Abstract: A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly and a conductive assembly. The winding assembly includes a winding conductive positive foil and a winding conductive negative foil. The package assembly fully encloses the winding assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The package assembly includes a casing structure, a filling body and a bottom enclosing structure. The casing structure has an accommodating space for receiving the winding assembly. The filling body is filled in the accommodating space for surrounding the winding assembly. The bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space. The bottom enclosing structure is surrounded by the casing structure and tightly connected to the filling body.

Abstract: A solid electrolytic capacitor and method for forming a solid electrolytic capacitor with high temperature leakage stability is described. The solid electrolytic capacitor has improved leakage current and is especially well suited for high temperature environments such as down-hole applications.

Abstract: A capacitor is provided having an outer shell. A capacitor film member is disposed within the outer shell. A conductor member is disposed within the outer shell in thermal contact with the capacitor film member. A collet member is slidingly coupled to the conductor member.

Abstract: A capacitor element having an upper surface, a lower surface, a first end surface and a second end surface is coated with a cathode layer, except for the first end surface. Anode lead extends out from the first end surface. An anode terminal has a first portion located close to and beneath the lower surface of the capacitor element and has a second portion connected to the anode lead via an arcuate connector. A cathode terminal is disposed under the lower surface of the capacitor element, being spaced from the first portion of the anode terminal. A packaging resin covers the capacitor element, the anode terminal and the cathode terminal. A depression is formed in the anode terminal, which extends from a portion of the anode terminal facing the lower surface of the capacitor element to the inner edge of the anode terminal facing the cathode terminal.

Abstract: A method is described for manufacturing a conductive polymer electrolytic capacitor. The method includes a step of aging a capacitor element including an electrolyte containing a conductive polymer and an ionic liquid by applying an aging voltage y (V) to the capacitor element to satisfy the following formula (1) or the following formula (2). In the following formulae (1) and (2), x represents a forming voltage for a valve metal. An electrolytic capacitor having a high withstand voltage is implemented by this method. 0.5x?y?x(0<x?48)??(1) 24?y?x(48<x)??(2).

Abstract: One embodiment of the present subject matter includes a capacitor, comprising a first cupped shell having a first opening, and a second cupped shell having a second opening, wherein the first opening and the second opening are adapted to sealably mate to form a closed shell defining a volume therein. In the embodiment, the closed shell is adapted for retaining electrolyte. A plurality of capacitor layers in a substantially flat arrangement are disposed within the volume, along with electrolyte, in the present embodiment. The present closed shell includes one or more ports for electrical connections.

Abstract: A solid electrolytic capacitor constituted by forming a dielectric coating film, a solid state electrolyte layer, and cathode lead-out layer in order on the surface of an anode body including niobium or an alloy containing niobium as the main component to an end of which an anode lead member is implanted to construct a capacitor element, connecting the anode lead member with an anode terminal and connecting the cathode lead-out layer, at the same time, with a cathode terminal, and being covered and sealed by a sheath resin, in that the sheath resin is formed by injecting and filling liquid silicone resin and heat curing molding the same.

Abstract: A retention device (10, 10′) for an expansion card (30) mounted in a cage (70), includes an attaching member (12) attached in the cage and located above the expansion card, and a pressing member (14) slidably attached to the attaching member for pressing a top of the expansion card. The pressing member includes engaging means (28, 28′), and the attaching member includes an elastic catch (22, 22′) which can engage a selected part of the engaging means. The elastic catch includes a handle (26) for facilitating disengagement of the catch from the engaging means. A length of the pressing member protruding from the attaching member is adjustable such that the retention device can fit a variety of differently sized expansion cards.

Abstract: In the present invention, a capacitor element including a valve action metal, an oxide film layer formed on the surface of the valve action metal, and a solid electrolytic layer formed on the oxide film layer is provided with an organic compound having a boiling point of not lower than 150° C. and a melting point of not higher than 150° C., and the capacitor element including the organic compound is arranged inside a package. The oxide film is repaired with the organic compound as a solvent by an application of a dc voltage.

Abstract: The present invention relates to an electric capacitor and, more specifically, to its electrical terminals. One problem that occurs while mounting the capacitor provided with the standard terminals on a pc board, is that the capsule is positioned to close to it and thus leaving no space between said board and the capsule resulting in a big difficulty to clean the board after the electrical components that have been welded to it. This problem is especially critical since, after the welding stage, the pc board has to be washed with a cleaning solution that can be stuck on said terminals resulting in malfunction of the electrical circuit. The solution that is known so far is the use of steps assembled in the cover disc.

Abstract: A hoop metal lead frame (1) having, solid electrolytic capacitor elements (5) on its terminal sections (2) is provided with a crosspiece (3) bridging both sides in terms of the width direction disposed along the length direction in a region between the capacitor elements (5), one crosspiece for two capacitor elements (5). The metal lead frame (1) is placed on a molding die so that the region without having the crosspiece is locating at the sub runner (8), which has branched out from the main runner (7). The capacitor elements (5) are encapsulated with a molding resin injected through the sub runner (8). Since the molding resin is not covering the crosspiece (3), the main runner portion (7) and the sub runner portion (8) can be severed from the metal lead frame (1) without effecting unwanted stress on the solid electrolytic capacitors (10). The solid electrolytic capacitors (10) thus manufactured have a superior property in the tight hermetic sealing.

Abstract: A capacitor includes a pellet molded within a protective material and having a cathode termination surface at one end and an anode wire extending from the other end. The cathode termination surface is centered with respect to the longitudinal axis of the capacitor. The method includes centering the pellet body and a tear drop shaped conductive cathode element within a mold and molding a protective coating around them. After the molding is complete a portion of the tear drop shaped member is removed to create a cathode termination.

Abstract: A simple method of mass producing a plurality of solid electrolytic capacitor elopements can be performed to produce capacitors with reduced leakage current and excellent reliability. The method includes supplying a band metal, a first portion of which contains protrusions on which a dielectric layer, then a conductor layer are formed. A conductive polymer film is formed on the conductor layer by electrolytic polymerization starting from a conductive tape adhered on a second portion of the band metal. The conductive tape acts as a common positive electrode for polymerization and a plurality of electrodes connected independently to the protrusions as negative electrodes. Finally a plurality of capacitor elements are formed by laminating individual protrusions cut off from the band metal.

Abstract: A solid electrolytic capacitor is provided which includes a capacitor element having an anode and a cathode, a sheet member for mounting the capacitor element, and a protection package formed on the sheet member to enclose the capacitor element. The sheet member is provided with an anode terminal and a cathode terminal which are connected to the anode and the cathode, respectively.

Abstract: A solid electrolytic capacitor has a molded casing containing therein a capacitor element, a first lead member connected to its anode and a second lead member connected to its cathode through a fuse. The second lead member is designed such that a relatively large capacitor element can be contained inside the casing although it must also have a large enough hole to allow a portion of the casing to penetrate therethrough to fasten it to the casing.

Abstract: An encapsulated solid electrolytic capacitor has an anode lead terminal, a cathode lead terminal, a capacitor element and a mold which is made of a synthetic resin material and encapsulates the capacitor element entirely. The capacitor element has an anode bar protruding longitudinally from a main body and is disposed between the anode lead terminal and the cathode lead terminal with the main body being electrically connected to the cathode lead terminal. The tip of the anode bar is welded to the anode lead terminal. The anode lead terminal has integrally formed with it a raised part which is L-shaped as seen longitudinally and is capable of having the anode bar inserted under its middle part, preventing it from becoming bent when it is soldered.

Abstract: A hollow cylindrical resin case provided at a periphery thereof with an axial opening and a resin terminal plate, one of which has a concave coupling section and the other has a convex coupling section, are coupled together and then filler resin is injected between the capacitor element attached to the terminal plate and the resin case to provide a seal. One or both of the resin case and the resin terminal plate are made of thermoplastic resin, and a space is defined between the coupling sections. A dimension of the space and an inserting force applied to the coupling portions are set to appropriate values, thereby realizing a high quality capacitor free from leakage of filler resin.

Abstract: A circuit is provided which incorporates a solid electrolytic capacitor between a power source and a load. The capacitor comprises: a capacitor element including a chip body and an anode wire projecting from the chip body; an anode lead electrically connected to the anode wire; a cathode lead paired with the anode lead and electrically connected to the chip body; an auxiliary lead separate from the anode and cathode leads; a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and part of the auxiliary lead; and a fuse wire for electrically connecting the auxiliary lead to the anode lead within the resin package. Each of the anode, cathode and auxiliary leads has an inner end located in the resin package, and an outer end projecting from the resin package. Further, the anode lead of the capacitor is electrically connected to the power source without intervention of any other electronic element.

Abstract: A solid electrolytic chip capacitor in which L-shaped portions of the anode terminal and cathode terminal form slanting surfaces which project beyond the projecting side surfaces of the resin sheathing.

Abstract: Respective arc-shaped portions of two cathode lead terminals are arranged in opposition across a capacitor element to surround the side periphery of the capacitor element. These arc-shaped portions have straight portions at respective one open ends, which straight portion extends in axial direction of the capacitor element, namely in a direction along which an anode lead terminal provided on the end face of the capacitor element extends. The straight portions of the cathode lead terminals also arranged in opposition across the capacitor element. Accordingly, two straight portions of the cathode lead terminals are aligned across the anode lead terminal. By this, a three-terminal dip type capacitor which can achieve high reliability of connection between the cathode lead terminals and the capacitor element and reduction of production cost.

Abstract: A solid electrolytic capacitor comprising a sintered body made of a valve metal having a terminal wire, a dielectric film, a metallic oxide layer, and a conductive polymer layer formed on the sintered body in this order is described. The polymer layer is so formed that it covers the entire surface of the sintered body. Methods of manufacturing a solid electrolytic capacitor provided with a conductive polymer layer are also described. In the electrolytic polymerization process, the wire attached to the sintered body is used as an anode terminal, and a conductive paste is applied to connect the terminal and a metallic oxide layer electrically over an insulating dielectric film in order for the polymerization to proceed. Electrolytic polymerization is also performed by forming a graphite layer beforehand, a part of which is made in contact with the terminal. Chemical polymerization in an acid environment is applicable, too.

Abstract: A polygonal capacitor including a polygonal capacitor case having an engaging portion at an inner surface thereof; a capacitor element accommodated in the polygonal capacitor case; a plurality of terminals respectively connected to a plurality of electrodes of the capacitor element through a base portion of each terminal; an insulating terminal base to which the terminals are fixed; and a resin filled in the polygonal capacitor case. An engaging member formed at the insulating terminal base is in pressure contact with the engaging portion of the polygonal capacitor case.

Abstract: A solid electrolytic capacitor is provided which comprises a capacitor element including a chip and an anode wire projecting from the chip, an anode lead electrically connected to the anode wire, a cathode lead electrically connected to the chip, and a resin package enclosing the capacitor element together with part of the anode and cathode leads. The resin package has a first end face from which the cathode lead projects out, and a second end face located adjacent to the anode lead. Each of the anode and cathode leads is bent outside the package toward the underside thereof. The resin package includes a larger width portion adjacent to the first end face and a smaller width portion adjacent to the second end face. The anode lead extends transversely of the anode wire and projects laterally from the smaller width portion.

Abstract: The electric double layer capacitor is designed such that a pair of electrode plates each having a lead terminal portion are positioned on upper and lower faces of an electric double layer capacitor element, the resulting assembly is resin-molded with a heat-resistant resin while applying a desired pressure to the assembly through the upper and lower electrode plates and the lead terminal portions are formed into shapes having L-shaped sections. This structure makes it possible to easily provide chip type electric double layer capacitors capable of being surface-mounted.

Abstract: Encased component which, using an electrically insulating moulding compound, is built into a box-like casing. At the short sides of the casing electrically conductive strips are folded over the edge, which strips contact the component on the inner side and form contact faces on the outer side to enable fixation, for example, in an electric wiring pattern.