Abstract: A nanosecond pulser system is disclosed. In some embodiments, the nanosecond pulser system may include a nanosecond pulser having a nanosecond pulser input; a plurality of switches coupled with the nanosecond pulser input; one or more transformers coupled with the plurality of switches; and an output coupled with the one or more transformers and providing a high voltage waveform with a amplitude greater than 2 kV and a frequency greater than 1 kHz based on the nanosecond pulser input. The nanosecond pulser system may also include a control module coupled with the nanosecond pulser input; and an control system coupled with the nanosecond pulser at a point between the transformer and the output, the control system providing waveform data regarding an high voltage waveform produced at the point between the transformer and the output.

Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.

Abstract: A cooling system for power semiconductor switches is provided. The cooling system includes a heat sink that is pressed against the power semiconductor switch. A plenum is also provided with an opening through a wall thereof which is aligned with the heat sink. A fan draws air through or around the heat sink and through the plenum wall opening and the plenum in order to cool the power semiconductor switch.

Abstract: Embodiments of the present application provide a laser light source and a laser projection device. The laser light source includes a laser assembly, where the laser assembly includes a laser and a circuit board, the laser includes a substrate and a light emitting chip arranged on the substrate, a lateral surface of the substrate is provided with a plurality of pins extending outwards therefrom, the circuit board is arranged on a side where the pins extend, and the circuit board is electrically connected to the pins. The laser light source of the present application features simple assembling and disassembling, reliable performance and relatively low cost.

Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Abstract: A technology downsizing a control panel unit is provided. The control panel unit for a machine tool comprises a casing, a duct, and a fan. The casing has an openable door. A control device is arranged in an internal space, which is closed when the door is closed. The duct has a groove and a ventilation opening. The groove is closed at a closed end and open to the internal space at an open end. The ventilation opening connects the groove with the internal space in a position nearer the closed end than the open end. The duct is fixed to an inner wall of the casing in such manner as the groove faces the inner wall. The fan is mounted on the ventilation opening. The air in the internal space is taken into the groove enclosed by the inner wall and the duct by the operation of the fan.

Abstract: An electronic display assembly includes a digital side assembly mounted to a first portion of a frame and includes a housing, an electronic display layer located rearward of a cover panel, and a first airflow pathway located rearward of the electronic display layer. An access panel is mounted to a second portion of the frame in a moveable manner and includes a second airflow pathway. An intake and an exhaust are in fluid communication with the first and second airflow pathways.

Abstract: A display apparatus includes a display panel including first display pads and second display pads spaced apart from the first display pads, a main circuit board, a first flexible circuit board which connects the main circuit board to the first display pads, a second flexible circuit board which connects the main circuit board to the second display pads and overlaps at least a portion of the first flexible circuit board, heat radiation members on the first and second flexible circuit boards, and a deformation prevention member spaced apart from the heat radiation members and disposed on at least one of the first and second flexible circuit boards. The deformation prevention member includes a metal.

Abstract: A power assembly that has at least two power modules that each have at least one component to be cooled, for example, an electronic chip mounted on a base from which cooling elements extend. Each power module also has a hollow body with a channel for flow of a coolant fluid Each power module is mounted on each respective body so that the cooling elements extend at least partially into said channel through an opening of the body. At least one deflector is mounted in the channel between the cooling elements of the two modules so as to force the coolant fluid to flow in the zone of the channel comprising the cooling elements.

Abstract: A low-voltage switching device with a nominal device current range of up to 650 A, includes a defined cooling arrangement with a structure that has a lower and an upper device region. Power-electronic components are arranged in the lower device region. In at least one embodiment, only one coolant is provided in the low-voltage switching device. A second coolant is replaced with defined air flow channels.

Abstract: A camera module for a vehicular vision system includes a metallic housing having a metallic upper housing portion and a metallic lower housing portion. A camera is accommodated in the housing and includes an imager circuit board having an imager thereat. The camera includes a lens barrel that protrudes through an aperture of the upper housing portion. A primary circuit board is accommodated in the housing and has an image processor that processes image data captured by the camera. A cooling fan is attached at the lower housing portion and directs airflow between heat dissipating fins of an outer side of the housing, with the heat dissipating fins being in thermal conductive connection via a thermal element with the image processor. The camera module is configured to be disposed at a vehicle windshield so as to have a field of view through the windshield and forward of the vehicle.

Abstract: An electronic apparatus includes: an apparatus chassis including therein an electronic board; a keyboard provided on a top of the apparatus chassis; and a fan device that includes a fan chassis and a blade part. The fan chassis includes a first air intake formed on a bottom surface thereof, a second air intake formed on a top surface thereof, and an air outlet formed on a side surface thereof. The blade part rotates inside the fan chassis. The fan device is arranged between a basal plate and a bottom surface of the keyboard inside the apparatus chassis. The basal plate includes a first inlet at a position overlapping the first air intake. The keyboard includes a second inlet that makes air pass through the keyboard in an up-down direction thereof. The electronic apparatus further includes a first water stop member that separates the first air intake from the electronic board.

Abstract: A motor control device includes a base board, a drive board including switching devices including switching elements for power conversion, disposed along a plane intersecting the base board, and attached to the base board, and a board including a processor configured to execute computation processing for controlling the switching devices, disposed along a plane intersecting the base board, and attached to the base board.

Abstract: According to various embodiments, there is provided a heat sink including: a heat conducting surface; a plurality of nozzle arrays arranged such that output ends of nozzles of the plurality of nozzle arrays face the heat conducting surface; and a plurality of fins configured to at least partially surround a respective portion of the heat conducting surface facing a respective nozzle array of the plurality of nozzle arrays.

Abstract: A radio assembly is provided. The radio assembly includes at least one radio module and a radome. The radio module has a heatsink disposed on one side and a radio module base on the other side thereof. The radio module base is disposed between the heatsink and the radome. The heatsink defines a cable channel for routing at least one power cable and at least one data cable.

Abstract: An electronic device includes a chassis which has mutually partitioned first chamber, second chamber and third chamber, an electronic substrate which is housed in the first chamber, loudspeaker modules which are housed in the second chamber and the microphones which are housed in the third chamber.

Abstract: The present invention relates to an inverter device having an inverter module for converting DC power stored in an energy storage system (ESS) of a photovoltaic power generation system into AC power and supplying the AC power to a load. The inverter device comprises a case, an input/output terminal unit, and a heat dissipating fan. The case has an inverter module housed therein and a plurality of heat dissipating holes formed on the rear surface thereof. The input/output terminal unit is fixed to an upper portion of the front surface of the case through a first fastening member, and a plurality of cables are connected to an inner surface thereof through a second fastening member so as to be energized. The heat dissipating fan is fixed to the front surface of the case while being disposed below the input/output terminal unit, and discharges heat generated by the inverter module.

Abstract: A solid state drive (SSD) device includes a cage with a top wall and a bottom wall spaced a distance from the top wall so as to define a cage interior between the top and bottom walls. In addition, at least 10% of an area along a side of the cage is open to the cage interior to permit airflow through the side of the cage. At least one printed circuit board (PCB), which includes at least one integrated circuit component, is also provided within the cage interior.

Abstract: A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.

Abstract: A power tool includes a housing, a saw blade for cutting a workpiece, a motor for driving the saw blade to rotate about a first axis, a circuit board for controlling the motor, a heat sink for cooling, and a base plate being formed with a flat surface for contacting with the workpiece during cutting. The housing includes a first containing portion being formed with a first container for containing the motor, a second containing portion extended along a direction substantially parallel to the flat surface from one of the two ends of the first containing portion along a direction substantially perpendicular to the first axis. The second containing portion is formed with a second container which is communicated with the first container. The circuit board and the heat sink are disposed in the second container.

Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.

Abstract: An electronic device may include a semiconductor package, that may include a package substrate. The package may include a semiconductor die. A plurality of package interconnects may include a first pillar extending from a surface of the package substrate. The electronic device may include a socket that may be configured to couple with the semiconductor package. The socket may include a plurality of socket interconnects configured to engage with the package interconnects. The plurality of socket interconnects may include a first contact, and the first contact may include an arm. The arm of the first contact may be configured to engage with the first pillar, and the arm may be configured to laterally displace when engaged with the first pillar. The engagement of the arm with the first pillar may establish an electrical communication pathway between the semiconductor package and the socket.

Abstract: A flywheel energy storage system includes a flywheel housing that encloses a flywheel rotor, a motor/alternator, and a power electronics unit. The power electronics unit includes a power electronics housing directly mounted on the flywheel housing, and one or more power electronic circuits enclosed by the power electronics housing. The direct mounting of the power electronics housing on the flywheel housing enables thermal distribution for passive cooling purposes. The design of the flywheel energy storage system also reduces the vibrational forces imparted by the power electronics housing on the flywheel housing.

Abstract: A power conversion device includes a semiconductor module with switching elements incorporated therein, a plurality of components electrically connected to the semiconductor module, and a laminated cooler provided with a plurality of cooling plates. A laminate is constituted by laminating at least the plurality of cooling plates and the semiconductor module, at least one among the plurality of cooling plates constituting the laminate is a large area cooling plate in which a projected area when viewed from the stacking direction is larger than the other cooling plates, and at least one of the components is a specific arrangement component which, when viewed from the stacking direction, is arranged in a specific position which overlaps the large area cooling plate, and, when viewed from a direction orthogonal to the stacking direction, overlaps with the laminate.

Abstract: An electronic device has a force touch function which is capable of minimizing a degradation of picture quality, wherein the electronic device may include a housing having a receiving space, an image display module disposed in the receiving space, and a force sensing panel disposed between a bottom surface of the housing and the image display module, which enables a user's force touch to be sensed through the force sensing panel, and to minimize a degradation of picture quality caused by heat.

Abstract: A power conversion device includes a main board, a connector module, an input conversion module, a capacitor, an output conversion module, a control module and a conducting part. The main board includes two lateral edges along a first direction and two lateral edges along a second direction. The connector module is mounted on the main board, and includes an input connector and an output connector. The output connector is located under the input connector. The input conversion module, the output conversion module and the control module are perpendicularly mounted on the main board. The conducting part is in parallel with the control module and electrically coupled with the input connector or the output connector. The connector module, the input conversion module, the capacitor and the output conversion module are mounted on the main board and arranged in a line along the second direction.

Abstract: An exemplary electronic device with integrated passive and active cooling includes a main logic board, a heat sink, and a cooling fan. A first surface of the heat sink faces the main logic board and contacts a heat-generating component of the main logic board. A second surface of the heat sink faces away from the main logic board and has a recess formed thereon. The heat sink further includes a plurality of fins that surround the recess. The cooling fan is at least partially enclosed within the recess by a fan shroud. The cooling fan is operable to draw air into the recess via channels defined by a first subset of the plurality of fins, and expel air from the recess via channels defined by a second subset of the plurality of fins.

Abstract: A heat sink arrangement can be comprised of a substantially planar base and fins extending upwards from the planar base. The planar base can be shaped in accordance with a light-emitting diode (LED) light fixture. An improved heat sink that the planar base is a component of can be capable of fitting within the LED light fixture. The space between the fins can form air pathways. Each fin can be substantially arced in shape, originating from a central region of the planar base and ending at an outside edge of the planar base.

Abstract: A vehicle adapter configured to be mounted to a vehicle. The vehicle adapter includes a body sized and shaped to receive and hold a portable communications device, the body including a surface configured to press against the portable communications device. The vehicle adapter further includes a cooling system coupled to the body, the cooling system including a conduit configured to deliver a coolant to an internal channel of the portable communications device. The conduit defines a projection sized and shaped to press against and open a valve on the portable communications device when the portable communications device is received into the vehicle adapter.

Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

Abstract: A reduced-depth rack server for a reduced depth rack includes a data storage device rotated a quarter turn within a carrier. An interposer cable connects at one end to a laterally presented electrical connector of the data storage device and presents another connector to an end that is inserted inwardly into a rack server chassis to electrically connect with a backplane of the reduced-depth rack server. In one embodiment, a data storage assembly of the data storage device, carrier and interposer cable is inserted from a front end of the chassis. In one embodiment, the data storage assembly is inserted from a top of the chassis to facilitate airflow.

Abstract: A display apparatus for displaying an image, including: a liquid-crystal panel which displays the image; a back light which emits light toward a rear face of the liquid-crystal panel; a rear frame which supports the back light via a screw; and a rear cover which covers part of a face of the rear frame which is different from a face of the rear frame on which the back light is provided, wherein the back light extends beyond an inner-frame region of the rear frame covered by the rear cover, and the screw is provided only in the inner-frame region.

Abstract: In the present invention, a housing having a trunk part accommodating therein a brushless motor and an output part to which a tip tool is to be connected, a handle part having one end connected to the trunk part, and an accommodation part provided at an other end of the handle part is used, and a FET serving as a switching element that supplies power to the motor is accommodated in the accommodation part from which a power supply cord is pulled out. It is possible to reduce the length of the trunk part in the front-rear direction compared to a case where the FET is disposed in the front-rear direction of the motor.

Abstract: The invention relates to a heat exchanger of an air circulation channel of a turbomachine, the heat exchanger being configured so as to have fluid to be cooled passing through it and including a plurality of fins protruding from a support surface, the heat exchanger being characterized in that each fin includes a base and a preferably continuous leading face which extends axially from the base in the air circulation direction while tapering from upstream to downstream along an axis parallel with the support surface.

Abstract: A plurality of vent perforations are formed on a side face of an electronic apparatus and communicate the inside and the outside of the electronic apparatus with each other therethrough. The electronic apparatus includes a fan which sucks or discharges air through the plurality of vent perforations. A groove is formed on the side face of the electronic apparatus and extends in a forward and rearward direction. The plurality of vent holes are formed on an inner face of the groove of the side face. With the structure, the vent holes can be suppressed from being closed up when the electronic apparatus is placed vertically, and the drop of the ventilation efficiency can be suppressed.

Abstract: In order to suppress an increase in the temperature of a leeward heat sink without increasing cost, a heat dissipating structure 140 according to the present invention includes a plurality of regions arranged along the direction of airflow from an air blower unit 150, wherein the regions are arranged in descending order of thermal resistance in each region, from windward to leeward.

Abstract: An integrated fan blade and a fan having the same are provided. The fan includes a stator (1) and a fan blade (2); the stator (1) is provided with a stator pivoting member (10) and disposed on and electrically connected to a circuit board (11); the fan blade (2) includes a blade wheel (20), a fan blade pivoting member (21) formed at the center of the blade wheel (20) and axially extended; and a plurality of blade pieces (22) annularly formed at the outer periphery of the blade wheel (20), and the fan blade pivoting member (21) is pivoted with the stator pivoting member (10), wherein the fan blade (2) is formed with a magnetic material area and formed through an integrally forming means. With the fan blade (2) being integrally formed, the fan operating property can be effectively improved.

Abstract: Provided is an electronic device that is provided with a filter circuit that suppresses the effects of electromagnetic noise propagated through space from a circuit board and reduces parasitic inductance, and can output a voltage with adequately reduced noise. To solve the above problem, in an electronic device provided with a cabinet (101), a circuit board (132) provided in the cabinet, an output terminal (122) that passes through a through hole provided in the cabinet and outputs the output of the circuit board to the outside, the present invention constructs a loop composed of a filter means (142) having a filter capacitor (142a), an output terminal, a cabinet, and wires (142b, 142c) for connecting these parts. The wire (142c) connected to the cabinet is connected to a position close to the output terminal, and reduces the size of the loop. In addition, a shield (102) is provided between the filter means and the circuit board.

Abstract: A room air conditioner with a liquid-to-air heat exchanging device for the exchange of heat between a liquid and air has a first flow channel for the air and a second flow channel for the liquid, and at least one Peltier element. The heat exchanging device is subdivided into a first stage in which a heat exchange occurs in a passive manner between the liquid and air, and a subsequent second stage in which heat is pumped from the liquid to the air or from the air to the liquid by supplying an electrical current to the at least one Peltier element.

Abstract: A heat dissipating device includes a supporting part, a plurality of first fins and a plurality of second fins. The first fins are disposed in a vertical array at the supporting part. The second fins are disposed in an inclined array at the supporting part. The first fins and the second fins are staggeredly disposed and adjacent to each other correspondingly. The heat exchange efficiency of the fins is improved so as to increase the heat dissipating efficiency of the heat dissipating device.

Abstract: An integrated circuit package is presented. In an embodiment, the integrated circuit package has contact pads formed on the top side of a package substrate, a die electrically attached to the contact pads, and input/output (I/O) pads formed on the top side of the package substrate. The I/O pads are electrically connected to the contact pads. The integrated circuit package also includes a flex cable receptacle electrically connected to the I/O pads on the top side of the package substrate. The flex cable receptacle is non-compressively attachable to a flex cable connector and includes receptacle connection pins electrically connected to the I/O pads.

Abstract: Techniques for cooling concentrating solar collector systems are provided. In one aspect, an apparatus for cooling a photovoltaic cell includes a heat exchanger having a metal plate with a bend therein that positions a first surface of the metal plate at an angle of from about 100 degrees to about 150 degrees relative to a second surface of the metal plate, and a plurality of fins attached to a side of the metal plate opposite the first surface and the second surface; a vapor chamber extending along the first surface and the second surface of the metal plate, crossing the bend; and a cladding material between the vapor chamber and the heat exchanger, wherein the cladding material is configured to thermally couple the vapor chamber to the heat exchanger. A photovoltaic system and method for operating a photovoltaic system are also provided.

Abstract: Various techniques are employed alone or in combination, to reduce the levelized cost of energy imposed by a power plant system. Solar energy concentrators in the form of inflated reflectors, focus light onto photovoltaic receivers. Multiple concentrators are grouped into a series-connected cluster that shares control circuitry and support structure. Individual concentrators are maintained at their maximum power point via balance controllers that control the flow of current that shunts this series connection. DC current from clusters is transmitted moderate distances to a centralized inverter. The inductance of transmission lines is maximized using an air-spaced twisted pair, enhancing the performance of boost-type three phase inverters. Cluster outputs are separate from individual inverters in massively interleaved arrays co-located at a central location.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a heat sink in the housing, a heat pipe including a curved portion toward the heat sink, and a fan including a cutout portion accommodating the curved portion.

Abstract: An image forming apparatus including a fan cover including a wall portion disposed to overlap a rotational axis of a fan in an axis direction along the rotational axis, the wall portion extending in an orthogonal direction perpendicular to the axis direction, a first section disposed on one side relative to the wall portion in the orthogonal direction, the first section having a first opening disposed on one side relative to the fan in the axis direction and on the one side relative to the rotational axis in the orthogonal direction, and a second section disposed on an other side relative to the wall portion in the orthogonal direction, the second section having a second opening disposed on the one side relative to the fan in the axis direction and on the other side relative to the rotational axis in the orthogonal direction.

Abstract: A heat dissipating device includes a semiconductor packaging structure having a stator set and a semiconductor element provided therein, a fan wheel set pivotally connected to the semiconductor packaging structure, and a guiding structure having a guiding channel. The guiding structure receives the semiconductor packaging structure and the fan wheel set. The fan wheel set includes a plurality of blades located above the surface of the semiconductor packaging structure. The stator set and the semiconductor element controls the first blades. The blades extend beyond side surfaces the semiconductor packaging structure and have their sizes increased, such that the airflow volume can be increased without changing the size of the semiconductor packaging structure.

Abstract: A cooling device includes: a heat sink and a heat pipe that are connected with each other; a metal plate that is connected with the heat pipe; an elastic member that is provided in the metal plate; and a securing member that is attachable with a printed circuit board on which a heating part is mounted, is able to be secured to the elastic member to be elastically deformed such that the metal plate is pushed to the heating part, and is able to position the metal plate in a state where the securing member is not secured to the elastic member.

Abstract: The present disclosure relates to a plate for use with a heatsink. The plate is adapted to engage with the heatsink and a fan subassembly, and comprises a first substantially planar section which is adapted to engage with the heatsink and a second substantially planar section which is adapted to engage with the fan subassembly.

Abstract: An improved cooling mechanism for a power electronics device is provided. More specifically, a cooling mechanism is provided that includes an air passageway configured to allow cooling air to bypass a portion of a heatsink adjacent to the rectifier circuitry and direct cooling air into an area of the heatsink that is nearer to the inverter circuitry. Another embodiment employs an air passageway with an air directing structure configured to provide an air flow that impinges on a lateral surface of the heatsink. In another embodiment, the air directing structure is chosen to provide a turbulent air flow in the heat dissipating structure within the vicinity of the inverter circuitry.

Abstract: An inverter, a sealing air duct, and a heat dissipation system are disclosed. The inverter includes: an enclosure having a first cavity and a second cavity that are isolated from each other and sealed; a magnetic conversion circuit including magnetic elements that is arranged in the first cavity; a power conversion circuit including power tubes that is arranged in the second cavity; a heatsink arranged at the bottom of the enclosure and located outside the first cavity and the second cavity; a sealing air duct arranged outside the second cavity, where the columnar pipeline is sealed at two ends, the bottom surface is formed by a side wall of the second cavity or a substrate of the heatsink, and the bottom surface includes an air inlet and an air outlet to communicate with the second cavity and the at least one columnar pipeline.