Abstract: A processing module is provided that comprises a set of processing module sides, each comprising a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side couples to another processing module side to form a modular processing module. The modular processing module comprises an exterior connection to a power source and a communication system and a plurality of cold plates coupled to the plurality of processing nodes. Liquid coolant is circulated through the plurality of cold plates via a closed loop by at least one pump through a plurality of tubes and through at least one heat exchanger. The at least one heat exchanger is coupled to an exterior portion of the processing module. The at least one heat exchanger cools the liquid coolant using air surrounding the processing module.

Abstract: Systems and methods are provided for controlling the temperature of an electronic component of a computer. In one embodiment, a system includes a compressor, a compact cooling block, a condenser, and a controller. The compressor compresses or cools a refrigerant. The condenser receives the refrigerant and condenses the refrigerant. The compact cooling block is thermally coupled to an electronic component of a computer, receives the refrigerant from the condenser, transfers thermal energy from the electronic component to the refrigerant, and sends the refrigerant to back to the compressor. The controller is in electronic communication with the compressor and controls the compressor based on a pulse-width modulation (PWM) signal in order to maintain a temperature range for the electronic component. In another embodiment, a system is provided that controls the temperature of a circulating liquid that, in turn, cools an electronic component of a computer.

Abstract: A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through tinned tubes exposed to the surrounding air.

Abstract: A retaining device for a printed circuit board includes an expandable bladder. The bladder is responsive to a source of pressurized fluid for selectively clamping a printed circuit board within a slot of an associated cooling and/or storage chassis. A method for retaining a circuit card within a chassis includes pressurizing a volume of fluid, and filling an expandable bladder with the pressurized fluid; wherein filling of the bladder causes its expansion and clamps a circuit card within the chassis.

Abstract: A thermosiphon system includes a condenser and an evaporator fluidically coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick.

Abstract: A computer casing includes several electronic components, a first heat sink, a side plate, a second heat sink, a container, a pump, and a tube. The first heat sink is attached to an electronic component, and defines a channel including an inlet and an outlet. The side plate defines an opening. The second heat sink is fixed to the side plate and covers the opening. The second heat sink includes a first side facing the opening and an opposite side external to the side plate. The container is used to store coolant and is fixed to the first side of the second heat sink. A pump is connected to the container. The tube includes a first end connected to the pump and a second end connected to the inlet of the channel of the first heat sink, and stays in contact with the first side of the second heat sink.

Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.

Abstract: A container data center is disclosed in the present invention, relating to the field of data centers. The container data center includes: a container box, in which the inside of the box is divided into an equipment compartment, a power supply and distribution compartment and a water chilling set compartment; doors set in the box; a power supply equipment installed in the power supply and distribution compartment; an electronic equipment and a water chilling terminal installed in the equipment compartment; a water chilling set installed in the water chilling set compartment, in which the water chilling set is in communication with the water chilling terminal to provide cold water for the water chilling terminal.

Abstract: A thermal interposer for a heat-generating electronic component located on an adapter card of a computer includes a thermally conducting planar body. The thermally conducting planar body may be configured to be coupled to the adapter card such that a first surface of the planar body is in thermal contact with a surface of the electronic component. The thermal interposer may also include a cold plate assembly removably coupled to a second surface of the planar body opposite the first surface. The cold plate assembly may include an inlet adapted to receive a cooling liquid into the cold plate assembly and an outlet adapted to discharge the cooling liquid from the cold plate assembly.

Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.

Abstract: A method of facilitating cooling of an electronics board having a plurality of electronic components mounted to the board by providing an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.

Abstract: A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.

Abstract: A method and apparatus for controlling and monitoring an air-conditioning system of a data processing installation includes at least one server switchgear cabinet for accommodating electrical units. Controlling of the cooling power of an air-conditioning unit is performed in at least two distinct defined modes, wherein in a first mode the air volume capacity of a blower is controlled to a minimum value at a maximum defined temperature difference between sucked hot air and supplied cold air, and in a second mode the cooling power is controlled such that a maximum defined temperature for the cooling medium flowing from a heat exchanger is not exceeded. The method and apparatus provide energy-saving cooling of such data processing installations.

Abstract: A heat dissipation device is provided in the present disclosure, where the heat dissipation device includes a hollow heat-sink base and a set of fluid tube. The fluid tube is inserted in the heat-sink base, and a cooling medium circulates in the fluid tube. The heat-sink base includes a heat absorption area configured to absorb heat. A cooling fluid, received in the heat-sink base, may be vaporized at the heat absorption area to absorb the heat taken by the heat absorption area, and condensed at a position that is inside the heat-sink base and away from the heat absorption area and on the fluid tube to release the absorbed heat.

Abstract: A composite component includes a first joining partner, at least one second joining partner and a first joining layer situated between the first joining partner and the second joining partner. In addition to the first joining layer, at least one second joining layer is provided between the first and the second joining partner; and at least one intermediate layer is situated between the first and the second joining layer.

Abstract: A cooling system for computer systems is disclosed. In one aspect, a method includes providing a flow of liquid coolant through conduits positioned within a server system, and spraying the liquid coolant via at least one outlet mechanism of each of the conduits. The outlet mechanisms are adapted to be placed in close proximity to a corresponding target component of one of the servers, to cool the target component.

Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.

Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.

Abstract: A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly, and then forms another metallic seal between the device assembly and a housing. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Abstract: A heat exchanger door is provided which includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly further includes an air-to-coolant heat exchanger and a structural support. The heat exchanger is disposed so that airflow through the airflow opening passes across the heat exchanger. The heat exchanger includes a heat exchanger core and a heat exchanger casing coupled to the core. The core includes at least one coolant-carrying channel which loops through the casing. The structural support is attached to the heat exchanger casing to define with the casing a tubular door support structure. The looping of the coolant-carrying channel(s) through the heat exchanger casing resides within the tubular door support structure.

Abstract: A method is provided which includes providing a heat exchanger door that includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly further includes an air-to-coolant heat exchanger and a structural support. The heat exchanger is disposed so that airflow through the airflow opening passes across the heat exchanger. The heat exchanger includes a heat exchanger core and a heat exchanger casing coupled to the core. The core includes at least one coolant-carrying channel which loops through the casing. The structural support is attached to the heat exchanger casing to define with the casing a tubular door support structure. The looping of the coolant-carrying channel(s) through the heat exchanger casing resides within the tubular door support structure.

Abstract: A heat transferring module adapted to an electronic device is provided. The electronic device includes at least one heat source and a plurality of ready-to-heat elements. The heat transferring module includes at least one water head, at least two loop heat pipes, at least two pumps, and a working fluid. The water head is thermally connected to the heat source. The loop heat pipes are connected to the water head respectively, and at least one of the loop heat pipes is thermally connected to the ready-to-heat elements. Each pump is connected to the corresponding loop heat pipe. The working fluid flows into the water head and at least one of the loop heat pipes by at least one of the pumps, so heat generated by the heat source is transferred to at least one of the ready-to-heat elements. A method of starting up an electronic device is also provided.

Abstract: At least one cooling channel is positioned adjacent to an electronic component. The cooling channel communicates with plenums at each of two opposed axial ends. A dielectric fluid is received in the cooling channel. The cooling channel is provided with at least one electrode. A potential is applied to the at least one electrode such that an electric field magnitude at the downstream end of the channel is less than an upstream electric field magnitude, and such that a dielectrophoretic force on a bubble in the cooling channel will force it downstream.

Abstract: Disclosed is a member that contains electronic components. Using the member, when, for example, a vehicle or the like carrying electronic components such as an inverter collides with an external object, there is prevented damage to a housing containing the electronic components, which would otherwise occur due to interfering objects. Furthermore, the disclosed member can dissipate heat produced by the contained electronic components. The member includes a housing for containing electronic components, a cooling passage that is provided inside the housing and uses a refrigerant to cool the electronic components, and a heat dissipation part that dissipates heat from the cooling passage and prevents the housing from being damaged by impacts from external interfering objects.

Abstract: A housing can have a cap, a base member and a mid-portion positioned between and removably coupled with the cap and the base member. The cap and the mid-portion can define a reservoir therebetween and the cap can define a recessed inner wall in fluid communication with the reservoir. The mid-portion can define a recessed impeller chamber configured to receive a pump impeller. The mid-portion can further define a retainer positioned between the impeller chamber and the inner chamber. A resiliently compressible member can be positioned within the inner chamber and configured to resiliently compress in response to a volumetric expansion of the liquid coolant. The retainer can contact the resiliently compressible member to prevent the resiliently compressible member from moving out of the reservoir or into a position blocking a liquid coolant flow through a port. The mid-portion can define a housing wall forming the retainer.

Abstract: A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being provided to those cores in a more active state and less cooling provided to those cores in a less active state.

Abstract: Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.

Abstract: A device has a passive cooling device having a surface, at least one active cooling device on the surface of the passive cooling device, and a thermal switch coupled to the passive cooling device, the switch having a first position that connects the active cooling device to a path of high thermal conductivity and a second position that connects the passive cooling device to the path of high thermal conductivity.

Abstract: Embodiments of the disclosure may include a thermal management system. The thermal management system may include a cooling apparatus including a cooler block configured to retain at least one fluid channel, wherein the at least one fluid channel is configured to circulate a coolant within the cooler block and at least one plate mounted to the cooler block, wherein the at least one plate is comprised of a heat-conducting material, wherein the at least one fluid channel faces the at least one plate to be in thermal contact with the at least one plate. The system may also include a hard drive mounted onto the at least one plate, wherein heat generated by the hard drive is transferred to the at least one plate and removed from the at least one plate by the coolant circulating within the cooler block.

Abstract: A cooling coolant pipe of a server cabinet includes multiple tube bodies interconnected in series and at least one adjustable valve. In each of the tube bodies a first chamber and a second chamber that are adjacent to and separated from each other, the second chambers of the two adjacent tube bodies are in communication with each other, and a wall surface of each of the tube bodies has at least one connection port in communication with the first chamber. The adjustable valve is disposed in one of the tube bodies. The first chamber in each of the tube bodies is in communication with the second chamber in the tube body through the adjustable valve. In this way, the adjustable valve adjusts the flow rate of a cooling fluid flowing from the second chamber to the first chamber.

Abstract: A cooling device of a computer rack equipped with a back panel including an evacuation zone, toward the exterior of the rack, of air having circulated over electric power components arranged within the computer rack and a rear door in the thickness of which air cooling means is arranged. The cooling device also includes a supporting frame on which the rear door is mounted, molded to surround the air evacuation zone of the computer rack, and removable positioning means of the supporting frame against the back panel of the computer rack.

Abstract: A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

Abstract: A cooling module applicable in an electronic device is provided. The electronic device includes a plurality of first heat sources and a plurality of second heat sources. The cooling module includes a cooling loop and a plurality of heat pipes. The cooling loop includes a plurality of cooling units. The cooling units are connected in series through a plurality of connection tube and each cooling unit is thermally coupled to one of the first heat source. The heat pipes are thermally coupled to the second heat sources and the cooling units. When the cooling unit is in failure, the cooling units can be directly removed and replaced. Also, the second heat sources of the electronic device are capable of exchanging heat with the cooling unit through the heat pipe.

Abstract: Data center capsules providing modular and scalable capacity with integrated power and thermal transmission capabilities. Modular integrated central power system (“ICPS”) to fulfill the power and thermal needs of data center environments or other mission critical environments. Computer-based systems and methods for controlling the energy- and thermal-envelope of any single data center environment or other mission critical environment, or an ecosystem of multiple data center environments or multiple other mission critical environments.

Abstract: A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat from the rack of information technology equipment.

Abstract: An automotive power converter may include a cold plate, a printed circuit board spaced away from the cold plate and including at least one heat generating electrical component attached thereto, and another printed circuit board disposed between the cold plate and the printed circuit board spaced away from the cold plate. The converter may further include at least one thermally conductive element configured to provide a thermally conductive path from the at least one heat generating electrical component to the cold plate. The at least one thermally conductive element may pass through the printed circuit boards.

Abstract: A system for transferring heat from an electrical enclosure is provided. An electrical enclosure defines a housing area in which one or more electrical devices are housed. A heat pump extends through the electrical enclosure, the heat pump defining a channel configured to communicate fluid for transferring heat from the one or more electrical devices. The electrical enclosure is substantially sealed from the heat pump channel and from other areas outside the electrical enclosure.

Abstract: Provided is a system and method of circulating a cooling fluid in a cooling system. For example, provided is a system, comprising a modular unit configured to mount into a computer drive bay, comprising a pump and a reservoir, configured to gravity feed a fluid to the pump, wherein the reservoir is positioned at least partially directly above the pump.

Abstract: Thermal management systems for semiconductor devices are provided. Embodiments of the invention provide two or more liquid cooling subsystems that are each capable of providing active cooling to one or more semiconductor devices, such as packaged processors. In operation, a first liquid cooling subsystem can provide active cooling to the semiconductor device(s) while the second cooling subsystem is circulating a heat transfer fluid within its own subsystem. The second liquid cooling subsystem can be then switched into operation and provides active cooling to the semiconductor device(s) while the first cooling subsystem is circulating heat transfer fluid within its own subsystem. In alternate embodiments, the heat transfer fluid remains in the subsystem, but does not circulate within the subsystem when the subsystem is not providing cooling to the semiconductor device(s). The subsystems comprise heat dissipation units.

Abstract: Systems, methods and other means for improving rack based systems are discussed herein. Some embodiments may provide for a module for insertion in a rack based system. The module may include a brain board, a plurality of lobe components, a network switch, and a power lobe component. The plurality of lobe components may be coupled to the brain board and may each be configured to support a variable composition of processing and storage elements. Furthermore, the module may be configured to thermally couple with the rack based system to receive cooling from the rack based system.

Abstract: A cooling apparatus for a printed circuit board assembly is disclosed. The cooling apparatus comprises a main printed circuit (PC) board 202. The main PC board 202 has a plurality of connectors 210 mounted, in a parallel row, onto the top side of the main PC board 202. A first liquid cooling manifold 204 is positioned along one end of the parallel row of connectors 210 and a second liquid cooling manifold 206 is positioned along the other end of the parallel row of connectors 210. A plurality of heat sink devices 208, each having an elongated shape, run parallel to, and on each side of, the plurality of connectors 210. The plurality of heat sink devices 208 are coupled to the first and second liquid cooling manifolds.

Abstract: Disclosed herein is a semiconductor package. The semiconductor package includes a semiconductor module, a first heat dissipation unit, a second heat dissipation unit and a housing. The semiconductor module contains a semiconductor device. The first heat dissipation unit is provided under the semiconductor module. The first heat dissipation unit includes at least one first pipe through which first cooling water passes. A first rotator is rotatably disposed in the first pipe. The second heat dissipation unit is provided on the semiconductor module. The second heat dissipation unit includes at least one second pipe through which second cooling water passes. A second rotator is rotatably disposed in the second pipe. The housing is provided on opposite sides of the semiconductor module, the first heat dissipation unit and the second heat dissipation unit and supports the semiconductor module, the first heat dissipation unit and the second heat dissipation unit.

Abstract: A cooling device of the present invention includes: a substrate having a first surface which supports an electronic component and a second surface on an opposite side to the first surface; a container which can form a space between itself and the second surface of the substrate; and an evaporation section which is thermally connected to the electronic component supported on the substrate, which is arranged in the space so that at least a portion thereof is in contact with a liquid within the space, and which changes a phase of at least a portion of the liquid to gas on a basis of heat generated by the electronic component.

Abstract: Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame.

Abstract: A heat exchanger structure including multiple fluid circuits, through which respective streams of a first fluid pass from a stream inlet to a stream outlet to transfer heat to or from a second medium. The fluid circuits are arranged into at least a first group and a second group, at least the first group consisting essentially of only fluid circuits that perform substantially similarly according to at least one selected performance criterion. A control sensor for at least the first group generates a signal representative of a parameter of the first fluid in the associated group. A valve for at least the first group is in fluid communication with of all the streams of the associated group so as to be able to control the flow of fluid through the streams of the associated group in parallel.

Abstract: A rack includes a first pole, a second pole, a third pole, a fourth pole, four beams connected between the first to fourth poles, a number of first connection poles connected between the first pole and the second pole, and a number of second connection poles connected between the third pole and the fourth pole. The first to fourth poles, the beams, the first connection pole, and the second connection pole are all tubular and communicate with each other internally. A pump is arranged in a middle of each beam. Each first connection pole has a substantially same height with one of the second connection poles for sandwiching, together with the second connection pole, a liquid cooling server module which is operable to communicate with the rack internally to circulate cooling liquid.

Abstract: A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

Abstract: An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.

Abstract: A cooling device of a computer rack equipped with a back panel including an evacuation zone, toward the exterior of the rack, of air having circulated over electric power components arranged within the computer rack, and a rear door in the thickness of which air cooling means is arranged. The cooling device also includes a supporting frame on which the rear door is mounted, molded to surround the air evacuation zone of the computer rack, and removable positioning means of the supporting frame against the back panel of the computer rack.