Abstract: An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantity of heat. The flow of air enters the air duct. The air duct has a restriction chamber that includes a venturi vent in which the flow of air into the duct and through the restriction chamber creates a new flow of air into the venturi vent. The new flow of air into the venturi vent does not pass over the at least one component in the electronic device.

Abstract: The invention relates to a cooling arrangement in a frequency converter, the arrangement being configured to convey heat generated at the frequency converter to a space surrounding the frequency converter, comprising a power part (10) of the frequency converter, a control part (20) and cooling means, comprising a cooling motor (31) and a transfer means (32) for producing cooling. In accordance with the invention, a cooling frequency converter is arranged in connection with the frequency converter to control the cooling means. The power part of the cooling frequency converter comprises a rectifier (11) of the frequency converter, an intermediate circuit (12) of the frequency converter as well as a unique power unit (43) of the cooling frequency converter.

Abstract: A multi-chip electronic package comprised of a plurality of integrated circuit chips secured together in a stack formation. The chip stack is hermetically sealed in an enclosure. The enclosure comprises a pressurized, thermally conductive fluid, which is utilized for cooling the enclosed chip stack. A process and structure is proposed that allows for densely-packed, multi-chip electronic packages to be manufactured with improved heat dissipation efficiency, thus improving the performance and reliability of the multi-chip electronic package.

Abstract: An airflow blocker component of an apparatus in one example is coupled with a support component. The airflow blocker component comprises a flexible flap portion that is bendable away from the support component into a position that directs one or more airflow portions to promote an increased cooling of one or more thermal components.

Abstract: An electrical switchgear (ES) comprising at least one function module (FM, FM . . . ) having an encapsulated housing, and a decompression channel (DK) which is connected to the housing. Said decompression channel (DK) comprises a ventilation device (LV, LV . . . ) in at least one of its generated surfaces, said device having two wall-type ventilation elements (LE 1,2) which are successively arranged at a distance from each other and are provided with ventilation openings. One ventilation element (LE 1) is connected to the generated surface of the decompression channel (DK) in a fixed manner, and the other ventilation element (LE 2) can be moved in a guided manner against the fixed ventilation element (LE 1). The moveable ventilation element (LE 2) can be linearly displaced inside a guiding frame (FR) and the ventilation openings of the ventilation elements (LE 1,2) are staggered in relation to each other.

Abstract: The invention relates to a cooling structure of an electronic equipment needing forced-air-cooling by fans and so force and has an object to enhance a cooling capacity and enhance a mounting efficiency of the substrate units. The cooling structure of an electronic equipment needing forced-air-cooling comprises, to achieve the above object, substrate housing parts, an upstream side duct, a downstream side duct, exhaust means and air adjusting means. The substrate housing parts detachably house therein one or plurality of substrate units, and the downstream side duct allows the air for cooling which passed from the upstream side duct through the substrate housing part to flow. The exhaust means is provided at the exhaust part to forcibly discharge air to the outside air, thereby allowing the air for cooling to flow to the substrate housing parts, and the air adjusting means adjusts the air for cooling which flows to the downstream side duct.

Abstract: A bus cooling fan that operates without an external electrical power supply. The fan is positioned proximate two bus bars of a polyphase electrical system. The fan includes a rotor supporting fan blades and mounted on an axle. The axle is supported by cross-braces in a shroud surrounding the rotor. The shroud is open at the ends. The fan is fabricated of non-ferrous, non-conducting material with the exception of the rotor. The bent rods which interact with the electromagnetic field created by the current-carrying bus bars of the polyphase electrical system to make the rotor function as an induction motor when the fan is placed proximate two bus bars.

Abstract: An electrical component having a hybrid air cooling system. The electrical component comprises an air plenum that extends across the width of the component and a first set of air movers that is positionable in a first lateral position downstream of the air plenum within the component enclosure and a second set of air movers that is positionable in a second lateral position downstream of the air plenum within the component enclosure. The first and second sets of air movers each include at least two air movers arranged adjacent each other in series. When both positioned in the component enclosure, the first and second sets of air movers are arranged in parallel such that both serial and parallel air flows are provided within the component enclosure to dissipate heat generated therein.

Abstract: A self contained multiple dimming channel package includes a housing with a main power circuit board supported on its bottom wall and a control circuit board extending laterally and vertically to baffle air flow through the housing. A cross flow cooling fan forces air through an opening in the control board and across power switching modules and toroidal chokes mounted to the main board. Each power switching module includes a heat sink with fins parallel to the air flow, and the chokes are mounted in rows with their central openings aligned with the air flow. The power switching modules include circuits attached to the heat sinks with terminals releasably plugged into mating connectors on the main board. Circuit breaker switches are snapped into place in the housing. The front corners of the housing are provided with integral mounting bracket and handle members.

Abstract: The present invention relates to an apparatus for supplying heat to directly cooled electronics. To ensure that directly cooled electronics are maintained at a temperature above 0° C., a circulation fan is provided in a transverse junction between an outlet duct and an inlet duct, for a recirculation flow of supplied cooling air, whereby outgoing hot air from the electronics, when necessary, may be mixed with the cold air, so as to raise the temperature of the cooling air to be supplied to the electronics.

Abstract: A cooling fan apparatus includes a plastic housing and an electric fan. The housing containing the fan is mounted directly on the external surface of equipment being cooled. No separate mounting frame is utilized. The modular fan apparatus is on-line replaceable and is useful with other units to provide cooling fan redundancy. Preferably, a filtered electrical connector and a light emitting diode are integrated with the housing.

Abstract: A rack assembly includes a nineteen-inch sub-assembly coupled to a four-inch extension that comprises two substantially closed side panels adjacent to each other, two substantially open sides adjacent to each other, a closed top and bottom, a plurality of mounting flanges for attaching the extension to a nineteen-inch sub-assembly and a plurality of embossments for receiving mounting hardware for installing the sub-assembly and extension into a twenty-three-inch rack. The four-inch extension is formed not only to allow a nineteen-inch rack sub-assembly to be installed in a twenty-three-inch rack, but also is formed to conduct air exhausted from a side of the nineteen-inch sub-assembly towards a rear end of the twenty-three-inch rack.

Abstract: A switchgear cabinet having at least one cabinet door and a fan-assisted air circulation on an interior for cooling heat-generating devices installed inside, which are disposed one above the other in tiers. With particular air circulation, the partial cooling air flows in the tiers and can be set and adjusted, to a large extent independently of one another.

Abstract: A raised floor air handling system for use in a building that is used in combination with and set into an elevated floor assembly that is mounted on a principal floor of a building so as to provide an air plenum between the two floors. An air handling assembly is mounted below an integral raised or elevated floor tile to pull air via a radial impeller fan from the air plenum and directs it vertically through the integral raised floor tile into air distribution ducting (flexible, anti-static fabric with nozzles, linear vents, or other types of perforations) and onto the equipment/location being served air. The raised floor tile is designed to match the load rating of other floor tiles to become an integral part of the elevated floor assembly. The ducting attaches to the top of the raised floor tile via removable duct collars and is supported vertically/horizontally by miscellaneous hardware attached to existing/new structures.

Abstract: A switchgear cabinet having at least one cabinet door and a fan-assisted air circulation on an interior for cooling heat-generating devices installed inside, which are disposed one above the other in tiers. With particular air circulation, the partial cooling air flows in the tiers and can be set and adjusted, to a large extent independently of one another.

Abstract: A ventilation device for electrical control devices is provided in a housing wall of a housing. The ventilation device includes a wall with an inner opening that is open with respect to the space inside the housing and is intended for receiving and delivering a gas from and to the space inside the housing. The wall of the device also includes an outer duct opening that is open with respect to the housing surroundings and is intended for receiving and delivering a gas from and to the housing surroundings. The inner opening and the outer duct opening are connected to each other for leading the gas between the openings through a ventilation duct unit in which a membrane unit is disposed. The inner opening and the outer duct opening are offset laterally with respect to each other such that they do not overlap each other.

Abstract: A portable image projector is provided with a fan having a control system for cooling a metal-halide arc lamp. The arc lamp cooling system of the present invention includes a fan having a fan control to operate the fan at an initially reduced level during lamp start-up to allow the temperature of the arc lamp to increase to its full operating temperature. The fan control includes a microcontroller to operate the fan at a reduced voltage over a period of time after which the voltage is increased to operate the fan at full capacity. Power to the fan may be increased in incremental time steps or linearly over a period of time as determined by the microcontroller.

Abstract: A bus cooling fan that operates without an external electrical power supply. The fan is positioned between a pair of bus bars. The fan includes a rotor having fan blades and is mounted on an axle, which is supported by cross-braces in a shroud surrounding the rotor and open at the ends. The fan is fabricated of non-ferrous, non-conducting material with the exception of bent rods that support the fan blades and are mounted on an axle. The bent rods interact with the electromagnetic field created by the current-carrying bus bars and act as a rotor for an induction motor when the fan is placed between bus bars.

Abstract: A high-efficiency, automatic detecting, and self-adjustable temperature controlled air flow device, more particularly a computer power supply having dual adjustment temperature controlled air flow device, includes a primary fan mounted at a front end of a power supply of a computer, and a secondary fan mounted at the other end. One side of the primary fan is provided with an adjustment knob to allow the user to adjust rotational speed. The secondary fan is controlled by an environmental temperature detecting circuit inside the power supply. The device can automatically adjust, detect, and provide high-efficiency heat dissipation effects.

Abstract: A personal computer includes a main unit including a computer circuit therein, and a flat panel display unit supported in a standing state by the main unit through a connecting section. The connecting section includes a lower strut attached to the main unit, and an upper strut attached to the display unit and combined with the lower strut such that the lower and upper struts are movable relative to each other. The upper strut is provide with a rack and is biased upward by a spring. The lower strut is provided with a stopper arranged to engage with the rack. The display unit is placed at an arbitrary height when the positions of the first and upper struts are changed relative to each other, and are fixed by the stopper.

Abstract: An apparatus and method for cooling heat generating components within a compartment are disclosed. A cooling assembly isolates heat produced by a processor in a personal computer (“PC”) system and exhausts it from the PC prior to adversely affecting other components within the PC. A fan causes air to blow across the processor having an attached heat sink disposed within the cooling assembly, and the air exits the cooling assembly without adversely affecting the other components surrounding the processor. In one example, an alternative passage is provided for the air.

Abstract: An underground equipment vault for power and electronic equipment includes an airflow system in combination with an above ground forced air source. The airflow courses through separate first and second chambers including a first chamber for power supplies and a second chamber for energy storage equipment. This airflow, sequentially traversing both chambers, dissipates heat from the equipment and further dispels hydrogen gases from the batteries to the outside air. An airflow system, utilizing fans, provides positive pressure to force the desired airflow through the chambers. The vault is closed with a dual lid structure to supply supporting strength and also supply a secure seal for closing the vault. The dual construction provides an insulating space for further insulating the vault from ambient conditions.

Abstract: A fire containment and air flow control mechanism for a device or chassis housing electronic components. The electronic components generate heat during operation of the device. An aperture in the housing permits warm air generated within the chassis to escape into the environment to cool the circuit board or card. A trap door is provided for the aperture for purposes of fire containment. Normally, the trap door is open, allowing the warm air to escape through the aperture. The trap door is moveable relative to the housing between a first position, in which the trap door does not cover the aperture, and a second position, in which the trap door substantially obstructs the aperture. A temperature sensitive material, such as a nylon or other polymeric filament that melts when subject to sufficient heat or flame, is operatively connected to the trap door. The temperature sensitive material is transformed, e.g.

Abstract: A built-up heat exchanger including a seat and a plurality of radiators superposed on a top of the seat is provided. The seat is made of a thermal conductive material in sheet form and has at least two notches formed on a top surface thereof. The a plurality of radiators are made of a thermal conductive material in sheet form and are punched to form a plurality of upward extended fins and at least two downward projected ridges corresponding to the at least two notches on the seat, such that any of the radiators may be superposed on the top surface of the seat with the at least two downward projected ridges fitly received in the at least two notches. Since the number of fins formed on each radiator and the number of radiators superposed on the seat may be freely decided depending on actual need, the built-up heat exchanger may be used in different applications.

Abstract: Protective packaging for electronic equipment includes an expanded foam body with cavities for components, air ducts, and the like. An outer EMI bag surrounds the equipment containing foam body. The assembly is enclosed within a deformable exterior case which includes front and rear covers, air filters, or fans. The cases are modular and stackable. Integrally formed connectors electrically couple adjacent cases together. The connectors couple the EMI bags together to form a common shield.

Abstract: The invention concerns a horizontally divided switchgear, including compartments for high voltage and for cable connection. The cable connection compartment is common to one or more switchgear cubicles and is a compartment separated from the high voltage compartment(s) of the cubicle(s). In the switchgear is included one or more switchgear cubicles defined by vertical (12, 13, 14) and horizontal (15, 16) walls. The cubicle is arranged with only high voltage equipment, while connection means (18) for incoming and outgoing current cables are arranged exteriorly underneath the lower horizontal wall (16) of the cubicle. Bushing means (17) for cable conections are arranged in the lower horizontal wall (16).

Abstract: The chip-to-board (or chip-to-MCM) connection assembly and method therefor features a semiconductor chip (31) having a front surface (31f) on which external terminal pads are provided; a board or MCM (32) having a surface (e.g., a recessed surface) at a first side thereof to which the rear surface (31r) of the chip is affixed; and a connection carrier (33), disposed as an overlay, which electrically links the chip and the board or MCM. In this assembly scheme, the connection carrier (e.g., a bump carrier) which is affixed to both the chip and the board or MCM, contains all required signal line tracings (57) to provide the electrical interconnection between the semiconductor chip and the board or MCM. The bump carrier replaces all bond wires (24) and the like and can include support/control circuitry, passive and/or active, associated with, for example, high-speed/high-power IC chips (51).

Abstract: Structure for housing and heat sinking active equipment pieces (3; 2) in a space vehicle, comprising a constraining external container (1; 46) containing a cooling gas or a mixture of gases, means for mechanically holding said boxes (3; 2) into the container (1; 46) and a plurality of channels (32) or empty volumes (18), provided between the external surfaces of the active equipment boxes (3; 2) and the means for mechanically holding said boxes, for the circulation of the cooling gas or mixture of gases. (FIG.

Abstract: A switchboard for mounting and supplying electrical power to a plurality of circuit breakers has all the breakers are mounted on one side of a vertical power stack. The power stack has vertical buses to which the breakers are connected. Insulators and spacers provide air ventilation paths through the power stack. The main bus connecting members on the other side of the power stack from the breakers and are spaced apart vertically to allow for improved heat dissipation. By using vertical bus connectors, the bus connecting members may be connected to through bus connectors at any height on the back of the switchboard. The main bus connecting members are in a vertical chimney for improved heat dissipation. The circuit breaker at the highest location (the “A” phase) has the highest temperature and in the present invention, the main bus connecting member for the A phase is in the highest position to place it closest to the heat source and thereby improve the heat conduction away from the breakers.

Abstract: A power distribution apparatus includes an electronic chassis, a power distribution member and a first power supply. The electronic chassis includes a front wall, a back wall and first and second side walls. The power distribution member is positioned within the electronic chassis between the first and second side walls. The first power supply is mounted to an outer surface of the first side wall. Power is distributed from the first power supply to the power distribution member.

Abstract: In a double-walled electronics cabinet 1 an axial fan 5 is inserted in its inner wall 2. In order to prevent the creation of air eddies in front of the fan intake 8, an air baffle plate 16, which is in direction of flow, is located over the fan intake 8 in the gap 4 between inner wall 2 and external wall 3. The efficiency of the axial fan 5 is crucially improved by the division of the flow of fresh air, and the creation of air eddies and differences in pressure are purposefully avoided.

Abstract: A motor control compartment provides an air flow chamber at the rear thereof and mounts the solid state switches on heat sinks that are positioned in the air flow. An apertured support plate separates the interior of the compartment from the air flow chamber and allows additional space for supplemental control equipment.

Abstract: The semiconductor device comprises an insulating film in which penetrating holes are formed, a semiconductor chip having electrodes, a wiring pattern adhered by an adhesive over a region including penetrating holes on one side of the insulating film and electrically connected to the electrodes of the semiconductor chip, and external electrodes provided on the wiring pattern through the penetrating holes and projecting from the surface opposite to the surface of the substrate on which the wiring pattern is formed. Part of the adhesive is drawn in to be interposed between the penetrating holes and external electrodes.

Abstract: A cooler which can be fitted on a rear wall or a side wall or a door of a switching cabinet and can be connected thereto via an intake and an inlet aperture of an internal circuit. According to the invention, rain and dustproofing is improved because alongside a central ventilation shaft open at the top, the cooler housing has vertical ventilation chambers open at the top as part of an external circuit hermetically separated from the internal circuit, the top of the switching cabinet and cooler housing is covered by a roofing component spaced therefrom which projects on all sides beyond the control box and the cooler housing and leaves a peripheral ventilation slot opening downwards. The roofing component is divided by two partitions into three chambers which communicate with the ventilation shaft and both ventilation chambers in the cooler housing.

Abstract: An alternating current circuit breaker having an extended fin cantilevered from its housing. A portion of the fin along its extended length is magnetized so that the fin flutters in the magnetic field generated by the alternating current conducted through the breaker. The resulting magnetic resonance vibration establishes forced, convective heat transfer which assists cooling of the breaker.

Abstract: A chassis for receiving power supply modules therein, including: (1) a cabinet; (2) an elongated bus bar assembly suspendable within the cabinet from a mount coupled to the cabinet at an end thereof, the bus bar assembly having a pair of conductors, the pair of conductors having terminal connectors associated therewith for receiving output terminals of a power supply module received into the cabinet (3) a shelf, oriented laterally with respect to the bus bar assembly and located proximate the terminal connectors, that supports at least one power supply module received into the cabinet, the bus bar assembly being suspendable to eliminate a need for support of a weight of the bus bar assembly apart from the mount.

Abstract: A telecommunications switch chassis includes a housing which is divided into front and rear compartments by a transverse printed circuit board or mid-plane. Notches are provided in the upper edges of the mid-plane which are adapted to receive tabs projecting from the ends of a pair of card guides so that the card guides are supported on edge in proper laterally spaced relation within the front compartment. The card guides are formed with columns of slots whose edges are deformed to form slides interleaved with the slots so that the card guides can support a stack of printed circuit cards in vertical spaced relation within the front compartment, the spaces between the cards being aligned with the slots in the card guides.

Abstract: An improved arc-resistant switchgear enclosure is disclosed. The disclosed arc-resistant switchgear enclosure provides a cost effective structure to collect and channel the pressure and hot exhaust gases from lower compartments and safely vent these gases through the switchgear enclosure. In preferred embodiments, an internal arc chamber is formed by assembling modules and creating a void within the center of the switchgear enclosure. As multiple compartments or modules for a switchgear enclosure are connected, an arc chamber is created within the enclosure. Upon initiation of an arc fault within a particular compartment, a relief flap or cover for that particular compartment opens to channel the pressure and the gases into the internal arc chamber or directly through the top of the enclosure. Pressure and gases are vented into the internal arc chamber and flow horizontally through the arc chamber until a path to the top of the switchgear enclosure is reached.

Abstract: A microwave oven includes a protective cover for enclosing a choke PCB, on which a choke device and a fuse are mounted, whereby moisture is not formed on the choke device and fuse, and the choke device and fuse are protected against contact. The accidental protective cover has vent slots and is provided near a rear plate forming one portion of the housing of the microwave oven. Air slots, through which outside air is drawn, are formed on a portion of the rear plate that faces the vent slots of the protective cover.

Abstract: An apparatus and method for cooling components within a housing, such as those of a computer system. Multiple chambers are created within the housing, each having at least one cooling fan and a corresponding air inlet. These chambers are segregated by an internal divider or baffle element which effectively eliminates airflow between the chambers. Cooling fans within the housing are utilized as exhaust fans such that, in conjunction with the effect of the baffle element, substantially linear airflow is maintained within each chamber. Certain critical heat-producing components of the system are placed in proximity to the air inlets in each chamber, thereby maximizing the cooling of the components for a given fan rating and inlet air temperature, and increasing cooling system efficiency by substantially reducing the cooling of components that are insensitive to heat.

Abstract: The cooling air generated from an air conditioner is supplied into an air passageway formed below the floor on which an equipment is disposed. The cooling air supplied to the air passageway is guided into the equipment through an opening made in the floor. The cooling air introduced into the equipment is released into the free space within the room. Further, the air stream released into the free space of the room is partly introduced again into the equipment.

Abstract: A hot-air chimney for a computer in an enclosure, for the purpose of removing hot air generated by ICs within the enclosure, is fabricated in the shape and form of an expansion card for the computer. The chimney has a base panel in the shape of the expansion card, and an enclosed passage formed on the base panel. The chimney also has an end flange fashioned to simulate an end panel of the expansion card, and the enclosed passage is open to an opening in the end flange. In computers wherein expansion cards are installed parallel to and overlying a motherboard, the hot-air chimney is installed in place of an expansion card adjacent to the motherboard. An opening positioned in the base panel into the enclosed passage, and positioned to overlie a heat-producing IC on the motherboard, conducts heated air from the IC into the enclosed package and then outside the enclosure via the opening in the end flange. The chimney is particularly effective for computers with fan-mounted ICs, such as a CPU with a cooling fan.

Abstract: A device for distributing cooling air to switchgear cubicles, the method including distributing cooling air or other cooled gas in a series of closely arranged switchgear cubicles (1a-1d) which are insulated from the surrounding air, the cooling air or gas flowing along the same path as the current lines extending through and into the cubicles. The air or gas is distributed to the respective cubicles (1a-1d) in the series of cubicles via channels (5,6a-6d) in the form of protective channels or busbar boxes which constitute semiprotection for the single-phase or multi-phase busbars (4a-4d) which distribute electric current to the cubicles and to the electric equipment present in the cubicles. The cubicles. The direction of the cooling gas distribution is the same as the current direction or reversed relative thereto.

Abstract: A cooling system is provided for compartments containing a heat generating apparatus, such as solid state variable speed constant frequency system, whose functionality is essential and whose cooling needs vary significantly during use. A main coolant channel is used to provide cooling to the heat generating apparatus under normal operating conditions. During an overtemperature condition; an auxiliary coolant channel provides additional coolant to the heat generating apparatus. Both of the channels are partially disposed within the heat generating apparatus, and they are both completely separate and free of fluid communication with each other. Each channel also contains a pump, such as a fan, for applying a motive force necessary to deliver the coolant to the heat generating apparatus.

Abstract: A motor vehicle ventilation apparatus for providing ventilation by a fan (3), located within an air channel (1) of the apparatus, whose operation can be multiply, or step, adjusted by "switching in" performance resistors (8). The performance resistors (8) and a step switch (7) required for adjusting operation of the fan (3) are arranged on members forming the air channel (1), or are in the air channel, within an effective ventilating range of the fan (3).

Abstract: A molded case circuit breaker support and a circuit breaker enclosure are arranged with air transfer slots and passages to promote chimney effect cooling of the circuit breaker components. The slots in the circuit breaker support direct ambient cooling air onto the circuit breaker terminals while the passages through the enclosure direct the ambient air flow from the bottom to the top of the enclosure.