Significant Electrical Connection Means (e.g., Terminals Or Leads) Patents (Class 361/538)
  • Patent number: 11177203
    Abstract: In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first conductive clip, where the first terminal of the inductor can be coupled with a contact pad of the first conductive clip. The second terminal of the inductor can be electrically coupled with the leadframe via a second conductive clip, where the second terminal of the inductor can be coupled with a contact pad of the second conductive clip. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: November 16, 2021
    Assignee: FAIRCHILD SEMICONDUCTOR CORPORATION
    Inventors: Jerome Teysseyre, Romel Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian Almagro, Maria Cristina Estacio
  • Patent number: 10993341
    Abstract: An electronic device according to an embodiment may include a housing, which includes a front structure and a rear structure attached to each other, and a touch screen display. The front structure of the housing may include a first plate facing a first direction and a side plate extending from the first plate. The first plate may have a first thickness. The side plate may have a second thickness larger than the first thickness. The side plate may include a first surface facing a peripheral portion of the rear structure. The rear structure may include a second plate facing a second direction opposite the first direction and a second surface facing the first surface. The first surface may face a third direction. The second surface may face a fourth direction. The third and fourth directions may be configured to differ from the first and second directions, respectively. The touch screen display may have at least a part exposed through at least a part of the first plate. Other various embodiments may be possible.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: April 27, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Do-Hyung Ha, Seong-Hoon Kim, Min-Sung Lee, Hyung-Sup Byeon, Dong-Hyun Yeom, Min-Woo Yoo, Hyun-Ju Hong
  • Patent number: 9129749
    Abstract: An example includes a capacitor case sealed to retain electrolyte, at least one anode disposed in the capacitor case, the at least one anode comprising a sintered portion disposed on a substrate, an anode conductor coupled to the substrate in electrical communication with the sintered portion, the anode conductor sealingly extending through the capacitor case to an anode terminal disposed on the exterior of the capacitor case with the anode terminal in electrical communication with the sintered portion, a cathode disposed in the capacitor case, a separator disposed between the cathode and the anode and a cathode terminal disposed on an exterior of the capacitor case and in electrical communication with the cathode, with the anode terminal and the cathode terminal electrically isolated from one another.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: September 8, 2015
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Gregory J. Sherwood, Michael J. Root, Peter Jay Kuhn, Mary M. Byron, Eric Stemen
  • Patent number: 9123470
    Abstract: An example includes a capacitor case sealed to retain electrolyte, at least one anode disposed in the capacitor case, the at least one anode comprising a sintered portion disposed on a substrate, an anode conductor coupled to the substrate in electrical communication with the sintered portion, the anode conductor sealingly extending through the capacitor case to an anode terminal disposed on the exterior of the capacitor case with the anode terminal in electrical communication with the sintered portion, a second electrode disposed in the capacitor case, a separator disposed between the second electrode and the anode and a second electrode terminal disposed on an exterior of the capacitor case and in electrical communication with the second electrode, with the anode terminal and the second electrode terminal electrically isolated from one another.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: September 1, 2015
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Gregory J. Sherwood, Michael J. Root, Eric Stemen
  • Patent number: 9007743
    Abstract: Provided is a solid electrolytic capacitor that is excellent in productivity, has improved volumetric efficiency aiming for capacity increase, a stable fillet shape when mounted, and has excellent ESL characteristics. Included is a capacitor stack element composed of a stack of capacitor elements. The capacitor element includes one anode part of an anode body made of linear, foil-like, or plate-like valve metal and a cathode part composed of dielectric, solid electrolyte, graphite, and silver paste layers, which are sequentially formed to another surface of the anode body separated by insulating resin. A fillet formation part with a recessed part is provided to an end surface of anode and cathode terminals of a mounting electrode side of a first direction end surface of the electrode substrate to which the capacitor stack element is mounted. Further, the anode and cathode terminals for element connection reach the end surface of the first direction.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: April 14, 2015
    Assignee: Nec Tokin Corporation
    Inventors: Akihiro Kawai, Kenji Araki
  • Patent number: 8848341
    Abstract: One example includes a capacitor case sealed to retain electrolyte, electrolyte disposed in the capacitor case, a capacitor electrode disposed in the capacitor case, an electronic component mounted to the capacitor electrode and disposed in the capacitor case, the electronic component including two contacts, with a first contact mounted onto the capacitor electrode and with a second contact mounted onto a terminal disposed on an exterior of the capacitor case and sealingly extending through the capacitor case, the first and second contacts electrically isolated from one another, a additional capacitor electrode disposed in the capacitor case, a separator disposed between the capacitor electrode and the additional capacitor electrode and a additional terminal disposed on the exterior of the capacitor case and in electrical communication with the additional capacitor electrode, with the terminal and the additional terminal electrically isolated from one another.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: September 30, 2014
    Assignee: Cardiac Pacemakers, Inc.
    Inventor: Gregory J. Sherwood
  • Patent number: 8787003
    Abstract: According to one embodiment of a capacitor module, the capacitor module includes a substrate having a metallization on a first side of the substrate, a plurality of connectors electrically coupled to the metallization and a plurality of capacitors disposed on the metallization. The plurality of capacitors includes a first set of capacitors electrically connected in parallel between a first set of the connectors and a second set of the connectors. The capacitor module further includes a housing enclosing the plurality of capacitors within the capacitor module.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: July 22, 2014
    Assignee: Infineon Technologies AG
    Inventors: Daniel Domes, Reinhold Bayerer
  • Patent number: 8773844
    Abstract: A decoupling device including a lead frame and at least one capacitor unit assembly is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions located at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor unit assembly includes multiple capacitor elements. The multiple capacitor elements of the capacitor unit assembly is connected in parallel, arrayed on the same plane and disposed on the lead frame. Each capacitor element has a cathode portion and an anode portion opposite to each other. The cathode portion of the capacitor element is electrically connected with the cathode terminal portion. The anode portion of the capacitor element is electrically connected with the anode terminal portion. When multiple capacitor unit assemblies exists, the capacitor unit assemblies are arrayed in a stacked way.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: July 8, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Liang Cheng, Yi-Hsiu Pan, Yu-Ting Cheng, Li-Duan Tsai
  • Patent number: 8760840
    Abstract: A lead 3 of an electrochemical device includes a lead body 3A containing Al, and a bent metallic thin film 3a provided to a tip part of the lead body 3A. The metallic thin film 3a includes a thin film body 3a1 containing Ni, and a plating layer 3a2 containing Sn and covering at least an outer surface of the bent thin film body 3a1. A specific area of an inner surface of the bent thin film body 3a1 and a surface of the lead body 3A are welded in a predetermined area without the plating layer 3a2 being disposed there between.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: June 24, 2014
    Assignee: TDK Corporation
    Inventors: Hiroaki Hasegawa, Hidetake Itoh, Yoshihiko Ohashi, Kazuo Katai, Yosuke Miyaki
  • Patent number: 8748020
    Abstract: An energy storage device includes an electrode unit in which a cathode having a cathode lead, an anode having an anode lead, and a separator located between the cathode and the anode to separate the cathode and the anode from each other are rolled together; a housing receiving the electrode unit; an electrolyte filled in the housing; an inner terminal arranged in the housing to face the electrode unit; and an outer terminal connected to the inner terminal. A groove is formed in a side of the inner terminal, and a side protrusion is formed on an inner wall of the housing at a location corresponding to the groove.
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: June 10, 2014
    Assignee: LS Mtron, Ltd
    Inventors: Ha-Young Lee, Jin-A Kang, Jun-Ho Kim, Sang-Hyun Bae
  • Patent number: 8693167
    Abstract: An electronic component includes a lead wire, a functional element, and an outer housing. The lead wire includes a leader electrode made of metal containing aluminum, a metal wire containing tin, and a welded section formed by welding a first end of the metal wire to a first end of the leader electrode. A second end of the leader electrode is connected to the functional element. The outer housing seals the functional element therein such that a second end of the metal wire is led out therefrom. The lead wire further includes a resin film coating the welded section at least at a portion not covered with the outer housing. Resin material for the resin film has pierce strength of 0.05 MPa/?m per unit thickness or greater and an elastic coefficient of 10 GPa or less.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: April 8, 2014
    Assignee: Panasonic Corporation
    Inventors: Yasuhiro Yano, Douyuu Hachisu, Junji Yamane
  • Patent number: 8576544
    Abstract: A capacitor assembly that includes a conductive polymer electrolytic capacitor that is enclosed and hermetically sealed within a ceramic housing in the presence of an inert gas is provided. Without intending to be limited by theory, the present inventors believe that the ceramic housing is capable of limiting the amount of oxygen and moisture supplied to the conductive polymer of the capacitor. In this manner, the conductive polymer is less likely to oxidize in high temperature environments, thus increasing the thermal stability of the capacitor assembly.
    Type: Grant
    Filed: January 9, 2012
    Date of Patent: November 5, 2013
    Assignee: AVX Corporation
    Inventors: Bharat Rawal, Gang Ning, Brady Jones, Zebbie Lynn Sebald, Stanislav Zednicek, Zdenek Sita
  • Patent number: 8514549
    Abstract: A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: August 20, 2013
    Assignee: Oracle America, Inc.
    Inventors: David Hockanson, Istvan Novak, Leesa Noujeim
  • Patent number: 8432664
    Abstract: A cylindrical sealing member for a capacitor has a circular first plane and a circular second plane placed oppositely to the first plane, and is provided with two lead holes that penetrate the first and second planes. This sealing member for a capacitor contains butyl rubber, and inorganic material oblate particles having flat surfaces. The sealing member includes a first portion, and a second portion in the vicinity of an outer circumference of the sealing member as well as in the vicinity of the two lead holes. In the first portion, the inorganic material oblate particles are scattered such that flat surfaces thereof are oriented substantially in parallel with the first plane. In the second portion, the inorganic material oblate particles are scattered such that the flat surfaces thereof are oriented substantially perpendicularly to the first plane.
    Type: Grant
    Filed: August 8, 2011
    Date of Patent: April 30, 2013
    Assignee: Panasonic Corporation
    Inventors: Kiyoshi Hirota, Yuichiro Tsubaki, Katsufumi Shimanaka
  • Patent number: 8351187
    Abstract: A solid capacitor according to an aspect of the invention may include: a capacitor device having an anode lead wire extending from one side thereof; a case molding the capacitor device and exposing the anode lead wire to the outside thereof; cathode and anode lead frames exposed on the outside the case and electrically connected to the capacitor device; a reinforcement interposed in the case between the anode lead wire and the anode lead frame so as to support the capacitor device and electrically connecting the anode lead wire and the anode lead frame; and a resin shielding part applied to the exposed portion of the anode lead wire to prevent the infiltration of foreign substances through the anode lead wire.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: January 8, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Kwang Kim, Kwan Hyeong Kim, Chong Hoon Pak
  • Patent number: 8351188
    Abstract: A first lead frame has a cathode connection portion connected via a first electrically conductive member to a cathode portion, and a first connection portion having a first connection surface, and is at least partially, externally exposed. A second lead frame has a supporting connection portion connected via a second electrically conductive member to the cathode portion, and a second connection portion having a second connection surface facing the first connection surface. A third electrically conductive member interconnects the first and second connection portions. A solid electrolytic capacitor that can achieve low cost and high production yield can thus be provided.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: January 8, 2013
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Akinari Kurokawa, Yoshikazu Hirata, Takuji Yoshitomi
  • Patent number: 8310817
    Abstract: In a solid electrolytic capacitor, a path of an electric current flowing from a lower layer to an upper layer of a laminate in cathode portions of respective capacitor elements connected through an electroconductive adhesive layer is opposite to paths of electric currents flowing from a canopy through joints to cathode terminals, thereby achieving reduction in ESL by mutual inductance effect in a simple structure. Since the solid electrolytic capacitor has the structure in which the laminate is surrounded by the canopy and joints, sufficient pressure resistance is ensured for the capacitor elements during resin injection. For this reason, a resin mold to cover the laminate can be formed by transfer molding, which ensures excellent heat resistance and moisture resistance.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: November 13, 2012
    Assignee: TDK Corporation
    Inventors: Masaaki Kobayashi, Hironori Sato
  • Patent number: 8289678
    Abstract: The present invention relates to a solid electrolytic capacitor and a method for preparing the same. There is provided a solid electrolytic capacitor in accordance with the invention including a capacitor element with anode polarity therein and a cathode layer formed on an outer surface thereof; an anode wire with an end portion protruding on one surface of the capacitor element; a cathode lead layer formed on the other surface the capacitor element; a molding part surrounding the capacitor element to expose the protruding end portion of the anode wire and an end portion of the cathode lead layer; and an anode terminal and a cathode terminal formed by a plating layer at both sides of the molding part. It is possible to save preparation cost by simplifying a structure and a preparation process of the solid electrolytic capacitor.
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: October 16, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd
    Inventors: Jae Kwang Kim, Kwan Hyeong Kim, Chong Hoon Pak
  • Patent number: 8254085
    Abstract: A stacked electric double layer capacitor includes a capacitor unit, an aluminum laminate film, and a current collector terminal. The capacitor unit includes a pressure plate, and a current collector plate arranged inside the pressure plate. The aluminum laminate film wraps the capacitor unit, and includes a periphery that defines and surrounds a hole at a side surface of the capacitor unit. The current collector terminal is L-shaped, and includes a contact portion in contact with the current collector plate, and a terminal portion arranged perpendicular to the contact portion, wherein at least a part of the terminal portion is exposed through the hole of the aluminum laminate film, and connected to an external circuit, and the terminal portion is heat-welded to the aluminum laminate film.
    Type: Grant
    Filed: August 26, 2008
    Date of Patent: August 28, 2012
    Assignee: Meidensha Corporation
    Inventor: Masahiro Mishima
  • Patent number: 8248759
    Abstract: A capacitor has a capacitor element, an open-topped case on which terminals joined to a pair of electrode lead sections of the capacitor element are disposed facing each other, and a cover combined with the open surface of the case. Each terminal has a pair of intermediate conductive sections and a pair of terminal sections. The joint has a joint surface to which one of the electrode lead sections of the capacitor element is joined. The intermediate conductive sections are L-shaped, and are extendedly disposed in directions opposite to each other from both ends of the joint. The terminal sections are disposed further extendedly from the intermediate conductive sections and placed symmetrically about the joint.
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: August 21, 2012
    Assignee: Panasonic Corporation
    Inventors: Masayuki Sato, Yukiyasu Sugihara, Yasuyuki Ito, Nario Niibo
  • Patent number: 8213160
    Abstract: A solid electrolytic capacitor including a solid electrolytic capacitor component comprises a porous anode body 2 composed of valve metal having a anode lead 1 protruding therefrom, a anode oxide film, a solid electrolyte layer 4, a graphite layer 5, a silver paste layer 6, a resist layer 3 separating the anode lead 1 used as a anode portion and the porous anode body 2 used as a cathode portion, and a anode lead element 7 connected to the anode lead 1, the anode oxide film, solid electrolyte layer 4, graphite layer 5, silver paste layer 6 being successively formed on the surface of the porous anode body 2, wherein the solid electrolytic capacitor component is bonded on a mounting substrate 21 having a anode terminal 21a, a cathode terminal 21b, and an insulating portion 21c therebetween with a precuring insulating adhesive 9 formed on the insulating portion 21c of the mounting substrate 21 and precuring conductive adhesives 8 formed on the anode terminal and cathode terminal, and sealed with exterior resin 10
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: July 3, 2012
    Assignee: NEC Tokin Corporation
    Inventors: Takeshi Saito, Yuji Yoshida, Takeo Kasuga, Koji Sakata, Katsuhiro Yoshida, Masanori Takahashi
  • Patent number: 8213161
    Abstract: A solid electrolytic capacitor according to the present invention comprises an anode body, an anode lead in contact with an outer surface of the anode body, a dielectric layer formed on a surface of the anode lead, and a cathode layer formed on a surface of the dielectric layer. The anode lead is provided with a plurality of openings passing through the anode lead. Another solid electrolytic capacitor according to the present invention comprises an anode body, an anode lead in contact with an outer surface of the anode body, a dielectric layer formed on a surface of the anode lead, and a cathode layer formed on a surface of the dielectric layer. The anode lead is provided with a cutout on an outer circumference edge of the anode lead.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: July 3, 2012
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Koichi Nishimura, Koji Endo, Takashi Umemoto, Hiroshi Nonoue
  • Patent number: 8184429
    Abstract: A capacitor is improved in reliability by suppressing the formation of burrs or protrusions at a joint portion between an aluminum wire round rod and an external terminal in a lead wire used for a capacitor. A metal cap having a higher melting point than aluminum is fitted to an end portion of the aluminum wire round rod and the metal cap is heated, thereby joining the aluminum wire round rod to the metal cap. Thereafter, the external terminal and the metal cap are welded to each other. The metal cap has a curved surface in which an outer periphery is decreased from an opening toward an end portion opposite to the opining. The opening is provided with a stepped portion, so that the sealing degree is increased when the lead wire is inserted into a hole of the sealing member.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: May 22, 2012
    Assignee: Panasonic Corporation
    Inventors: Junji Yamane, Hiroshi Kurimoto, Kohei Harazono, Doyuu Hachisu, Takanao Saito, Hiroyuki Saikawa
  • Patent number: 8179665
    Abstract: A solid electrolytic capacitor includes a capacitor element surrounded with a cathode layer, an anode wire inserted into the capacitor element, a cathode terminal electrically connected to the capacitor element by being positioned at one side below the capacitor element, an anode terminal defining a space between the capacitor element and a top surface thereof and is electrically connected to the anode wire by being positioned at the other side below the capacitor element, a conductive paste coated being thicker toward an inside of the capacitor element, thereby electrically connecting the capacitor element to the cathode terminal and broadening the space, and a fixing film closely coupled to a bottom surface of the conductive paste. A molding unit wraps the capacitor element and the fixing film in a state of closely adhering the conductive paste and the cathode terminal to top and bottom surfaces of the fixing film, respectively.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: May 15, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Kwang Kim, Kwan Hyeong Kim, Chong Hoon Pak
  • Publication number: 20120113567
    Abstract: A capacitor assembly that includes a conductive polymer electrolytic capacitor that is enclosed and hermetically sealed within a ceramic housing in the presence of an inert gas is provided. Without intending to be limited by theory, the present inventors believe that the ceramic housing is capable of limiting the amount of oxygen and moisture supplied to the conductive polymer of the capacitor. In this manner, the conductive polymer is less likely to oxidize in high temperature environments, thus increasing the thermal stability of the capacitor assembly.
    Type: Application
    Filed: January 9, 2012
    Publication date: May 10, 2012
    Applicant: AVX CORPORATION
    Inventors: Bharat Rawal, Gang Ning, Brady Jones, Zebbie Lynn Sebald, Stanislav Zednicek, Zdenek Sita
  • Patent number: 8169774
    Abstract: A first solid electrolytic capacitor according to the present invention includes a capacitor element, an exterior resin covering the capacitor element, an anode terminal, a cathode terminal, and a metal wire. The capacitor element includes an anode body from which an anode lead is extracted, a dielectric layer formed on a surface of the anode body, and a cathode layer formed on the dielectric layer. The anode terminal and the cathode terminal are electrically connected to the anode lead and the cathode layer, respectively, and extracted to an outer surface of the exterior resin, the anode terminal including an opposing part opposed to the anode lead in the exterior resin. The metal wire includes both ends connected to the opposing part and a curving part, and is provided to the anode lead, and at least a part of the curving part is electrically connected to the anode lead.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: May 1, 2012
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Nobuhiko Hayashi, Takashi Umemoto, Hiroshi Nonoue
  • Patent number: 8134827
    Abstract: An aspect of the present invention provides a solid electrolytic capacitor that comprises: an anode mainly formed of a valve metal or an alloy thereof; an anode lead terminal a part of which is buried in a side surface of the anode; a dielectric layer formed on surfaces of the anode and mainly formed of an oxide; a conducting polymer layer formed on the dielectric layer; a cathode layer formed on the conducting polymer layer on an outer circumferential surface of the anode, the cathode layer comprising: a carbon layer; and a silver paste layer formed on the carbon layer; a thermal expansion layer provided on the side surface of the anode and on a part of the outer circumferential surface continuing from the side surface; and a rein outer package provided to cover the anode, dielectric layer, cathode layer, and thermal expansion layer, wherein a thermal expansion coefficient in a temperature range lower than a glass transition temperature of the thermal expansion layer is larger than that of each of the silver
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: March 13, 2012
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Takashi Umemoto, Hiroshi Nonoue
  • Patent number: 8130486
    Abstract: An electronic component includes a functional element, first and second collectors joined to the functional element, and an outer package integrally covering the functional element and the first and second collectors. The functional element has first and second end surfaces having circular shapes and a side surface having a cylindrical shape extending along a center axis. The element includes first and second electrode foils rolled about the center axis and exposed from the first and second surfaces, respectively. The outer package has first and second surfaces parallel to the first and second end surfaces of the functional element, and has first to fourth corners as seen from a direction of the center axis. The first corner is adjacent to the second corner. The first and second terminals are arranged at the first and second corners of the outer package, respectively. This electronic component can have a small size and a small height while reducing its equivalent series resistance.
    Type: Grant
    Filed: July 7, 2009
    Date of Patent: March 6, 2012
    Assignee: Panasonic Corporation
    Inventors: Kazuya Kawahara, Yuuki Murata, Takashi Oda
  • Patent number: 8094434
    Abstract: A capacitor assembly that includes a conductive polymer electrolytic capacitor that is enclosed and hermetically sealed within a ceramic housing in the presence of an inert gas is provided. Without intending to be limited by theory, the present inventors believe that the ceramic housing is capable of limiting the amount of oxygen and moisture supplied to the conductive polymer of the capacitor. In this manner, the conductive polymer is less likely to oxidize in high temperature environments, thus increasing the thermal stability of the capacitor assembly.
    Type: Grant
    Filed: April 1, 2008
    Date of Patent: January 10, 2012
    Assignee: AVX Corporation
    Inventors: Bharat Rawal, Gang Ning, Brady Jones, Zebbie Lynn Sebald, Stanislav Zednicek, Zdenek Sita
  • Patent number: 8040662
    Abstract: A solid electrolytic capacitor includes a cathode terminal structured such that the cathode terminal's flat portion connected to a cathode portion has a divided structure made up of a first flat portion and a second flat portion spaced from each other by a predetermined distance to form a slit. Therefore, even if the cathode terminal is caused to be peeled off from the cathode portion, the peeling can be restricted to only one of the first and second flat portions, so that the peeled-off area can be prevented from increasing. Accordingly, the reliability of the state of fixture of the cathode terminal to the cathode portion is improved, so that the solid electrolytic capacitor can be provided having the structure with which the reliability of the solid electrolytic capacitor can be improved.
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: October 18, 2011
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Akinari Kurokawa, Yoshikazu Hirata
  • Patent number: 8028653
    Abstract: A filament post used in plasma-enhanced chemical vapor deposition has an outer shell and an inner post. An electrical potential is applied only to the inner post to ensure that there is no impact on the plasma density and the carbon film properties. The inner post and the outer shell are electrically insulated by ceramic insulators, such that no electrical potential is applied to outer shell. The stress generated in the carbon film is directly related to the electrical potential of the surface to which the film is deposited. The carbon film deposited on the outer shell of the post is not highly stressed, which significantly reduces film delamination from the filament post surfaces.
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: October 4, 2011
    Assignee: Hitachi Global Storage Technologies Netherlands, B.V.
    Inventors: Eric Hwang, Jinliu Wang, Richard Longstreth White
  • Patent number: 7974077
    Abstract: A solid electrolytic capacitor includes a capacitor element, an anode lead frame, a cathode lead frame, and a mold resin portion. The anode lead frame includes an anode terminal portion and a rising portion. The rising portion is formed integral with the anode terminal portion, and extends from the anode terminal portion through the mold resin portion toward the anode portion, and is connected to the anode portion. At the rising portion, a catching recess and a holding portion are formed and, in addition, a first slit is formed downward from the catching recess. Thus, a solid electrolytic capacitor allowing highly accurate and reliable attachment of the capacitor element to the lead frame without using any additional member is provided.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: July 5, 2011
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Keiko Matsuoka, Shoji Umeda
  • Patent number: 7969713
    Abstract: A solid electrolytic capacitor includes a capacitor element, an anode lead frame, a cathode lead frame, and a mold resin portion. The anode lead frame includes an anode terminal portion and a rising portion. The rising portion is formed integral with the anode terminal portion, extends from the anode terminal portion through the mold resin and is connected to an anode portion. At the rising portion, a catching portion receiving and supporting the anode portion from below and a hook portion surrounding and holding an outer circumferential surface of the anode portion, with the anode portion received in the catching portion, are formed. Therefore, a solid electrolytic capacitor can be provided, which allows highly accurate attachment of the capacitor element on the lead frame without applying any additional member and reduces equivalent series resistance.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: June 28, 2011
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Keiko Matsuoka, Shoji Umeda
  • Patent number: 7969710
    Abstract: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one side is inserted into the capacitor element and the other side projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; an anode lead frame fixed to the side of the capacitor element, where the anode wire projects outward, and having an insertion portion into which the projecting end of the anode wire is inserted; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire, the outer surface of the anode lead frame, and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire and the anode lead frame; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of the
    Type: Grant
    Filed: January 8, 2008
    Date of Patent: June 28, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hee Sung Choi, Seoung Jae Lee, Yeoung Jin Lee, Sung Han Won, Ha Yong Jung, Hyun Ho Shin, Jung Tae Park, Jae Youn Jeong
  • Patent number: 7969712
    Abstract: A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.
    Type: Grant
    Filed: April 19, 2007
    Date of Patent: June 28, 2011
    Assignee: Oracle America, Inc.
    Inventors: Leesa Noujeim, David Hockanson, Istvan Novak
  • Patent number: 7929274
    Abstract: The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.
    Type: Grant
    Filed: April 3, 2008
    Date of Patent: April 19, 2011
    Assignee: Kemet Electronics Corporation
    Inventors: Erik Reed, David Jacobs, Randolph S. Hahn
  • Patent number: 7916457
    Abstract: A multi-layered solid electrolytic capacitor including capacitor elements, each comprising an anode body having an anode portion and a cathode portion having a dielectric oxide film and a cathode layer formed in succession on a surface of the anode body, the capacitor elements being stacked on top of one another and the anode portions being weld-secured to anode mounting surfaces of anode mounting parts provided in an anode terminal. The multi-layered solid electrolytic in which the anode mounting parts are provided such that the anode mounting parts are disposed parallel to each other, and adjacent anode mounting parts are joined to each other by a joint part.
    Type: Grant
    Filed: December 26, 2005
    Date of Patent: March 29, 2011
    Assignees: Sanyo Electric Co., Ltd., Saga Sanyo Industries Co., Ltd.
    Inventors: Kazutoyo Horio, Shinji Arimori
  • Patent number: 7796397
    Abstract: Provided is an electronic components assembly capable of effectively dealing with unwanted charge accumulated in a capacitor even when general-purpose components are used. An assembly 10 includes an electrolytic capacitor 1, a coil lead 4, and a circuit mounting board 5. The electrolytic capacitor 1 includes a main body 1a, an anode lead 2, and a cathode lead 3. The coil lead 4 is wrapped around the main body 1a. The circuit mounting board 5 has the electrolytic capacitor 1 and the coil lead 4 mounted thereon. The coil lead 4 is connected to a ground of the circuit mounting board 5.
    Type: Grant
    Filed: August 22, 2007
    Date of Patent: September 14, 2010
    Assignee: Panasonic Corporation
    Inventors: Hideaki Yamauchi, Masayuki Asai, Shuusaku Yamamoto, Takashi Sakaguchi, Takashi Yamamoto
  • Publication number: 20100226072
    Abstract: A solid capacitor according to an aspect of the invention may include: a capacitor device having an anode lead wire extending from one side thereof; a case molding the capacitor device and exposing the anode lead wire to the outside thereof; cathode and anode lead frames exposed on the outside the case and electrically connected to the capacitor device; a reinforcement interposed in the case between the anode lead wire and the anode lead frame so as to support the capacitor device and electrically connecting the anode lead wire and the anode lead frame; and a resin shielding part applied to the exposed portion of the anode lead wire to prevent the infiltration of foreign substances through the anode lead wire.
    Type: Application
    Filed: August 25, 2009
    Publication date: September 9, 2010
    Inventors: Jae Kwang KIM, Kwan Hyeong KIM, Chong Hoon PAK
  • Patent number: 7787235
    Abstract: Provided is a solid electrolytic capacitor with a high capacity occurrence rate and a high capacity and a method for manufacturing the solid electrolytic capacitor. An anode body is formed on a periphery of an anode lead having a hollow structure. The anode body has a porous body of a valve metal or an alloy of the metal as its main component. The hollow structure allows an inside and an outside of the anode body to connect with each other. A dielectric layer is formed on a surface of the anode body, and a conducting polymer layer is formed on a surface of the dielectric layer. When the conducting polymer layer is formed, the inside of the anode body is depressurized by suction from the outside of the anode body through the hollow structure of the anode lead.
    Type: Grant
    Filed: April 9, 2008
    Date of Patent: August 31, 2010
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Masayuki Fujita, Takashi Umemoto, Hiroshi Nonoue
  • Patent number: 7736398
    Abstract: A method is described for manufacturing a conductive polymer electrolytic capacitor. The method includes a step of aging a capacitor element including an electrolyte containing a conductive polymer and an ionic liquid by applying an aging voltage y (V) to the capacitor element to satisfy the following formula (1) or the following formula (2). In the following formulae (1) and (2), x represents a forming voltage for a valve metal. An electrolytic capacitor having a high withstand voltage is implemented by this method. 0.5x?y?x(0<x?48)??(1) 24?y?x(48<x)??(2).
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: June 15, 2010
    Assignee: Kaneka Corporation
    Inventors: Kazuyuki Tateishi, Mutsuaki Murakami, Hiroyuki Furutani
  • Patent number: 7733630
    Abstract: A plurality of capacitor cells (10) are layered to form a cell group. On the top of each capacitor cell (10), a pair of electrode plates (10b) is formed to protrude upward. The adjacent electrode plates (10b) are connected to each other. A connection piece (20) protruding upward is attached to each of the electrode plates (10b). The connection piece (20) is connected to a circuit substrate (30). Thus, it is possible to effectively make a connection between the cell group of the capacitor cells (10) and the circuit substrate (30).
    Type: Grant
    Filed: March 24, 2006
    Date of Patent: June 8, 2010
    Assignees: Japan Radio Co., Ltd., Nisshinbo Industries, Inc.
    Inventors: Toshiyuki Maeda, Masanori Goudo, Katsutoshi Sugi, Hideshige Nakagawa, Satoshi Kubota
  • Patent number: 7722683
    Abstract: One embodiment of the present subject matter includes a capacitor, comprising a first cupped shell having a first opening, and a second cupped shell having a second opening, wherein the first opening and the second opening are adapted to sealably mate to form a closed shell defining a volume therein. In the embodiment, the closed shell is adapted for retaining electrolyte. A plurality of capacitor layers in a substantially flat arrangement are disposed within the volume, along with electrolyte, in the present embodiment. The present closed shell includes one or more ports for electrical connections.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: May 25, 2010
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Brian Doffing, James A. Taller, Gregory J. Sherwood, Jason A. Shiroff
  • Patent number: 7706133
    Abstract: A solid electrolytic capacitor includes a capacitor element, an anode-side lead terminal connected to an anode of the capacitor element, a cathode-side lead terminal connected to a cathode of the capacitor element, and an armor covering the capacitor element and having an electrical insulating property. The armor has two principal faces opposed to each other, and two side faces connecting the two principal faces and opposed to each other. The anode-side lead terminal has at least a first terminal portion exposed in one of the principal faces. The cathode-side lead terminal has at least a first terminal portion exposed in the one of the principal faces, and a second terminal portion exposed in the one of the principal faces and extending from the first terminal portion so as to be exposed in either of the two side faces. The solid electrolytic capacitor satisfies the following relation: W/G?1.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: April 27, 2010
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Masaaki Kobayashi
  • Patent number: 7688571
    Abstract: A solid electrolytic capacitor includes a base substrate, a capacitor element, a metal cap, an extractor terminal and an insulating member. The base substrate has electrical conductivity. The capacitor element is provided on the base substrate. The metal cap is coupled to the base substrate and covers the capacitor element. The extractor terminal passes through the base substrate, is coupled to an anode of the capacitor element, and includes a first conductive member acting as a core member and a second conductive member covering the first conductive member. The insulating member is provided between the base substrate and the extractor terminal. Electrical conductivity of the first conductive member is higher than that of the second conductive member. Thermal expansion coefficient of the second conductive member is less than that of the insulating member.
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: March 30, 2010
    Assignee: Nichicon Corporation
    Inventors: Hidetoshi Ishizuka, Toshiyuki Mizutani, Minoru Funahashi, Tadayuki Echigo
  • Patent number: 7683269
    Abstract: A terminal electrode body on a substrate is exposed relative to a resin layer, protruding out beyond the side of the resin layer. That is, the terminal electrode body is not covered by the resin layer. The electronic element is covered by an insulating layer and the terminal electrode body and the electronic element are electrically connected. Hence, an electric signal applied to the terminal electrode body can be transmitted to the electronic element. A cover layer covers the terminal electrode body and the boundary between the terminal electrode body and the resin layer.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: March 23, 2010
    Assignee: TDK Corporation
    Inventors: Toshiyuki Yoshizawa, Masaomi Ishikura, Masahiro Miyazaki, Akira Furuya, Nobuyuki Okuzawa
  • Patent number: 7656647
    Abstract: Surface mount electrolytic capacitors are provided with anode and cathode terminations having respective first termination portions provided on the bottom surface of a molded package in a generally coplanar configuration. A second cathode termination portion is bent in a generally perpendicular fashion to the first cathode termination portion and may then be adhered to the external cathode layer of a capacitor body. A second anode termination portion is bent in a generally perpendicular fashion to the first anode termination portion and may then be welded to an anode wire connected to and extending from the capacitor body. An insulation pad may be provided between the first anode termination portion and the capacitor body to prevent device shorting. A planar termination frame may be provided to form the electrolytic capacitors of the present subject matter.
    Type: Grant
    Filed: September 17, 2007
    Date of Patent: February 2, 2010
    Assignee: AVX Corporation
    Inventors: Douglas M. Edson, Glenn M. Vaillancourt, Walter Koda, Scott A. McCarthy, James A. Fife
  • Patent number: 7633740
    Abstract: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one end is inserted into the capacitor element and the other end projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of the conductive bumps.
    Type: Grant
    Filed: January 8, 2008
    Date of Patent: December 15, 2009
    Assignee: Samsung Electro-Mechanics Co. Ltd.
    Inventors: Hee Sung Choi, Seoung Jae Lee, Yeoung Jin Lee, Sung Han Won, Ha Yong Jung, Hyun Ho Shin, Jung Tae Park, Jae Youn Jeong
  • Patent number: 7619874
    Abstract: An apparatus comprising a capacitor stack, including one or more substantially planar anode layers, and one or more substantially planar cathode layers. Additionally, the capacitor has a case having a first opening and a second opening, the first opening sized for passage of the capacitor stack, and a cover substantially conforming to the first opening and sealingly connected to the first opening. Also, the capacitor includes a plate substantially conforming to the second opening and sealingly connected to the second opening, the plate defining an aperture. Additionally, the capacitor includes a plug substantially conforming to the aperture in the plate, the plug sealingly connected to the plate. The capacitor stack is disposed in the case, and the terminal is in electrical connection with the case and at least one capacitor electrode.
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: November 17, 2009
    Assignee: Cardiac Pacemakers, Inc.
    Inventor: Brian L. Schmidt
  • Patent number: 7619876
    Abstract: A solid electrolytic capacitor includes a porous sintered body made of a valve-acting metal and embedded with part of an anode lead having a protruding portion, a solid electrolyte layer formed in contact with a dielectric layer formed in the porous sintered body, a mounting anode terminal member, a mounting cathode terminal member, and an insulating casing resin. The capacitor further includes a small piece of a metal frame made of a valve-acting metal. This small piece of the metal frame is formed integrally with the protruding portion of the anode lead by cutting, after the anodic oxidation, the metal frame to which the protruding portion of the anode lead is fixed by resistance welding. The small piece of the metal frame and the mounting anode terminal member are connected together by wire bonding so that the anode lead and the mounting anode terminal member are electrically connected together.
    Type: Grant
    Filed: June 17, 2008
    Date of Patent: November 17, 2009
    Assignee: NEC TOKIN Corporation
    Inventors: Kunihiko Shimizu, Takashi Mizukoshi, Koji Sakata