Abstract: The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.

Abstract: A chip solid electrolyte capacitor with low ESR and small initial failure ratio comprising a plurality of solid electrolyte capacitor elements each produced by stacking a dielectric oxide film layer, a semiconductor layer and an electrically conducting layer in this order to form a cathode part on a surface of an anode substrate exclusive of the anode part at one end, the anode substrate comprising a sintered body of a valve-acting metal or an electrically conducting oxide or comprising the sintered body connected with a metal wire, which is a chip solid electrolyte capacitor obtained by horizontally laying the plurality of electrolyte capacitor elements in parallel with no space on a pair of oppositely disposed end parts of a lead frame such that the anode part or the metal wire and the cathode part come into contact with the lead frame, joining each element, and molding the entire with a resin while leaving outside the external terminal parts of the lead frame, wherein the volume ratio of one sintered body

Abstract: A chip-type solid electrolytic capacitor has a four-terminal structure. The chip-type solid electrolytic capacitor includes capacitor elements laminated such that anode electrodes face alternately in opposite directions; a pair of anode terminals opposing each other; and a pair of cathode terminals opposing each other. The magnetic fluxes generated by current passing between respective terminals are mutually cancelled, thus allowing ESL to be drastically reduced. Further reduction of ESL is feasible by shortening the distance between the terminals as much as possible so as to reduce the current loop area.

Abstract: An object of the invention is to provide a capacitor element capable of reducing product defects caused in the process step of forming a cathode electrode film and capable of reducing the size and weight of a solid electrolytic capacitor incorporating the capacitor element. The capacitor element includes an anode chip body including a porous sintered body formed by sintering valve metal powder into a rectangular parallelepiped, an anode wire fixed to a first end surface of the anode chip body, a dielectric film formed on the metal powder of the anode chip body, a solid electrolyte layer formed on the dielectric film, and a cathode-side electrode film formed on the anode chip body via the solid electrolyte film. The object is achieved by rounding or chamfering at least two of four edges of the anode chip body at which four side surfaces of the anode chip body meet a second end surface which is opposite from the first end surface, the two edges being parallel with each other.

Abstract: Implantable heart-monitoring devices, such as defibrillators, pacemakers, and cardioverters, detect abnormal heart rhythms and automatically apply corrective electrical therapy, specifically one or more bursts of electric charge, to abnormally beating hearts. Critical parts in these devices include the capacitors that store and deliver the bursts of electric charge. Some devices use cylindrical aluminum electrolytic capacitors which include terminals that extend from one end of the case, making the capacitor longer and generally necessitating use of larger device housings. Accordingly, the inventors devised capacitor connection structures that allow size reduction. One exemplary capacitor includes two conductive endcaps at opposite ends of its capacitive element, instead of two upright terminals at one end, thereby allowing reduction in the height or volume of the capacitor and/or increases in the dimensions of other components, such as aluminum foils.

Abstract: The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.

Abstract: A multiterminal solid electrolytic capacitor mountable to a board for two terminals is provided. In the solid electrolytic capacitor (10) in accordance with the present invention, an anode of a capacitor device (12) is connected to one end part (35B) of a via (32) connected to a plurality of anode leads (34B) arranged on a base sheet surface (14a), whereas a cathode of the capacitor device (12) is connected to the other end part (35A) of a via (32) connected to a plurality of cathode leads (34A) similarly arranged on the base sheet surface (14a). Each end part (35B) of the via (32) connected to the anode lead (34B) is electrically connected to an end part (35D) of the via (32) connected to a land electrode (42B) arranged on the lower face (10a) of the base sheet (14). Each end part (35A) of a plurality of vias (23) connected to the cathode lead (34A) is electrically connected to an end part (35C) of the via (32) connected to a land electrode (42A).

Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.

Abstract: A miniature solid electrolytic capacitor is provided, which is suitable for being disposed within an electrically insulating layer, and is connected to a component using an electrically conductive adhesive with a connection resistance at an anode being low and with connection reliability being improved. Specifically, the electrolytic capacitor includes a valve metal element for an anode having a capacitor forming part and an electrode lead part, a dielectric oxide film formed on the valve element, a solid electrolyte layer formed on the dielectric oxide film and a charge collecting element for a cathode formed on the solid electrolyte layer, wherein at least one through hole is formed in the electrode lead part so as to expose a core of the valve metal element, and wherein an exposed portion of the core is used as a connecting portion.

Abstract: It is an object of the present invention to provide a solid electrolytic capacitor which can reduce the ESL and the ESR and increase electrostatic capacitance at a small size, and a method for manufacturing such a solid electrolytic capacitor. A solid electrolytic capacitor component includes a foil-like aluminum substrate whose surface is roughened or enlarged and which is formed with an aluminum oxide film 2x on the surface thereof and foil-like aluminum substrates whose surfaces are not roughened and a cathode electrode including a solid high molecular polymer electrolyte layer, a graphite paste layer and a silver paste layer is formed on the surface of the foil-like aluminum substrate. In the solid electrolytic capacitor component 110, lead electrode pairs including anode lead electrodes are disposed adjacent with each other, whereby magnetic fields to be generated are canceled.

Abstract: A solid electrolytic capacitor including a capacitor element having an anode body partly provided with a cathode layer, an anode-side and a cathode-side lead frame attached to a lower surface of the capacitor element, and a housing covering the lead frames and the capacitor element except lower surfaces of the lead frames. The housing covers an outer end face of each of the lead frames, the outer end face of each lead frame being provided with a filling portion filled with a resin forming the housing.

Abstract: The invention provides an electric double-layer capacitor sealed up by a flexible casing material that ensures a release of pressure upon an increasing internal pressure. A pressure release valve (1) is attached to the flexible casing material. The pressure release valve (1) comprises a collar airtightly joined to the flexible casing material and a cylindrical portion (3) connected to the collar, extending out of a capacitor enclosure. The cylindrical portion (3) comprises an end part (5) having a self-closing passage (6) that is opening to the outside only upon a pressure release and is closed up in a normal state, and a channel (4) in communication with the interior of the capacitor enclosure.

Abstract: A capacitor including an expandable part fabricated on a capacitor housing is enclosed. The expandable part is expandable by a fault that occurs within the capacitor housing, thereby extending the capacitor housing to contact with an external interrupter. The external interrupter includes an external electrode and an external sensing circuit. The external sensing circuit detects a contact between the capacitor housing and the external electrode and sends a signal to disconnect the capacitor from an apparatus circuit.

Abstract: A capacitor including an expandable part fabricated on a capacitor housing is enclosed. The expandable part is expandable by a fault that occurs within the capacitor housing, thereby extending the capacitor housing to contact with an external interrupter. The external interrupter includes an external electrode and an external sensing circuit. The external sensing circuit detects a contact between the capacitor housing and the external electrode and sends a signal to disconnect the capacitor from an apparatus circuit.

Abstract: A solid electrolytic capacitor of the present invention is produced by connecting a solid electrolytic capacitor element with a lead frame after plating the lead frame with copper and then roughening the surface thereof, and then by molding the solid electrolytic capacitor element and lead frame with an encapsulating resin possessing a thermal expansion coefficient that is near the thermal expansion coefficient of the lead frame. The solid electrolytic capacitor thus produced shows excellent solderability and can withstand a thermal shock encountered at the time of soldering when the solid electrolytic capacitor is mounted on a circuit board. Accordingly, a solid electrolytic capacitor that ensures excellent reliability after being mounted on a circuit board is obtained.

Abstract: A compact solid electrolytic capacitor includes a capacitor element having a positive electrode and a negative electrode which are respectively connected electrically to a first lead and a second lead and a casing of a resin material surrounding the capacitor element. A low melting-point metal layer serving as a fuse, which will quickly melt under an abnormal condition, is inserted between and electrically connects the capacitor element and the second lead and an arc-extinguishing material capable of absorbing the melted metal of the low melting-point metallic material fills a throughhole through the second lead where the latter contacts the low melting-point metal layer. The low melting-point metal layer may be in the form of a flat ribbon of thickness only about 50-100 &mgr;m.

Abstract: An electronic part such as a ceramic capacitor and a resistor used in various kinds of electric appliances has an apprehension that an electronic part element might be red-heated to be burnt when an abnormal current flows in spite of dielectric covering member, and therefore it has been impossible to supply a nonflammable electronic part having a stabilized performance. In the present invention, an electronic part is constructed such that since an electronic part element 8 such as a condenser or a resistor is put in a case 5 which in turn is nearly sealed to cut off the supply of oxygen, the electronic part is prevented from catching fire even if it generates heat, and since an opening 6 is formed in a portion of the case 5 or a sealing member 7 so as to allow the gas to be let out, when the electronic part generates heat to increase the pressure, the case 5 can be prevented from being ruptured. Accordingly, it is possible to provide a nonflammable electronic part having stabilized characteristics.

Abstract: A stack type electric double layer capacitor includes a plurality of unit cells, each with a pair of polarizing electrodes facing each other across a porous separator, a pair of current collecting members, and a gasket surrounding the electrodes and current collecting members. The gasket has a heat radiation notch in the direction parallel to or perpendicular to the stacking direction. This prevents heat from accumulating in the capacitor at the time of rapid charge and discharge, and thereby enhances the reliability of the capacitor.

Abstract: A solid electrolytic capacitor array includes a substrate (12) made of conductive silicon, and an insulation film (15) which is formed with a plurality of contact holes is formed on an upper surface of the substrate. A plurality of contact layers (18) which are respectively connected to the substrate through the contact holes is formed on the insulation film. A plurality of chips each of which is a sintered unit of tantalum powder are arranged on the contact layers, respectively. A plurality of solid electrolytic layers which are respectively electrically insulated from the tantalum powder of the chips by insulation films are provided on the chips, respectively. A covering resin layer (25) covers the chips in a manner that portions of the solid electrolytic layers of the chips are respectively exposed, and cathode electrodes are formed on the covering resin layer so as to be electrically conducted to the solid electrolytic layers being exposed from the covering resin layer.

Abstract: A metal tape is employed to form electrodes for an electrolytic capacitor. At least one side surface of the metal tape has rigidly adhered thereto a separating sheet of microporous thermoplastic material. This preferably is done by a thermal process or by cementing. Both surfaces of the metal tape, for example formed of aluminum, may have separating sheets applied thereto. Selected regions of such surface or surfaces may be maintained uncoated, whereby subsequent use as electrodes may enable the attachment to such uncoated regions of terminal contacts.

Abstract: A solid electrolytic capacitor according to the present invention includes a chip substrate segment (12), a sintered chip (21) of metal powder mounted on an upper surface of the chip substrate segment (12), a solid electrolyte layer (23) formed on the chip (21) in electrical insulation from the metal powder of the chip (21) via a dielectric film (22), a resin coating (25) covering the chip (21) with a portion of the solid electrolyte layer (23) exposed, a cathode terminal electrode film (27) formed in electrical conduction with the exposed portion of the solid electrolyte layer (23), and an anode terminal electrode film (28) formed on the chip substrate segment (12) in electrical conduction with the metal powder of the chip (21).

Abstract: A solid electrolytic capacitor has a molded casing containing therein a capacitor element, a first lead member connected to its anode and a second lead member connected to its cathode through a fuse. The second lead member is designed such that a relatively large capacitor element can be contained inside the casing although it must also have a large enough hole to allow a portion of the casing to penetrate therethrough to fasten it to the casing.

Abstract: An electric double layer capacitor including a pair of activated charcoal electrodes facing each other with the intermediary of a porous separator, and current collecting members each being positioned on a surface of the respective electrode opposite to a surface contacting the separator is disclosed. Hydrophobic powdery activated charcoal is provided around the electrodes for adsorbing gases. With this arrangement, it is possible to prevent pressure inside the capacitor from being elevated by gases produced in the capacitor, thereby enhancing the reliability of the capacitor.

Abstract: A capacitor has a capacitor element including a metallized film and a case for hermetically containing the capacitor element. The capacitor element has a protective mechanism for protecting it against insulation breakdown at overvoltage or thermorunaway. The capacitor also has a safety device for keeping the capacitor safe at high internal pressure due to heating. Thus, the protective mechanism and the safety device operate surely, the capacitor is protected under various severe conditions, and the life of the capacitor becomes longer.

Abstract: A fused surface mounting type solid electrolytic capacitor is provided which includes a capacitor element, a safety fuse wire, and a package enclosing the capacitor element together with the fuse wire. The capacitor element includes a capacitor chip and an anode wire projecting downwardly from the chip toward the bottom surface of the package. The safety fuse wire is electrically connected to the chip and bent to extend downwardly toward the bottom surface of the package. An anode-side terminal electrode is formed on the package to extend from a first side surface of the package to the bottom surface in electrical conduction with the anode wire, while a cathode-side terminal electrode is formed on the package to extend from a second side surface of the package to the bottom surface in electrical conduction with the safety fuse wire.

Abstract: An electronic component is provided which includes at least one chip element having at least two poles; and at least two leads respectively connected electrically to the two poles. At least one of the two leads is electrically connected to a corresponding one of the two poles through a solder fuse wire which has a nail head end and a flattened discal end.

Abstract: A capacitor which is provided with internal protection and in which plastic film is wound around a core tube (3) to form a capacitor cylinder (2). Metallic contact surfaces (4, 5) are formed at the ends of the cylinder to connect connecting leads, and a fusible portion (9) is provided between the second contact surface (5) and the phase lead, said fusible portion (9) serving both as a thermal fuse and as an overload protector.

Abstract: A circuit is provided which incorporates a solid electrolytic capacitor between a power source and a load. The capacitor comprises: a capacitor element including a chip body and an anode wire projecting from the chip body; an anode lead electrically connected to the anode wire; a cathode lead paired with the anode lead and electrically connected to the chip body; an auxiliary lead separate from the anode and cathode leads; a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and part of the auxiliary lead; and a fuse wire for electrically connecting the auxiliary lead to the anode lead within the resin package. Each of the anode, cathode and auxiliary leads has an inner end located in the resin package, and an outer end projecting from the resin package. Further, the anode lead of the capacitor is electrically connected to the power source without intervention of any other electronic element.

Abstract: A fuse arrangement includes a fuse element having a serpentine shape disposed resilient and incombustible or fire-resistant insulating plates and external connection terminals formed at the fuse arrangement. A capacitor has a safety fuse with a fuse element formed between two insulating plates affixed to one end surface of a chip piece of the capacitor so that one end of the safety fuse element is electrically connected to one electrode of the capacitor, and a connection terminal electrode film is formed on the outer surface of the safety fuse body connected to the other end of the safety fuse element.

Abstract: A solid electrolytic capacitor is provided which comprises a capacitor element and a safety fuse. The anode of the capacitor element is electrically connected to an anode lead, whereas the cathode of the capacitor element is electrically connected to a cathode lead through the safety fuse. A resin package encloses the capacitor element, the fuse, a part of the anode lead, and a part of the cathode lead. The resin package has a recess which is formed with a port extending toward the fuse. An elastic closure member is fitted in the recess of the resin package to close the port.

Abstract: A solid electrolytic capacitor that includes a capacitor element including a chip and an anode wire projecting from a first end face of the chip. The chip has a second end face opposite to the first end face and a side face between the first and second end faces. An anode lead is electrically connected to the anode wire and a cathode lead is paired with the anode lead. The capacitor also includes a safety fuse wire that has a first end electrically connected to the side face of the chip, and a second end electrically connected to the cathode lead. A resin package encloses the capacitor element, part of the anode lead, part of the cathode lead, and the fuse wire. An insulating layer is formed at least on the side face of the chip adjacent to the second end face thereof for contacting and supporting the safety fuse wire.

Abstract: A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a first fuse wire connecting electrically between the chip body and the cathode lead, and a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and the first fuse wire. The capacitor further comprises an auxiliary lead separate from the anode and cathode leads, and a second fuse wire for electrically connecting the auxiliary lead to one of the chip body and the anode lead within the resin package. In an alternative embodiment, there is only a single fuse wire, the fuse wire acting both as a temperature fuse and as an overcurrent fuse.

Abstract: A solid electrolytic capacitor is provided which comprises a capacitor element including a porous sintered chip of metal particles, a solid electrolytic substance electrically insulated from the metal particles by a dielectric substance, an anode terminal layer electrically connected to the metal particles, and a cathode terminal layer electrically connected to the solid electrolytic substance. The capacitor element has a terminal portion located adjacent to the anode terminal layer and provided with barrier means for preventing the solid electrolytic substance from entering to the terminal portion.

Abstract: A fused chip-type solid electrolytic capacitor in which a fuse is difficult to be cut and broken down during its fabrication sequence. The capacitor includes a capacitor element having an anode lead and a cathode layer, an anode terminal fixed to the anode lead, a fuse electrically connected to the cathode layer, a cathode terminal electrically connected to said cathode layer through said fuse; and a resin sheathing for entirely covering said capacitor element. The fuse is formed of a piece of a metallized plastic film and is mechanically bonded to the cathode terminal to the cathode layer by a first and second electrically conductive materials, respectively. The metallized plastic tape is preferably formed of a plastic base film and a metal layer deposited on the base film, and the metal layer is mechanically bonded to the cathode terminal by the first electrically conductive material and to the cathode layer by the second electrically conductive material.

Abstract: Provided is a solid electrolytic capacitor including a capacitor element, an internal anode lead extending from a substantially central portion of one lateral surface of the capacitor element, other surfaces of the capacitor element normal to the lateral surface being adapted to serve as cathode terminal walls, an external anode lead connected to the internal anode lead, an external cathode lead connected to one of the cathode terminal wall, and a resin mold encapsulating the capacitor element as well as connecting portions associated therewith, wherein the external anode lead connected to the internal anode lead is bent to have at least two steps at its end portion, a lower step of said at least two steps being fixed to another one of the cathode terminal walls through an insulating material, an upper step of said at least two steps being fixed to the internal anode lead.

Abstract: An electronic component is provided which comprises a resin package for enclosing inside parts. The package has a heat sensitive surface portion provided with a heat sensitive material which irreversibly discolors at a temperature higher than the soldering temperature for the electronic component. The component may be a solid tantalum capacitor, solid aluminum capacitor, diode or transistor which generates heat under abnormal operating conditions.

Abstract: A solid electrolytic capacitor of the type having a built-in fuse is disclosed in which a connecting portion between the fuse and a capacitor element is made thin and securely formed to accommodate the capacitor element to be increased in capacitance without changing the outer size of a resin package. The solid electrolytic capacitor including a capacitor element, an internal anode lead extending from one surface of the capacitor element, other surfaces of the capacitor element serving as a cathode terminal wall, an external anode lead connected to the internal anode lead, an external cathode lead connected to the cathode terminal wall through a fuse, and a resin package encapsulating the capacitor element, the fuse and respective connecting portions of the external anode lead and the external cathode lead.

Abstract: A package-type solid electrolytic capacitor is provided which comprises a pair of capacitor elements, a pair of diodes associated with the capacitor elements, a pair of leads associated with the capacitor elements and the diodes, and a resin package enclosing the capacitor elements, the diodes and part of the leads. The leads may be exchangeably connectable to a positive and a negative electrodes of a circuit pattern. In one state of lead connection, one of the diodes passes a current only for one of the capacitor elements. In the other state of lead connection, the other diode passes a current only for the other capacitor element. Thus, the capacitor is non-polar and therefore can be mounted without paying any attention to the polarity.

Abstract: A package-type solid electrolytic capacitor is provided which comprises a capacitor element including a chip from which an anode wire partially projects out, a resin package enclosing the capacitor element, and a diode also enclosed in the package. The diode has a negative pole electrically connected to the anode wire, and a positive pole electrically connected to the chip. The diode is designed to allow passage therethrough of a forward current under a forward bias which is lower than the reverse dielectric breakdown voltage of the capacitor element.

Abstract: A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a fuse wire having a first end electrically connected to the cathode lead and a second end electrically connected to the chip body, and a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and the fuse wire. The first end of the fuse wire has a nail head form for bonding to the cathode lead with a sufficient adhesion area without increasing the length of the first end.

Abstract: A packaged electrical component includes an electrical component having at least two electrical leads, the electrical component generating a gas during operation, and a package enclosing the electrical component with the leads extending from the package, the package consisting of at least one selectively permeable material having a relative high permeability to a gas generated within the package during operation of the electrical component and a relatively low permeability to at least one other fluid, such as water, that may be present inside and/or outside the package.

Abstract: A capacitor apparatus incorporating a fuse incorporates a capacitor device having a first electrode and a second electrode; a fuse whose one end is connected to the first electrode; a first lead terminal connected to the other end of the fuse; a second lead terminal connected to the second electrode; and resin in which the capacitor device, fuse, and a part of the first and second lead terminals are molded. According to such features, fuming and ignition of the capacitor device due to an excessive current therethrough can be prevented without fail.

Abstract: A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a first fuse wire connecting electrically between the chip body and the cathode lead, and a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and the first fuse wire. The capacitor further comprises an auxiliary lead separate from the anode and cathode leads, and a second fuse wire for electrically connecting the auxiliary lead to one of the chip body and the anode lead within the resin package.

Abstract: A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a fuse wire having a first end electrically connected to the cathode lead and a second end electrically connected to the chip body, and a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and the fuse wire. The first end of the fuse wire has a nail head form for bonding to the cathode lead with a sufficient adhesion area without increasing the length of the first end.

Abstract: A fused chip-type solid electrolytic capacitor is provided in which a cathode terminal comprises a connecting portion and a leading portion formed separately to each other, a fuse is provided between the connecting portion and leading portion thereof in a cross linking manner to connect them electrically, and an electrically insulative protective body provided thereon to connect them mechanically and integrally. The cathode terminal formed as shown above is connected through said connecting portion to a cathode layer of a capacitor element, and led through said leading portion to the outside of an external resin. In this capacitor, the electrically insulative protective body for coupling the connecting portion and leading portion of the cathode terminal may cover a fuse itself and the positions where the fuse is connected correspondingly to the connecting portion and leading portion, but it is preferably to cover a surface of said leading portion on the capacitor element side as well.

Abstract: In a chip-type solid electrolytic capacitor with a fuse, a cathode terminal has an inside connecting portion, an outside lead portion, and a fuse for bridging between the inside connecting portion and the outside lead portion. Predetermined portions including the fuse are protectively insulated by protective resin which is provided with a projecting portion. Part of the protective resin is exposed from a molding resin. The cathode terminal arranged as described above is preliminarily formed as an integral article. In the assembling process, a cathode layer of a capacitor element and the inside connecting portion are assembled together so as to be adhered and conducted to each other.

Abstract: In order to prevent an incorporated fuse in a solid electrolyte capacitor from being disconnected by mechanical stress after the attachment thereof and to maximize the capacity of the fuse-incorporated capacitor element by reducing the space for attachment of the fuse; a solid electrolyte capacitor equipped with an opening mechanism is structured in a manner such that a fuse connecting portion is constructed by a three layered structure in which an insulator is sandwiched between an anode terminal and a metal piece connected to an anode lead terminal, and a fuse is disposed in a cross-linking manner between the metal piece and the anode lead terminal. With this arrangement, according to the present inveniton, it is possible to prevent the fuse from being broken or disconnected from the connecting portions by mechanical impacts after connection of the incorporated fuse.

Abstract: A fused solid electrolytic capacitor comprises a cathode part formed by applying a first external conductive layer on the solid electrolyric capacitor element, connecting a fuse wire to the first external conductive layer, applying, in turn, an insulating resin layer and a second external conductive layer onto the solid electrolytic capacitor element so that an electrical bridge is formed between the first and second external conductive layers of the solid electrolytic capacitor through the fuse wire which is connected to the first external conductive layer and then electrically connecting the second external conductive layer and the external cathode terminal. According to such a capacitor structure, the fuse wire would not be broken due to, for instance, vibration, the reliability of connection of the fuse wire and yield of the capacitor are markedly improved since the fuse wire is firmly fixed.

Abstract: A fuse-incorporated, chip-type solid electrolytic capacitor comprises an element which is composed of an anode body and a dielectric oxide film, a semiconductor layer and a cathode layer sequentially formed on the body. The body is made of a valve metal and carries an anode lead implanted therein. The capacitor also has an insulating resin layer applied to the outer peripheral surface of the element, said outer peripheral surface including an anode-lead-implanted surface and another surface located on the side opposite to the implanted surface, an anode terminal formed on the resin layer applied on the implanted surface, a cathode terminal formed on the resin layer applied on the opposite surface, and a fuse electrically connecting the cathode layer and the cathode terminal.

Abstract: A plastic film having a resin coating is used in mechanically securing the cathode of a solid electrolyte capacitor to a paddle of a leadframe while electrically insulating the cathode from the paddle.