Abstract: The aim of the invention is to reduce the temperature gradient at the connection terminals of a connection unit to which lines can be joined. The inventive temperature compensation element is made of at least one first strip of thermally conducting material on which terminal lugs are arranged in a row at essentially right angles to the strip and are insulted in relation to each other and the strip. The terminal lugs are connected to the strip in a thermally conductive manner and can be respectively contacted to the lines with corresponding contact terminals of the connection unit.

Abstract: A lead frame for a quad flat no-lead package includes a plurality of units arranged in a matrix manner and each having four comers. Each of the corners extends outwards to define an attaching portion for attachment to a UV tape such that four sides of each of the units won't fly off when the sides are cut off.

Abstract: A high-power thyristor module includes a housing configured with an inner receiving space, and a thyristor unit disposed in the inner receiving space in the housing and including a mounting frame, and a plurality of high-power thyristors mounted on the mounting frame. Each thyristor has a gate. The mounting frame includes a dielectric top plate disposed on a top side of the housing, and a plurality of electrodes mounted on the top plate so that the electrodes are exposed outwardly of the housing, and coupled respectively to the gates of the thyristors. Cooling oil is contained in the inner receiving space so that the thyristors are submerged thereby.

Abstract: A semiconductor device including a semiconductor element having external terminals at a first level and external electrodes at a second level, higher than the first level. The external terminals include power terminals, ground terminals and signal terminals formed on a main surface of the semiconductor element. The external electrodes include power electrodes connected to the power terminals via power connecting sections, ground electrodes connected to the ground terminals via ground connecting sections and signal electrodes connected to the signal terminals via signal connecting sections. One of the signal terminals, signal electrodes and corresponding signal connecting sections are surrounded by either the power connecting sections connecting the power terminals and power electrodes or by the ground connection sections connecting the ground terminals and ground electrodes.

Abstract: A frame joining structure for electrical and electronic equipment housing cabinets, in which ends of frames are simplified in shape to dispense with complex cutting and which possesses excellent strength and waterproof property. Ends of outer side surfaces (4) of three mutually orthogonal frames (1a, 1b, 1c), which constitute a framework of a cabinet, are cut at two planes of ±45° relative to a plane defined by other two frames to be point-shaped. These ends are joined together directly or through a corner member (20) having the same configuration as that of the ends to constitute a firm corner portion.