With Separable Connector Or Socket Means Patents (Class 361/785)
  • Patent number: 8995147
    Abstract: A connection assembly includes a connection member and a switch. The connection member includes a serial attached small computer system interface (SAS) connector electronically connected to the switch. When the switch is electronically connect to the motherboard, the switch transmits signals from the motherboard to a hard disk drive backplane via the SAS connector. When the switch is electronically connect to the hard disk drive backplane, the switch transmits signals from the hard disk drive backplane to the motherboard via the SAS connector.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: March 31, 2015
    Assignee: Zhongshan Innocloud Intellectual Property Services Co., Ltd.
    Inventors: Lei Liu, Guo-Yi Chen
  • Patent number: 8995141
    Abstract: An electronic device includes a first component electrically coupled to a second component. The first component and the second component are coupled by the base of a spring loaded connector.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: March 31, 2015
    Assignee: Amazon Technologies, Inc.
    Inventors: Nidhi Rathi, Edward A. Lilgegren
  • Publication number: 20150049451
    Abstract: An interconnection system includes a first board group, a second board group orthogonal to the first board group, and a center backplane arranged between the first board group and the second board group. The first board group includes a number of first boards parallel to each other and the second board group includes a number of second boards parallel to each other. Curved male connectors re arranged on each of the first boards and curved female connectors are arranged on each of the second boards. The curved male connectors and the curved female connectors directly cooperate and are connected in one-to-one correspondence.
    Type: Application
    Filed: November 3, 2014
    Publication date: February 19, 2015
    Inventors: Baoqi Wang, Guodong Zhang, Fangming Liu
  • Patent number: 8947888
    Abstract: A substantially cable-free board connection assembly may include a plurality of printed circuit boards (PCBs) forming an interconnect plane for a plurality of electronic devices respectively attached to a plurality of plane boards included in the interconnect plane. An insertion direction for substantially all connectors is substantially perpendicular to a face of the interconnect plane. At least a portion of the board connection assembly is mounted to a support structure via a flexible connection.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: February 3, 2015
    Assignee: Microsoft Corporation
    Inventors: Eric C. Peterson, David T. Harper
  • Patent number: 8939774
    Abstract: In exemplary implementations of this invention, electrical connections are fabricated between two orthogonal surfaces by electroplating. The two surfaces are separated (except for the electrical connections) by a gap of not more than 100 micrometers. Multiple electrical connections may be fabricated across the gap. In preparatory steps, conductive pads on the two surfaces may be separately electroplated to build up “bumps” that make it easier to bridge the remainder of the gap in a final plating step. Alternately, electroless deposition may be used instead of electroplating. In exemplary implementations, a 3D probe array may be assembled by inserting array structures into an orthogonal base plate. The array structures may be aligned and held in place, relative to the base plate, by mechanical means, including side hooks, stabilizers, bottom hooks, alignment parts and a back plate.
    Type: Grant
    Filed: November 12, 2012
    Date of Patent: January 27, 2015
    Assignee: Massachusetts Institute of Technology
    Inventors: Jorg Scholvin, Anthony Zorzos, Clifton Fonstad, Edward Boyden
  • Patent number: 8934256
    Abstract: One exemplary object of the present invention is to provide a card device which can be shared in main body devices employing different power supply systems, and a power supply method of the card device. The card device according to the present invention includes a flat rectangular card base body (101), an internal circuit (301), an external connector (102), and a main body connector (103). The external connector (102) is provided on an edge (202) positioned on an opening side (201) of a card slot (21) in a state in which the card device is inserted into the card slot (21), and is adapted to be supplied with power from an external power supply. The main body connector (103) is provided on the innermost side of a card slot (200) in a state in which the card device is inserted into the card slot (200), and is supplied with power from a main body device.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: January 13, 2015
    Assignee: NEC Corporation
    Inventor: Motohiro Mukouyama
  • Patent number: 8934257
    Abstract: In some embodiments, an apparatus includes a first substrate, a second substrate, a first coupler, and a second coupler. The first substrate is formed from a first material and includes an electrical pad. The second substrate is formed from a second material and includes an electrical pad. The first coupler is configured to mechanically couple the first substrate to the second substrate without a soldered connection. The second coupler includes a first end portion, configured to be soldered to the electrical pad of the first substrate, and a second end portion, configured to be soldered to the electrical pad of the second substrate. The second coupler configured to electrically couple the first substrate to the second substrate.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: January 13, 2015
    Assignee: Juniper Networks, Inc.
    Inventors: Boris Reynov, Jack Kohn, Victor Mei, Shreeram Siddhaye, Ben Nitzan, Venkata Penmetsa
  • Patent number: 8929083
    Abstract: Supports for plural billboard display modules include one or more structural frames mountable to existing billboard poster panels and other planar structural surfaces; each individual structural frame having a sufficient number of frame cutout areas to minimize frame weight to no greater than fifty pounds for hand lifting and mounting to the poster panels, but not such a sufficient number of frame cutout areas to compromise the structural integrity of the structural frame for resisting wind load forces in excess of 100 pounds per square foot when mounted to the poster panels while supporting the plural billboard display modules; and wherein each structural frame is arranged in an array of structural bay members defined by the cutout areas and visual separation features, the visual separation features facilitating the separating of the array into smaller array configurations, wherein the smallest array is a one bay high by one bay wide configuration.
    Type: Grant
    Filed: October 2, 2013
    Date of Patent: January 6, 2015
    Inventors: David Franklin Cox, Arne E. Carlson
  • Patent number: 8929062
    Abstract: A wireless terminal device includes: a conduction and connection module, and a first Printed Circuit Board, PCB, connected to the conduction and connection module, and the wireless terminal device further includes a first conductor, where one of the conduction and connection module and the first PCB is connected to one end of the first conductor through a first capacitance coupling module, and the other one of the conduction and connection module and the first PCB is connected to the other end of the first conductor. Through the foregoing processing, capacitance coupling and grounding between the conduction and connection module and the PCB can be implemented through the first capacitance coupling module.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: January 6, 2015
    Assignee: Huawei Device Co., Ltd.
    Inventors: Yanping Xie, Qing Liu, Ping Lei, Yao Lan, Shuhui Sun
  • Patent number: 8923003
    Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: December 30, 2014
    Assignee: Apple Inc.
    Inventors: Alexander D. Schlaupitz, Joshua G. Wurzel
  • Patent number: 8923011
    Abstract: A combination of an interconnect board and a module board for connecting a plurality of electronic modules to a processing unit is described. The interconnect board comprises a plurality of interconnect data lines connected between a plurality of interconnect board input terminals and interconnect board output terminals. The module board comprises at least one electronic module connected to a module connection input terminal, a plurality of module board data lines connected between a plurality of module board input terminals and a plurality of module board output terminals, and an unconnected module board output terminal. A first one of the interconnect board output terminals is connectable to the module connection input terminal, and the unconnected module board output terminal is connectable to one of the interconnect board input terminals.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: December 30, 2014
    Assignee: Kathrein-Werke KG
    Inventors: Lothar Schmidt, Christoph Kutscher
  • Patent number: 8908385
    Abstract: An interface module has an integrated component for replacing a component on a circuit board, the terminal contacts on the bottom side of the interface module being designed as provided for the contacts of the component on the circuit board, the interface module being divided into an adaptor part as a base module and a protocol converter part as a tool access module.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: December 9, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Claus Moessner, Burkhard Triess, Gert Maier, Peter Bach
  • Patent number: 8902606
    Abstract: An electronic interconnect system comprises: a motherboard having electrical contacts on its upper and lower surfaces along a selected edge; an electronic module comprising a circuit board with electronic devices mounted thereon, and further comprising two opposing flexible portions that are openable outwardly from one another, the flexible portions having electrical contact pads on the opposing surfaces, so that when the flexible portions are placed on either side of the edge of the motherboard the pads align with contacts on the respective surfaces of the motherboard and make electrical contact therewith.
    Type: Grant
    Filed: October 17, 2012
    Date of Patent: December 2, 2014
    Assignee: Microelectronics Assembly Technologies
    Inventors: James E. Clayton, Zakaryae Fathi
  • Patent number: 8897030
    Abstract: An expansion apparatus includes a first connector having first power pins and first signal pins, and a second connector having second power pins and second signal pins. A power circuit is connected to the first and second power pins. A serial advanced technology attachment (SATA) expansion controller is connected to the first and second signal pins. First control chips are connected to the SATA expansion controller and the power circuit. First storage chips are connected to the first control chips and the power circuit. A third connector has third power pins corresponding to second power pins, and third signal pins corresponding to second signal pins. Second control chips are connected to the third power pins and the third signal pins. Second storage chips are connected to the second control chips and the third power pins.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: November 25, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Meng-Liang Yang
  • Patent number: 8885349
    Abstract: A daughter circuit board of a brushless DC motor for interface signal conversion, having circuit units integrated on the daughter circuit and eight ports for communicating with a control system of a user terminal. The daughter circuit board is plugged into a motor controller for signal conversion so that the motor controller communicates with the control system of the user terminal. The eight ports include a signal input port of analog control, a signal port for activating a fan mode, signal ports of speed feedback, a reserved signal port, a port of COM, a port of DC power supply, and a R/T port.
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: November 11, 2014
    Assignee: Zhongshan Broad-Ocean Motor Co., Ltd.
    Inventors: Yong Zhao, Xiansheng Zhang
  • Patent number: 8879241
    Abstract: A server rack configured for a plurality of servers is disclosed, in which each of the servers has a power supply circuit board. The server rack includes: a case having a first face and a second face opposed to each other, the first face having an opening for the servers to be arranged in the case in an orientation; a power supply module provided on the second face of the case; and a power transmission assembly composed of a busbar provided on the second face in the orientation and electrically connected to the power supply module; and a plurality of electrical connectors provided on the busbar and coupled respectively with the power supply circuit boards of the servers. Through the power transmission assembly, the servers may be powered in a centralized way by the power supply module.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: November 4, 2014
    Assignee: Giga-Byte Technology Co., Ltd.
    Inventors: Tung-Ke Lu, Chin-Han Tsai
  • Patent number: 8867230
    Abstract: In the present invention, generation of occurrence of a wiring area is prevented, and a reflection by an inconsistency of a characteristic impedance of a high-speed signal line and a through hole connecting portion. By doing so, a conductor pattern of a raised shape is formed on each of front and back of a through hole, on a GND layer closest to the high-speed signal line in the vicinity of the connecting portion of the high-speed signal line and the through hole. Further, the conductor pattern is a trapezoidal shape, and is a shape which becomes wider as it becomes closer to the through hole.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: October 21, 2014
    Assignee: Hitachi, Ltd.
    Inventor: Masatoshi Yoshihara
  • Patent number: 8861222
    Abstract: A backplane includes multiple vertical insertion plates separately arranged from each other, and connectors connecting circuit boards and a circuit serving as signal wiring are disposed on the vertical insertion plates. Each connector is electronically connected to the circuit of the vertical insertion plate on which the connector is disposed, so that when the connector on the vertical insertion plate connects a switch board with a service board, the switch board and the service board can implement signal interconnection through the signal wiring of the vertical insertion plate. Due to the backplane of a three-dimensional structure, the processing difficulty of the backplane is greatly lowered, the cost is greatly reduced, thus solving the problem of excessively large number of layers and excessively large size, which is caused by large-scale backplane wiring.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: October 14, 2014
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Hai Wen, Qian Deng
  • Patent number: 8854833
    Abstract: A serial advanced technology attachment (SATA) dual-in-line memory module (DIMM) includes a circuit board. A control chip and a number of storage chips are arranged on the circuit board. First and second extending boards extend from an end of the circuit board and are coplanar with the circuit board. A space is defined between the first and the second extending boards. A first edge connector is arranged on the first extending board and connected to the control chip. A second edge connector is arranged on bottom edges of the second extending board and the circuit board. A third edge connector is arranged on a top edge of the circuit board opposite to the bottom edge of the circuit board.
    Type: Grant
    Filed: October 30, 2011
    Date of Patent: October 7, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chun-Po Chen, Chia-Ming Yeh
  • Patent number: 8848387
    Abstract: The present invention provides a shield case having electrical conductivity and being mountable on a circuit board. The shield case includes a first surface adapted to be placed on the circuit board and a second surface provided continuously with the first surface and extending at an angle or at a right angle with respect to the first surface. A first recess of generally U-shape is provided in a boundary area of the first surface with the second surface and including first and second end portions. A pair of second recesses is provided in a boundary area of the second surface with the first surface and communicating with the first and second end portions of the first recess. The shield case also includes a pad, being defined by the first and second recesses and connectable by soldering to an electrode of the circuit board.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: September 30, 2014
    Assignee: Hosiden Corporation
    Inventors: Takayuki Nagata, Takahisa Ohtsuji
  • Patent number: 8842441
    Abstract: The present invention discloses a circuit board interconnection architecture, which includes at least one first plugboard and at least two second plugboards substantially perpendicular to the first plugboard, where at least one of the first plugboard and the second plugboards is provided with several slots; the first plugboard and the second plugboards are mated and electrically connected by using signal connectors on both sides of the slots. The circuit board interconnection architecture solves a fitting precision problem of the first plugboard and the second plugboards in orthogonal directions. Even though there is an assembly tolerance between the first plugboard and the second plugboards, the connectors still satisfy assembly precision requirements, which can also avoid overall deformation of a first circuit board and a second circuit board after the first plugboard and the second plugboards are interconnected and mated orthogonally.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: September 23, 2014
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Lei Bai, Xiongbiao Liu, Lexiong Peng
  • Patent number: 8830683
    Abstract: A motherboard assembly includes a motherboard and an expansion card. The motherboard includes an expansion slot, a storage device interface, a power connector, and a central processing unit (CPU). The expansion slot includes a protrusion, first signal pins connected to the CPU, first power pins connected to the power connector. The expansion card includes a circuit board. A storage unit, a display unit, a power circuit, and a serial advanced technology attachment (SATA) connector connected to the storage unit and the storage device interface of the motherboard are all arranged on the circuit board. A notch is defined in a bottom edge of the circuit board, to receive the protrusion. An edge connector is arranged on a bottom edge of the circuit board and includes second power pins connected to the power circuit, and second signal pins connected to the display unit.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: September 9, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wei-Dong Cong, Guo-Yi Chen
  • Patent number: 8804371
    Abstract: A motherboard assembly includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board, a memory slot, a platform controller hub (PCH), a storage device interface, and a storage controller connected to the PCH and the storage device interface. An edge connector is set on a bottom edge of the circuit board. A port is arranged on the circuit board, and connected to the storage chips and the storage device interface, enabling a motherboard to communicate with the SATA DIMM module.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: August 12, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wu Zhou, Yang Liu, Cheng-Fei Weng
  • Patent number: 8803004
    Abstract: In one embodiment, an apparatus includes a cover panel. An adhesive layer is coupled to the cover panel. A perimeter of the adhesive layer forms at least a portion of a gasket seal extending substantially perpendicular to an inner surface of the cover panel. An inner surface of the gasket seal defines an edge of a channel. The apparatus also includes a substrate coupled to the adhesive layer. The substrate includes an outer surface having disposed thereon a connection pad region and drive or sense electrodes. The drive or sense electrodes are disposed between the substrate and the cover panel. At least a portion of the channel is disposed between the gasket seal and the connection pad region. The apparatus further includes a flexible printed circuit (FPC) electrically coupled by the connection pad region to the drive or sense electrodes. A first portion of the FPC extends through the channel.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: August 12, 2014
    Assignee: Atmel Corporation
    Inventor: David Brent Guard
  • Patent number: 8803003
    Abstract: A circuit board is provided which includes a plurality of signal pairs of connectors. The signal pairs of connectors are disposed in a triangular grouping of three signal pairs of connectors such that a first connector of each signal pair is located at a vertex of the triangular grouping. A second connector of each signal pair is located at a side of the triangular grouping adjacent to the vertex of the first connector. The signal pairs may be differential pairs.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: August 12, 2014
    Assignee: Cisco Technology, Inc.
    Inventors: Paul L. Mantiply, Straty Argyrakis
  • Patent number: 8780580
    Abstract: A display device includes a second flexible printed circuit board electrically connected to interface terminals, a display panel joined to a first flexible printed circuit board, and a sub panel joined to the second flexible printed circuit board. The second flexible printed circuit board includes an upper end portion which extending sideward from an end portion of the sub panel above the first flexible printed circuit board, an outward bent portion bent from the upper end portion in a return direction, an intermediate portion extending from the outward bent portion such that the intermediate portion passes an electrically connecting portion with the first flexible printed circuit board below the first flexible printed circuit board, an inward bent portion bent from the intermediate portion in a return direction toward the electrically connecting portion, and a lower end portion extending from the inward bent portion and reaching the electrically connecting portion.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: July 15, 2014
    Assignee: Japan Display Inc.
    Inventor: Eiji Oohira
  • Patent number: 8780536
    Abstract: A motherboard includes a printed circuit board (PCB), a central processing unit (CPU), a regulator, a first memory adaptor, and a second memory adaptor. The PCB includes a top surface, a bottom surface, a plurality of first soldering pads and first leads arranged on the top surface, and a plurality of second leads arranged between the top surface and the bottom surface. The PCB defines a plurality of first vias, second vias, and power vias. The CPU is connected to the first vias. The voltage regulator is connected to the power vias. The first memory adaptor neighbors to the regulator and is surface-mount soldered to the first soldering pads. The first soldering pads are connected to the first vias by first leads. The second memory adaptor is soldered to the second vias. The second vias are connected to the first vias by the second leads.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: July 15, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Shin-Ting Yen, Yung-Chieh Chen, Duen-Yi Ho
  • Patent number: 8760173
    Abstract: A signal test apparatus for a serial attached Small Computer System Interface (SAS) device includes an SAS female connector to be connected to the SAS device, an SAS male connector to be connected to a server, first and second pairs of subminiature version A (SMA) connectors, and first and second groups of switches. When the first pair of SMA connectors is connected to an oscillograph to test a pair of output signals from the SAS device, the second group of switches are turned on and the first group of switches are turned off to communicate the SAS device with the server. When the second pair of SMA connector is connected to the oscillograph to test another pair of output signals from the SAS device, the first group of switches are turned on and the second group of switches are turned off to communicate the SAS device with the server.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: June 24, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hui Li, Fa-Sheng Huang
  • Publication number: 20140160711
    Abstract: A mortise lock includes: a first printed circuit board; a contact pad arranged on the first printed circuit board; a second printed circuit board; a printed circuit board connector arranged on the second printed circuit board, the printed circuit board connector being configured to connect the first printed circuit board to the second printed circuit board; and a plug contact arranged on the second printed circuit board. The plug contact is configured to be accessible from outside of the mortise lock.
    Type: Application
    Filed: May 30, 2012
    Publication date: June 12, 2014
    Inventors: Kai Gröne, Michael Suberg, Marc-André Schneider
  • Patent number: 8749990
    Abstract: The present invention provides a DC-DC power converter that comprises two or more Printed Wiring Boards (PWB) mounted parallel to one another and without encapsulation. Electronic components can be mounted on both sides of each board. The open design and parallel orientation of the PWBs allow airflow over components mounted on the PWBs. The PWBs are preferable made of FR-4 with copper foils, with one thicker board being comprised of more copper layers and the other boards comprised of less copper layers. In the preferred embodiment, the power processing elements are housed in the thicker PWB, while the thinner boards house the control circuitry.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: June 10, 2014
    Inventors: Sun-Wen Cyrus Cheng, Carl Milton Wildrick, Jeffrey John Boylan
  • Patent number: 8736290
    Abstract: A signal detection apparatus for a serial attached SCSI (SAS) device includes an SAS female connector to be connected to a SAS device, an SAS male connector to be connected to a system, and first to fourth pairs of subminiature version A (SMA) connectors. When the first pair of SMA connectors is connected to an oscillograph to detect a pair of output signals from the SAS device, the second and third pairs of SMA connectors connect the SAS device with the system. When the second pair of SMA connector is connected to the oscillograph to detect another pair of output signals from the SAS device, the first and fourth pairs of SMA connectors connect the SAS device with the system.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: May 27, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Fa-Sheng Huang
  • Patent number: 8730683
    Abstract: An attachment mechanism for an electronic component includes a circuit board and a fastener. A first connector is fastened to the circuit board to be connected to a second connector of the electronic component. The first connector includes a mounting portion fastened to the circuit board and a main body on a top of the mounting portion. The fastener includes an engaging portion and a rotating portion rotatably connected to a first end of the engaging portion. The engaging portion sandwiches the main body. The rotating portion includes a top wall and two abutting walls extending from opposite ends of the top wall to abut a top of the main body. One of the abutting walls is rotatably connected to the first end of the engaging portion. A stop wall extends from the other abutting wall to be detachably connected a second end of the engaging portion.
    Type: Grant
    Filed: May 4, 2012
    Date of Patent: May 20, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Zheng-Heng Sun
  • Publication number: 20140126170
    Abstract: Embodiments of the present invention disclose a backplane, a cabinet-level communication device, and a method for replacing a backplane, related to the field of mobile communication technologies, and can greatly reduce difficulty in replacing a backplane while ensuring stability of a connection between the backplane and a front board or a rear board. The backplane includes: a base plate of a stripe structure; one or more first connectors arranged on a first face of the base plate and configured to connect a corresponding connector on a front board; and one or more second connectors arranged on a second face of the base plate opposite to the first face and configured to connect a corresponding connector on a rear board.
    Type: Application
    Filed: December 31, 2013
    Publication date: May 8, 2014
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Lei Bai, Feng Ao, Fei Luo
  • Publication number: 20140063769
    Abstract: Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations.
    Type: Application
    Filed: August 29, 2012
    Publication date: March 6, 2014
    Inventors: Michael B. Wittenberg, Jared M. Kole, Sawyer I. Cohen, Shayan Malek
  • Patent number: 8643188
    Abstract: A semiconductor module system includes a substrate, at least one semiconductor chip, and a number of at least two electrically conductive first connecting elements. The substrate has a bottom side and a top side spaced apart from the bottom side in a vertical direction. The at least one semiconductor chip is arranged on the top side. Each one of the first connecting elements has a first end which protrudes away from an insulation carrier of the substrate in a direction perpendicular to the vertical direction. The semiconductor system further includes a connecting system with a number of N?1 connectors. A first one of the connectors includes at least two electrically conductive second connecting elements. Each one of the second connecting elements has a first end. The first end of each one of the first connecting elements is electrically conductively connectable to the first end of one of the second connecting elements.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: February 4, 2014
    Assignee: Infineon Technologies AG
    Inventors: Thilo Stolze, Olaf Kirsch
  • Patent number: 8634203
    Abstract: A latch assembly for securing two boards together includes a male section and a female section. The male section includes a base to be fixed to one board, a tab protruding from a first side surface of the base. The tab includes at least one latching portion protruding therefrom. The female section includes a support block fixed to the other one board and defining a chamber, a movable block slidably retained within the chamber of the support block, and the at least one elastic member is retained within the chamber. The movable block includes a stop portion capable of latching with the at least one latching portion when the movable block is retained in a securing position by the tab. The at least one elastic member applies a push force to the movable block to movably retain the movable block in the normal position.
    Type: Grant
    Filed: October 27, 2011
    Date of Patent: January 21, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chi-An Yu, Yan-Hao Li, Xing Xia, Xiao-Ming Zhu
  • Patent number: 8625269
    Abstract: A serial advanced technology attachment (SATA) DIMM includes a board body. A control chip is arranged on the board body. An extending board extends from an end of the board body. A first edge connector is set on the extending board. A second edge connector is set on a bottom side of the board body. The first edge connector includes a number of signal pins connected to the control chip, and a number of ground pins.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: January 7, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yung-Chieh Chen, Shou-Kuo Hsu
  • Patent number: 8611102
    Abstract: A computing device includes a first motherboard and a second motherboard perpendicularly attached to the first motherboard. The first motherboard includes a first CPU module and a plurality of first peripheral component interconnect (PCI) sockets. The second motherboard includes a second CPU module and a plurality of second PCI sockets. The plurality of first PCI sockets is located perpendicularly to both motherboards. The plurality of second PCI sockets includes at least one PCI socket that is obliquely oriented relative to the first motherboard.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: December 17, 2013
    Assignees: Hong Fu Jin Precision Industry (WuHan) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Biao Zeng, Zhi-Guo Zhang, Yuan-Ting Guo, Li-Fu Xu
  • Patent number: 8604358
    Abstract: An inner wire capable of power integration and power division and adapted for use with an inverter having a casing and a circuit board includes a female connector and a male connector. The female and male connectors are each disposed in the casing and each include power lines, at least two signal lines, and a ground line. The power lines each have one end electrically connected to power connectors in pairs and the other end to power terminals respectively. The signal lines have one end electrically connected to two signal connectors respectively and the other end to signal terminals. The ground lines have one end electrically connected to ground connectors and the other end to ground terminals. The power terminals, signal terminals, and ground terminals are disposed in the male and female connectors. The signal connectors, ground connectors, and power connectors are electrically connected to the circuit board.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: December 10, 2013
    Inventor: Wan-Yu Chang
  • Patent number: 8605456
    Abstract: According to one embodiment, an electronic apparatus includes a case, a main circuit board in the case, a connector on the main circuit board, an auxiliary circuit board includes one end portion connected to the connector and an extending portion extending outside the main circuit board, and a spring supporting mechanism between the case and the extending portion of the auxiliary circuit board. The spring supporting mechanism includes a spring portion configured to support the extending portion elastically deformable in a direction across a surface of the auxiliary circuit board, and is fixed to the extending portion to prevent the auxiliary circuit board from moving along the surface thereof.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: December 10, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Chiu Brad
  • Patent number: 8570760
    Abstract: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) device assembly includes an interface, a cable, and a board. An edge connector is set on a bottom edge of the board, and a control chip and a connector are arranged on the board. The connector includes a first shell and a number of first pins. The first pins include signal pins connected to the control chip, and ground pins. The interface includes a second shell and a connecting portion extended from a bottom of the second shell. A number of second pins are arranged on the connecting portion. The cable is extended through a side of the second shell to be connected to the first pins. A distance between a top of the first shell and a top of the board is greater than a height of the second shell.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: October 29, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Guo-Yi Chen
  • Patent number: 8559170
    Abstract: A central processing unit (CPU) expansion card may be inserted into a first connector of a motherboard. The CPU expansion card includes a board, a CPU socket mounted on the board, a number of memory slots mounted on the board and electrically connected to the CPU socket, and a second connector electrically connected to the CPU socket and mounted on the bottom side of the board to be inserted into the first connector of the motherboard.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: October 15, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yao-Tsung Lee, Yi-Cheng Tseng, Chun-Hsien Tsai, Feng-Ming Chang
  • Patent number: 8559189
    Abstract: A riser card is used for connecting at least one power supply to a motherboard in an electronic device. The riser card includes a first printed circuit board (PCB) and a second PCB. The first PCB includes at least one power connector for laterally receiving the at least one power supply. The second PCB is located parallel to the first PCB. The second PCB includes an insert terminal for connecting to the motherboard. The first PCB is spaced from the second PCB, and the first PCB and the second PCB are electrically connected.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: October 15, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Zhan-Yang Li
  • Patent number: 8552300
    Abstract: To provide a printed board fixing device capable of reducing the thickness and size with a simple structure. The printed board fixing device includes a coupling member which two-folds a flex rigid printed board that includes one and the other rigid printed boards via a flexible part and mutually couples and fixes the one and the other boards. The length of the coupling member is set to be within a range of entire thickness including the one and the other rigid printed boards. The coupling member is provided at two points on the one and the other rigid printed boards.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: October 8, 2013
    Assignee: NEC Corporation
    Inventor: Atsushi Kozato
  • Publication number: 20130258629
    Abstract: A fixing apparatus is used to parallel mount an expansion card to a motherboard. The fixing apparatus includes a mounting bracket fixed to the motherboard, and a retaining member rotatably connected to the mounting bracket. The mounting bracket includes a supporting board supporting the expansion card. The retaining member includes an abutting arm and a locking portion. When the retaining member is rotated to a locking position, the abutting arm abuts against a top of the expansion card to sandwich the expansion card with the supporting board, and the locking portion engages with the mounting bracket to prevent a rotation of the retaining member. When the retaining member is rotated to a releasing position, the abutting arm will move away from the expansion card.
    Type: Application
    Filed: August 2, 2012
    Publication date: October 3, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD .
    Inventor: LI-REN FU
  • Publication number: 20130258630
    Abstract: A hard disk drive (HDD) connector includes a motherboard port, a HDD port, and a signal processing circuit. The motherboard port and the HDD port are connected to a motherboard and a HDD, respectively. The signal processing circuit includes a signal processing module. The signal processing module is connected between the motherboard port and the HDD port to enhance signal transmission integrity between the motherboard and the HDD.
    Type: Application
    Filed: August 29, 2012
    Publication date: October 3, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: BO TIAN, KANG WU
  • Patent number: 8547772
    Abstract: A memory power supply circuit is used for providing power to a first memory module received in a first memory slot and a second memory module received in a second memory slot, and comprises a logic circuit and a switching power supply. The logic circuit comprises a first input terminal electrically connected to the first memory slot, a second input terminal electrically connected to the second memory slot, and a first signal terminal. The switching power supply comprises a first power terminal, a second power terminal, and a second signal terminal electrically connected to the first signal terminal. When the first memory slot and the second memory slot receive the first memory slot and the second memory module, the switching power supply turns on the first power terminal and the second power terminal; otherwise, the switching power supply turns off the first power terminal or the second power terminal.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: October 1, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Kang Wu
  • Patent number: 8523391
    Abstract: A flat light source apparatus has a light source board which comprises unit boards, each unit board having a printed circuit board and a light source formed on the printed circuit board, wherein the unit boards are arranged adjacent to each other at least in one direction, and any pair of the unit boards adjacent to each other is integrated by a connecting portion provided therebetween. The apparatus also has a main wire which extends along a plane of the light source board, wherein the main wire extends between adjacent unit boards via the connecting portion such that all of the unit boards are electrically connected to each other by the main wire. The apparatus further has a branch wire for supplying electric power to the light source, the branch wire being provided in each unit board and branching from the main wire in each unit board.
    Type: Grant
    Filed: February 3, 2006
    Date of Patent: September 3, 2013
    Assignee: NEC Corporation
    Inventors: Masahiro Ishizuka, Katsuyuki Okimura, Yoshinori Ueji, Ryuichiro Morinaka, Naoki Tatsumi, Tomoyuki Fukuda
  • Publication number: 20130223035
    Abstract: A motherboard is disclosed, which allows an expansion circuit board to be electrically connected to it. The motherboard includes a primary circuit board and an adapter component. The primary circuit board includes an expansion slot. The adapter component is connected to the expansion slot. The adapter component is used for being electrically connected to the expansion circuit board, such that the primary circuit board and the expansion circuit board can perform signal transmission via the adapter component. The expansion circuit board and the primary circuit board are not located on the same plane.
    Type: Application
    Filed: December 7, 2012
    Publication date: August 29, 2013
    Applicant: PEGATRON CORPORATION
    Inventor: PEGATRON CORPORATION
  • Patent number: 8520401
    Abstract: A motherboard assembly includes a motherboard and a serial advanced technology attachment dual-in-line memory module (SATA DIMM) module with a circuit board. The motherboard includes an expansion slot and a storage device interface. An edge connector is set on a bottom edge of the circuit board to be detachably engaged in the expansion slot, and a notch is set on a bottom edge of the circuit board to engage in a protrusion of the expansion slot. A SATA connector of the circuit board is connected to the storage device interface of the motherboard.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: August 27, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Bo Tian, Guo-Yi Chen