Abstract: Disclosed is a method of assembling a backplane connector subassembly for a module of a modular energy system. The backplane connector subassembly physically and electrically connects at least two modules stacked on top of one another. The method includes providing a back panel defining an inner surface, attaching a first support member to the inner surface of the back panel, attaching a second support member to the inner surface of the back panel, attaching the upstream connector to the back panel by sliding a first mating hole defined in the upstream connector onto the first support member, and attaching the downstream connector to the back panel by a sliding a second mating hole defined in the downstream connector onto the second support member. The first support member is configured to support an upstream connector. The second support member is configured to support a downstream connector.

Abstract: A device may monitor an intake temperature of an air flow through an air intake of a building that includes a ventilation system for temperature control of a first region of the building, a liquid cooling system for temperature control of equipment that is within a second region of the building, and a heat exchanger that is thermally coupled to the ventilation system and the liquid cooling system. The device may determine that the intake temperature is below a threshold temperature. The device may control the ventilation system to cause the air flow to cool a water flow of the liquid cooling system via the heat exchanger to produce a cooled water flow. The device may control the liquid cooling system to cause the cooled water flow of the liquid cooling system to bypass a chiller system of the liquid cooling system to reduce power consumption by the chiller system.

Abstract: A sealed and thermally insulating tank incorporated in a supporting structure (2), the tank including at least one inclined tank wall (1) forming an angle with a horizontal direction and fixed to a supporting wall of the supporting structure (2) is disclosed. The tank wall (1) has a multilayer structure including successively, in the direction of thickness from the outside to the inside of the tank, a thermally insulating barrier (3) held against the corresponding supporting wall and a sealed membrane (4) carried by the thermally insulating barrier (3). The tank includes sealed strips (15) in the space formed between the thermally insulating barrier (3) and the supporting wall.

Abstract: A heat dissipating system for electronic devices includes a first heat dissipation device, a second heat dissipation device, and a thermal conduction component. The thermal conduction component is disposed around the first heat dissipation device and configured to thermally contact a heat source. The second heat dissipation device is disposed adjacent to the thermal conduction component. The first heat dissipation device is configured to generate a first working fluid toward the thermal conduction component, such that the heat transferred from the heat source to the thermal conduction component is dispersed in a plurality of directions directing away from the first heat dissipation device. The second heat dissipation device is configured to generate a second working fluid, such that the heat distributed adjacent to the second heat dissipation device is dissipated in at least one direction directing away from the second heat dissipation device.

Abstract: A cooling system is disclosed for a server rack holding one or more servers. The cooling system includes a cooling module configured to condition coolant to provide cooling within the server rack. The cooling system further includes at least one evaporator configured to couple to an upstream side of the server rack, relative to airflow through the server rack, and cool the airflow flowing into the server rack with the coolant. The cooling system further includes at least one condenser configured to couple to a downstream side of the server rack, relative to the airflow through the server rack, and cool the coolant after the coolant passes through the at least one evaporator.

Abstract: A portable information handling system supports processing components in a housing having first and second portions rotationally coupled by a hinge to move between closed and clamshell positions. Each housing portion includes a cooling fluid reservoir that stores cooling fluid for transfer of thermal energy from a processing component. Cooling fluid moves between the first and second housing portion cooling fluid reservoirs to provide a balanced weight distribution for the information handling system based upon the position of the housing portions, such as to increase the weight of a base portion of the housing resting on a support surface while decreasing the weight of an opposing lid portion.

Abstract: A device may monitor an intake temperature of an air flow through an air intake of a building that includes a ventilation system for temperature control of a first region of the building, a liquid cooling system for temperature control of equipment that is within a second region of the building, and a heat exchanger that is thermally coupled to the ventilation system and the liquid cooling system. The device may determine that the intake temperature is below a threshold temperature. The device may control the ventilation system to cause the air flow to cool a water flow of the liquid cooling system via the heat exchanger to produce a cooled water flow. The device may control the liquid cooling system to cause the cooled water flow of the liquid cooling system to bypass a chiller system of the liquid cooling system to reduce power consumption by the chiller system.

Abstract: The present concepts maintain forward flow and prevent reverse flow of heat-transferring media. A first zone and a second zone are proximate to each other. A first fan moves air through the first zone in a forward direction. A second fan moves air through the second zone in a forward direction. The speed of the first fan is compared with the speed of the second fan. If the first fan speed is slower than the second fan speed, then the first fan speed is adjusted to match the second fan speed. Therefore, reverse airflow in the first zone is prevented.

Abstract: A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. The computing device of the disclosure includes a device housing enclosing an enclosed heat-dissipation air duct, and the computational heat dissipation structure; the computational heat dissipation structure is located in the enclosed heat-dissipation air duct. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e.

Abstract: A cooling apparatus is disclosed for cooling an electronic device, the apparatus including a conductive mounting bracket to couple with an electronic device housing and a heat sink integrated with the conductive mounting bracket. The cooling apparatus further includes a heat pipe coupled with the conductive mounting bracket on a first side of the heat pipe, the heat pipe to be directly coupled with a targeted electronic component within the electronic device, on a second side of the heat pipe. The apparatus may further include a conductive mounting interface attached to the electronic device housing to attach to the conductive mounting bracket. A mounting receptacle deployed within the conductive mounting interface may be used to expose the targeted electronic component.

Abstract: Methods and structures are provided for implementing selective airflow modification. An airflow control member holder receives and retains an airflow control member having compliance characteristics allowing easy removal and changing of the airflow control member. The airflow control member holder includes retention features to facilitate mounting and removal from the system, such as mounting and removal from a printed circuit board (PCB). The airflow control member holder provides a protective function for a component, such as a depopulated component, a central processing unit (CPU) or other device.

Abstract: The present invention provides a linear control circuit for controlling an external device. The linear control circuit includes a temperature sensor and a controller. The temperature sensor is configured to sense a temperature. The controller is electrically coupled to the external device and the temperature sensor, and configured to provide a linear control signal associated with a control parameter value according to a sensing result in response to the temperature and linearly control the rotational speed of the external device by the linear control signal.

Abstract: Embodiments are disclosed of a cooling system for use in a data center. The cooling system includes an IT region, a ceiling region, and a cooling air plenum sandwiched between the IT region and the ceiling region. The IT region includes one or more IT plenums that are coupled to the cooling air plenum to supply cooling air to the IT region, which can have house a plurality of IT racks that are clustered around the IT plenums and are adapted to house one or more pieces of liquid-cooled or hybrid-cooled information technology (IT) equipment. The ceiling region includes one or more ceiling plenums and one or more sets of heat exchangers, each heat exchanger being cooled by the cooling air delivered to the ceiling plenums. The cooling air plenum is fluidly coupled by a flow control to the one or more IT plenums and is fluidly coupled by a flow control to the one or more ceiling plenums or to the volume of the ceiling region between ceiling plenums.

Abstract: In accordance with one embodiment, an electrical connector has heat dissipation holes, and is configured to be mounted to a substrate having electrical traces that are partially offset from each other, and partially aligned with each other. The holes pass through a shroud of the electrical connector such that, when the electrical connector is mated with a second electrical connector, air flows outside a perimeter of the second electrical connector, and may cool the mated connectors as well as dissipate heat from the substrate.

Abstract: A thermally conductive insulator includes a first part having first fins arranged on a surface of the first part, and a second part having second fins arranged on a surface of the second part. The first fins and the second fins are arranged in such a way that they mesh with one another. Arranged between the first and second parts in a region of the first and second fins is an insulating layer.

Abstract: A semiconductor module is provided to downsize the module, the semiconductor module including a terminal case made of a resin for housing a semiconductor chip; and a cooling portion including a refrigerant circulating portion through which a refrigerant flows and a joining portion surrounding the refrigerant circulating portion, the refrigerant circulating portion being arranged below the terminal case, and the cooling portion being arranged directly or indirectly in close contact with the terminal case at the joining portion, wherein the terminal case is provided above the joining portion, and has a side wall provided so as to surround the semiconductor chip when seen in a top view, and a temperature sensor for sensing a temperature of the refrigerant is provided on the side wall.

Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Abstract: A heat dissipating assembly, adapted to be disposed at an M.2 expansion card and configured onto a main board with the M.2 expansion card, is provided. The heat dissipating assembly includes a first heat dissipating member and a first double-end screwing member. The first heat dissipating member is adapted to be disposed on the main board, located between the main board and the M.2 expansion card, and has at least one first through hole. The first double-end screwing member includes a first thread and a first nut having a first screw hole. The first thread passes through one of the at least one first through hole of the first heat dissipating member and is detachably fixed to the main board. The first nut presses against the first heat dissipating member.

Abstract: An electronic rack includes a number of server chassis arranged in a stack. Each server chassis includes one or more servers and each server includes one or more processors. The electronic rack further includes a number of cooling chassis corresponding to the server chassis. Each cooling chassis is configured to provide liquid cooling to the processors of the server chassis. The cooling chassis includes a cooling module having one or more cooling devices arranged and positioned vertical aligned with the processors of the corresponding server chassis to extract the heat generated from the processors. The cooling chassis further includes a cooling unit coupled to the cooling modules to form a cooling loop to circulate the cooling liquid between the cooling devices and the cooling unit to cool the cooling liquid carrying the heat extracted from the cooling devices. A natural convection cooling loop is assembled and adapted on the cooling chassis.

Abstract: A data center regulates supply air provided to multiple compartments including an information technology (IT) compartment having a cold aisle and a hot aisle and an operation technology (OT) compartment. An environmental subsystem of the data center includes an air handling system that provides supply air to the cold aisle and that draws return air from the hot aisle to moderate or cool a temperature of IT component(s) that may be installed within the IT compartment. Airflow regulation device(s) are positioned in at least one of (i) a supply air passage that guides a portion of the supply air in the cold aisle of the IT compartment into the OT compartment to moderate or cool a temperature of OT component(s) that may be installed within the OT compartment and/or (ii) a return air passage that guides air from the OT compartment(s) to the hot aisle of the IT compartment.

Abstract: A notebook computer and a keyboard decorative panel thereof are provided. The notebook computer includes a casing, a keyboard module and a keyboard decorative panel. The keyboard module is disposed on the casing. The keyboard decorative panel is disposed on the casing to conceal a hinge on the casing and a fastening hole of the keyboard module. The keyboard decorative panel includes a first cover, a second cover, and a flexible member connected between the first cover and the second cover. The flexible member has flexibility. The first cover bends relative to the second cover because of the flexible member. Therefore, the notebook computer and the keyboard decorative panel thereof enhance the ease of changing the keyboard module.

Abstract: A support structure for a flexible interconnect of a superconducting system can include a support member that is formed of thermally conductive material. The support member can include a plurality of parallel slots. Each slot can extend from a first surface of a base of the support member to a second surface of the base. The first and second surfaces of the base can be positioned on parallel planes and each slot can be shaped to allow relative movement of a fastener that allows a respective connector assembly to be affixed to the support member. Moreover, the respective connector assembly can provide mechanical support for the flexible interconnect of the superconducting system and establish a heat path between the flexible interconnect and the support member. The support member can also include a wall extending transverse from the first surface of the base, the wall comprising a plurality of through-holes.

Abstract: Particular embodiments described herein provide for an electronic device that includes a hybrid keyboard. The keyboard can include a first portion of keys with a first key travel and a second portion of keys with a second key travel. The second key travel is less than the first key travel and a support plate can be raised under the second portion of keys and cause the second portion of keys to have the second key travel. In an example, a heat pipe or some other component can be located under the raised support plate and second portion of keys with the second key travel.

Abstract: Heat exchanger assemblies and methods are provided for cooling the interior of an enclosure (e.g., electrical cabinets, computer server racks, chemical chambers, and animal cages). Heat is transferred via thermal conduction from a first plurality of surfaces positioned inside the enclosure to a second plurality of surfaces positioned outside the enclosure. The first and second plurality of surfaces remain in thermal contact with one another during use. Heat is dissipated from the second plurality of surfaces to the ambient air outside the isolated environment without the ambient outside air mixing together with the air inside the enclosure. This, in turn, inexpensively removes heat from the air inside the enclosure and prevents contaminants from entering the enclosure.

Abstract: Apparatuses and systems are disclosed and can include a case for eyewear having an eyewear body carrying onboard electronic components that comprise a heat source that generates heat during electrically powered operation is disclosed. The case can hold the eyewear when the eyewear are in a stowed position. The case can further include one or more supports to support the eyewear in the stowed position within the holding space. One or more heat sinks are integrated with the one or more supports. Each of the one or more heat sinks are thermally conductive coupled with a corresponding heat sink of the eyewear. A first heat conduction pathway is thermally connected to the one or more heat sinks and can extend into the case body to conduct heat from the heat source into the case with the eyewear supported in the stowed position.

Abstract: Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same are disclosed herein. According to an aspect, a system includes a fluid conduit comprising a first portion and a second portion that are fluidly connected to each other for carrying cooling fluid proximate to a first electronic component and a second electronic component of a computing device. The system also includes a first fluid conduit carrier configured to hold the first portion of the conduit. Further, the system includes a second fluid conduit carrier configured to hold the second portion of the conduit. The first fluid conduit carrier and the second fluid conduit carrier are configured to connect to one another.

Abstract: A display device includes a display module from which heat is emitted; a connection rod coupled to the display module and with which the display module is mountable to a structure disposed external to the display device and spaced apart from the display module along a first direction, the connection rod lengthwise extending along the first direction; and a heat pipe disposed inside the connection rod and lengthwise extending along the first direction.

Abstract: A heat dissipation assembly and portable electronic device including the same wherein heat dissipation assembly includes first heat pipe. The first heat pipe includes first end part and second end part that are opposite to each other. The second end part includes inner peripheral wall and outer peripheral wall surrounding the inner peripheral wall. A vapor channel is formed between the outer peripheral wall and the inner peripheral wall. The inner peripheral wall forms insertion hole. A central line of the insertion hole is at first distance from the outer peripheral wall along first direction. The central line of the insertion hole is at second distance from the outer peripheral wall along second direction. The first direction is different from the second direction, and the first distance is different from the second distance.

Abstract: Described herein is an air handling unit that includes canopies for compressor fans and exhaust fans located on a top thereof, which canopies provide for noise abatement and a canopy to assist in keeping precipitation out. The canopies further include louvers that can be controlled to provide for even further noise abatement and precipitation control.

Abstract: A portable medical device, such as an ultrasound imaging system, is configured to connect to a stand, and transfer heat from the device to the stand. The device includes a heat-generating source, a hot plate that is thermally coupled to the heat-generating source, and a barrier plate that is biased away from the hot plate and moveable between a first position, wherein the device is not docked to the stand, and a second position, wherein the device is docked to the stand. In the first position, the barrier plate is not in thermally conductive contact with the hot plate, and in the second position, the barrier plate is in thermally conductive contact with the hot plate. When moved from the first position to the second position, a cold plate on the stand pushes the barrier plate into the second position such that heat generated by the imaging system is transferred through the barrier plate to the hot plate and into a cold plate of the stand.

Abstract: An air flow distribution system for a plurality of fans includes an air collimator that is operable to pass a flow of air in a linear vertical direction, thereby creating an improved optimal flow direction for cooling device components. The air collimator includes air transfer diverters to redirect swirling air from a fan into a linear flow, thereby increasing the cross-sectional air flow distribution throughout the device being cooled. Self-activating, separately controlled plurality of louver systems automatically close upon failure of an associated one of a plurality of cooling fans to prevent air from recirculating back through the failed fan. Therefore, air continues to move in a linear direction across the device components such that the device components remain at a specified temperature.

Abstract: A solid-state drive (SSD) adapter card is provided, which includes a card body provided with a low connection base and a high connector base. A first M.2 SSD and a second M.2 SSD are inserted into the low connection base and the high connection base respectively. There is a heat dissipation bottom plate between the first M.2 SSD and the second M.2 SSD. One end, protruding from the second M.2 SSD, of the heat dissipation bottom plate is provided with a heat sink, and a fan is disposed thereon. A heat dissipation cover is disposed on the outer side of the second M.2 SSD and fixed on the heat dissipation bottom plate; the heat dissipation cover is also provided with a heat sink. Via this structure, the card body can be installed with several SSDs, which can increase the capacity of the adapter card and improve the operational stability.

Abstract: A disclosed apparatus may include a storage drawer chassis having thermally-conductive barriers, with the thermally-conductive barriers defining storage bays adapted to receive storage drives. The apparatus may further include a coolant manifold, an inlet mechanism adapted to receive coolant into the coolant manifold of the storage drawer chassis, and an outlet mechanism adapted to permit coolant to exit the storage drawer chassis for thermal processing. The coolant manifold may be disposed in the storage drawer chassis to distribute coolant among a plurality of coolant channels extending within the thermally-conductive barriers to cool the storage drives. Other related systems, devices and methods are disclosed.

Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

Abstract: A closure (100) facilitates upgrading a network to extend optical fibers closer to, or all the way to, the subscribers by facilitating the transition between optical signals to electrical signals. The closure includes a base (110) and a cover (120) defining an interior; and a circuit board (130) disposed within the interior. A management tray (140) can be coupled to the base. The circuit board (130) includes the optoelectronic circuitry. The management tray (140) includes a platform (141) disposed between the circuit board (130) and the cover (120). Various types of fiber and electrical cable sub-assemblies (160) can be received at a port (113) defined in the closure.

Abstract: A head-mounted display (HMD) includes a hybrid fan, a printed circuit board (PCB) with one or more electronic components and a heat pipe to dissipate heat. The hybrid fan has a center axis extending from a rear side of the HMD to a front side of the HMD. The hybrid fan pulls air from a rear side of the HMD. The heat pipe has an end coupled to the PCB. The heat pipe partially surrounds a periphery of the hybrid fan and transfers heat away from at least the PCB. The HMD further includes a side cover and a front cover. The side cover encloses the hybrid fan, the PCB and the heat pipe. The front cover is attached to the side cover with a slit between an outer edge of the front cover and an outer edge of the side cover to discharge air from the hybrid fan.

Abstract: An information processing apparatus comprising a plurality of computation nodes each having a CPU, a cooler that cools a refrigerant in a conduit in which the refrigerant that cools the CPU of each of the plurality of computation nodes circulates, and a control node, wherein the control node decreases a cooling power of the cooler after execution of a job by the plurality of computation nodes is ended, and causes the CPU in which the execution of the job is ended to transition from a non-power saving mode to a power saving mode at a predetermined time interval a predetermined number of the CPUs at a time when a temperature of the refrigerant is equal to or more than a threshold value, and stops a process of causing the CPU to transition to the power saving mode when the temperature of the refrigerant is less than the threshold value.

Abstract: A display device includes a display that displays images, a light source that irradiates light toward a back surface of the display, a metal material that radiates heat generated by the light source, a protective part provided in proximity to the perimeter of the display, wherein the protective part opposes the metal material, and a conductive part interposed between and electrically connects the protective part and the metal material.

Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.

Abstract: A cooling system includes a chassis defining a housing and including a wall having an outer surface. A computing device is located in the housing. A heat transfer device located in the housing engages the computing device and the wall, providing for heat transfer from the computing device, through the heat transfer device, and through the wall to the outer surface to produce supplemental passive cooling of the computing device via the outer surface. A heat dissipation aperture is defined by the chassis, and a heat dissipation device located in the housing adjacent the heat dissipation aperture engages the heat transfer device, which provides for heat transfer from the heat transfer device to the heat dissipation device. A forced convection device located in the housing generates an airflow past the heat dissipation structure and through the heat dissipation aperture to enable primary active cooling of the computing device.

Abstract: An electronic apparatus includes a case, an electronic part housed in the case, and a heat sink coupled to the electronic part and at least partially arranged outside a side wall of the case with a gap formed between an outer peripheral portion of the heat sink and the side wall of the case.

Abstract: An example memory module cooler may include a first liquid manifold, a second liquid manifold, and a cooling tube connected to the first and second liquid manifolds such that. The cooling tube may be connected to the manifolds such that (1) liquid coolant can flow from the first liquid manifold through the cooling tube to the second liquid manifold, and (2) the cooling tube can be rotated relative to the first and second liquid manifolds around a longitudinal axis of the cooling tube. The cooling tube may have an oblong cross-sectional profile.

Abstract: Aspects of the disclosure generally relate to at least one device for heat transfer or dissipation. The at least one device for heat transfer or dissipation can include an air-to-air heat exchanger. The air-to-air heat exchanger can include an air flow inlet and various slots to establish a flow-through air path.

Abstract: A head-mounted display (HMD) includes a hybrid fan, a printed circuit board (PCB) with one or more electronic components and a heat pipe to dissipate heat. The hybrid fan has a center axis extending from a rear side of the HMD to a front side of the HMD. The hybrid fan pulls air from a rear side of the HMD. The heat pipe has an end coupled to the PCB. The heat pipe partially surrounds a periphery of the hybrid fan and transfers heat away from at least the PCB. The HMD further includes a side cover and a front cover. The side cover encloses the hybrid fan, the PCB and the heat pipe. The front cover is attached to the side cover with a slit between an outer edge of the front cover and an outer edge of the side cover to discharge air from the hybrid fan.

Abstract: An information processing apparatus includes a housing that a slot where an electronic assembly is inserted and extracted and a power supply unit. A first air inlet is present in a corner in a front portion of the electronic assembly and includes a space to store an engaging mechanism that engages with the slot. A duct is arranged between the slot and the housing and includes a second air inlet in a front portion of the housing. A fan is arranged between the slot and the power supply unit. The first inlet communicates with the duct and, by the fan, air from the first air inlet and the second air inlet is sent to the power supply unit through the duct.

Abstract: A computer case cooling structure, including: a case body; at least one control element, configured on a long edge side of the case body; a partition plate, configured inside the case body, thereby dividing the inside of the case body into a first cooling space and second cooling space; a cover body, coupled pivotally to one side of the cover body, thereby rotatable around a shot edge side of the case body; a cooling door assembly, configured movably on the case body; a first fan assembly, configured on the case body and corresponding to the first cooling space; and a second fan assembly, configured on the case body and corresponding to the second cooling space. Whereby, the heat generated from interface cards can be discharged through the first cooling space, and the heat generated from a central processing unit the second cooling space, achieving independent cooling without interference.

Abstract: A three-dimensional packaging structure and a packaging method of power devices. The packaging structure includes power devices, direct copper bonded substrates (i.e., DBC substrates), flexible printed circuit boards (i.e., FPC boards), bonding wires, heat dissipation substrates, decoupling capacitors, a heatsink with integrating the fan, shells, and forms a half-bridge circuit structure composed by the power devices. The power circuit structure is optimized, parasitic inductance in the commutation loop is reduced by mutual inductance cancellation, thus overvoltage and oscillation during the power device switching process can be reduced. Additionally, by using the flexible characteristic of the flexible PCB, a three-dimensional packaging structure is formed and power density is improved.

Abstract: An electronic apparatus which can achieve both a reduction in thickness of a chassis and an improvement in a heat releasing performance is provided. An electronic apparatus 10 includes a chassis 12 having an electronic component 18 arranged therein, a heat sink 20 which is provided in the chassis 12 and absorbs heat generated from the electronic component 18 when its one surface 20a is arranged to enable conduction of the heat from the electronic component 18, and a heat conducting sheet 22 which is arranged in the chassis 12, closely arranged on the other surface 20c on the side opposite to the one surface 20a of the heat sink, has an outer shape area larger than an outer shape area of the heat sink 20, and extends to the outside of an outer shape of the heat sink 20.

Abstract: A cooling assembly for cooling a processor includes a heat sink base defining a first area and a second area, a plurality of heat sink fins extending from the first area, a thermoelectric cooling module having a cold side and hot side, wherein the cold side is in contact with the second area, and a heat sink module in contact with the hot side. In use, a method includes monitoring a processor parameter selected from processor power consumption and processor temperature, and causing airflow across the plurality of heat sink fins and the heat sink module. The method further includes powering on the thermoelectric cooling module in response to the processor parameter having a value greater than a first threshold value, and powering off the thermoelectric cooling module in response to the processor parameter having a value less than a second threshold value.

Abstract: An electronic device may include an electronic device chassis having first fastener openings, and circuit boards, each circuit board having opposing sides. The electronic device may include a respective heat sink flange extending outwardly from each opposing side of each circuit board. Each heat sink flange may have second fastener openings. The electronic device may have a respective fastening arrangement coupling each heat sink flange to adjacent portions of the electronic device chassis. Each fastening arrangement may include a fastener receiving strip having fastener receiving passageways, and fasteners extending through respective ones of the first and second fastener openings into corresponding ones of the fastener receiving passageways in the fastener receiving strip.