Abstract: An integrated base station antenna includes a feed board having a plurality of columns of radiating elements mounted thereon and a plurality of phase shifters coupled to the plurality of columns of radiating elements mounted on a same side of the feed board as the plurality of columns of radiating elements.

Abstract: A resilient antenna securing device that includes a frame structure and a plurality of fin components projecting outwardly from the frame structure. The fin components are configured to receive and hold one or more RF antenna portions. Each fin of a first pair of the plurality of fins components includes a tab that extends toward the other fin of the first pair of fins. At least one first intermediate fin of the plurality of fins is disposed between the first pair of fins. The tabs from the first pair of fins together trap a first RF antenna portion between the tabs and the at least one first intermediate fin.

Abstract: An electrical characteristic measuring device (70) comprises an evaluation table (30) on which a semiconductor device (10) is to be placed, and a device pressing member (20) to press the device (10). The pressing member (20) comprises a non-conductive electrode pressing part (22) to press a device electrode part (12) and a flange pressing part (23) to press a flange portion (14) of a base material (11). In a flange contact part (42) of the flange pressing part (23), a surface facing the flange portion (14) of the base material (11) has the same shape as a flange facing surface of a screw head of a screw (16) for fastening to an apparatus on which the device 10 is to be mounted.

Abstract: Provided is an antenna device including a first antenna body, and a power supply module detachably attached to the first antenna body. The power supply module is provided on a fastening region of a first radiation fin of the first antenna body.

Abstract: A cooling system for a gas turbine engine comprising a closed circuit containing a change-phase fluid, the closed circuit having at least one cooling exchanger configured to be exposed to a flow of cooling air for the change-phase fluid to release heat to the cooling air. A plurality of heat exchangers in are heat exchange relation with the change-phase fluid in the closed circuit, the plurality including at least a first heat exchanger configured to receive a first coolant from a first engine system for the change-phase fluid to absorb heat from the first coolant, and a second heat exchanger configured to receive a second coolant from a second engine system for the change-phase fluid to absorb heat from the second coolant. The system is configured so that the fluid at least partially vaporizes when absorbing heat from at least one of the first coolant and the second coolant and at least partially condenses when releasing heat to the cooling air.

Abstract: A fluid cooling module (or system) for peripheral component interconnect express (PCIE) electronics housed within a chassis is disclosed. The system includes a mounting rail attached to a chassis, a cold/cooling plate having one or more mounting bolts attached to a side of the cold plate, the one or more mounting bolts to lock the cold plate to a fixing channel of the mounting rail to position a surface of the cold plate against a surface of the PCIE electronics, locking teeth of the fixing channels ensure a proper pressure being loaded horizontally on the PCIE electronics by the cold plate, and a fluid loop along a length of the mounting rail to circulate a fluid to the cold plate to cool the PCIE electronics.

Abstract: A low pressure compressor for a gas turbine engine includes a low pressure compressor case extending circumferentially around a central axis of the gas turbine engine. The low pressure compressor case includes an inner radial wall surrounding a low pressure compressor rotor and an outer radial wall at least partially defining a fan bypass passage of the gas turbine engine. A low pressure compressor compartment is located between the inner radial wall and the outer radial wall and an electrical component is located in the low pressure compressor compartment. An inlet port at the outer radial wall is configured to admit a cooling airflow into the low pressure compressor compartment from the fan bypass passage to cool the electrical component.

Abstract: An electronic apparatus includes a board on which a heating element is mounted, a fan including a discharge port, a heat-exchange unit configured to receive air discharged from the discharge port of the fan and radiate heat and a heat-conductive unit configured to thermally couple the heating element and the heat-exchange unit. The heating element is placed as an extension of a discharging direction of the air from the fan with respect to the discharge port of the fan. The heat-exchange unit is placed between the heating element and the fan in a direction substantially parallel to the discharging direction.

Abstract: A camera module with good heat dissipation efficiency and stability includes a base. The base comprises a first receiving groove. At least one escaping hole is defined at the base and the escaping hole forms a connection between the first receiving groove and the ambient environment. At least one heat dissipation block is received in each escaping hole.

Abstract: The present invention generally relates to an array backframe with integral manifolding for high performance fluid cooling of devices. The integral manifolding of the array backframe is designed to perform three functions. First, the array backframe parallelizes the fluid paths to provide uniform, cool supply fluid to every device in the array. Second, the array backframe minimizes the parasitic heat losses between supply and exhaust by use of an isolation cavity. Third, the array backframe collapses hundreds of fluid lines into a single internal manifold to enhance modularity while also serving as a structural support member.

Abstract: In one aspect, luminaires are described herein enabling independent thermal management of driver and LED assemblies. For example, a luminaire comprises a driver assembly vertically integrated with a LED assembly, the driver assembly comprising a driver heatsink having an interior in which a circuit board assembly is positioned, and the LED assembly comprising an array of LEDs and LED heatsink, wherein a barrier is positioned between the driver heatsink and the LED heatsink, separating convective cooling of the driver assembly from convective cooling of the LED assembly.

Abstract: An integrated ceiling device (80, 120) includes an electronics assembly (56) and a mechanical arrangement (20). The mechanical arrangement includes a housing (22), a heat dissipating structure (24), and support arms (26). The housing is configured to retain the electronics assembly. The heat dissipating structure includes a lamp seat (50) for receiving a light source (54), and a central opening (34) surrounded by fins (36). The support arms extend between and interconnect the housing with the heat dissipating structure. The housing is positioned within the central opening and is spaced apart from the fins of the heat dissipating structure to enable a free flow of air in an air gap (42) between the housing (22) and the structure (24). The electronics assembly may include a plurality of elements (160, 162, 164, 166) retained in the housing which are spaced apart from the heat dissipating structure.

Abstract: A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supported on the casing are used.

Abstract: A heat sink for an interchangeable expansion module that can be connected to a computer board is disclosed. In one aspect, the heat sink has at least one cooling module in which a coolant flows, and at least one first electrical connector. The heat sink, wherein the expansion module has at least one second electrical connector configured to be connected to the first electrical connector of the board, and has at least one heat exchange surface, the heat sink comprising at least one heat-transfer device configured to be removably placed against the exchange surface, and the heat-transfer device further being configured such that it is in thermal contact with the cooling module and is mechanically attached, in a removable manner, to the cooling module of the board when the expansion module is connected to the board is also disclosed.

Abstract: According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive sheet and an electric insulator sheet which is directly attached to the electrically conductive sheet and which is thermally coupled to the semiconductor chip, and an array of cooling structures directly attached to the electrically conductive sheet and configured for removing heat from the semiconductor chip when interacting with cooling fluid.

Abstract: Cooling device with liquid for electronic cards, in particular for high-performance processing units, comprising at least a hydraulic circuit in which a heat-carrying fluid flows in order to extract the heat produced by electronic components and/or hot spots present on an associated electronic card. The device comprises a cooling plate mechanically coupled to the electronic card so as to be inserted in a containing rack of the processing unit. The plate has a heat extraction surface facing and partly in contact, or at least in close proximity, with the electronic components and/or the hot spots. The hydraulic circuit is made in the thickness of the plate and has a geometric grid development, along which a plurality of hydraulic sub-circuits are disposed and switching means to define desired paths. The plate has sliding guide means able to cooperate with corresponding alignment means of the containing rack.

Abstract: Heat dissipation in vertically arrayed host device configurations can be improved through inclusion of heat sinks having split-stream fin architectures. The split-stream fin architecture includes two or more sets of angled fins separated by a central conduit, which allows for more efficient inflow and/or expulsion of convection cooling air over the heat sink. The split-stream fin arrangement may include inwardly angled fins in order to draw convection cooling air inwards from horizontal inlets, in which case warm exhaust is expelled through the central conduit. Conversely, the split-stream fin arrangement may include outwardly angled fins, which draw convection cooling air from the central conduit, and expel warm air through horizontal exhausts. The split-stream fin arrangements function well when host devices are configured horizontally, which allows for more flexible host device configurations.

Abstract: A semiconductor substrate for use in an integrated circuit, the semiconductor substrate including a channel defined on a surface of the substrate. The channel includes a first wall, a second wall, and a third wall. The first wall is recessed from the surface. The second wall extends from the surface to the first wall. The third wall extends from the surface to the first wall and faces the second wall across the channel. At least one of the second wall and the third wall includes a plurality of structures projecting into the channel from the second wall or the third wall.

Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack and positioned for air passing through the electronics rack to pass across the heat exchanger. The heat exchanger is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.

Abstract: An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat.

Abstract: A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a silicon-based base portion having a first primary surface and a silicon-based support structure. The silicon-based support structure includes a mounting end and a distal end opposite the mounting end with the mounting end received by the base portion such that the support structure extends from the first primary surface of the base portion. The support structure includes a recess defined therein to receive the edge-emitting laser diode. The support structure further includes a slit connecting the distal end and the recess to expose at least a portion of a light-emitting edge of the edge-emitting laser diode when the edge-emitting laser diode is received in the support structure.

Abstract: This disclosure relates to an apparatus and method 10 for protecting an electronic circuit from an airflow. The apparatus 10 comprises a base 12, wherein said base 12 comprises a cover means for covering at least part of the electronic circuit. The apparatus further comprises a guide means for guiding an airflow around the electronic circuit.

Abstract: An electronic device includes a case having an exhaust vent, an electronic component, a radiation component including radiation fins adjacent to the exhaust vent and formed of first plates disposed parallel to one another to form first air channels, the radiation component radiating the heat received from the electronic component to air passing through the first air channels, a fan disposed at a position having a space from the radiation fins to send air toward the radiation fins, a dust filter including second plates disposed parallel to one another to form second air channels and disposed in the space between the radiation fins and the fan to transfer the air to the radiation fins while capturing dust. The dust filter is removable and the second plates have a shape to be inserted in the first air channels so as to push the dust out of the first air channels.

Abstract: An LED light source device capable of making the amount of light of an emitting region a predetermined amount of light or more and uniformizing the amount of light is provided. The LED light source device 1 includes an ultraviolet LED array 3 including an LED juxtaposition region R in which LEDs 10 that emit ultraviolet light toward the front are juxtaposed, and a light transmitting member 4 provided on the front side of the LED juxtaposition region R of the ultraviolet LED array 3 so as to be opposed thereto, showing a rectangular parallelepiped outer shape, and formed of a material containing quartz. At a front surface 10a of the LED 10, an emitting surface S surrounded by a marginal portion 11 of a predetermined width H and for emitting the ultraviolet light is provided.

Abstract: A motor controller, including: a supporting frame, a control circuit board, and a control box. The control box includes: a cavity, a base plate, and a plurality of fins. The control circuit board is disposed on the base plate in the cavity. The fins are disposed outside the cavity on an outer side surface of the base plate. Cooling ducts are formed between adjacent fins. The control box is fixed on the supporting frame.

Abstract: A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.

Abstract: A computer system is provided. The computer system includes a housing, a mainboard, a first heat source, a second heat source and a flow field modulator. An inlet and an outlet are formed on the housing. The mainboard is disposed in the housing. The first heat source is located on a first location of the mainboard. The second heat source is located on a second location of the mainboard. The flow field modulator is disposed on the mainboard including a control unit, a piezoelectric element and a guiding sheet. The control unit is electrically connected to the mainboard. The piezoelectric element is electrically connected to the control unit. The guiding sheet is connected to the piezoelectric element.

Abstract: A supporting apparatus, configured to support a heat dissipating device, includes a bracket, two adjusting structures, and two mounting portions. Each of the two mounting portions defines a mounting hole. Each of the two adjusting structures is engaged in each of the mounting holes and includes an adjusting member and an installation member engaged with the adjusting member. Each of the adjusting members defines a through hole. The two adjusting members are rotatable relative to the two mounting portions from a first position to a second position. When the adjusting members are in the first position, a first line is running through the two through holes. When the adjusting members are in the second position, a second line is running through the two through holes, and a length of the first line is less than a length of the second line.

Abstract: A system for cooling portable facilities which include heat generating electronics, interior fans, a heat sink integrally serving as part of a wall or ceiling, and an outer heat pipe assembly in thermal communication with the heat sink allowing for heat dissipation. External fans pull external air over the outer heat pipe assembly. A first transducer monitors inner air temperature within the portable building, a second transducer monitors the outer heat pipe assembly, and a third transducer is secured proximate to a fin side of the heat sink. A controller is connected to the transducers, fans, and power supply. Computer instructions monitor temperatures from the transducers, compare the temperatures to preset limits, and individually or simultaneously actuate, regulate, or turn off the fans when monitored temperatures meet or exceed preset limits.

Abstract: The present invention provides a display device comprising a display panel, a driving chip and a heatsink. The driving chip is used to drive the display panel. The heatsink is thermally connected with the driving chip to dissipate the heat generated by the driving chip. Through the said method, the display device according to the present invention is provided with the heatsink connected with the driving chip to dissipate the heat generated by the driving chip, which improves the stability and reliability of the driving chip.

Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.

Abstract: A chassis for a plurality of computers for use in a data center, the chassis at least one extensible fin, the fin either extensible perpendicularly from the front of the chassis or extensible parallel with the front of the chassis.

Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Abstract: Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.

Abstract: Disclosed herein are electric vehicle control device which can distribute the heat generated by the semiconductor devices in the DC/AC converter efficiently. Also disclosed herein are methods of converting DC to AC while keeping the heat value of the semiconductor devices stable.

Abstract: A heat pipe mounting method and a heat pipe assembly thereof are disclosed. The method includes the step of providing a heat-transfer block and a plurality of heat pipes. A plurality of heat pipe grooves is formed on the heat-transfer block. The heat pipes are then press-fitted to respective heat pipe grooves. During the press-fitting step, the heat pipes are flattened to force the flattened part of one heat pipe into abutment against the flattened part of another heat pipe in a flushed manner. Thereby, the heat pipes are abutted to each other with no separation therebetween. Hence, the heat transfer performance is increased.

Abstract: A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.

Abstract: In order to improve cooling performance of a switch unit or switchgear equipped with the switch unit, the switch unit includes a switch having a movable electrode and a fixed electrode and is casted as one body with a resin, the resin is provided with resin fins, and the thickness of the resin fin is changed so that the resin fin has a thickness sloped in the longitudinal direction of the resin fin.

Abstract: A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The thermal management component comprises (i) a frame having a chamber defined therein; and (ii) a heat exchange plate in mechanical communication with at least a portion of the frame. The method comprises (a) providing a thermal management component as described herein; and (b) circulating at least one heat transfer fluid through said component.

Abstract: A cooling device includes a heat sink base plate for mounting on a circuit board to absorb waste heat from a heat source, a radiation fin unit consisting of a set of radiation fins, mounted on the heat sink base plate opposite to the circuit board and defining a plurality of heat-dissipation passages between each two adjacent ones of the radiation fins, a cooling fan unit mounted on the radiation fin unit for creating currents of air toward the heat-dissipation passages, a plurality of thermal tubes supported on the heat sink base plate and fastened to the radiation fins. Each radiation fin has first wind guiding wall portions and second wind guiding wall portions respectively tilted in reversed directions to facilitate the flow of air through the heat-dissipation passages.

Abstract: The front case of the unit case contains a circuit section including a power semiconductor module, and the rear case contains a cooling fin assembly of the semiconductor module and a cooling fan. The cooling air ventilated through the wind channel by the cooling fan is discharged upward from the unit case. The water-proof cover is placed over the top of the unit case. The water-proof cover includes an exhausting structure formed with openings downward at the left and right sides of a front part of the water-proof cover to form an exhausting path; and a ventilation guide formed around an exhausting port inside a rear part of the water-proof cover. The cooling air discharged to the inside space of the water-proof cover by the cooling fan is ventilated through the ventilating path and exhausted outside through the exhausting path.

Abstract: A combinational chassis featuring heat dissipation comprises a chassis body, a base plane shell, and a first side shell and a second side shell, of which the two sides connect to each other in the same direction of the base plane shell. A heat dissipation device comprises a plurality of heat-sink parts on the outside surface of chassis body. The heat-sink part comprises a raised portion integrally connected to the inside, and a joint portion connected to the outside. The raised portion integrally protrudes outwards from the outside surface. The joint portion geometrically protrudes from the raised portion. A wedge groove is formed near the joint portions where an inlet groove is formed. The inlet groove connects and communicates with the wedge groove. The chassis may be connected vertically in stack and/or connected horizontally for expansion to expand the computer system for preferably flexible application and optimal heat dissipation.

Abstract: An image forming device includes an exposure device configured to emit exposure light and an air flow generator configured to generate an air flow. The exposure device includes a heat source that generates heat and a heat sink configured to dissipate the heat. The heat sink includes a plurality of fins located inside the air flow. The plurality of fins extend in a direction parallel to a direction where the air flow flows and are arrayed in a direction orthogonal to the direction where the air flow flows. The plurality of fins are formed so as to increase in height from an upstream side toward a downstream side in the direction where the air flow flows.

Abstract: Power supply and heat sink modules are suitable for use in sealed outdoor enclosures. Circuit elements in the power supply modules are connected to multiple heat sinks. The heat sinks are combined in heat sink modules. The heat sink modules provide high thermal conductivity while avoiding electromagnetic interference.

Abstract: An exemplary electronic device includes a container, a fan assembly and a duct received in the container. The fan assembly includes a centrifugal fan and a fin group thermally contacting an electronic component in the container. An air passage is defined between each adjacent fins of the fin group. An inner side of the fin group is mounted on an outlet of the centrifugal fan. A bottom surface of the fin group and an inner surface of the container cooperatively define a first channel therebetween. The duct includes an inlet and a first outlet. Airflow guided by the centrifugal fan flows through the duct and the first channel to cool a bottom end of the fin group, then is absorbed into the centrifugal fan from an inlet of the centrifugal fan, and then flow through the air passages of the fin group to cool a central portion the fin group.

Abstract: A system for cooling a heat generating device comprises a heat sink and a plurality of ion emitter elements that form an electrohydrodynamic (EHD) air flow device. The heat sink has a base disposed in thermal communication with a heat generating device, such as a processor. A plurality of heat sink fins is coupled to electrical ground to form ion collectors. Ion emitter elements are disposed in a non-planar pattern along first ends of the plurality of fins so that each ion emitter element is equidistant from the first end of a nearest fin. A power supply applies an electrical potential between the plurality of ion emitter elements and the plurality of fins to induce a flow of ions that cause airflow across the heat sink. It is preferable to have at least three ion emitter elements that are equidistant from each fin of the heat sink.

Abstract: A power converter device is disclosed herein. The power converter device includes a printed wiring board assembly, a cold plate base and a shell plate assembly. The cold plate base is fastened under the printed wiring board assembly for dissipating heat generated by the printed wiring board assembly. The shell plate assembly having a top shell plate, a bottom shell plate, at least two side plates respectively mounted on the cold plate base in different orientations. The printed wiring board assembly and the cold plate base are enclosed with the shell plate assembly.

Abstract: A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate (1). The substrate (1) having a surface where a heat absorbing surface (5) is formed. There are multiple hollow conduits inside the substrate (1) to act as evaporating conduits (6). The heat dissipation device further comprises condensing conduits (7) intercommunicated with the evaporating conduits (6). The evaporating conduits (6) and the condensing conduits (7) form sealed conduits. The sealed conduits are filled with liquid which vaporizes upon heating. At least the evaporating conduits (6) are set in the substrate (1).

Abstract: The present invention provides a back frame of flat panel display device, which includes primary assembling pieces, secondary assembling pieces, and an adjustable bracing piece. The primary assembling pieces have a number of at least two, and the at least two primary assembling pieces are connected through joining to form a main frame structure of the back frame. The secondary assembling pieces are joined to the primary assembling pieces. According to practical needs of the main frame structure, different materials are used for primary assembling pieces at different locations. The back frame further includes the bracing piece that is mounted to the primary assembling pieces or the secondary assembling pieces. The available mounting points between the bracing piece and the primary assembling pieces or the secondary assembling pieces are of a number of at least two so that the bracing piece is selectively mounted to the back frame at different positions. The present invention also provides a backlight system.

Abstract: A system for removing heat from a computing device includes a carrier and one or more heat removal elements. The carrier includes a carrier surface having a carrier surface pattern. The carrier surface pattern includes coupling portions. The coupling portions of the carrier surface pattern selectively couple, at different locations on the pattern, the heat removal elements to the carrier. The heat removal elements conduct heat from heat producing components of the computing device to the carrier. The carrier conducts heat away from the heat removal elements.