bent in a generally perpendicular fashion to the first cathode termination portion and may then be adhered to the external cathode layer of a capacitor body. A second anode termination portion is bent in a generally perpendicular fashion to the first anode termination portion and may then be welded to an anode wire connected to and extending from the capacitor body. An insulation pad may be provided between the first anode termination portion and the capacitor body to prevent device shorting. A planar termination frame may be provided to form the electrolytic capacitors of the present subject matter.
    Type: Grant
    Filed: September 17, 2007
    Date of Patent: February 2, 2010
    Assignee: AVX Corporation
    Inventors: Douglas M. Edson, Glenn M. Vaillancourt, Walter Koda, Scott A. McCarthy, James A. Fife
  • Patent number: 7649730
    Abstract: A wet electrolytic capacitor that includes a plurality of anodes, cathode, and working electrolyte that is disposed in electrical contact with the anodes and current collector is provided. Any number of anodes may generally be employed, such as from 2 to 40, in some embodiments from 3 to 30, and in some embodiments, from 4 to 20. The anodes are thin and typically have a thickness of about 1500 micrometers or less, in some embodiments about 1000 micrometers or less, and in some embodiments, from about 50 to about 500 micrometers. By employing a plurality of anodes that are relatively thin in nature, the resulting wet electrolytic capacitor is able to achieve excellent electrical properties.
    Type: Grant
    Filed: March 20, 2007
    Date of Patent: January 19, 2010
    Assignee: AVX Corporation
    Inventors: Brady Jones, Gang Ning, Bharat Rawal
  • Patent number: 7643269
    Abstract: An electrical component, which contains an electrode with an electrically conductive body having a dielectric surface. An amorphous layer comprising SiO2, having a specific surface area of approximately 50 to 500 m2/g, is arranged on the body. An electrically conductive coating is arranged on the amorphous layer. A solid electrolyte capacitor is an electrical component of this type in which, for example, the electrode is connected as the anode and the electrically conductive coating is connected as the cathode.
    Type: Grant
    Filed: January 25, 2006
    Date of Patent: January 5, 2010
    Assignee: Kemet Electronics Corporation
    Inventor: Thomas Kirschbaum
  • Publication number: 20090290291
    Abstract: [Problem] In a wound-type solid electrolytic capacitor, leakage current that is caused by separation of a hard coating film from the cathode is prevented from increasing. [Resolution Means] A solid electrolytic capacitor is configured to include a wound capacitor element that has an anode (2), a cathode (3) composed of aluminum, a hard coating film (28) formed on a surface of the cathode (3), a separator (4b), and a solid electrolyte layer, and is also configured so that the solid electrolytic capacitor further includes an intermediate layer 18 formed between the cathode (3) and the hard coating film (28), the hard coating film (28) is composed of a compound of aluminum, titanium, and at least one nonmetallic element, and the intermediate layer (18) contains at least one element selected from the group of metallic elements consisting of aluminum and titanium.
    Type: Application
    Filed: November 29, 2006
    Publication date: November 26, 2009
    Applicants: SANYO ELECTRIC CO., LTD., SAGA SANYO INDUSTRIES CO., LTD.
    Inventor: Satoru Yoshimitsu
  • Publication number: 20090290292
    Abstract: The present invention relates to a capacitor chip and a solid electrolytic capacitor, wherein in a capacitor chip in which one or more capacitor element is laminated on a metal lead frame to carry electricity and the whole is encapsulated with resin, a laminated body is located within a certain definite range. The present invention enables to increase the capacitance of a capacitor by broadening the allowable range of the total thickness of the laminated capacitor chips without generating defective appearance of the laminated solid electrolytic capacitor.
    Type: Application
    Filed: December 14, 2006
    Publication date: November 26, 2009
    Applicant: SHOWA DENKO K. K.
    Inventors: Kenki Kobayashi, Eiji Komazawa, Tomoya Utashiro
  • Patent number: 7618610
    Abstract: A niobium suboxide powder comprising 100 to 600 ppm of magnesium is described. The niobium suboxide powder may (alternatively or in addition to 100 to 600 ppm of magnesium) further include 50 to 400 ppm of molybdenum and/or tungsten. The niobium suboxide powder is suitable for the production of: capacitors having an insulator layer of niobium pentoxide; capacitor anodes produced from the niobium suboxide powder; and corresponding capacitors.
    Type: Grant
    Filed: June 2, 2008
    Date of Patent: November 17, 2009
    Assignee: H. C. Starck GmbH
    Inventors: Oliver Thomas, Christoph Schnitter
  • Publication number: 20090279233
    Abstract: A method for treating anodes of refractory valve metals by deoxidizing the anodes using Mg in an oven, prior to sintering. The process limits free oxygen in the metal compact and improves performance of a capacitor, especially with regards to rated voltage.
    Type: Application
    Filed: May 12, 2008
    Publication date: November 12, 2009
    Inventors: Yuri Freeman, Philip M. Lessner, Jeffrey Poltorak, Steven C. Hussey
  • Patent number: 7616430
    Abstract: The invention provides a capacitor electrode member in which layers constituting the electrode member are highly adhesive. The capacitor electrode member comprises aluminum material (1), a carbon-containing layer (2) formed on the surface of the aluminum material (1), and further an interposition layer (3) containing an aluminum element and a carbon element, the interposition layer being formed between the aluminum material (1) and the carbon-containing layer (2). The interposition layer (3) constitutes a first surface portion which is formed on at least a part of the region of the surface of the aluminum material (1) and contains a carbide of aluminum. The carbon-containing layer (2) constitutes a second surface portion (21) formed so as to extend outward from the first surface portion (3). The carbon-containing layer (2) further contains carbon particles (22) and the second surface portion (21) is formed between the first surface portion (3) and the carbon particles (22) and contains a carbide of aluminum.
    Type: Grant
    Filed: August 31, 2005
    Date of Patent: November 10, 2009
    Assignee: Toyo Aluminium Kabushiki Kaisha
    Inventors: Akinori Ro, Zenya Ashitaka, Hiroshi Tada
  • Patent number: 7612986
    Abstract: An aluminum plate having an aluminum purity of not less than 99.98% by mass and an Fe content of 5 to 50 ppm with the balance consisting of unavoidable impurities is used to realize increased capacitance of an aluminum electrolytic capacitor, reduced height, and improved high frequency characteristics. In this aluminum plate, the total content of Fe in crystal/precipitate is 1 to 50% based on the original content, and the thickness of the aluminum plate 0.2 to 1 mm. In the formation of a capacitor anode, the aluminum plate is subjected to alternate current etching so as to leave a core part having an average thickness of 50 to 150 ?m in the center part in the thickness-wise direction to increase the surface area, followed by anodic oxidation.
    Type: Grant
    Filed: March 13, 2006
    Date of Patent: November 3, 2009
    Assignee: Nippon Light Metal Company, Ltd.
    Inventors: Masahiko Katano, Masashi Isobe, Shinichi Arai
  • Patent number: 7612987
    Abstract: A chip-type filter has a laminated body formed by stacking a plurality of capacitor elements, a pair of positive electrode terminals, a pair of negative electrode terminals, insulating outer resin, and an inductor section. The laminated body includes capacitor elements in a first group and capacitor elements in a second group, the positive electrode sections in both groups are disposed on the opposite sides with respect to the negative electrode sections. Positive electrode terminals are electrically connected to the positive electrode sections of capacitor elements in the first group and those of capacitor elements in the second group, respectively. Negative electrode terminals are electrically connected to the negative electrode sections in the laminated body, and are disposed at both ends of the direction crossing the connecting direction between the positive electrode terminals. The inductor section is insulated from the negative electrode sections and couples the positive electrode terminals.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: November 3, 2009
    Assignee: Panasonic Corporation
    Inventors: Junichi Kurita, Kenji Kuranuki, Youichi Aoshima, Hiroshi Higashitani, Tsuyoshi Yoshino
  • Patent number: 7609505
    Abstract: The present invention relates to a resin-molded chip solid electrolyte capacitor comprising a plurality of solid electrolyte capacitor elements horizontally laid in parallel with no gap on a pair of oppositely disposed end parts of a lead frame, and a fixing layer which is extending across the plurality of capacitor elements and fixing the capacitor elements with each other; and having low equivalent series resistance (ESR) and low leakage current (LC value), a production method of the same and an electronic device using the capacitor.
    Type: Grant
    Filed: August 12, 2004
    Date of Patent: October 27, 2009
    Assignee: Showa Denko K.K.
    Inventors: Kazumi Naito, Katutoshi Tamura
  • Patent number: 7602602
    Abstract: A conductive polymer having high conductivity and a solid electrolytic capacitor having low ESR are provided. A conductive polymer is synthesized using as a monomer a compound of a dimer to a decamer in which 3-alkyl five-membered heterocyclic rings are bonded at positions 2 and 5, being sterically controlled. Further, this conductive polymer is used as the solid electrolyte of a solid electrolytic capacitor.
    Type: Grant
    Filed: January 27, 2009
    Date of Patent: October 13, 2009
    Assignee: Nec Tokin Corporation
    Inventors: Naoki Takahashi, Ryuta Kobayakawa, Tomoki Nobuta, Yasuhisa Sugawara, Satoshi Suzuki
  • Patent number: 7599169
    Abstract: An aspect of the present invention provides a method of manufacturing a solid electrolytic capacitor. The solid electrolytic capacitor includes an anode made of valve action metal, a dielectric layer, a solid electrolytic layer, a cathode conductive layer, and a cathode terminal. The method forms the cathode conductive layer by forming a conductive paste and conductive adhesive between the solid electrolytic layer and the cathode terminal and then simultaneously hardening the conductive paste and the conductive adhesive.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: October 6, 2009
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Kazuhiro Takatani, Mamoru Kimoto
  • Publication number: 20090244814
    Abstract: A method for manufacturing a solid electrolytic capacitor device is disclosed. The solid electrolytic capacitor device comprises a package substrate and a capacitor element which is mounted on the package substrate. The package substrate comprises an outer anode electrode, an outer cathode electrode, an inner anode electrode and an inner cathode electrode The outer anode electrode is electrically connected to the inner anode electrode. The outer cathode electrode is electrically connected to the inner cathode electrode. The capacitor element comprises a capacitor body and an anode lead portion which extends from the capacitor body. The capacitor body has a surface at least one part of which is provided with a cathode portion. The method comprises: forming the anode lead portion; forming the cathode portion after the formation of the anode lead portion; and connecting the anode lead portion and the cathode portion to the inner anode electrode and the inner cathode electrode, respectively.
    Type: Application
    Filed: March 25, 2009
    Publication date: October 1, 2009
    Applicant: NEC TOKIN Corporation
    Inventors: Shinya TOKASHIKI, Katsuhiro Yoshida, Masanori Takahashi
  • Publication number: 20090244811
    Abstract: A fused electrolytic capacitor assembly that offers improved performance characteristics in a convenient and space-saving package is provided. More specifically, the fused electrolytic capacitor assembly contains an electrolytic capacitor element and a resettable fuse contained within a case. The capacitor assembly also contains a stress absorbing material that is positioned adjacent to and in contact with the resettable fuse. By selecting a stress absorbing material having a certain modulus and a certain degree of inherent flexibility, the present inventors believe the resettable fuse is better able to expand to its full capacity upon exposure to an excessive current. In this manner, the resettable fuse is able to better function during use.
    Type: Application
    Filed: March 25, 2008
    Publication date: October 1, 2009
    Applicant: AVX CORPORATION
    Inventor: Ivan Pascenko
  • Publication number: 20090244812
    Abstract: A capacitor assembly that includes a conductive polymer electrolytic capacitor that is enclosed and hermetically sealed within a ceramic housing in the presence of an inert gas is provided. Without intending to be limited by theory, the present inventors believe that the ceramic housing is capable of limiting the amount of oxygen and moisture supplied to the conductive polymer of the capacitor. In this manner, the conductive polymer is less likely to oxidize in high temperature environments, thus increasing the thermal stability of the capacitor assembly.
    Type: Application
    Filed: April 1, 2008
    Publication date: October 1, 2009
    Applicant: AVX CORPORATION
    Inventors: Bharat Rawal, Gang Ning, Brady Jones, Zebbie Lynn Sebald, Stanislav Zednicek, Zdenek Sita
  • Publication number: 20090190287
    Abstract: A solid electrolytic capacitor in which the withstand voltage can be enhanced and a manufacturing method thereof are provided. A mixed powder is prepared by mixing a first powder containing at least one selected from the group consisting of a valve metal, an alloy of a valve metal, a metal oxide of a valve metal, and a metal nitride of a valve metal and a second powder containing a metal oxide different from the first powder. An anode is made by sintering the mixed powder. A dielectric layer is formed on a surface of the anode, and a cathode is formed on the dielectric layer.
    Type: Application
    Filed: January 26, 2009
    Publication date: July 30, 2009
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Kazuhiro TAKATANI, Kazuhito Kikuchi, Mutsumi Yano, Takashi Umemoto, Hiroshi Nonoue
  • Publication number: 20090185329
    Abstract: An electrolytic capacitor that contains an anodically oxidized anode that is incorporated with an additional metallic element is provided. More specifically, the metallic element is built into the valve metal pentoxide of the dielectric layer. In one particular embodiment, the addition of the metallic element results in a niobium pentoxide dielectric that contains closely packed units of O atoms, Nb6 octahedral, and metal atoms (“A”) that serve as counter cations. The use of relatively small electropositive metal atoms (A?) helps fill the tetrahedral (e.g., Al, Si, Ti, Mg, or Mn), octahedral (e.g., Nb, V, Mg, or Mn) and trigonal bipyramid (e.g., V, Nb) interstices of the crystals. The stability of capacitor leakage current may be improved by variation in this crystal structure.
    Type: Application
    Filed: January 22, 2008
    Publication date: July 23, 2009
    Applicant: AVX CORPORATION
    Inventors: Hana Breznova, Martin Biler
  • Publication number: 20090185330
    Abstract: An electrolytic capacitor anode etched with an organic acid prior to anodic oxidation of the anode to create the dielectric layer. Without intending to be limited by theory, it is believed that the organic acid can etch away at least a portion of any oxides on the anode. This provides a relatively uniform surface for the creation of the dielectric, which in turn leads to a dielectric layer having a substantially uniform thickness and homogeneous amorphous structure and thus improved leakage current and stability. The organic acid may also have other residual benefits, such as removing any metallic impurities from the surface of the anode.
    Type: Application
    Filed: January 22, 2008
    Publication date: July 23, 2009
    Applicant: AVX CORPORATION
    Inventors: Hana Breznova, Martin Biler
  • Publication number: 20090180240
    Abstract: The present invention relates to valve metal particles uniformly containing nitrogen and a method for preparing the same, and a valve metal green pellet and a sintered pellet made from the particles, and an electrolytic capacitor anode. The present invention provides valve metal particles uniformly containing nitrogen, wherein the difference ratio of nitrogen contents of particles is 20% or less. The present invention provides a process for preparing said valve metal particles uniformly containing nitrogen, wherein the raw material particles of the valve metal were heated in a nitrogen-containing gas at a temperature of 200° C. or less for 2 hours or more. The present invention also provides a valve metal green pellet made from said valve metal particles. The present invention also provides a valve metal sintered pellet.
    Type: Application
    Filed: October 14, 2008
    Publication date: July 16, 2009
    Inventors: Bin LI, Luntao PAN, Aiguo ZHENG, Yuezhong MA, Yuewei CHENG, Xuecheng DONG, Xueqing ZHANG, Zhidao WANG, Baojun ZHU
  • Patent number: 7561410
    Abstract: A hybrid capacitor is provided which includes a substrate, at least one plate capacitor and at least one through hole capacitor. The substrate has through holes and the plate capacitors are on the substrate. At least one through hole capacitor and at least one plate capacitor are in parallel. The through hole capacitor at least includes an anode layer, a first dielectric layer, a first cathode layer and a second cathode layer. The anode layer is disposed on an inner surface of at least one through hole, and a surface of the anode layer is a porous structure. The first dielectric layer is disposed on the porous structure of the anode layer and covered with the first cathode layer. The first cathode layer is covered with the second cathode layer. A conductivity of the second cathode layer is larger than a conductivity of the first cathode layer.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: July 14, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Min-Lin Lee, Li-Duan Tsai, Shur-Fen Liu, Bang-Hao Wu, Cheng-Liang Cheng
  • Publication number: 20090174987
    Abstract: A porous metal thin film formed from aluminum has a film structure in which domains having an average diameter of 200 nm or more, and 500 nm or less and being formed through aggregation of a plurality of grains having an average grain diameter of 50 nm or more, and 160 nm or less are distributed discretely at an average distance of 5 nm or more, and 40 nm or less, wherein the area occupied by the above-described domains is 60% or more, and 90% or less in a cross-section in any direction of the porous metal thin film.
    Type: Application
    Filed: December 8, 2008
    Publication date: July 9, 2009
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventor: Masao MIZUNO
  • Patent number: 7554454
    Abstract: An apparatus for detecting the power state of a circuit breaker switch is disclosed. The apparatus comprises a detector circuit, a processor and an indicator. The processor is coupled to the detector circuit. The indicator is coupled to the processor. In operation, the detector circuit senses an electronic signal at the circuit breaker switch and transmits a signal to the processor. The processor then transmits a signal to the indicator indicating the power state and location of the circuit breaker switch.
    Type: Grant
    Filed: April 21, 2005
    Date of Patent: June 30, 2009
    Assignee: Hi-Tech Electronic Products & Mfg., Inc.
    Inventors: Glenn T. Johnson, Michael E. Johnson
  • Patent number: 7554793
    Abstract: An improved conductive adhesive and capacitor formed using the improved conductive adhesive. The conductive adhesive has: 60-95 wt % conductor; 5-40 wt % resin; wherein the resin has: 55-98.9 wt % monomer defined by the formula: wherein: R is an aliphatic group of 1 to 10 carbons; R1 is an aliphatic group of 1 to 10 carbons; R2 is an alkyl, alkyl ether, aryl ether, silane or silicone; and wherein R and R1, R and R2 or R1 and R2 may be taken together to form a cyclic alkyl or aryl group; 0.1-15 wt % catalyst; 1-30 wt % accelerant defined by the formula: wherein R3 is an alkyl or substituted alkyl of 1-10 carbons; and R4 is an alkyl or substituted alkyl of 1-10 carbons with the proviso that at least one of R3 and R4 is substituted with a OR5 wherein R5 is selected from hydrogen, alkyl and aryl; and 0-15 wt % filler.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: June 30, 2009
    Assignee: Kemet Electronics Corporation
    Inventor: Antony P. Chacko
  • Patent number: 7554795
    Abstract: An electronic component has an element, a pair of terminal portions which are disposed on the element, and an external covering material which covers a part of the terminal portions and the element. The electronic component is configured such that inclined portions are disposed on corner portions of a bottom surface and side surfaces of the external covering material, and the terminal portions are protruded from corner portions where the inclined portions and the bottom surface of the external covering material intersect.
    Type: Grant
    Filed: June 3, 2005
    Date of Patent: June 30, 2009
    Assignee: Panasonic Corporation
    Inventors: Akio Hidaka, Shouichi Ikebe, Yuuichi Murano, Hirozumi Kazitani, Mika Ikeda, Yoshitaka Mizoguchi
  • Patent number: 7542267
    Abstract: In a lead frame for use in fabricating a face-down terminal solid electrolytic capacitor having a capacitor element an anode terminal, and a cathode terminal, a frame body has a connecting portion for being connected to the capacitor element. The connecting portion extends from a cathode terminal forming portion in a first direction to a position near an anode terminal forming portion. The anode terminal forming portion is connected to the frame body and used for forming the anode terminal. The cathode terminal forming portion is connected to the frame body and used for forming the cathode terminal. The anode terminal forming and the cathode terminal forming portions are spaced to each other in the first direction on a principal surface of the frame body.
    Type: Grant
    Filed: November 6, 2006
    Date of Patent: June 2, 2009
    Assignee: NEC TOKIN Corporation
    Inventor: Masami Ishijima
  • Publication number: 20090116173
    Abstract: A solid electrolytic capacitor according to this invention includes a capacitor element with a drawn-out anode lead, a conversion substrate mounted with the capacitor element, and a casing resin covering the capacitor element mounted on the conversion substrate. The conversion substrate has, on one surface thereof, a connection pattern composed of an anode portion connected to the anode lead and a cathode portion connected to the body of the capacitor element. The conversion substrate further has, on another surface thereof on the side opposite to the foregoing one surface, a terminal pattern composed of an anode terminal and a cathode terminal connected to the anode portion and the cathode portion through the conversion substrate, respectively. The terminal pattern differs from the connection pattern.
    Type: Application
    Filed: October 11, 2007
    Publication date: May 7, 2009
    Applicant: NEC TOKIN Corporation
    Inventors: Kunihiko Shimizu, Kazuyuki Katoh, Katsuhiro Yoshida
  • Patent number: 7529079
    Abstract: The invention provides a solid electrolytic capacitor wherein the anode has a dielectric oxide film of a structure less susceptible to damage due to mechanical stresses and which is diminished in leakage current and less prone to short-circuiting, and a process for fabricating the capacitor. The capacitor of the invention comprises an anode of aluminum having a dielectric oxide film formed over a surface thereof from amorphous alumina, and is characterized in that a plurality of tunnel-shaped etching pits are formed in the anode.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: May 5, 2009
    Assignees: Sanyo Electric Co., Ltd., Saga Sanyo Industries Co., Ltd., Japan Capacitor Industrial Co., Ltd.
    Inventors: Kazumasa Fujimoto, Hiromu Saito, Yasushi Yoshida, Yukio Takeda
  • Patent number: 7525791
    Abstract: A solid electrolytic capacitor is provided which is capable of exhibiting an excellent characteristic and high reliability against thermal stress. The solid electrolytic capacitor includes a base member having a capacitor element connecting face on its upper surface side and an electrode mounting face on its lower surface side and being made up of an insulating plate having first conductors and second conductors, disposed in a staggered format, each providing conduction between the upper and lower surface sides of the base member, and the capacitor element having anode portions and cathode portions, each being disposed in a staggered format, connected to each of the first and second conductors.
    Type: Grant
    Filed: March 5, 2008
    Date of Patent: April 28, 2009
    Assignee: NEC Tokin Corporation
    Inventors: Koji Sakata, Takeshi Saito, Yuji Yoshida, Takeo Kasuga, Masanori Takahashi, Katsuhiro Yoshida
  • Patent number: 7525789
    Abstract: An electronic apparatus has an electric load, an electrochemical capacitor, and an applying section. The electric capacitor includes a positive electrode, a negative electrode and an electrolyte placed between the positive electrode and the negative electrode and supplies electric power to the electric load. The applying section opens an electrical connection between the electrochemical capacitor and the electric load, and applies a minus potential to the positive electrode and a plus potential to the negative electrode.
    Type: Grant
    Filed: June 14, 2005
    Date of Patent: April 28, 2009
    Assignee: Panasonic Corporation
    Inventors: Kiyohiro Ishii, Hiroyuki Maeshima, Yasuyuki Ito
  • Patent number: 7525790
    Abstract: A solid electrolytic capacitor with face-down terminals includes a capacitor element having an anode lead drawn out therefrom in an offset manner, an anode terminal, a cathode terminal, and an insulating casing resin. At a rectangular mount surface having a first and a second side parallel to each other and forming an outer bottom portion, four terminal exposed portions are provided such that a terminal pair composed of the two terminal exposed portions are located at the first side and a terminal pair composed of the other two terminal exposed portions are located at the second side. The two terminal exposed portions located at the first side serve as mount-surface exposed portions of the anode terminal and the cathode terminal, while, the two terminal exposed portions located at the second side serve as dummy terminals that are not electrically connected to the capacitor element.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: April 28, 2009
    Assignee: NEC TOKIN Corporation
    Inventor: Fumio Kida
  • Publication number: 20090103247
    Abstract: An electrolytic capacitor that comprises an anode body formed from a powder comprising electrically conductive ceramic particles and a non-metallic element in an amount of about 100 parts per million or more is provided in one embodiment of the invention. The non-metallic element has a ground state electron configuration that includes five valence electrons at an energy level of three or more. Examples of such elements include, for instance, phosphorous, arsenic, antimony, and so forth. The capacitor also comprises a dielectric layer overlying the anode body and an electrolyte layer overlying the dielectric layer.
    Type: Application
    Filed: October 22, 2007
    Publication date: April 23, 2009
    Applicant: AVX CORPORATION
    Inventor: Tomas Karnik
  • Publication number: 20090103244
    Abstract: The invention provides a solid electrolytic capacitor wherein the anode has a dielectric oxide film of a structure less susceptible to damage due to mechanical stresses and which is diminished in leakage current and less prone to short-circuiting, and a process for fabricating the capacitor. The capacitor of the invention comprises an anode of aluminum having a dielectric oxide film formed over a surface thereof from amorphous alumina, and is characterized in that a plurality of tunnel-shaped etching pits are formed in the anode.
    Type: Application
    Filed: December 9, 2008
    Publication date: April 23, 2009
    Applicants: SANYO ELECTRIC CO., LTD., SAGA SANYO INDUSTRIES CO., LTD., JAPAN CAPACITOR INDUSTRIAL CO., LTD.
    Inventors: Kazumasa Fujimoto, Hiromu Saito, Yasushi Yoshida, Yukio Takeda
  • Patent number: 7515397
    Abstract: Methods to at least partially reduce a niobium oxide are described wherein the process includes mixing the niobium oxide and niobium powder to form a powder mixture that is then heat treated to form heat treated particles which then undergo reacting in an atmosphere which permits the transfer of oxygen atoms from the niobium oxide to the niobium powder, and at a temperature and for a time sufficient to form an oxygen reduced niobium oxide. Oxygen reduced niobium oxides having high porosity are also described as well as capacitors containing anodes made from the oxygen reduced niobium oxides.
    Type: Grant
    Filed: May 19, 2004
    Date of Patent: April 7, 2009
    Assignee: Cabot Corporation
    Inventors: David M. Reed, Sridhar Venigalla, Ricky W. Kitchell, Stephen J. Krause, Heather L. Enman, Dorran L. Schultz, Jeffrey A. Kerchner
  • Publication number: 20090080145
    Abstract: The present invention provides a metal powder composed of tantalum or niobium that achieves both sinterability and fluidity and the manufacturing method thereof. The present invention also provides a tantalum or niobium powder that enables the manufacturing of an anode for a solid electrolytic capacitor in which holes are formed for a conductive polymer-containing solution to pass through, without using a hole molding material or pore forming material. Furthermore, the present invention provides an anode for a solid electrolytic capacitor that enables the manufacturing of a high-volume and low ESR solid electrolytic capacitor. The present invention further provides a manufacturing method of a metal powder that allows the manufacturing of a metal powder of a given diameter range from a raw powder at high yield, without requiring a lot of work and time.
    Type: Application
    Filed: May 31, 2006
    Publication date: March 26, 2009
    Inventors: Yujiro Mizusaki, Isao Sugiyama, Hitoshi Iijima, Osamu Kubota
  • Patent number: 7508652
    Abstract: A solid electrolytic capacitor which is easy to make and a method of making the same are provided. In a solid electrolytic capacitor in accordance with the present invention, a substrate on which a capacitor device is mounted includes anode electrode parts and cathode electrode parts of a lead frame, and a resin plate, whereas parts exposed from the upper face of the resin plate construct anode electrode terminals and cathode electrode terminals. Therefore, this substrate can easily be made by mold-sealing the anode electrode parts and cathode electrode parts with the resin plate. Consequently, the solid electrolytic capacitor in accordance with the present invention using such a substrate can also be made easily.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: March 24, 2009
    Assignee: TDK Corporation
    Inventor: Masaaki Kobayashi
  • Publication number: 20090073640
    Abstract: Nb1-xTaxO powder wherein x is 0.1 to 0.5 is described. Further, this powder, as well as niobium suboxide powders, can be doped with at least one dopant oxide. Pressed bodies of the powder, sintered bodies, capacitor anodes, and capacitors are also described.
    Type: Application
    Filed: July 11, 2008
    Publication date: March 19, 2009
    Applicant: Cabot Corporation
    Inventor: Sridhar Venigalla
  • Publication number: 20090067121
    Abstract: Tantalum powder capable of providing a small-sized tantalum electrolytic capacitor while maintaining capacity is described. Tantalum powder in the present invention can be characterized in that the CV value is from 200,000 to 800,000 ?FV/g, when measured by the following measuring method. Pellets are produced by forming tantalum powder such that the density is 4.5 g/cm3, then the pellets are chemically converted in a phosphoric acid aqueous solution of concentration 0.1 vol. % at a voltage of 6V and a current of 90 mA/g, and the chemically converted pellets are used as measuring samples to measure the CV value in a sulfuric acid aqueous solution of concentration 30.5 vol. % at a temperature of 25° C. under a frequency of 120 Hz and a voltage of 1.5V.
    Type: Application
    Filed: October 30, 2008
    Publication date: March 12, 2009
    Applicant: CABOT CORPORATION
    Inventors: Yujiro Mizusaki, Hitoshi Iijima, Yoshikazu Noguchi
  • Patent number: 7501692
    Abstract: Provided are a semiconductor lead frame, a semiconductor package having the semiconductor lead frame, and a method of plating the semiconductor lead frame. The method includes preparing a substrate formed of a Fe—Ni alloy (alloy 42), and a plating layer that contains grains less than 1 micrometer in size and is plated on the substrate. The growth of whiskers when a Sn plated layer is formed on a substrate formed of a Fe—Ni alloy (alloy 42) can be suppressed by minimizing the grain size of the Sn plated layer.
    Type: Grant
    Filed: August 1, 2005
    Date of Patent: March 10, 2009
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Woo-suk Choi, Joong-do Kim, Eun-hee Kim, Soo-bong Lee
  • Publication number: 20090059477
    Abstract: A solid electrolytic capacitor that is capable of withstanding laser welding without a significant deterioration in its electrical performance is provided. The capacitor contains an anode body, dielectric layer overlying the anode body, and a solid organic electrolyte layer overlying the dielectric layer. Furthermore, the capacitor of the present invention also employs a light reflective layer that overlies the solid organic electrolyte layer. The present inventors have discovered that such a light reflective layer may help reflect any light that inadvertently travels toward the capacitor element during laser welding. This results in reduced contact of the solid organic electrolyte with the laser and thus minimizes defects in the electrolyte that would have otherwise been formed by carbonization. The resultant laser-welded capacitor is therefore characterized by such performance characteristics as relatively low ESR and low leakage currents.
    Type: Application
    Filed: September 4, 2007
    Publication date: March 5, 2009
    Applicant: AVX CORPORATION
    Inventors: Jan Petrzilek, Ivan Horacek
  • Patent number: 7495890
    Abstract: A solid electrolytic capacitor body is attached to lead frame by a secondary adhesive and a method for forming the capacitor assembly. The assembly consists of a chip that has conductive adhesive formed on the cathode surface. Secondary adhesive is placed adjacent to the conductive adhesive. Lead frame is attached to these adhesives and the adhesives are cured simultaneously. Secondary adhesive can be thermally or UV cured. The solid electrolytic capacitor formed by this method showed improved adhesion between lead frame and capacitor body.
    Type: Grant
    Filed: August 4, 2006
    Date of Patent: February 24, 2009
    Assignee: Kemet Electronics Corporation
    Inventor: Antony Chacko
  • Patent number: 7495891
    Abstract: A solid capacitor and the manufacturing method thereof are disclosed. The solid capacitor consists of a dielectric layer and two electrodes. A plurality of holes formed by an opening process is disposed on surface of the dielectric layer. The two electrodes connect with the dielectric layer by the holes. By means of a plurality of high temperature volatile matters, the plurality of holes is formed on surface of the dielectric layer during sintered process. The holes are connected with the outside so as to increase surface area of the dielectric layer and further the capacity is increased. And the solid capacitor stores charge by physical means. Moreover, the solid capacitor can be stacked repeatedly to become a multilayer capacitor.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: February 24, 2009
    Assignee: Ctech Corporation
    Inventors: Shang Mei Lee, Ting Keng Lin, Yung Sheng Huang
  • Patent number: 7489498
    Abstract: A capacitor element comprises an anode, a dielectric layer formed on the anode, an electrolyte layer formed on the dielectric layer, and a cathode formed on the electrolyte layer. On the cathode formed by the surface of the capacitor element, a conductive adhesive layer containing silver particles and an organic silane layer made from aminopropyltriethoxysilane (APTES) are sequentially formed, and the cathode and a cathode terminal are connected through the conductive adhesive layer and the organic silane layer. In addition, an anode terminal is connected to an anode lead which exposed from the anode by welding.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: February 10, 2009
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Hiroaki Izu, Takahisa Iida, Mutsumi Yano, Mamoru Kimoto
  • Patent number: 7486498
    Abstract: A capacitor anode (1) includes a substrate (10) which is formed from an alloy, metal, or metal compound which has a high tensile yield strength and high elastic modulus. The material has a composition which can be anodized, yielding an adherent and compressively stressed dielectric film (12) of pure, mixed, alloyed, or doped oxide that has a high usable dielectric strength (e.g., over 50 V/?m) and high dielectric constant (e.g., 20 to over 10,000). A capacitor formed from the anode has a high energy density.
    Type: Grant
    Filed: January 12, 2005
    Date of Patent: February 3, 2009
    Assignee: Case Western Reserve University
    Inventors: Gerhard E. Welsch, Donald L. McGervey
  • Publication number: 20080310081
    Abstract: A solid electrolytic capacitor includes a porous sintered body made of a valve-acting metal and embedded with part of an anode lead having a protruding portion, a solid electrolyte layer formed in contact with a dielectric layer formed in the porous sintered body, a mounting anode terminal member, a mounting cathode terminal member, and an insulating casing resin. The capacitor further includes a small piece of a metal frame made of a valve-acting metal. This small piece of the metal frame is formed integrally with the protruding portion of the anode lead by cutting, after the anodic oxidation, the metal frame to which the protruding portion of the anode lead is fixed by resistance welding. The small piece of the metal frame and the mounting anode terminal member are connected together by wire bonding so that the anode lead and the mounting anode terminal member are electrically connected together.
    Type: Application
    Filed: June 17, 2008
    Publication date: December 18, 2008
    Applicant: NEC TOKIN Corporation
    Inventors: Kunihiko SHIMIZU, Takashi Mizukoshi, Koji Sakata
  • Publication number: 20080297983
    Abstract: A method for manufacturing an electrode sheet for capacitors includes the step of thermally spraying mixed powder 6 in which intermetallic compound powder of Al and valve action metal other than Al, such as Ti, Zr, Nb, Ta and Hf, and Al powder are mixed, onto a surface of an aluminum foil 2, or supplying intermetallic compound powder 7 of Al and valve action metal other than Al, such as Ti, Zr, Nb, Ta and Hf, and Al powder 8 from different positions and thermally spraying the intermetallic compound powder and the Al powder onto a surface of an aluminum foil 2, to thereby form an Al-valve action metal alloy layer on at least one surface of the aluminum foil 2.
    Type: Application
    Filed: March 24, 2005
    Publication date: December 4, 2008
    Applicant: SHOWA DENKO K.K.
    Inventors: Hiroyuki Kawabata, Atsushi Otaki, Tomoaki Yamanoi
  • Patent number: 7460357
    Abstract: An electrolyte for an electrolytic capacitor which is high in electrolytic conductivity, excellent in heat stability and high in withstand voltage. An electrolyte for an electrolytic capacitor comprising a tetrafluoroaluminate ion; and an electrolyte for an electrolytic capacitor containing a salt and a solvent, characterized in that electrolytic conductivity X (mS·cm?1) at 25° C. and withstand voltage Y (V) of a capacitor satisfy the relationships of formulae (I): Y??7.5X+150, and X?4, Y>0.
    Type: Grant
    Filed: December 16, 2005
    Date of Patent: December 2, 2008
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Masayuki Takeda, Masahiro Takehara, Makoto Ue
  • Patent number: 7453683
    Abstract: A chip-type aluminum electrolytic capacitor is provided that allows a lead wire exposed from an insulated terminal plate to have an increased temperature sooner than the other parts to provide highly-reliable soldering in a relatively-easy reflow atmosphere environment and that has a superior vibration resistance. The capacitor includes an insulated terminal plate (3) that includes, at the outer surface thereof, an insertion hole (2a) to which a pair of lead wires (2) introduced from a sealing member of a capacitor body are inserted and a first concave groove (2a) for storing lead wires (2) inserted to the hole while lead wires (2) being bent in an orthogonal direction. Insulated terminal plate (3) is attached to the capacitor so as to be abutted with the above sealing member. Metal electrode (4) is buried in an inner face of first concave groove (2a) provided in insulated terminal plate (3) and the periphery thereof.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: November 18, 2008
    Assignee: Panasonic Corporation
    Inventors: Ryuji Nakamura, Hiroshi Kurimoto, Yasushi Kurasaki
  • Publication number: 20080280153
    Abstract: An anodizing solution, and method of anodizing, comprising suspending at least one aluminium substrate in an anodizing solution and applying an anodizing current to the anodizing solution. The anodizing solution comprises 0.01-5%, by weight, sodium silicate and 0.01-5%, by weight, ?-amino acid.
    Type: Application
    Filed: July 18, 2008
    Publication date: November 13, 2008
    Inventors: John Tony Kinard, Brian John Melody, Albert Kennedy Harrington, David Alexander Wheeler
  • Patent number: 7450366
    Abstract: A solid electrolytic capacitor (A1) includes a porous sintered body (1) of valve metal, internal anode terminals (11a, 11b) projecting from the porous sintered body, and external anode terminals (21a, 21b) positioned lower than the internal anode terminals and having a bottom surface utilized for surface-mounting. The internal anode terminals (11a, 11b) are provided at a position lower than the center of the porous sintered body (1) in the height direction of the porous sintered body.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: November 11, 2008
    Assignee: Rohm Co., Ltd.
    Inventor: Chojiro Kuriyama