Heat Pipe Patents (Class 361/679.52)
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Patent number: 11956929Abstract: A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is removably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.Type: GrantFiled: September 15, 2021Date of Patent: April 9, 2024Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Chun-Ming Chang, Tai-Jung Sung
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Patent number: 11871549Abstract: Provided is a heat conduction mechanism including: a first member including at least one heat source; a second member including a heat dissipation element, the second member displaceable with respect to the first member; and a heat conductive sheet that transfers heat of the heat source to the heat dissipation element, in which a protective sheet is provided to a portion of the heat conductive sheet that can be in contact with at least a part of the first member or the second member.Type: GrantFiled: May 8, 2020Date of Patent: January 9, 2024Assignee: SONY GROUP CORPORATIONInventor: Hiroto Yamada
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Patent number: 11864344Abstract: A computing device chassis for a common cooling solution for die packages comprising: a chassis base comprising: an internal cavity; a cooling element housed in the internal cavity; and one or more thermal interfaces to the cooling element.Type: GrantFiled: September 27, 2021Date of Patent: January 2, 2024Assignee: ADVANCED MICRO DEVICES, INC.Inventor: Christopher M. Jaggers
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Patent number: 11847003Abstract: A folding device and a heat dissipation apparatus, where the folding device includes a heat collection element, including a heat collection plate and a first shaft sleeve, where a first end of the heat collection plate is in contact with a heat source in a first folding part, and a second end of the heat collection plate is coupled to an outer wall of the first shaft sleeve, the first shaft sleeve is sleeved on a rotating shaft, and a third end of the cooling element is in contact with the rotating shaft, and a fourth end of the cooling element is in contact with a heat dissipation device in a second folding part.Type: GrantFiled: December 22, 2020Date of Patent: December 19, 2023Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Guo Yang, Tao Huang, Wenming Shi, Teng Long, Wei Li, Jianliang Wang, Zhiguo Zhang
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Patent number: 11693456Abstract: Examples of the disclosure relate to vapour chambers. Examples of the disclosure can provide an apparatus comprising: at least a first vapour chamber portion and a second vapour chamber portion wherein the vapour chamber portions comprise walls housing an internal volume where the internal volume is configured to enable vapour flow; at least one hinge formed from walls of the first vapour chamber portion and walls of the second vapour chamber portion and configured to enable the first vapour chamber portion to be moved relative to the second vapour chamber portion; and wherein the hinge is thermally conductive and configured to enable heat to be transferred from the first vapour chamber portion to the second vapour chamber portion.Type: GrantFiled: July 23, 2021Date of Patent: July 4, 2023Assignee: Nokia Technologies OyInventors: Nick Jeffers, Diarmuid O'Connell, Ian Davis, Akshat Agarwal, Oliver Burns
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Patent number: 11662154Abstract: A heat transfer system includes a first vapor chamber, a second vapor chamber spaced from the first vapor chamber, and a flexible thermal strap disposed between and coupled to both the first vapor chamber and the second vapor chamber. The flexible thermal strap permits the second vapor chamber to rotate relative to the first vapor chamber.Type: GrantFiled: May 15, 2020Date of Patent: May 30, 2023Assignee: Aavid Thermal Corp.Inventors: Jerome Toth, Bradley R. Whitney
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Patent number: 11586243Abstract: A portable information handling system folds a flexible display over a hinge and selectively engages a brake that restricts hinge movement if a predetermined condition exists, such as a predetermined thermal state associate with potential damage to the flexible display. Heating and cooling elements increase or decrease the flexible display thermal state to fall within a constraint that supports folding and releases the hinge brake.Type: GrantFiled: August 2, 2019Date of Patent: February 21, 2023Assignee: Dell Products L.P.Inventors: Yagiz Can Yildiz, Christopher A. Torres, Kevin M. Turchin, Gerald R. Pelissier
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Patent number: 11483948Abstract: Disclosed herein are thermal interface materials (TIMs) including memory foam cores. In an exemplary embodiment, a thermal interface material generally includes a memory foam core including a plurality of sides defining a perimeter. A heat spreader is disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core.Type: GrantFiled: August 25, 2020Date of Patent: October 25, 2022Assignee: Laird Technologies, Inc.Inventors: Jason L. Strader, Kyle Burke Huffstutler, Eric Edward Trantina
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Patent number: 10143108Abstract: In a heat dissipating device adapted to a plurality of memory modules, a base surrounds the memory modules and has two long edges parallel to the memory modules, a first short edge and a second short edge. A plurality of heat conducting members of a comb-shaped frame extends from a heat dissipating wall connected to the first short edge to the second short edge. The heat conducting members are arranged side by side to form a plurality of receiving spaces for receiving the memory modules. A cover is pivotally connected to the comb-shaped frame and can rotate with respect to a first axis parallel to the first short edge. A movable portion is fixed with the comb-shaped frame and two resilient wings of the cover push two outmost heat conducting members inwardly, such that the heat conducting members and the memory modules abut against each other tightly.Type: GrantFiled: September 15, 2017Date of Patent: November 27, 2018Assignee: COOLER MASTER CO., LTD.Inventors: Chun-Ching Ho, Hsin-Hung Chen
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Patent number: 9861008Abstract: An outdoor unit of an air conditioner is disclosed. The outdoor unit of the air conditioner includes an outdoor unit body, a printed circuit board having a heat generating element installed thereat, an electronic box mounted in the outdoor unit body, the electronic box having the printed circuit board installed therein, a heat dissipation module contacting the heat generating element, the heat dissipation module allowing refrigerant to flow therethrough, and a heat dissipation module support mounted in the outdoor unit body such that the heat dissipation module is fixed to the heat dissipation module support to support the heat dissipation module. Shaking of the heat dissipation module can be minimized when the electronic box is separated, thereby improving reliability of the heat dissipation module.Type: GrantFiled: March 18, 2015Date of Patent: January 2, 2018Assignee: LG ELECTRONICS INC.Inventors: Kakjoong Kim, Jaehwa Jung, Chiwoo Song
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Patent number: 9848515Abstract: Various computing devices, thermal solutions and enclosures are disclosed. In one aspect, a computing device enclosure is provided that includes a first compartment that has a first upper side and is adapted to house the computing device and a liquid cooling device. The computing device has at least one heat generating component operable to transfer heat to the liquid cooling device. A second compartment has a lower side that includes an air inlet and a second upper side that has an air outlet. The second compartment is adapted to house a head exchanger to remove hear transferred to the liquid cooling device. A hub connects the first second compartment to the first compartment in spaced apart relation so as to leave a gap between the first upper side and the lower side.Type: GrantFiled: May 27, 2016Date of Patent: December 19, 2017Assignee: Advanced Micro Devices, Inc.Inventors: Christopher Janak, Steve Capezza, Christopher M Jaggers, David A McAfee, Ali Akbar Merrikh, Matthew Grossman, Nicholas Poteracki, Jefferson West, Paul Hughes
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Patent number: 9606590Abstract: A heat sink of a computing system includes a base and a shield associated with a component. The base is to mount to the computing system, and the shield is to be coupled to the base.Type: GrantFiled: December 22, 2011Date of Patent: March 28, 2017Assignee: Hewlett-Packard Development Company, L.P.Inventors: Paul N. Walker, Earl W Moore
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Patent number: 9128667Abstract: A protective cover for a slot and a screen provided in a mobile terminal is provided. The protective cover for a slot and a screen of a mobile terminal having a window at a front surface, having a slot in a recess formed in a predetermined depth at an upper portion of a rear surface, and mounts an injection and discharge element in the slot includes: a slot protective cover for covering the injection and discharge element and fastened to the recess; and a screen protective cover extended in a length for covering the window from the slot protective cover and for rotating to the front surface or the rear surface using one side surface of the mobile terminal as a central axis.Type: GrantFiled: August 28, 2013Date of Patent: September 8, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Namsu Kim, Jinsoo Kim
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Publication number: 20150124399Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.Type: ApplicationFiled: February 26, 2014Publication date: May 7, 2015Applicant: ACER INCORPORATEDInventors: Cheng-Wen Hsieh, Wen-Neng Liao
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Patent number: 9013869Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.Type: GrantFiled: December 31, 2013Date of Patent: April 21, 2015Assignee: Apple Inc.Inventors: Brett W. Degner, Gregory Tice
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Patent number: 9013874Abstract: A heat dissipation device for an electronic device includes a base, a plurality of fins and at least one heat pipe. The base has a front surface and a rear surface opposite to the front surface. A heat-generating component of the electronic device is disposed adjacent to the rear surface. The plurality of fins extend from the front surface of the base. The heat pipe is disposed on the front surface of the base and in a cutout portion of the plurality of fins. The heat dissipation device, which removes heat from the heat-generating component, has a low profile and improved heat dissipation capability.Type: GrantFiled: September 12, 2012Date of Patent: April 21, 2015Assignee: SK hynix memory solutions inc.Inventor: Givargis George Kaldani
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Patent number: 8988880Abstract: An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe configured to transfer heat from the circuit board to a wall of the chassis, and a brace configured to press the heat pipe against the wall. A brace includes a medial portion configured to contact a heat pipe and an end portion including a protrusion that is configured to be received in a depression of a chassis.Type: GrantFiled: September 19, 2012Date of Patent: March 24, 2015Assignee: GE Intelligent Platforms, Inc.Inventor: Laith Anthony Vincent
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Publication number: 20150077929Abstract: Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container having a thickness of not larger than 0.5 mm. This container is formed by stacking and diffusion-joining together etched sheet bodies. Particularly, etching is performed on one side surface of each of the sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the thickness of the container is not larger than 0.5 mm. More particularly, since the thickness of the container is formed to not larger than 0.5 mm, the sheet-type heat pipe can be effortlessly installed in a thin chassis such as that of a mobile terminal.Type: ApplicationFiled: September 4, 2014Publication date: March 19, 2015Inventors: Osamu HONMURA, Nobuyuki Kojima, Naoto Sakuma
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Patent number: 8982557Abstract: According to one embodiment, an electronic apparatus includes a printed circuit board, a heat pipe, a fan unit and a fixing unit. The heat pipe has a first end physically fixed to and thermally connected to a first circuit component, and a second end opposite to the first end. The fan unit is provided in the vicinity of the second end of the heat pipe, and cools the second end. The fixing unit fixes the position of the heat pipe at a position different from the position of the first circuit component.Type: GrantFiled: June 8, 2012Date of Patent: March 17, 2015Assignee: Kabushiki Kaisha ToshibaInventors: Hideki Watanabe, Shigeo Hayashi
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Publication number: 20150062802Abstract: Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and a daughterboard coupled to the motherboard and including a Graphics Processing Unit (GPU) coupled to a second side of the heat pipe. In other embodiments, a method may include providing a motherboard including a CPU; coupling a cooling system to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and coupling a daughterboard to the motherboard, the daughterboard including a GPU coupled to a second side of the heat pipe.Type: ApplicationFiled: September 5, 2013Publication date: March 5, 2015Applicant: Dell Products, L.P.Inventors: David William Grunow, Daniel William Kehoe, Matthew B. Mendelow
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Patent number: 8966922Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.Type: GrantFiled: November 14, 2012Date of Patent: March 3, 2015Assignee: International Business Machines CorporationInventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
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Patent number: 8959941Abstract: A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.Type: GrantFiled: July 21, 2011Date of Patent: February 24, 2015Assignee: International Business Machines CorporationInventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
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Patent number: 8955347Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.Type: GrantFiled: July 21, 2011Date of Patent: February 17, 2015Assignee: International Business Machines CorporationInventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
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Publication number: 20150043160Abstract: An adjustable heat sink which allows factory, service, or customers to adjust the width of the heat sink to take advantage of some or all available unpopulated DIMM space to optimize cooling and performance. Such an adjustable heat sink addresses many of the limitations of other heat sinks and is advantageous for reducing part numbers within a platform and across platforms. Such an adjustable heat sink also simplifies field upgrades when either adding or removing populated DIMMs to an information handling system thus enhancing performance without a need to change CPU Heat sinks.Type: ApplicationFiled: August 12, 2013Publication date: February 12, 2015Applicant: Dell Products L.P.Inventors: Eric M. Tunks, Stuart Allen Berke
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Patent number: 8947873Abstract: A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.Type: GrantFiled: November 26, 2012Date of Patent: February 3, 2015Assignee: International Business Machines CorporationInventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
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Patent number: 8941981Abstract: A computer includes various features that improve its functionality and/or ease of use. A modular electronics cartridge that includes a piston seal and opposed-direction latches removably engages a cartridge bay of the computer. A high intensity touch-screen display and a high power processor are disposed in a sealed compartment of the computer, and a remote heat exchanger is used to cool the sealed compartment. An interface converter/adapter converts a standard mini-PCI Express slot into a specialized mini-PCI Express slot with voice capabilities. SIM and microSD card slots mount to a pivoting door on the computer such that opening the door provides easier access to the card slots.Type: GrantFiled: December 15, 2010Date of Patent: January 27, 2015Assignee: Xplore Technologies Corp.Inventors: David Reber, Michael Garel
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Patent number: 8941986Abstract: A computer system includes a computer case, an enclosure, and a heat dissipating device. The computer case includes a rear plate with a plurality of ventilation holes. The enclosure includes a separating portion to divide the computer case into a first receiving area and a second area. The heat dissipating device includes a first heat sink, a second heat sink, a heat pipe and a fan. The first heat sink is attached to a chip, and the fan communicates with the second heat sink. The first heat sink and the fan are received in the first receiving area, and the second heat sink is received in the second receiving area. The heat pipe extends through the separating portion, and the plurality of ventilation holes, the first heat sink, the fan, the heat pipe, and the second heat sink together defines an air path for air flowing through.Type: GrantFiled: April 11, 2012Date of Patent: January 27, 2015Assignee: ScienBizIP Consulting (Shenzhen) Co., Ltd.Inventor: Yang Li
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Patent number: 8934235Abstract: A heat transfer device is described. In one or more implementations, a heat transfer device includes a heat sink and a thermal storage enclosure disposed proximal to at least a portion of the heat sink. The thermal storage enclosure configured to be disposed proximal to a heat-generating component of a device. The thermal storage enclosure includes a phase change material configured to have a melting temperature that is below a temperature at which a cooling fan of the device is set to operate to cool the heat-generating device.Type: GrantFiled: January 23, 2012Date of Patent: January 13, 2015Assignee: Microsoft CorporationInventors: Brandon A. Rubenstein, Jeffrey Taylor Stellman
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Publication number: 20140368991Abstract: A data center is cooled through hydronic convection mechanisms, geothermal mechanisms or combinations thereof. The individual computing devices of such a data center are cooled through a thermally conductive interface with a liquid. The liquid's container can extend to a cooling apparatus located physically above such computing devices to provide hydronic convection cooling, or it can extend into the earth, either in the form of a heat pipe, or in the form of conduits through which the liquid is actively pumped. The hydronic convection cooling and geothermal heat pipe cooling operate via temperature differentials and consume no external electrical power. Geothermal cooling avoids heat soak by utilizing multiple different sets of conduits extending into the earth, where at least some of those sets of conduits are not utilized for a period of time. Combinations of hydronic convection mechanisms and geothermal cooling can also be utilized.Type: ApplicationFiled: June 13, 2013Publication date: December 18, 2014Inventors: Sean M. James, Brandon Aaron Rubenstein
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Patent number: 8897016Abstract: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.Type: GrantFiled: October 2, 2012Date of Patent: November 25, 2014Inventors: Brett W. Degner, Peteris K. Augenbergs, Frank Liang, Amaury J. Heresztyn, Dinesh Mathew, Thomas W. Wilson
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Patent number: 8897012Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.Type: GrantFiled: December 14, 2012Date of Patent: November 25, 2014Assignees: Inventec (Pudong) Technology Corporation, Inventec CorporationInventors: Feng-Ku Wang, Yi-Lun Cheng, Chih-Kai Yang, Wei-Hsin Wu, Hua-Feng Chen, Ming-Hung Lin
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Patent number: 8897002Abstract: The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.Type: GrantFiled: June 8, 2012Date of Patent: November 25, 2014Assignee: Apple Inc.Inventors: Brett W. Degner, Christiaan A. Ligtenberg, Ron A. Hopkinson, Patrick Kessler, Bradley J. Hamel, Dinesh C. Mathew, John M. Brock, Keith J. Hendren, Peteris K. Augenbergs, Joss N. Giddings, Matthew C. Waldon, Cina Hazegh, Matthew P. Casebolt, Charles A. Schwalbach, Brandon S. Smith, William F. Leggett, Gavin J. Reid, Tom Tate, Gary Thomason
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Patent number: 8891234Abstract: An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached on the first panel and located between the first panel and the second panel. The heat dissipation module is attached on the motherboard and includes a fan with a cover, a first fin assembly attached to a first side of the fan, and a second fin assembly attached to a second side of the fan. The cover includes a main plate with an opening and a resisting flange extending slantwise from an edge of the opening. A portion of the first fin assembly is exposed by the opening. The resisting flange resists against the second panel to keep the main plate away from the second panel.Type: GrantFiled: October 18, 2012Date of Patent: November 18, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Lung-Chi Huang, Chih-Hao Yang
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Patent number: 8879261Abstract: A heat-dissipating device for an electronic apparatus can include: a thermal base coupled to a first electronic component in such a manner that enables heat-transfer therebetween so that heat generated by the first electronic component mounted on a substrate is absorbed thereby; and a vibrating capillary-shaped heat-pipe loop comprising a first heat-absorption portion coupled with the thermal base in such a manner that enables heat-transfer therebetween and a heat-dissipating portion configured to dissipate heat absorbed by the first heat-absorption portion, the heat-pipe loop having working fluid injected thereinto. The heat-pipe loop can be radially disposed with a central area thereof hollowed out, and an assembly area of a coupling member can be exposed in the central area so that the coupling member for coupling the thermal base to the substrate is coupled through the central area.Type: GrantFiled: October 25, 2012Date of Patent: November 4, 2014Assignee: Icepipe CorporationInventor: Sang-Cheol Lee
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Patent number: 8879260Abstract: The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.Type: GrantFiled: August 7, 2012Date of Patent: November 4, 2014Assignee: Qimonda AGInventors: Sven Kalms, Christian Weiss
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Patent number: 8854806Abstract: A memory protection device and a computer including the memory protection device are disclosed. The memory protection device includes insulating heat-conducting bars which are provided on an upper end of slot arms at two sides of a memory connection base and cover up heat emitting holes of the slot arms.Type: GrantFiled: July 26, 2010Date of Patent: October 7, 2014Inventor: Lin Feng
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Patent number: 8850176Abstract: A speed-up booting module of an electronic device includes a first heat pipe with two ends connected to a first component and a second component respectively, and the first heat pipe including a first working fluid, wherein when a booting process is performed at a first environmental temperature, the heat from the first component in operation is transferred to the second component so that a temperature of the second component reaches an operating temperature; and a second heat pipe with two ends connected to the first component and a third component respectively, and the second heat pipe including a second working fluid, a boiling point of the second working fluid is higher than the boiling point of the first working fluid; wherein at a second environmental temperature, a temperature of the second component reaches the boiling point, the heat from the first component is transferred to the second component.Type: GrantFiled: July 5, 2012Date of Patent: September 30, 2014Assignee: Getac Technology CorporationInventor: Chi-Jung Wu
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Publication number: 20140268553Abstract: A system for cooling multiple in-line CPUs in a confined enclosure is provided. In an embodiment, the system may include a front CPU and a front heat sink that may be coupled to the front CPU. The front heat sink may have a plurality of fins and a corresponding fin pitch. The system may further include a rear CPU disposed in line with the front CPU and a rear heat sink coupled to the rear CPU. The rear heat sink may have a plurality of fins and a corresponding fin pitch. The fin pitch of the rear heat sink may be higher than the fin pitch of the front heat sink. In another embodiment, the front and rear heat sinks may be coupled together by one or more heat pipes.Type: ApplicationFiled: June 28, 2013Publication date: September 18, 2014Inventors: Kevin Lee Van Pelt, Theodore Robert Johnson, Robert Michael Kinstle III
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Patent number: 8837139Abstract: A flat radiator with flat type heat pipe and its application for portable computers is provided. The heat pipe in a radiator use tubular type and plate type structures. An air convective extended heat exchange surface surrounds and is over against the fan impeller, such that the radiator is extremely compacted, and the heat transport distance in heat pipe is shortened. Further introducing enhanced convective heat transfer structure and setting the fins according to the aerodynamics improve the heat dissipating capacity. The restrictions to a radiator when installing are reduced, which helps to implement the standardization of the radiator series. Also portable computers using the radiator are provided.Type: GrantFiled: July 28, 2008Date of Patent: September 16, 2014Inventor: Biao Qin
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Patent number: 8804336Abstract: A heat dissipating apparatus includes a centrifugal fan, a heat sink and a heat pipe. The centrifugal fan includes a frame and an air outlet defined on the frame. The heat sink is arranged adjacent to the air outlet of the centrifugal fan. The heat pipe includes an evaporation section and a condensation section extending from the evaporation section. The condensation section is connected to the heat sink. The evaporation section is for absorbing heat from a first and second heat generating component. The frame includes an elastic plate abutting to the evaporation section of the heat pipe and applying a force to the evaporation section of the heat pipe. An electronic device equipped with the heat dissipating apparatus is also provided.Type: GrantFiled: August 25, 2011Date of Patent: August 12, 2014Assignee: Foxconn Technology Co., Ltd.Inventor: Chih-Peng Lee
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Patent number: 8792241Abstract: An assembly includes an electronic device casing, a heat-dissipating module and a waterproofing module. The electronic device casing is formed with an encircling wall. The encircling wall has a wall body and an apertured portion formed in the wall body. The heat-dissipating module is coupled to the electronic device casing, is surrounded by the encircling wall, and includes a heat pipe extending through the apertured portion. The waterproofing module includes a waterproofing element that has a ring portion disposed on a top rim of the wall body, and a sleeve portion having a first sleeve segment that is connected to the ring portion, that is sleeved on the heat pipe and that engages the apertured portion so as to establish water tightness between the heat pipe and the apertured portion.Type: GrantFiled: December 19, 2011Date of Patent: July 29, 2014Assignee: Wistron CorporationInventors: Po-Yuan Hsu, Wei-Cheng Wang, Chen-Yu Li, Hsing-Wang Chang, Tsung-Hsien Chen, Chia-Cheng Su
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Patent number: 8792238Abstract: A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium.Type: GrantFiled: February 3, 2012Date of Patent: July 29, 2014Assignee: Celsia Technologies Taiwan, Inc.Inventors: George Anthony Meyer, IV, Chien-Hung Sun, Chieh-Ping Chen, Yung-Tai Lu, Ming-Kuei Hsieh
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Patent number: 8792240Abstract: A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate (1). The substrate (1) having a surface where a heat absorbing surface (5) is formed. There are multiple hollow conduits inside the substrate (1) to act as evaporating conduits (6). The heat dissipation device further comprises condensing conduits (7) intercommunicated with the evaporating conduits (6). The evaporating conduits (6) and the condensing conduits (7) form sealed conduits. The sealed conduits are filled with liquid which vaporizes upon heating. At least the evaporating conduits (6) are set in the substrate (1).Type: GrantFiled: December 15, 2011Date of Patent: July 29, 2014Assignee: Huawei Technologies Co., Ltd.Inventors: Taqing Feng, Zhijian Li, Yuping Hong, Hongliang Chen, Jian Shi
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Patent number: 8792235Abstract: According to one embodiment, a heat radiation block is pressed in contact with a heat receiving plate of an apparatus body, a heat receiving block receives its reaction force via a heat pipe and thus moves. A drawer section and the heat radiation block are fixed and held in the apparatus body after the movement of the heat receiving block.Type: GrantFiled: May 2, 2012Date of Patent: July 29, 2014Assignee: Toshiba Tec Kabushiki KaishaInventor: Kazuyuki Matsumura
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Patent number: 8780559Abstract: An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.Type: GrantFiled: December 29, 2011Date of Patent: July 15, 2014Assignee: General Electric CompanyInventors: Stanton Earl Weaver, Jr., Tao Deng, Hendrik Pieter Jacobus de Bock, Shakti Singh Chauhan
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Patent number: 8773855Abstract: A heat-dissipating device and an electronic apparatus having the same are disclosed. The heat-dissipating device includes a heat-transferring heat pipe unit having a wick type of a heat pipe, in which a wick is formed on an inner surface of the heat pipe and a working fluid is injected into the heat pipe, and a heat-dissipating heat pipe unit having an oscillating capillary type of a loop heat pipe, in which the loop heat pipe is formed as a capillary and a working fluid is injected into the loop heat pipe. Here, the heat pipe includes a radiator being disposed adjacent to a heat source and transporting heat transferred from the heat source to the loop heat pipe, and the loop heat pipe includes a heat-receiving portion, which is thermally coupled to the radiator, and a heat-dissipating portion, which releases heat absorbed from the heat-receiving portion.Type: GrantFiled: November 21, 2011Date of Patent: July 8, 2014Assignee: Zaonzi Co., Ltd.Inventor: Sang-Cheol Lee
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Publication number: 20140185232Abstract: In some embodiments, cooling devices with metal hydrides are disclosed.Type: ApplicationFiled: December 27, 2012Publication date: July 3, 2014Inventors: Dhanesh Chandra, Daryl J. Nelson, Muralidhar Tirumala, Anupam Kumar, Anjali Talekar
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Patent number: 8767390Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a first back plate on the circuit board, a second back plate on the circuit board, and a connecting portion connecting the first back plate with the second back plate.Type: GrantFiled: June 15, 2012Date of Patent: July 1, 2014Assignee: Kabushiki Kaisha ToshibaInventors: Koichiro Takeguchi, Yasuyuki Horii, Shingo Koide
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Patent number: 8760862Abstract: A portable electronic device, which including a casing, a circuit board, a fan and a heat dissipating device, is disclosed. The circuit board is disposed in the casing and includes at least one electronic component thereon. The fan is disposed in the casing. The heat dissipating device is disposed in the casing and near the side of an air outlet of the fan. Gaps formed between the outer surfaces of the heat dissipating device and the inner surfaces of the casing as air flow channels. The portable electronic device isolates heat conducted to the casing of the portable electronic device via the gaps.Type: GrantFiled: January 5, 2012Date of Patent: June 24, 2014Assignee: Asustek Computer Inc.Inventor: Cheng-Yu Wang
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Patent number: 8760864Abstract: A heat-dissipation structure for a portable folding electronic apparatus includes a hinge support and a heat-conducting device. The portable folding electronic apparatus includes a first casing, a second casing, a hinge, a panel module, and the heat-dissipation structure. The first casing and the second casing are pivotally connected by the hinge. The panel module includes a frame and a light source disposed at a corner of the frame. The hinge support is connected to the hinge and the frame. The heat-conducting device is fixed on the hinge support near the light source. Therefore, heat produced by the light source can be dissipated through the heat-conducting device for improving the optical effect of the panel module; deformation of the heat-conducting device can be reduced by use of the stiffness of the hinge support.Type: GrantFiled: April 29, 2012Date of Patent: June 24, 2014Assignee: AU Optronics Corp.Inventor: Ho-Hsing Chiang