Abstract: According to an example provided herein, a cold plate has a surface for mounting a component thereto, a first path to flow cooling fluid therethrough in a vicinity of the surface and a housing mounted on the surface that extends from the surface. The housing has a second path attaching to the first path to flow fluid to flow through the housing wherein the housing is designed to at least partially enclose the component and wherein the component is cooled by the housing.

Abstract: A heat radiation structure of an electric apparatus provided herein is capable of readily releasing heat of electronic components to the outside and suppressing heat conduction to a rotational position sensor. A metal electromagnetic wave shielding member is fixed to a casing body of a casing. The electromagnetic wave shielding member includes a first portion that is connected to an opposed wall portion of the casing body to face a circuit substrate and a cylindrical second portion that is extending from a peripheral end of the first portion and along a peripheral wall portion of the casing body without being in contact with a housing. A heat conductive member having electrical insulating and heat conductivity properties as well as flexibility is disposed between the circuit substrate and the electromagnetic wave shielding member to closely contact both of the plurality of electronic components and the first portion of the electromagnetic wave shielding member.

Abstract: A heat sink device for dissipating heat from an electronic component mounted thereto, the device comprising: an inlet for receiving a fluid; an outlet for venting said fluid; a heat dissipation zone intermediate the inlet and outlet; said zone including a plurality of transverse channels and a plurality of oblique channels extending between adjacent transverse channels; wherein said oblique and transverse channels define a fluid path for said fluid from the inlet to the outlet.

Abstract: A thermal interposer for a heat-generating electronic component includes a thermally conducting body that is configured to be thermally coupled to the electronic component. The thermally conducting body may include a first region that is located on a first face of the thermally conducting body. The first region may be adapted to be in thermal contact with a surface of the electronic component. The thermally conducting body may also include a second region located on a second face that is opposite the first face of the thermally conducting body. The thermal interposer may also include a cold plate assembly that is removably coupled to the thermally conducting body. The cold plate assembly may be in thermal contact with the second region of the thermally conducting body. The cold plate assembly may include an inlet adapted to receive a cooling liquid into the cold plate assembly and an outlet adapted to discharge the cooling liquid from the cold plate assembly.

Abstract: A liquid cooling system includes a heat conductive member, a liquid tank, and plural conduits connecting the heat conductive member with the liquid tank. The heat conductive member is configured for thermally connecting to a heat-generating electronic component. The liquid tank defines a liquid injection hole therein. A clip assembly is connected to the liquid tank. When pressed against the clip assembly by a user, the liquid tank is fastened by the clip assembly and thus retained in position. When pressed again toward the clip assembly, the liquid tank is released from the clip assembly and ejected in a direction away from the heat-generating electronic component. An electronic device using the liquid cooling system is also provided.

Abstract: Various embodiments disclose a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is disclosed. The system comprises a cold plate that is mounted on the electronic enclosure to conduct heat thermally. The cold plate has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components. One or more heat risers are configured to be thermally coupled between the first surface of the cold plate and at least one of the plurality of electronic components.

Abstract: A module system is provided that includes at least one module support and at least one module support and at least one energy storage module that is connected to the at least one module support. The module support and the energy storage module have cooling fluid connections, electric contacts, and coupling elements that are adapted to each other.

Abstract: A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein tile base plate comprises a plurality of metal pellets to dissipate heat from the integrated heat spreader.

Abstract: A power electronics module includes a frame, a jet impingement cooler assembly, and a power electronics assembly. The frame includes a first surface, a second surface, a power electronics cavity within the first surface of the frame, a fluid inlet reservoir, and a fluid outlet reservoir. The fluid inlet and outlet reservoirs extend between the first surface of the frame and the second surface of the frame. The fluid inlet reservoir and the fluid outlet reservoir are configured to be fluidly coupled to one or more additional modular power electronics devices. The jet impingement assembly is sealed within the frame and fluidly coupled to the fluid inlet reservoir and the fluid outlet reservoir. The power electronics assembly includes at least one power electronics component, is positioned within the power electronics cavity, and is thermally coupled to the jet impingement cooler assembly. Power electronic module assemblies are also disclosed.

Abstract: A housing or other enclosure used to facilitate fluid cooling of a circuitry of a battery charger, such as but not limited to a battery charger of the type used to facilitate charging a high voltage vehicle battery with AC energy provided from a utility power grid. The housing may include a groove and seal arrangement operable to seal a fluid coolant chamber used to cool the circuitry from leaking fluid during use.

Abstract: A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources.

Abstract: A backboard assembly includes a back plate, an electrically insulative sheet and a connection element. The connection element comprises a plurality of first engaging structures on a first side thereof to engage with the back plate and a plurality of second engaging structures on a second side opposing to the first side to engage with the electrically insulative sheet.

Abstract: Thermoelectric-enhanced, liquid-cooling apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure in thermal communication with the component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop for receiving coolant from and supply coolant to the liquid-cooled structure. A thermoelectric array is disposed with first and second coolant loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the liquid-to-air heat exchanger for cooling thereof.

Abstract: A cooling member for withdrawing heat from a heat containing device is disclosed. The cooling member can have a housing with a fluid inlet, a fluid outlet and a plurality of irregular-shaped fins located at least partially therewithin. In addition, a plurality of irregular-shaped and hierarchical branched fluid pathways can be located between the plurality of fins and the housing and/or the plurality of fins can be in physical contact with the heat containing device.

Abstract: A cold plate assembly includes an inlet manifold layer, a target heat transfer layer, a second-pass heat transfer layer, and an outlet manifold layer. The inlet manifold layer includes a coolant fluid outlet and an inlet channel. The inlet channel includes a plurality of fluid inlet holes fluidly coupled to a plurality of impingement jet nozzles. The target heat transfer layer includes a plurality of target heat transfer cells having a plurality of target heat transfer layer microchannels extending in a radial direction from a central impingement region. The second-pass heat transfer layer includes a plurality of second-pass heat transfer cells having a plurality of second-pass heat transfer layer microchannels extending in a radial direction toward a central fluid outlet region, and one or more transition channels. The impingement jet nozzles are positioned through the central fluid outlet region. The outlet manifold layer includes an outlet channel having a plurality of fluid outlet holes.

Abstract: A cooling system and method are provided for facilitating cooling of multiple liquid-cooled electronics racks. The cooling system includes a main system coolant supply loop with a plurality of system coolant supply branch lines for facilitating supply of cooled system coolant to the electronics racks, and a main system coolant return loop with a plurality of system coolant return branch lines for facilitating return of exhausted system coolant from the electronics racks. When operational, cooled system coolant circulates through the coolant supply loop and exhausted system coolant circulates through the coolant return loop. A plurality of modular cooling units are coupled to the coolant supply loop and coolant return loop. Each modular cooling unit includes a heat exchanger to facilitate cooling of a portion of the exhausted coolant circulating through the main system coolant return loop for return as cooled system coolant to the main system coolant supply loop.

Abstract: A method and associated assembly are provided for cooling of a computing embodiment having electronic components. The heat generating components are disposed in the vicinity of at least one cold plate providing direct liquid cooling. Coolant is provided to the cold plate which will eventually exit it through one or more ports or orifices placed on the sides or both side and bottom of the cold plate. The placement, size and number of port(s) or orifice(s) can be selectively adjusted to control amount of coolant flow. Effluent flow from the cold plate flows over the remaining immersion cooled components and then exits the liquid tight enclosure which houses the electronic components.

Abstract: A cooling device may include a fluid inlet manifold, a case body, and a fluid outlet manifold that are formed of a molded polymer composite material. The fluid inlet manifold may include a fluid inlet channel and a fluid inlet reservoir. The case body may include a plurality of cooling channels extending from a first surface of the case body to a second surface of the case body. The cooling channels may fluidly couple the first surface of the case body to the fluid inlet reservoir. The fluid outlet manifold may further include a fluid outlet channel and a fluid outlet reservoir. The cooling channels may fluidly couple the second surface of the case body to the fluid outlet reservoir. The fluid inlet channel, cooling channels, and fluid outlet channels may include a cross-section topology.

Abstract: A power element mounting substrate including a circuit layer brazed to a surface of a ceramic plate, and a power element soldered to a front surface of the circuit layer, wherein the circuit layer is constituted using an Al alloy with an average purity of more than or equal to 98.0 wt % and less than or equal to 99.9 wt %, Fe concentration of the circuit layer at a side of a surface to be brazed to the ceramic plate is less than 0.1 wt %, and Fe concentration of the circuit layer at a side of the surface opposite to the surface to be brazed is more than or equal to 0.1 wt %.

Abstract: A jet impingement heat exchanger includes an inlet jet, a target layer, a second layer, a transition channel, and a fluid outlet. The target layer includes an impingement region and a plurality of target layer microchannels that radially extend from the impingement region. The jet of coolant fluid impinges the target layer at the impingement region and flows through the radially-extending target layer microchannels toward a perimeter of the target layer. The second layer includes a plurality of radially-extending second layer microchannels. The transition channel is positioned between the target layer and the second layer to fluidly couple the second layer to the target layer. The coolant fluid flows through the transition channel and the plurality of radially-extending second layer microchannels. The fluid outlet fluidly is coupled to the second layer. Jet impingement exchangers may be incorporated into a power electronics module having a power electronics device.

Abstract: Apparatus and method are provided for two-phase dielectric cooling of an electronic device. The apparatus includes a coolant flow path, a vapor condenser and one or more vapor fans. The coolant flow path is in fluid communication with the electronic device, where liquid dielectric coolant within the flow path vaporizes upon contacting the electronic device, forming dielectric coolant vapor, and thereby facilitating cooling of the electronic device. The vapor condenser is also in fluid communication with the coolant flow path and facilitates condensate formation from the dielectric coolant vapor. The one or more vapor fans are disposed within the flow path to actively move dielectric coolant vapor into contact with the vapor condenser, and thereby enhance cooling of the electronic device by facilitating coolant condensate formation and thus recirculation of the coolant condensate as liquid dielectric coolant.

Abstract: A system to remove heat from an in-line memory module and/or circuit board may include a cold-rail to engage each end of an in-line memory module adjacent to where the in-line memory module is attachable to a circuit board, the cold-rail to remove heat from the in-line memory module. The system may also include a cold-plate connected to the cold-rail with the circuit board between the cold-plate and the cold-rail, the cold-plate to remove heat from the circuit board.

Abstract: A power module is proposed to package an electronic system having flip chip power MOSFET devices. The power module includes a front surface cover board and a multi-layer printed circuit laminate bonded thereto. Notably, the front surface of the printed circuit laminate includes recessed pockets each having printed circuit traces atop its floor. Inside the recessed pockets are power MOSFET and other circuit components bonded to the printed circuit traces. As the circuit components are encased inside the power module, it features a low profile, an increased mechanical robustness and EMI/RFI immunity. Additionally, some circuit components can be provided with a front-side bonding layer that is also bonded to the front surface cover board to realize a double-side bonding to the interior of the power module. Methods for making the low profile power module are also described.

Abstract: A cooling member for a variable speed drive. The variable speed drive has a component that generates heat during operation of the drive and a base. The base has a surface that receives the component, a channel formed in the surface of the base and a passageway formed in the base and receiving fluid therethrough. Fluid flowing through the passageway provides cooling to the component and the base is manufactured from an injection molding process.

Abstract: Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes a dehumidifying air-to-liquid heat exchanger disposed at an air inlet side of the rack and a re-humidifying structure disposed at an air outlet side of the rack. The dehumidifying air-to-liquid heat exchanger is in fluid communication with a coolant loop for passing chilled coolant through the heat exchanger, and the dehumidifying heat exchanger dehumidifies ingressing air to the electronics rack to reduce a dew point of air flowing through the rack. A condensate collector disposed at the air inlet side collects liquid condensate from the dehumidifying of ingressing air, and a condensate delivery mechanism delivers the condensate to the re-humidifying structure to humidify air egressing from the electronics rack.

Abstract: Various embodiments of the present invention provide an anchor, circuit board assembly, and method for operably engaging an electronic component with a circuit board having a first side and a second side. Anchor embodiments include an anchor portion configured for receiving at least a portion of the electronic component and a pair of anchor legs flexibly extending from the ends of the anchor portion and configured for insertion into apertures defined in the circuit board. The anchor further includes a compression element slidably disposed about the anchor legs and movable between an unlocked position and a locked position. The compression element is configured for urging the anchor legs towards one another when moved from the unlocked position to the locked position such that the anchor is secured in the apertures when the compression element is in the locked position.

Abstract: A flexible-to-rigid tube is flexible when routed and is then rigidized to increase burst strength. According to the preferred embodiments of the present invention, the flexible-to-rigid tube is included in a cooling plate assembly for transferring heat from electronic components mounted on a circuit board. In one embodiment, the flexible-to-rigid tube (while in a flexible state) includes a polydimethylsiloxane (PDMS) or other silicone containing pendant or terminal epoxy, vinyl and/or acrylate functional groups and an initiator (e.g., a sulfonium salt photoinitiator, a free radical photoinitiator, or a thermal initiator). In another embodiment, triallyl isocyanurate (TAIC) and an initiator are incorporated into a conventional PVC-based tubing material. The flexible-to-rigid tube changes from the flexible state to a rigid state via formation of a cross-linked network upon exposure to actinic radiation or heat.

Abstract: A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

Abstract: The present invention provides an apparatus for cooling parts of a hybrid electric vehicle. The apparatus cools the main heating parts of a motor driving system, including an inverter, in the HEV. A heat dissipater may also be provided and equipped with different heating parts, such that the heating parts share the heat dissipater. A channel for a coolant to flow is formed in the heat dissipater, and the heat dissipater defines heat transfer paths for transferring heat generated from the heating parts to the coolant. The heating parts include a power module, an inductor, and a film capacitor.

Abstract: According to an example provided herein, a cold plate has a surface for mounting a component thereto, a first path to flow cooling fluid therethrough in a vicinity of the surface and a housing mounted on the surface that extends from the surface. The housing has a second path attaching to the first path to flow fluid to flow through the housing wherein the housing is designed to at least partially enclose the component and wherein the component is cooled by the housing.

Abstract: Methods and apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external contacts are operatively coupled to the terminals on the support member. The assembly also includes a second microelectronic die having integrated circuitry and second external contacts electrically coupled to the first external contacts. The first die is between the support member and the second die. The assembly can further include a heat transfer unit between the first die and the second die. The heat transfer unit includes a first heat transfer portion, a second heat transfer portion, and a gap between the first and second heat transfer portions such that the first external contacts and the second external contacts are aligned with the gap.

Abstract: A substrate for electronic components includes a ceramic tile and a cooling metal layer. The cooling metal layer can include copper, aluminum, nickel, gold, or other metals. The cooling metal layer has an enhanced surface facing away from the ceramic tile, where the enhanced surface includes either fins or pins. Electronic components can be connected to the substrate on a surface opposite the cooling metal layer.

Abstract: A power converter design is disclosed with a novel approach to thermal management which enhances the performance and significantly reduces the cost of the converter compared to prior art power converters. The invention minimizes the heating of one power component by another within the power converter and therefore enables the power converter to work at higher power levels. Essentially, the power converter uses a heatsink having a high length to width ratio, a linear array of power components thermally coupled to the heatsink parallel to the long axis of the heatsink and a heat removal system which produces the highest cross sectional thermal flux perpendicular to said long axis. In addition, a number of ancillary thermal management techniques are used to significantly enhance the value of this basic approach. A specific circuit design for the power converter is not disclosed or discussed as the invention can be applied to any number of power converter electrical topologies.

Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.

Abstract: Disclosed is an embodiment of a rack system including a cooled universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane mounting area on a second side of the rack system opposite to the first side, a power bus, a plurality of cooled partitions, a plurality of module bays, two or more service unit backplanes and a coolant source. The power bus may be configured to provide power to the universal backplane mounting area and the plurality of cooled partitions. The rack system may also include a plurality of service units that may be configured to have different functions within the rack system.

Abstract: The semiconductor device includes a plurality of semiconductor packages stacked on one another. Each semiconductor package includes a main current electrode terminal disposed in a case section of the semiconductor package, the main current electrode terminal being exposed outside the case section to be electrically connected to an external power supply. The main current electrode terminal extends in the stack direction of the semiconductor packages, and embedded in the case section at a surface portion thereof facing an external surface of the case section. Both end surface portions of the main current electrode terminal in the stack direction respectively reach end surface portions of the case section in the stack direction so that the main current electrode terminals of each adjacent two of the semiconductor packages are in contact with each other when the semiconductor packages are stacked on one another in the stack direction.

Abstract: Compliant conduction rail assembly and method are provided for facilitating cooling of an electronics structure. The rail assembly includes a first thermally conductive rail mounted to a surface of the electronics structure, a second thermally conductive rail thermally conductively interfaced to the first rail, and a biasing mechanism biasing the second rail away from the first rail. The first and second rails and the biasing mechanism are configured for slidable insertion into a housing with the electronics structure, the housing containing a liquid-cooled cold plate(s). With insertion of the electronics structure into the housing, the second rail engages the liquid-cooled cold plate and is forced by the biasing mechanism into thermal contact with the cold plate, and is forced by the cold plate towards the first rail, which results in a compliant thermal interface between the electronics structure and the liquid-cooled cold plate of the housing.

Abstract: A cooling system comprising a heat sink having, a first contact zone and a second contact zone, which are configured to absorb, a first heat flow from a first component, a second heat flow from a second component, and a first transmission means for transmission of the first heat flow via the first contact zone into the heat sink. In addition, a first transmission means is arranged between the first component, and the heat sink and include a first plug means that is shaped such that the first plug means forms a first fit with a first bushing means that is arranged in the heat sink, where the first fit provides tolerance compensation between first and second contact zones.

Abstract: A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines a tapered inlet distribution chamber configured to receive a coolant, C-shaped inlet manifolds configured to receive the coolant from the tapered inlet distribution chamber, inverted C-shaped outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and disposed in a circular arrangement. The outlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the inlet chamber. The body further defines a tapered outlet chamber configured to receive the coolant from the outlet manifolds, where the inlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the tapered outlet chamber.

Abstract: A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines inlet manifolds configured to receive a coolant and outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a circular or spiral arrangement. Millichannels are formed in the body or in the lids, are disposed in a radial arrangement, and are configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to cool one of the upper and lower contact surfaces of the electronic device package. Heat sinks with a single lid are also provided.

Abstract: The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

Abstract: A water-cooled communication chassis includes a chassis body and a water cooling unit. The chassis body includes at least one heat receiving portion, at least one heat dissipation portion, and at least one first water pipe system. The first water pipe system has a front part extended through the heat receiving portion and a rear part arranged on the heat dissipation portion, so that heat absorbed by the heat receiving portion is transferred via the first water pipe system to the heat dissipation portion and dissipated therefrom into ambient air. The water cooling unit communicates with the first water pipe system and drives a cooling fluid stored therein to circulate in between the first water pipe system and the water cooling unit, so that the heat absorbed by the heat receiving portion can be quickly and continuously carried away from the communication chassis by the circulating cooling fluid.

Abstract: Computer systems with air cooling systems and associated methods are disclosed herein. In several embodiments, a computer system can include a computer cabinet holding multiple computer modules, and an air mover positioned in the computer cabinet. The computer system can also include an airflow restrictor positioned proximate to an air outlet of the computer cabinet, and an overhead heat exchanger mated to the computer cabinet proximate to the air outlet.

Abstract: A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing electronic devices to the heat transfer assemblies. The plurality of heat producing electronic devices and respective heat transfer assemblies are positioned on the wiring substrate having the regions overlapping. A heat conduit thermally communicates with the heat transfer assemblies. The heat conduit circulates thermally conductive fluid therethrough in a closed loop for transferring heat to the fluid from the heat transfer assemblies via the heat spreader.

Abstract: An electrical installation has a container which encloses high-voltage components. The electrical installation can be fitted inexpensively and quickly, and at the same time provide sufficient cooling of the high-voltage components. A control room with control elements and/or display elements of the electrical installation and a cool room with a cooling device for at least one of the high-voltage components are disposed in the interior of the container.

Abstract: Carriage chassis for installation of a component assembly in a support structure. The support structure includes a power connector in a connector housing. The carriage chassis includes: rails adapted to receive a component assembly and a safety cover. One of the rails includes a tri-lobed torsion stop that includes a first lobe configured to contact the connector housing when no safety cover is installed, preventing a component assembly from coupling with power; a second lobe configured to receive contact from a displacement member of a safety cover, rotating the tri-lobed torsion stop; and a third lobe configured to provide contact to the displacement member when the safety cover is installed and a component assembly is coupled with power. The third lobe and the first lobe prevent removal of the safety cover when a component assembly is coupled with the power connector.

Abstract: A cooling apparatus is disclosed. The cooling apparatus comprising a printed circuit (PC) board with an integrated circuit (IC) socket mounted onto the top side of the PC board. A mounting frame generally in the shape of a plate, with a first opening passing through the center of the plate, is mounted on the top side of the PC board with the IC socket located inside the first opening. A cold plate is attached to the mounting frame, the cold plate has an opening that passes through the cold plate. The opening in the cold plate is sized to allow an IC to be inserted into the IC socket through the opening. A fluid passageway is formed inside the cold plate. A fluid inlet port and a fluid outlet port are mounted on the cold plate and coupled to a first end and a second end of the fluid passageway, respectively. A heat spreader is removably attached to the top side of the cold plate wherein the bottom side of the heat spreader is configured to contact the top side of an IC when the IC is mounted in the IC socket.

Abstract: A heat dissipating system includes an electronic device, a refrigeration device, a thermal connector, a cold plate, and a pipe. The cold plate is located in the electronic device for absorbing the heat. The refrigeration device is capable of refrigerating a coolant. The thermal connector is in contact with the cold plate. The pipe connects the thermal connector to the refrigeration device so that the coolant is capable of flowing out of the refrigeration device to the thermal connector and back to the refrigeration device.

Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

Abstract: A cooling device for a semiconductor element module and a magnetic part, includes: a water-cooled type heat sink having a cooling water passage; a semiconductor element module including a plurality of chips arranged side by side in a circulation direction in the cooling water passage, the semiconductor element module being mounted on the heat sink; and a magnetic part including a core and a winding portion mounted on the core, the magnetic part being mounted on the heat sink or another heat sink. In the cooling device, a plurality of cooling fins is disposed to extend along the circulation direction in the cooling water passage in a manner that the plurality of cooling fins are separated into groups for the respective chips arranged side by side in the circulation direction, and that the groups of the cooling fins are offset from each other in a direction perpendicular to the circulation direction. Accordingly, it is possible to have improved cooling efficiency of a heat sink with cooling fins.