Abstract: A cooling system for a high voltage system can include a high voltage supply and an electrical component coupled to the high voltage supply. The electrical component can generate heat that needs to be dissipated. The cooling system can include a cooling mechanism for dissipating the heat. The cooling mechanism can include a liquid conduit thermally coupled to the electrical component. The liquid conduit can contain a cooling solution comprising an alcohol having the formula R—OH, wherein R is a hydrocarbon having the formula CnH2n+1 and n is any positive integer between 1 and 6. The cooling system can additionally include a pump and a heat exchanger, each of which may be coupled to the liquid conduit.

Abstract: An electrical installation has a container which encloses high-voltage components. The electrical installation can be fitted inexpensively and quickly, and at the same time provide sufficient cooling of the high-voltage components. A control room with control elements and/or display elements of the electrical installation and a cool room with a cooling device for at least one of the high-voltage components are disposed in the interior of the container.

Abstract: An electronic device having a piezoelectric pump. The electronic device includes: an audio input section; an audio recording section recording input sound from the audio input section; a piezoelectric pump cooling air by a piezoelectric element; a drive circuit driving the piezoelectric element; and a control circuit monitoring and controlling operation of the audio input section, the audio recording section, and the drive circuit, wherein when an operation mode being monitored is an audio recording mode, in which the input sound is used for recording by the audio recording section, the control circuit controls the drive circuit to decrease the amount of air flow exhausted outside from the piezoelectric pump, and when the operation mode being monitored is another mode without audio recording, the control circuit maintains the amount of the air flow.

Abstract: One embodiment of the present invention is a method for setting and controlling temperature of a device that includes: (a) thermally contacting the device to a heat transfer apparatus, the heat transfer apparatus having an apparatus intake to receive thermal transfer fluid, an apparatus exhaust to output thermal transfer fluid, and a conduit to conduct thermal transfer fluid from the apparatus intake to the apparatus exhaust through the heat transfer apparatus; (b) flowing a first thermal transfer fluid in a first thermal control circuit at a first temperature, and flowing a second thermal transfer fluid in a second thermal control circuit at a second temperature; (c) at a first predetermined time, directing the first thermal transfer fluid to flow to the apparatus intake, and from the apparatus exhaust back to the first thermal control circuit and the second thermal transfer fluid to flow in the second thermal control circuit without flowing to the apparatus intake; and (d) at a second predetermined time, di

Abstract: A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.

Abstract: Electronic equipment installed outdoors to house an internal unit is provided, meeting the waterproof standard and having an easily replaceable structure of the internal unit. The electronic equipment has an enclosure having a cover and a case with an opening and an air vent, and an internal unit in which an electronic component is mounted. The internal unit has a heat sink and radiation fins for releasing heat generated by the electronic component. The fins are inserted into the opening. The heat sink has a draining portion formed below the fins in a direction perpendicular to an extending direction of the radiation fins, a groove for waterproofing around the fins except an upper portion thereof, and two protrusions for fitting above the fins. The case has a rib for waterproofing around the opening except an upper portion thereof, and two holes for fitting above the opening.

Abstract: A converter arrangement comprising a switchgear cabinet for a plurality of converter assemblies forming respective main modules and each consisting of submodules, formed as a switching module and a capacitor module. The switchgear cabinet has connection devices for electrical connection of the converter assemblies and also, for each converter assembly, a rail system for the mechanical arrangement thereof. The capacitor module has a DC voltage contact device for electrical connection to the assigned switching module, and also sliding elements. The switching module has a cooling device, power semiconductor modules and also dedicated sliding elements. The sliding elements of the submodules are arranged in a stacked manner in the same rails of the rail system of the switchgear cabinet.

Abstract: An electronic system includes a first circuit board having a first optical element and a second circuit board having a second optical element positioned to electronically communicate with the first optical element over free space. The system also includes a cold plate having openings positioned to enable the optical communications over free space is positioned between the first circuit board and the second circuit board. The system further includes a condenser and a fluid conduit containing a cooling fluid configured to absorb heat through the cold plate and to convey the heat to the condenser, where the fluid conduit connects the cold plate and the condenser.

Abstract: The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.

Abstract: An electrical installation has a container which encloses high-voltage components. The electrical installation can be fitted inexpensively and quickly, and at the same time provide sufficient cooling of the high-voltage components. A control room with control elements and/or display elements of the electrical installation and a cool room with a cooling device for at least one of the high-voltage components are disposed in the interior of the container.

Abstract: An arrangement for cooling a high voltage converter including a major loop with a pump for making a coolant liquid to pass power semiconductor devices of the converter and a heat exchanger for lowering the temperature of the coolant liquid before passing the power semiconductor devices again. An extra loop is connected to the major loop. The extra loop has a cooling apparatus containing a volume of a cooling medium and adapted to cool the medium to a temperature substantially lower than the temperature of the coolant liquid after having passed the heat exchanger in the major loop. A control unit is adapted to divert at least a part of the coolant liquid to flow through the extra loop when the need of cooling the power semiconductor devices of the converter is extremely high.

Abstract: An embodiment of a system to dissipate heat from electric equipment disposed in an explosive atmosphere comprises at least one electric device disposed in an explosive atmosphere, and a cooling system operable to remove heat from the at least one electric device to cool the at least one electric device to a predetermined temperature.

Abstract: The invention relates to an electrical cabinet (1) for receiving electrical and/or electronic and/or optoelectronic devices, in particular low-current distribution devices, which is particularly suited for installation outdoors, comprising an inner cabin (2) and an outer cabin (3), a first cooling channel (12) and a second cooling channel (23) being configured to be bordering externally on boundary surfaces (6) of the inner cabin (2) and separated from each other.

Abstract: A support system for an electrical device arranges the plurality of heat-sink assemblies in an orientation that allows the forces associated with an electrical fault that are transferred to the support structure to be reduced. The arrangement allows the electrical fault forces to cancel one another out such that the resulting net force applied to the support structure is significantly reduced. The size, strength and/or robustness of the support system can be reduced as the forces transmitted thereto are greatly reduced. The heat-sink assemblies can be arranged to facilitate ease of maintenance by allowing the heat-sink assemblies to be removed from a front access panel of the electrical device.

Abstract: A system and method are provided for cooling exhaust from a power center, such as in the event of an arc fault. In one embodiment, a system is provided that includes a power center having an enclosure, an exhaust duct coupled to the enclosure, and a phase change material disposed in the enclosure, the exhaust duct, or both, wherein the phase change material is configured to rapidly cool exhaust in response to a high temperature in the enclosure. A method is provided that includes cooling an exhaust at a high temperature from a power center by changing phase of a phase change material from a solid to a vapor. Another method is provided that includes providing a phase change material configured to cool an exhaust at a high temperature from a power center by changing phase from a solid to a vapor.

Abstract: An electronic system includes a first circuit board having a first optical element and a second circuit board having a second optical element positioned to electronically communicate with the first optical element over free space. The system also includes a cold plate having openings positioned to enable the optical communications over free space is positioned between the first circuit board and the second circuit board. The system further includes a condenser and a fluid conduit containing a cooling fluid configured to absorb heat through the cold plate and to convey the heat to the condenser, where the fluid conduit connects the cold plate and the condenser.

Abstract: A technique for cooling electrical bus structures is disclosed, in which a phase change heat spreader is thermally coupled to the bus. A continuous phase change cycle occurs within the heat spreader to draw heat from the bus during operation. The heat spreader may be planar, and extend over an area greater then the surface area of the bus to enhance cooling and to render the overall assembly more isothermal. The heat spreader may be placed near bus joints and circuits to remove heat caused by increased resistance at such locations.

Abstract: A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive material to which the multiple heat sources are coupled, preferably at evaporation points that are placed on opposite sides of a fluid reservoir for the liquid phase of the working fluid that feeds the evaporation points via capillary flow through a picking material.

Abstract: Disclosed is a liquid cooling system for an electric machine including a frame heat conductively attachable to a stator of an electric machine. The liquid cooling system further includes a cover mechanically attached to the frame and fluidly sealed to the frame, the cover and frame defining a cavity therebetween. The cover includes at least one protrusion extending substantially a distance between the cover and the frame. A method for constructing a liquid is also provided. The method includes forming at least one protrusion in the cover and structurally affixing the cover to the frame. The cover is fluidly sealed to the frame.

Abstract: A cooling device is disclosed for an electrical operating means, which has a surface to be cooled. The cooling device comprises a coolant, a peripheral wall, whose interior defines a volume for the coolant, a fastening for fastening the cooling device to the electrical operating means, and a contact-pressure means. The peripheral wall has a thermally conductive contact wall with a contact face, which is designed for areal contact with the surface to be cooled. The contact-pressure means mechanically prestresses the contact wall in order to produce an areal contact pressure of the contact face against the surface to be cooled when the cooling device is fastened to the electrical operating means.

Abstract: A system and method for manufacturing a power bus assembly is provided. The power bus assembly includes a first conductive sheet configured to receive a positive charge and distribute the positive charge to a plurality of connection points formed thereon. The power bus assembly also includes a second conductive sheet configured to receive a negative charge and distribute the negative charge to a plurality of connection points formed thereon. Additionally, the power bus assembly includes an insulating sheet arranged between the first conductive sheet and the second conductive sheet to electrically isolate the first conductive sheet from the second conductive sheet. A plurality of vice fasteners are included to secure the first conductive sheet, the second conductive sheet, and the insulating sheet together to form the power bus assembly.

Abstract: In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid is adapted to secure to the printed circuit board so as to mount with the substrate to form a fluid chamber between the lid and the substrate, and to cause the substrate to mate with the printed circuit board. In one embodiment, a cambered bolster plate is located on a side of the printed circuit board opposite the lid and the lid is fastened to the bolster plate to secure the lid to the printed circuit board. A baffle, which may be removable in some embodiments, is located within the lid and directs coolant flow through the fluid chamber.

Abstract: A power choke or transformer has an iron core, windings, and a cooling apparatus having a heat exchanger with a heat absorber and a cooling fluid duct operationally connected to the heat absorber, wherein the iron core is operationally connected to the heat absorber to remove heat emitted by the iron core.

Abstract: A multi-chip electronic package comprised of a plurality of integrated circuit chips secured together in a stack formation. The chip stack is hermetically sealed in an enclosure. The enclosure comprises a pressurized, thermally conductive fluid, which is utilized for cooling the enclosed chip stack. A process and structure is proposed that allows for densely-packed, multi-chip electronic packages to be manufactured with improved heat dissipation efficiency, thus improving the performance and reliability of the multi-chip electronic package.

Abstract: A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate.

Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: Thermal management devices and methods include branching networks comprising flow channels of varying cross-sectional area. The branching networks can be fractal-like in nature with an increase in the total flow area following a flow channel bifurcation. In representative embodiments, the branching networks are defined in a channel pattern that is laminated between cover plates to form a thermal management device. The channel pattern includes bridging portions so that the branching network is defined with a single pattern piece. The branching networks can exhibit radial symmetry or be aligned with respect to one or more axes. Heat exchangers and diffusive mixers that include such networks are also provided.

Abstract: A device for securing a computer data storage device in a computer enclosure includes a support frame having a top wall for supporting the data storage device and two side walls for supporting the support frame in the enclosure. Aligned openings are defined in the side walls for movably receiving a control bar therein with the control bar being movable between a released position and a locked position. Elongate slots are defined in the top wall extending in a direction normal to the moving direction of the control bar for receiving projections mounted to the data storage device. The control bar has a bottom section and at least a front section. Notches are defined in the front section through which the projections pass when the control bar is at the released position. Stop walls are formed on the bottom section offset from the notches a predetermined distance for engaging with the projections of the data storage device when the control bar is moved to the locked position.

Abstract: A plate type heat pipe comprises: a plate type container which includes a heat absorbing side and a heat dissipating side to form a hermetically sealed hollow portion; at least one heat transfer block which is thermally connected to each of inner walls of the heat absorbing side and the heat dissipating side; a wick which is placed along a side wall of the heat transfer block through the inner wall of the heat dissipating side; and a working fluid enclosed in the hollow portion. A securing member to secure the wick and the heat transfer block in close contact may be further included.

Abstract: The present invention relates to an apparatus and method for increasing the power rating of an offshore high voltage power cable (1) which includes passage of the cable from the sea to a platform installation (2) through a bending strain reliever (BSR) (4). An inlet for introducing cooling fluid to an interface space (5) between the BSR and the cable is provided through a sleeve, (6) closing the space at the end (7) of the BSR and that an outlet for the fluid is provided at the upper end (12) of the BSR through a special flange (13).

Abstract: Structure for housing and heat sinking active equipment pieces (3; 2) in a space vehicle, comprising a constraining external container (1; 46) containing a cooling gas or a mixture of gases, means for mechanically holding said boxes (3; 2) into the container (1; 46) and a plurality of channels (32) or empty volumes (18), provided between the external surfaces of the active equipment boxes (3; 2) and the means for mechanically holding said boxes, for the circulation of the cooling gas or mixture of gases. (FIG.

Abstract: A control device, in particular for controlling an automatic motor vehicle transmission, includes an electronic circuit mounted on a substrate. The circuit is accommodated in a housing which is sealed with respect to a surrounding fluid, and is connected to electrical conductors that run outside the housing. The housing contains a filler which is formed of a viscous fluid and is compatible with surrounding fluid. The filler is preferably transmission oil.

Abstract: In a double-walled electronics cabinet 1 an axial fan 5 is inserted in its inner wall 2. In order to prevent the creation of air eddies in front of the fan intake 8, an air baffle plate 16, which is in direction of flow, is located over the fan intake 8 in the gap 4 between inner wall 2 and external wall 3. The efficiency of the axial fan 5 is crucially improved by the division of the flow of fresh air, and the creation of air eddies and differences in pressure are purposefully avoided.

Abstract: The invention relates to a passive liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments. The apparatus comprises an external shell, defining a chamber with a plurality of heat dissipating components disposed within the chamber and surrounded by the shell. The components are immersed into a low boiling point dielectric liquid partially filling the chamber. The shell has two portions, an upper portion of the shell adjacent the area above the liquid level which forms a vapor space, and a lower portion of the shell adjacent the liquid. The shell has an external heat transfer structure providing more efficient heat transfer from the upper part of the shell, for example, in the form of external fins extending outward from the shell, and an internal heat transfer structure in the form of internal fins extending inward from the shell and into the chamber. Preferably, the external fins extend along the upper portion of the shell only.

Abstract: In a liquid cooling device (1) for a high-power semiconductor module (14), which contains a plurality of heat-generating submodules (8a-h) arranged next to one another on a cooling surface (3) and is fusion-bonded to the cooling surface (3), an improved load cycle resistance is achieved by the liquid cooling device (1) having a housing (2) which encloses a liquid space (4), through which a cooling liquid flows, and the upper side of which forms the cooling surface (3), and by the housing (2) of the liquid cooling device (1), at least in the region of the cooling surface (3), consisting of a metal-ceramic composite material, the coefficient of thermal expansion of which is adapted to the coefficient of thermal expansion of the ceramic substrates or of the power semiconductor devices of the submodules (8a-h) and, by additional means (11a-h; 12) for improving the heat transfer between the cooling surface (3) and the cooling liquid being provided in the liquid space (4) of the liquid cooling device (1).

Abstract: A device for filtering an electrically insulative and thermally conductive medium includes at least one heater immersed in the liquid medium and at least one solid particle filter immersed in and permeable to the liquid medium. The immersed filter is located in a natural convection current of the liquid medium.

Abstract: A power semiconductor valve device including an enclosure for semiconductor components and a hollow insulating body to supply power to the semiconductor components from a remote location, in which the hollow insulating body is formed from a non-ceramic material and includes concentrically mounted tubes spaced from each other to provide an annular gap between them.