Abstract: A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.

Abstract: Air in the first section is allowed to run into a second section through first and second air vents in an electronic apparatus. This causes an increase in the amount of airflow in the first section. In particular, if the pressure loss is larger in the first section, airflow blocked in the first section is forced to run into the second section. A smooth airflow can be established in the first section. Moreover, if the pressure in the first section is set larger than the pressure in the second section, a smoother airflow is established from the first section to the second section. A further superior airflow can be established in the first section.

Abstract: According to one embodiment, an electronic device includes a housing including an opening, a partition wall which partitions an interior part of the housing into a first chamber and a second chamber which is opened to the outside through the opening, first and second heat generating parts mounted in the first chamber, a first heat radiation member located in the second chamber, a heat transfer member which transfers heat generated by the first heat generating part, a cooling fan which draws outside air and exhausts the air against the first heat radiation member, a second heat radiation member which is exposed to the outside of the housing and is thermally connected to the second heat generating part, and a cover covering the opening and the second heat radiation member. The cover forms a gap between the cover and the housing. The gap communicates with the second chamber.

Abstract: A case for covering electronic parts and efficiently discharging heat generated from the electronic parts and a display apparatus including the case are provided. The case includes at least one partition wall partially separating at least an inner space of the case. An entry portion, through which air flows in, and an exit portion, through which the air having flowed in through the entry portion and then having absorbed heat from the electronic parts flows out, are formed in each plane of the case. Each plane is separated by the partition wall.

Abstract: A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front face of the cooling unit to cool the rack. The cooling unit is configured to release the cooled air along a substantial portion of a height of the front face of the rack.

Abstract: The present invention provides a configuration of a hard drive enclosure system and method for manufacture in which a polymer including electromagnetic interference shielding (EMI shielding) properties is configured such that shielding gaskets may be reduced or eliminated completely. Patterned honeycomb “tubes” are molded into the front wall of the front panel providing access to the interior of the front plate, and allowing ventilation. Other EMI shielding cuts may be molded or stamped into the sides of the disk-drive enclosure and raised tab structures allow the enclosure to be placed in an array. The container is generally stamped, molded or extruded from Premier® or another EMI-shielding polymer material that provides sufficient EMI shielding.

Abstract: A communication cabinet, that includes: at least one fan, adapted to rotate at a first direction during a first period and to rotate at a second opposing direction during a second period; a controller, adapted to control the at least one fan; and at least one filter positioned to prevent dust from entering the communication cabinet and to allow air to exit the communication cabinet such as to remove dust from the filter during the second period. A method for dust removal from a filter, the method includes: providing communication cabinet that comprises the filter, whereas the filter is positioned such as to prevent dust from entering the communication cabinet; rotating at least one fan at a first direction during a first period such as to cool at least one communication circuit installed within the communication cabinet; and rotating the at least one fan at a second opposing direction during a second period such as to remove dust from the at least one filter.

Abstract: The invention relates to a computer rack, frame or system having a direct current power supply positioned at the upper portion of the rack. In one variation, the DC power supply is placed in the highest shelf in the computer rack. In another variation, the DC power supply is placed on top of the computer rack. In yet another variation, a dual column computer rack with a back-to-back configuration is implemented with DC power supplies placed in a top shelf of the one of the computer columns. The DC power supply may comprise of one or more direct current power supply modules configured to provide fail over protection. In another aspect of the invention, the power supply modules are placed in a separate rack and provide direct current to support computers in one or more computer racks.

Abstract: A fan impeller of a heat-dissipating fan device is mounted in a receiving space of a fan housing, and includes coupling ribs that extend radially and outwardly from an outer surrounding surface of a hub cap and that are spaced apart angularly from each other, a smaller-diameter first connecting ring disposed coaxially around an intermediate portion of the hub cap and connected to the coupling ribs, a larger-diameter second connecting ring disposed coaxially around a lower portion of the hub cap, and fan blades that are spaced apart angularly from each other. Each fan blade has a first blade body connected to and disposed uprightly on the first connecting ring, and a second blade body connected to and extending radially from the first blade body and having a bottom end connected to the second connecting ring.

Abstract: A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing the surface area exposed to the cooling fluid. In one embodiment, the cooling fluid moves parallel to the base plate, and the discharge openings are oriented to discharge fluid in the same direction as the pump output, +/−90 degrees. Baffles may be added to duct the cooling fluid over the heat sink. In another embodiment, the cooling fluid moves perpendicular to the base plate and the discharge openings are oriented to vent the cooling fluid along lines that extend outward from a center point of the base plate, or along radial lines drawn from a central point through the pin-fins.

Abstract: The present invention relates to a package structure compatible with a cooling system, the package structure comprising a carrier, a chip, a mold compound and a cooling tubule that can be connected to a cooling system. The chip is arranged on the carrier and electrically connected to the carrier, while the mold compound covers the chip and one surface of the carrier. The cooling tubule is disposed either within the mold compound or on an outer surface of the mold compound. The cooling tubule is connected to a cooling tubing of the cooling system and a fluid driven by a pump circulates in the cooling tubing and the cooling tubule for heat dissipation.

Abstract: The present invention is related to a venting apparatus for a computer. The apparatus includes a chassis plate and a venting plate. The chassis plate has a first hole and a second hole. The venting plate has a plurality of venting apertures. The venting plate is selectively disposed over the first hole and the second hole.

Abstract: A mobile computer comprising a lower panel, a top panel, side panels, an electrical computer component, a plurality of keyboard keys, and a computer screen. The lower panel can be located over a horizontal surface. The top panel is vertically spaced from the lower panel. The side panels extend between the lower panel and the top panel. The panels define a housing. An air inlet opening is formed into the housing and an air outlet opening is formed at a higher elevation than the air inlet opening out of the housing. The electrical computer component is located within the housing. Power up of the component causes heating thereof. Air follows a natural convection path being through the air inlet opening into the housing, over the component, and out of the housing through the air outlet opening. The keys are located on the housing. The computer screen is mounted to the housing.

Abstract: A semiconductor clamped-stack assembly (32) has at least two clamped stacks, each of these clamped stacks having a plurality of power semiconductor components (8) and a plurality of heat sinks (6), which are arranged in series along a horizontally extending axial direction (A). According to the invention, power semiconductor components (8) from different clamped stacks are assigned to one another and are located in a common mounting plane, which is perpendicular to the axial directions (A) of the clamped stacks (31). Mutually associated power semiconductor components (8) can be removed from the clamped-stack assembly or, respectively, inserted into the clamped-stack assembly in a common mounting direction, which lies in the mounting plane. Mutually associated power semiconductor components (8) are preferably mounted on a common plate (14). As a result, they can be dismantled when the clamped-stack assembly (32) is loosened, without further power semiconductor components or heat sinks having to be dismantled.

Abstract: An electronic package in which an electronic component (e.g., LSI chip module) includes a heat dissipating surface (e.g., metal layer) and is positioned on a printed wiring board such that the heat dissipating surface is located adjacent a heat transfer area on the board. The heat transfer area is in the form of a pattern of solder-applied areas from which the solder bonds to the heat dissipating layer to provide heat transfer from the component to the board. Through holes may also be used in the board to increase heat removal.

Abstract: An electromagnetic interference (EMI) shielded vent panel construction for disposition over an opening of an electronics enclosure. The panel includes an electrically-conductive media having an outer periphery supported within an electrically-conductive frame. The frame is configured as including an elongate end wall, and a pair of oppositely-disposed side walls. Each of the side walls has an outer surface, one of which is disposable about the opening of the enclosure in electrically-conductive adjacency with the surface thereof, and an inner surface spaced-apart from the inner surface of the other of the side walls. The outer periphery of the media is retained intermediate the inner surfaces of the side walls.

Abstract: An electromagnetic interference (EMI) shielded vent panel construction for disposition over an opening of an electronics enclosure. The panel includes an electrically-conductive medium having an outer periphery supported within an electrically-conductive frame. The frame is configured as having a generally C-shaped cross-sectional profile and includes an elongate end wall having an interior an exterior surface, and a pair of oppositely-disposed side walls extending from the end wall interior surface. Each of the side walls has an outer surface, one of which is disposable about the opening of the enclosure in electrically-conductive adjacency with the surface thereof, and an inner surface spaced-apart a first predetermined distance from the inner surface of the other of the side walls. The outer periphery of the medium is received intermediate the inner surfaces of the side walls such that each extends over a corresponding edge portion of the medium faces.

Abstract: An apparatus and method for cooling heat generating components within a compartment are disclosed. A cooling assembly isolates heat produced by a processor in a personal computer (“PC”) system and exhausts it from the PC prior to adversely affecting other components within the PC. A fan causes air to blow across the processor having an attached heat sink disposed within the cooling assembly, and the air exits the cooling assembly without adversely affecting the other components surrounding the processor. In one example, an alternative passage is provided for the air.

Abstract: A computer for a server or work station which has two air cooling streams one stream leads from outside the chassis across the motherboard and through a vented power supply then directly into the environment and is driven by a fan inside the power supply. This air stream independently and directly removes the major source of heat which is the power supply. The second air stream circulates from outside the chassis through the hard drives and out of openings adjacent the hard drives and is driven by fans positioned between the hard drives and vented openings in the chassis. The efficient heat removal is compatible with an arrangement of components in the chassis such that the overall height is less than 3½. The reduced height and efficient heat removal make the computer ideally suited for mounting in a server chassis with other servers where close spacing is desired.

Abstract: A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A laterally Enlarged heat sink section is integrally formed on the evaporating end portion and has a flat bottom side and an arcuate top side.

Abstract: The inventive EM panel comprises multiple layers of perforated metal sheets that are electrically connected with each other. Since multiple sheets are used, the holes can be larger than in a single sheet shield, as attenuation improvements from increased panel thickness can be traded for attenuation reductions from increased hole size. The metal sheets are perforated with equal-sized holes in a common pattern. The metal sheets are arranged in a stack such that the equal-sized holes have co-located centers. Also the holes of each sheet are lined up such that air enters the panel through the side of the panel with beveled holes. The bevel is formed from the punch used to make the holes. This prevents dust from clogging the panel. The sheets of the panel are electrically connected at the periphery of the sheets via a rivets or a gasket.

Abstract: A method (and structure) for cooling a portable computer includes attaching a portable computer to a holder, transferring heat of a heat-generating component disposed within the portable computer to the holder, and releasing the transferred heat to the atmosphere. The portable computer includes a fixture for detachably fixing the portable computer to the holder, a heat release device for releasing heat of a heat-generating component disposed within the portable computer to the outside, and a supporter which supports the fixture and the heat release device.

Abstract: A portable computer includes a base having a heat producing electronic component mounted therein. A heat sink, also referred to as a remote heat exchanger, is positioned in the base adjacent to the heat producing component. A heat pipe has a first end permanently bonded to the heat sink and extends to a second end thermally engaged with the heat producing component. The heat sink and heat pipe assembly is rotatable about an axis of the heat sink so as to move the second end of the heat pipe into and out of thermal engagement with the heat producing component.

Abstract: A back cover assembly is provided for use in a device including a housing having a plurality of walls forming an enclosure. A blower mechanism is adapted to cause exhaust air to flow from an interior of the housing to an exterior of the housing. The back cover assembly is located in proximity with the blower mechanism, and includes an acoustical chamber adapted to permit exhaust air from the interior of the housing to pass therethrough. The acoustical chamber is adapted and constructed to reflect acoustical energy back into the blower mechanism. In an embodiment, at least one interior surface of the acoustical chamber is lined with a sound absorbing material such as polyurethane polyester foam. The acoustical chamber can include a front wall with at least one inlet open to blower mechanism, and a rear wall with at least one outlet. The outlet is in fluid communication with the at least one inlet on the front wall, and is open to the exterior of the housing.

Abstract: In a modern computer, heat is removed from the internal power supply unit by means of a fan and ducting for channeling the airflow created by the fan through the circuitry of the power supply unit. The fan draws part of its air supply from the ambient air inside the computer casing and this helps to cool other components of the computer such as the microprocessor. As the power of microprocessors increases, the cooling requirement for this component has increased and heat sinks have been utilised to increase heat transfer to the surrounding air. Whilst further augmentation of heat removal could be achieved by increasing the power of the cooling fan, this would also increase noise levels. The present arrangement provides for increased heat removal without increasing fan power by arranging for the microprocessor heat sink to project into the ducting used to channel cooling air over the circuitry of the power supply unit.

Abstract: EMI-attenuating air ventilation panel for electrical and electronic systems. An opening through a metallic panel is realized using an extrusion method in order to obtain a tube leaving the opening at one end. The periphery of the opening at the other side of the extruded tube has a smooth edge in order to improve air circulation. A multitude of such extruded holes are critically placed on the panel to form an array. The panel in turn is mounted in an electrical or electronic system to allow air cooling while the extruded tubes attenuate EMI radiation to and from electrical circuits.

Abstract: An enclosure panel for covering the access opening in an equipment compartment includes a main panel body which is constructed and arranged so as to attach directly to the equipment compartment in such a way as to substantially cover the access opening. The main panel body defines a plurality of oblong slots which are arranged into a plurality of side-by-side columns wherein each column is configured with a substantially uniform herringbone pattern. The herringbone pattern provides a unique and preferred compromise between a uniform pattern of oblong slots arranged in columns and rows and a uniform pattern of circular openings arranged in staggered rows and columns. By use of the uniform herringbone pattern the open area for preferred cooling air flow is achieved while at the same time maintaining the structural strength and integrity of the enclosure panel.

Abstract: An electronics cabinet which provides venting of gases within a battery compartment and also protects the inside from wind driven rain and other particles. A cover assembly is provided over the compartment of the cabinet, which assembly includes a cover member with a plurality of louvers and a blocking plate covering the louvers. A fan is mounted in the compartment in order to circulate air within the compartment so as to enhance the venting capability.

Abstract: An apparatus for cooling an integrated circuit device includes a container defining a chamber that is partially filled with a coolant which forms a coolant pool in the chamber, wherein heat generated by the integrated circuit device causes boiling of the coolant in the coolant pool so that vaporized coolant rises upwardly from the coolant pool and condenses on a ceiling of the chamber forming coolant droplets thereon. The apparatus further includes a cooling conduit positioned within the chamber and at least partially out of the coolant pool, the cooling conduit further being positioned (1) in a first path traveled by the vaporized coolant as it rises upwardly from the coolant pool towards the ceiling, and (2) in a second path traveled by the coolant droplets falling from the ceiling due to gravity.

Abstract: A method of forming a multi-layer circuit board or card. The method includes the step of forming a plurality of conductive planes. The conductive planes include ground, signal, or power planes. At least one through hole is formed through at least one of the conductive planes. An electrically conductive material is deposited onto an inside surface of the at least one through hole to form a plated through hole. At least one thermal relief passage is formed at least in the at least one of the conductive planes for preventing the diffusion of heat throughout the circuit board or card during the securing or removal or chips or other components to the circuit board or card by heating the material deposited in the at least one through hole to a temperature above its melting point. The at least one thermal relief passage is located in the vicinity of the at least one through hole and is free from electrical connection therewith.

Abstract: A multi-layer printed circuit board or card including at least one passage in at least one of the layers of the circuit board or card for preventing the diffusion of heat throughout the circuit board or card during the securing or removal of components in plated through holes in the circuit board or card by the heating of the plating material to a temperature above a melting point of the plating material.

Abstract: In an electronic equipment assembly having a plurality of electronic equipment housings tiered, a horizontal air passageway is formed on the lower surface of each bottom plate of each electronic equipment housing, air ventilation openings being formed on the top plate thereof, vertical ducts open to the horizontal air passageway being formed on the outside of the side plate, the cross section of each vertical duct being the same in shape and size. When two electronic equipment housings are tiered, common vertical ducts are formed, through which heated air can be expelled and cables can be routed.

Abstract: A computer assembly comprised of a plurality of modular units which are readily connectable by pluggable terminals to permit quick interchangeability and/or replacement of certain units by untrained and unskilled personnel. The computer assembly includes a docking bay module provided with a number of external connectors for connection to equipment such as a keyboard, printer, cash register, etc., and a power supply plug. A CPU module containing the logic circuitry is slidably mounted in and out of the docking bay module and is readily connected by mating pluggable terminals to the various equipment linked to the external connectors on the docking bay module. A peripheral bay module may be added to the docking bay and CPU modules to function as a file server station in a local area network environment. The CPU module is quickly and conveniently replaced by unskilled personnel for maintenance and repair purposes.